Abstract: According to the present invention, there are provided microcapsules comprising an emulsion droplet encapsulated by a metallic film, wherein the emulsion droplet comprises an emulsifier disposed around a liquid core material. The present invention also provides processes for preparing the microcapsules, as well as formulations comprising the same. The present invention further provides for certain consumer products comprising: an adjunct material; and a plurality of microcapsules, said microcapsules comprising: an emulsion droplet encapsulated by a metallic film, wherein the emulsion droplet comprises an emulsifier disposed around a liquid core material.

Abstract: A filtration system includes a plurality of underdrain blocks arranged in a side-by-side configuration so as to define a gap therebetween, the gap configured to receive grout. Each underdrain block includes a top wall, a bottom wall, and a plurality of side walls connecting the top wall and the bottom wall. A grout bridge is arranged in the gap between adjacent underdrain blocks so as to form a grout seal between the grout bridge and adjacent side walls of the adjacent underdrain blocks. The adjacent sidewalls each include a rib, each rib defining a slot. The grout bridge is arranged in adjacent slots of the adjacent sidewalls of the adjacent underdrain blocks. A method of arranging a filtration system and a grout bridge are also disclosed.

Abstract: Methods for the use of nanocrystalline or amorphous metals or alloys as coatings with industrial processes are provided. Three, specific, such methods have been detailed. One of the preferred embodiments provides a method for the high volume electrodeposition of many components with a nanocrystalline or amorphous metal or alloy, and the components produced thereby. Another preferred embodiment provides a method for application of a nanocrystalline or amorphous coatings in a continuous electrodeposition process and the product produced thereby. Another of the preferred embodiments of the present invention provides a method for reworking and/or rebuilding components and the components produced thereby.

Abstract: Techniques for electrodeposition of thin film solar panels are provided. In one aspect, an electrodeposition apparatus is provided. The electrodeposition apparatus includes at least one electroplating cell; and a conveyor for moving panels over the electroplating cell, wherein the conveyor comprises at least one metal belted track over the electroplating cell surrounding a plurality of metal rollers. The electroplating cell can include an anode at a bottom of the electroplating cell; and a plurality of paddles at a top of the electroplating cell. A baffle may be located in between the anode and the paddles. An electroplating process is also provided.

Abstract: Cup-shaped workpieces are first each secured in a downwardly open position on respective fingers of a workpiece holder, and to holder is inverted such that the workpieces are open upward and the upwardly open workpieces are lowered into a body of anodizing liquid in a treatment bath until the workpieces are wholly immersed. The holder and the workpiece are then moved horizontally immersed in the body of anodizing liquid while passing electricity between the holder and a cathode immersed in the bath below the workpieces such that the liquid anodizes surfaces of the workpieces. Finally, the holder is raised out of the body of liquid with the workpieces open upward, and while the workpieces are still above the body of liquid, the holder and the workpieces are again inverted so that the workpieces are open downward and any treatment liquid in the workpieces drains downward back into the bath.

Abstract: Methods for the use of nanocrystalline or amorphous metals or alloys as coatings with industrial processes are provided. Three, specific, such methods have been detailed. One of the preferred embodiments provides a method for the high volume electrodeposition of many components with a nanocrystalline or amorphous metal or alloy, and the components produced thereby. Another preferred embodiment provides a method for application of a nanocrystalline or amorphous coatings in a continuous electrodeposition process and the product produced thereby. Another of the preferred embodiments of the present invention provides a method for reworking and/or rebuilding components and the components produced thereby.

Abstract: An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.

Abstract: A method for producing a metal coating on a plastics material part includes connecting each of a plurality of plastics material parts to a flexible support via a respective connecting part so as to temporarily chain the plurality of plastics material parts together. Each connecting part is attached to a respective one of the plurality of plastics material parts on at least one side. An electrically conductive connection is provided between the flexible support and each of the plurality of plastics material parts via the respective connecting part so as to provide a current supply for producing a galvanic metal coating layer on a conductive layer of each of the plurality of plastics material parts.

Abstract: The invention concerns a surface treatment electrode (11) to treat at least one object (1). It comprises at least one cavity (23) enclosing the object (1) to be treated during the treatment, having a geometry ensuring free movement of the object (1), this cavity (23) being delimited by a wall (24) comprising at least one opening (25) communicating the inside of the cavity (23) with a treatment solution (5) in which the electrode (11) is immersed during the surface treatment. The cavity (23) is substantially cylindrical and its diameter is approximately 50 to 100 micrometers larger than a maximum size of the object (1).

Abstract: An apparatus and method is disclosed for simultaneously electroplating at least two parts in a series electrical configuration in an electroplating system using a shared electrolyte with excellent consistency in thickness profiles, coating weights and coating microstructure. Parts in high volume and at low capital and operating cost are produced as coatings or in free-standing form.

Abstract: A robotic device has a base and at least one finger having at least two links that are connected in series on rotary joints with at least two degrees of freedom. A brushless motor and an associated controller are located at each joint to produce a rotational movement of a link. Wires for electrical power and communication serially connect the controllers in a distributed control network. A network operating controller coordinates the operation of the network, including power distribution. At least one, but more typically two to five, wires interconnect all the controllers through one or more joints. Motor sensors and external world sensors monitor operating parameters of the robotic hand. The electrical signal output of the sensors can be input anywhere on the distributed control network. V-grooves on the robotic hand locate objects precisely and assist in gripping. The hand is sealed, immersible and has electrical connections through the rotary joints for anodizing in a single dunk without masking.

Abstract: Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 ?m. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated.

Abstract: The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces (1), such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces (1) are transported on a conveying path by means of conveying members (6, 6?, 6?, 7). The treatment unit comprises carrier elements (4) with recesses (21), said carrier elements (4) being oriented to be parallel to the conveying path, and at least one module system for carrying the conveying members (6, 6?, 6?, 7) that consist of insertion elements (14, 26), preferably arranged in pairs, the at least one module system being configured such that it registers with and is preferably slidable into the recesses (21) of the carrier elements (4). The treatment unit is preferably utilized in horizontal conveyorized lines.

Abstract: A system and a method for electroplating a plurality of turbine blades, comprising providing a rotatable gear for each blade, operatively connecting a mount assembly for each gear, slidably placing an electric charge on the blades.

Abstract: Permanent or temporary alignment and/or retention structures for receiving multiple components are provided. The structures are preferably formed monolithically via a plurality of deposition operations (e.g. electrodeposition operations). The structures typically include two or more positioning fixtures that control or aid in the positioning of components relative to one another, such features may include (1) positioning guides or stops that fix or at least partially limit the positioning of components in one or more orientations or directions, (2) retention elements that hold positioned components in desired orientations or locations, and/or (3) positioning and/or retention elements that receive and hold adjustment modules into which components can be fixed and which in turn can be used for fine adjustments of position and/or orientation of the components.

Abstract: A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set of parallel mandrels. (The substrates are held in a mutually parallel orientation, typically vertically, during plating.) A voltage is applied to the substrates via a contact pin, a contact plate, a set of ball bearings, a rack end-plate, and the mandrels.

Abstract: In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for bringing treatment liquid into contact with the workpieces 9, means 10 for electrical contracting of the workpieces 9 at contacting sites and counterelectrodes 5.x which are so arranged that the workpieces 9 may be arranged opposing them, whereby the counterelectrodes 5.x are each subdivided into at least two electrode segments 13.x such that at least one contact-near electrode segment 13.1 and at least one contact-remote electrode segment 13.4 and possibly further electrode segments 13.2, 13.3 arranged between them are provided and each electrode segment 13.x is fed by a separate current source 15.x.

Abstract: Disclosed is a multi-step process for the coating of a substrate without re-racking the substrate between the coating operations comprising: providing a substrate holder with an inert protective polymeric coating covering a substantial portion of the holder; affixing a substrate to the substrate holder; electroplating a coating onto the substrate; without re-racking the substrate, applying a physical vapor deposition coating to the coated substrate; and removing the twice coated substrate from the substrate holder.

Abstract: An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical current density modifiers (364 and 37) reduce the electrical current density near the edge of the substrate (20). By reducing the current density near the edge of the substrate (20), the plating becomes more uniform or can be tailored so that slightly more material is plated near the center of the substrate (20). The system can also be modified so that the material that plates on electrical current density modifier portions (364) of structures (36) can be removed without having to disassemble any portion of the head (35) or otherwise remove the structures (36) from the system. This in-situ cleaning reduces the amount of equipment downtime, increases equipment lifetime, and reduces particle counts.

Abstract: An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed in the plating solution are connected to an anode and the body to be plated is connected to a cathode of a power supply.

Abstract: A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the inside surface (4) and a revolving guide means (6). In order to ensure advantageous coating conditions it is proposed that the electrolyte is conveyed with the help of the guide means (6) immersed only partly in the bath (8) in the circumferential direction through the gap (9) between the guide means (6) and the work-piece (3) guided outside of the bath (8).

Abstract: Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and media to be present in the solution at a volume ratio of above 1/1 to about 5/1. Another embodiment of the invention relates to an apparatus for electroplating a metal deposit on electroplatable substrates.

Abstract: A method of producing metal ferrules and an apparatus therefore enable metal ferrules to be produced with high productivity and high dimensional accuracy by arranging a plurality of long-sized core wires. A jig receives a metal to be electroformed and is placed in an electroforming tank, a holding unit in which a plurality of core wire holder for holding core wires are held in circumferential array is installed in the electroforming tank, and the core wire holders and the holding unit are rotatable on their respective axes. It is preferable that the resistivity of the core wires be 5×10?6 ?cm or less. A core wire plated within a thin layer of metal having a resistivity of 5×10?6 ?cm or less may be used. A conductive electric discharge body may be provided on the front end of the core wire.

Abstract: For electrolytic treatment of circuit boards and foils LP, a method and a device are used in which the sheets and foils are transported through a treatment unit and brought thereby in contact with treatment fluid 3. The sheets and foils are guided during transportation past at least one electrode arrangement, which comprises respectively cathodically polarized electrodes 6 and anodically polarized electrodes 7, the cathodically and anodically polarized electrodes also being brought in contact with the treatment fluid. The cathodically polarized electrodes and the anodically polarized electrodes are connected to a current/voltage source 8, so that a current flows through the electrodes 6, 7 and the electrically conductive surfaces 4.

Abstract: An electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Alternatively, a separate member may supply the plating electric current to the work. A plating solution in the hole in the work may be allowed to flow. Thus, a uniform plated film can be formed on both of the outer and inner surfaces of the work having the communicating with the outside such as a ring-shaped work, of which a ring-shaped bonded magnet is representative, by using the electroplating device.

Abstract: Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.

Abstract: A process for continuous nickel plating of an aluminum conductor, by electrolytically pre-treating the aluminum conductor to improve adherence of a nickel coat thereon by passing the aluminum conductor through a pre-treating bath in which is disposed an electrode connected to a first current source at a first voltage, for supplying to the aluminum conductor a pre-treating current, then electrolytically plating the pre-treated aluminum conductor with nickel in a plating bath in which is disposed an anode connected to a second current source at a second voltage, in which a nickel coat is deposited on the conductor by action of a nickel plating current In. At least the nickel plating current In is transmitted to the conductor through a mechanical electrical contact which contacts the conductor between the pre-treating bath and the plating bath, the pre-treating improving the contact properties of the conductor sufficient to permit the transmitting through the mechanical electrical conductor.

Abstract: The invention relates to carriers serving to supply current to workpieces to be treated electrolytically or counter-electrodes and a method for the electrolytic treatment of workpieces. The carriers according to the invention comprise at least three elongate electric current conductors, disposed parallel to one another, a first current conductor being configured in such a way that the workpieces or counter-electrodes can, for supplying electric current or for mechanical attachment, be attached to the conductor directly or via holding devices, respectively a second to nth current conductor is provided, the second current conductor being connected to the first current conductor, the third current conductor to the second current conductor etc.

Abstract: A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical contact from the plating solution. The conveyorized electroplating device has a fluid bed assembly with a manifold and an anode, a conveyor device adjacent to the fluid bed assembly, and a plurality of absorptive applicator assemblies, wherein the plurality of absorptive applicator assemblies are adjacent and in close proximity to the anode and in fluid communication with the fluid bed assembly. The conveyor device isolates the electrical contacts from the plating solution and is able to handle various sizes and thicknesses of substrates.

Abstract: Methods and apparatuses for in-situ cleaning of semiconductor electroplating electrodes to remove plating metal without requiring !the manual removal of the electrodes from the semiconductor plating equipment. The electrode is placed into the plating liquid and, an electrical current having reverse polarity is passed between the electrode and plating liquid. Plating deposits which have accumulated on the electrode are electrochemically dissolved and removed from the electrode.

Abstract: A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid.

Abstract: A method of processing wafers or other articles within a processing cell, entailing transporting a carrier supporting a vertically-oriented wafer horizontally through an inlet opening of a process cell, processing the vertically-oriented wafer within the process cell, and then transporting the carrier out of the process cell horizontally through an outlet opening of the process cell. In one exemplary implementation, the process performed within the cell is a pre-or post- treatment where the wafer is subjected to an acid solution treatment and/or a rinsing with de-ionized water treatment. In another exemplary implementation, the process performed within the process cell is an electroplating of the plating surface of the wafer. Additionally, a method of processing an empty carrier entailing transporting the carrier horizontally through an inlet opening of a process cell, processing the carrier within the process cell, and transporting the carrier out of the process cell horizontally through an outlet opening.

Abstract: A process for electrodeposition coating electrically conductive substrates in continuous electrodeposition coating plants, wherein, in the event of a shutdown of the conveying means, conventionally a belt, all the substrates not in motion and immersed in the electrodeposition coating tank are, at the latest after a brief de-energized interruption, completely coated while ensuring at least the nominal deposition period at the nominal deposition voltage, and then the completely coated, still immersed substrates not in motion remain de-energized in the electrodeposition coating tank and, when the conveying means has restarted, the substrates remain de-energized until reaching the end of the electrodeposition coating tank and are removed therefrom.

Abstract: An electroplating system (30) and process makes electrical current density across, a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical current density modifiers (364 and 37) reduce the electrical current density near the edge of the substrate (20). By reducing the current density near the edge of the substrate (20), the plating becomes more uniform or can be tailored so that slightly more material is plated near the center of the substrate (20). The system can also be modified so that the material that electrical current density modifier portions (364) on structures (36) can be removed without having to disassemble any portion of the head (35) or otherwise remove the structures (36) from the system. This in-situ cleaning reduces the amount of equipment downtime, increases equipment lifetime, and reduces particle counts.

Abstract: To avoid the formation of undesirable plating on electric supply rollers, there is provided a continuous plating apparatus in which a planar article to be plated is vertically clamped on both sides by electric supply rollers and the article to be plated is moved horizontally in a plating bath by the rotation of the electric supply rollers to plate both surfaces of the article to be plated. The apparatus is characterized in that the electric supply rollers are divided into conductive segments and non-conductive segments in the circumferential direction, with only the conductive segment which is in contact with the article to be plated being negatively charged, and other conductive segments which are at a distance from the article being positively charged.

Abstract: Plating rack for releasably holding parts in a plating process, as well as processes for fabricating and using such a rack, including spring members mounted to a frame which releasably hold plate-shaped parts from the opposite side edges of the parts in a manner permitting the part to move sufficiently, without disengagement, when immersed in an agitated plating fluid such that plating occurs on all the exterior surface regions of the plate and scarring is avoided.

Abstract: The present invention relates to a device and method for electrolytic deposition of metals on conducting particles. The conducting particles are completely immersed in a liquid and allowed to flow across a particle contacting surface of a cathode support. The particles flow across the surface and into a reservoir. Electrical contact is made between the negative pole of a DC power supply and the conducting particles. An anode mesh is placed above and parallel to the top face of the particle bed such that the mesh does not touch the particle bed but remains a controlled distance from it. The anode mesh is connected to the positive terminal of the DC power supply. A significant aspect of the present invention is that the device does not require a separator between the particle bed and the anode.

Abstract: In a device for surface treatment, in particular for electrochemical coating followed by electrophoretic coating, the material to be treated is moved through coating vessels in one or more planes. This is carried out using stepped cage conveyors which are provided, at different heights, with bearing arms for trays on which the material to be treated is located. Horizontal electrodes, past which the trays are moved, project between the bearing arms of each plane or into the space between each tray.

Abstract: A method of manufacturing R—Fe—B bonded magnets, capable of forming various corrosion resisting films on a R—Fe—B bonded magnet uniformly with a very high bonded strength so as to attain such a very high corrosion resistance thereof that prevents the bonded magnet from being rusted even in a long-period high-temperature high-humidity test; comprising barrel-polishing a porous R—Fe—B bonded magnet by a dry method using as media an abrasive stone formed by sintering inorganic powder of Al2O3, SiC, ZrO and MgO, or a mixture of an abrasive for metal balls and vegetable media, such as vegetable skin chips, sawdust, rind of a fruit and a core of corn, or a mixture of vegetable media the surfaces of which are modified by the above-mentioned abrasive and the above-mentioned inorganic pulverized bodies, so as to enable a surface of the magnet to be smoothed and sealed.

Abstract: A continuous plating system which is horizontal, allows for submersion of the entire article to be plated, and is useful for alloy plating. The invention provides a link/hinge conveyor system, the conveyor acts as the conductor, numerous processes/baths are possible, and difficult to plate alloys, such as a tin/bismuth plate can be produced. Homogeneous alloys are possible with the present invention. Also disclosed are novel dryer, rinse and reflow systems for use with the continuous plating system.

Abstract: In an electroplating method, a plating target article (X) disposed so as to be in contact with plating bath (14) is set as a cathode while a metal member disposed so as to be in contact with the plating bath (14) is set as an anode, and a voltage is applied between the cathode and the anode while vibrational flow is induced by vibrating vibrational vanes (16f) which are fixed in multi-stage style to a vibrating rod (16e) vibrating in the plating bath (14) interlockingly with vibration generating means (16d). Plating current flowing from the anode through the plating bath (14) to the cathode is pulsed and alternately set to one of a first state where the plating current keeps a first value I1 for a first time T1 and a second state where the plating current keeps a second value I2 having the same polarity as the first value I1 for a second time T2, the first value I1 being five or more times larger than the second value I2, and the first time T1 being three or more times longer than the second time T2.

Abstract: An efficient method for producing a high-precision, very small metal ball, such as a Cu ball having an outer diameter not greater than 1 mm, comprising the steps of: cutting metal wire having a diameter not greater than 0.3 mm into a predetermined length; melting and solidifying the metal wires to form starting metal pieces (11); charging a plating apparatus having a double-tank structure comprising an outer splash-proofing tank (8) and an inner plating tank (3), comprising a cathode (4) located at a horizontally turning peripheral portion and an anode centrally located inside the tank; turning the inner tank (3) in a forward and reverse direction while plating solution is discharged to the outer tank (8) due to a high speed rotation of the inner tank at 50 to 800 rpm; and electroplating the starting material to form a film of predetermined thickness without generating aggregation of plated product.

Abstract: The present invention relates to new methods for delivering solutions during electronic device manufacture. Methods of the invention include delivering metallization solutions to the device at an angle of less than 90 degrees with the surface of the device. The method may further comprise partially treating the device by delivering the metallization solutions from above the device, turning the device over, and then completing treatment by delivering the metallization solutions from below the article. The method is particularly useful in the formation of printed circuit boards and other electronic packaging devices having through-holes and blind vias.

Abstract: A curved component such as a turbine airfoil, shroud, or combustor centerbody is prepared with a platinum or a platinum-aluminide protective coating over only a portion of the surface thereof. The coating may serve as an environmental coating, or as a bond coat of a thermal barrier coating system. The partial coverage is achieved by depositing platinum only over a portion of the surface of the component, typically including the concave portion in the case of an airfoil, optionally depositing an aluminum layer, and optionally interdiffusing the platinum and aluminum layers.

Abstract: A process and apparatus for forming oxide coatings on bodies of aluminum and aluminum alloys are described. The process includes forming an electrolyte bath in an inert container. At least two reactive metal bodies are suspended in the bath. The bodies are connected to electrodes which, in turn, are connected to a multiphase AC circuit. A multiphase power (preferably three-phase between three bodies) potential is imposed between each of the bodies. The bodies are moved in the electrolyte bath relative to each other until micro-arcs occur on the surfaces of the bodies, whereby to commence oxidation of the bodies. The imposition of the potential between each of the bodies is continued until the desired thickness of oxide is formed on the bodies.

Abstract: The current density with which the process is used is of essential importance for the economy of a method of electrolytically treating materials. Normally only low or medium current densities are used, as the speed of replacement of consumed materials in the direct vicinity of the surface of the material for treatment has a restrictive effect on the magnitude of the current density at which a usable process result can still be achieved. However, a low current density leads to long electrolysis times and to complex treatment installations.

Abstract: A barrel plating method wherein each box containing pieces to be plated is provided with a kanban corresponding to the pieces contained in the box. The kanban of each box is read by an apparatus before the pieces are transferred from the box to a plating barrel, so that a plating coefficient corresponding to the information read from the kanban is retrieved from a host computer in which plating coefficients for various kinds of pieces are stored. The plating coefficient retrieved corresponding to the kanban of each box is proportional to a value of plating current to be supplied to a unit weight of pieces contained in the box. A value of plating current for each barrel is automatically calculated by multiplying the plating coefficient by the measured weight of the pieces put in the barrel. Barrel plating is performed by supplying each barrel with the value of the calculated plating current from power sources that correspond in number to barrels that are subjected to a plating process at a given time.

Abstract: Methods for forming pastes of powder particles coated with an electrically conductive coating are described. The powder particles, with or without an optional first conductive coating layer applied to their surface, are placed in contact with a cathode surface and immersed in an electroplating solution. An anode covered with a nonconducting but ion-permeable membrane is immersed in the solution in close proximity to the cathode. Agitation to move and gently tumble the powder over the cathode surface is provided. The powder particles are plated with a metal or metal alloy coating by biasing the anode with a positive voltage relative to the cathode. The coated powder is removed, rinsed and dried. The powder is added to a polymer material to form a paste which is heated to fuse the powder coating surfaces to form a network of interconnected particles and is further heated to cure the polymer.

Abstract: Zinc metal is deposited from an alkali electrolyte solution onto conductive seed particles in an electrowinning process which yields unusually high current efficiency and low energy consumption.

Abstract: The invention relates to a method and device for electroplating plate-shaped product, particularly printed circuit boards, in horizontal continuous plants with optional sequence of product, revolving contacting means serving for electrical connection of a source of bath current via wiper rails with the product, and the beginning and end of each individual product item at the inlet to the electroplating plant, and the transport speed of the product, being detected with the aid of sensors, said sensors sending sensor signals to a control system which ascertains whether a product item is present at the gripping point of the contacting means or not, the contacting means being connected electrically and in the electroplating sense in a low-resistance manner to the sources of bath current only when product is present in the region of contacts of the contacting means.