Zinc-containing Coating Patents (Class 205/155)
  • Patent number: 5240783
    Abstract: Steel plate for automobile bodies and a method for manufacturing the steel plate are disclosed, the steel plate containing 0.02.about.0.03% of P as an alloying element with a total amount of Cu, Ni, Cr, and Mo being more than 0. 01% but less than 0.08 weight % and being electroplated with a Zn alloy.
    Type: Grant
    Filed: October 19, 1988
    Date of Patent: August 31, 1993
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Tatsuo Kurimoto, Yoshihiko Hoboh, Tadashi Nonaka
  • Patent number: 5234573
    Abstract: A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.
    Type: Grant
    Filed: December 4, 1991
    Date of Patent: August 10, 1993
    Assignee: Fukuda Metal Foil and Powder Co., Ltd.
    Inventor: Masato Takami
  • Patent number: 5225067
    Abstract: A method for manufacturing an iron-zinc alloy plated steel sheet having two plating layers and excellent in electropaintability and press-formability, which comprises the steps of: passing a steel sheet through a zinc dip-plating bath to form a zinc dip-plating layer on at least one surface of the steel sheet; then, heating the steel sheet, on which the zinc dip-plating layer has been formed, to alloy the zinc dip-plating layer and the surface portion of the steel sheet, so as to form, on the surface thereof, an alloying-treated iron-zinc alloy dip-plating layer as a lower layer having a plating weight of from 30 to 120 g/m.sup.
    Type: Grant
    Filed: October 23, 1991
    Date of Patent: July 6, 1993
    Assignee: NKK Corporation
    Inventors: Masaru Sagiyama, Masaki Abe, Akira Hiraya, Junichi Inagaki, Masaya Morita
  • Patent number: 5209988
    Abstract: Steel plate for automobile bodies and a method for manufacturing the steel plate are disclosed, the steel plate containing 0.02.about.0.03% of P as an alloying element with a total amount of Cu, Ni, Cr, and Mo being more than 0.01% but less than 0.08 weight % and being electroplated with a Zn alloy.
    Type: Grant
    Filed: September 26, 1990
    Date of Patent: May 11, 1993
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Tatsuo Kurimoto, Yoshihiko Hoboh, Tadashi Nonaka
  • Patent number: 5207889
    Abstract: An improved treatment for copper foil comprising electrodepositing a metallic barrier layer of copper, zinc and antimony on at least one side of the foil which, preferably, has a matte surface formed prior to forming the barrier layer. The so-treated foil provides a high bonding strength when laminated to polymeric substrates and resists undercutting by mineral acid etchants and rinses during production of printed circuit boards.
    Type: Grant
    Filed: January 16, 1991
    Date of Patent: May 4, 1993
    Assignee: Circuit Foil USA, Inc.
    Inventors: Adam M. Wolski, Laurette M. Maguet, Michel Streel
  • Patent number: 5202012
    Abstract: A method for manufacturing a zinciferous electroplated steel sheet excellent in press-formability, which comprises the steps of: electroplating a steel sheet in a zinciferous acidic electroplating solution, which contains nitric acid ions or nitrous acid ions in an amount within a range of from 0.1 to 50 g per liter of the electroplating solution, and oxide particles of a metal or a semimetal, uniformly dispersible into the electroplating solution, in an amount within a range of from 0.1 to under 0.5 g per liter of the electroplating solution, to form, on at least one surface of the steel sheet, a zinciferous electroplating layer in which zinc hydroxide particles having the oxide particles as nuclei thereof are uniformly dispersed.
    Type: Grant
    Filed: February 13, 1992
    Date of Patent: April 13, 1993
    Assignee: NKK Corporation
    Inventors: Masaki Abe, Yukimitsu Shiohara, Masaru Sagiyama
  • Patent number: 5096546
    Abstract: The present invention relates to a process for treating a surface of a copper foil for producing the copper foil for a printed circuit board in which a zinc layer, a copper layer and a chromate layer are formed in turn on the copper foil. The product of the present invention is excellent in heat resistance and hydrochloric acid resistance and the process according to the present invention does not require the use of dangerous chemicals and is free from any problems on safety.
    Type: Grant
    Filed: February 28, 1990
    Date of Patent: March 17, 1992
    Assignee: Mitsui Kinzoku Kogyo Kabushiki Kaisha
    Inventors: Nobuo Kitamura, Makoto Fujiki, Yukio Kodama, Katsuhiro Yoshimura
  • Patent number: 5071520
    Abstract: A technique for improving the peel strength of copper and copper based alloy materials, and particularly for copper or copper based alloy materials which may be wrought or electrolytically deposited copper foil having an antitarnish treatment applied thereto, preferably by the use of a chromate-containing solution. The material is subjected to a rinse containing a silane coupling agent, which preferably is an organofunctional silane, and more preferably is an alkoxysilane derivative. Both the original peel strength and the peel strength after storage of the material so treated is enhanced.
    Type: Grant
    Filed: October 30, 1989
    Date of Patent: December 10, 1991
    Assignee: Olin Corporation
    Inventors: Lifun Lin, Paul Menkin