Coating A Substrate Predominantly Comprised Of Nonconductive Material To Which Conductive Material Or Material Which Can Be Converted Into Conductive Material Has Been Added (e.g., Nonconductive Polymer Substrate Containing Carbon Or Copper Oxide Particles, Etc.) Patents (Class 205/158)
  • Patent number: 10407604
    Abstract: Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 ?m to 20 ?m; and a filler having a grain diameter of 15 ?m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 ?m to 20 ?m.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: September 10, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Honami Nawa, Hirohisa Hino, Arata Kishi, Naomichi Ohashi, Yasuhiro Suzuki, Hidenori Miyakawa
  • Patent number: 10139724
    Abstract: The concepts described herein involve the use of random copolymer top coats that can be spin coated onto block copolymer thin films and used to control the interfacial energy of the top coat-block copolymer interface. The top coats are soluble in aqueous weak base and can change surface energy once they are deposited onto the block copolymer thin film. The use of self-assembled block copolymers to produce advanced lithographic patterns relies on their orientation control in thin films. Top coats potentially allow for the facile orientation control of block copolymers which would otherwise be quite challenging.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: November 27, 2018
    Assignee: Board of Regents The University of Texas System
    Inventors: C. Grant Willson, Christopher John Ellison, Takehiro Sleshimo, Julia Cushen, Christopher M. Bates, Leon Dean, Logan J. Santos, Erica L. Rausch
  • Patent number: 9852826
    Abstract: Described herein is a cable that includes a conductor surrounded by at least one semiconductive layer, wherein the layer comprises a polymer composition comprising a polypropylene homopolymer or a polypropylene copolymer with one or more comonomers, a polyolefin functionalized with an anhydride of a mono- or polycarboxylic acid, wherein said anhydride of a mono- or polycarboxylic acid can be linear or cyclic, wherein the functionalized polyolefin is different from the polypropylene homopolymer or polypropylene copolymer or the second polymer, and wherein the amount of the functionalized polyolefin is up to 10 wt % based on the total amount of the polymer composition, a solid conductive filler and a LDPE homopolymer or a LDPE copolymer of ethylene with one or more comonomers having a melting temperature (Tm) less than the Tm of the polypropylene homopolymer or polypropylene copolymer. Also described herein is a process for producing the polymer composition.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: December 26, 2017
    Assignee: BOREALIS AG
    Inventors: Thomas Steffl, Christer Svanberg
  • Patent number: 9657226
    Abstract: The present invention provides a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more, and the aqueous solution satisfying at least one of the following conditions (1) to (3): (1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, (2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and (3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L. The composition for etching treatment of the present invention is a composition containing no hexavalent chromium and having excellent etching performance and good bath stability.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: May 23, 2017
    Assignee: OKUNO CHEMICAL INDUSTRIES CO., LTD.
    Inventors: Shingo Nagamine, Koji Kita, Kuniaki Otsuka
  • Patent number: 9647027
    Abstract: An inorganic film is dry-etched using plasma with a photoresist pattern serving as a mask, and an organic film is dry-etched using plasma with the photoresist pattern serving as a mask without exposing a pad electrode. The photoresist pattern is removed using a stripping solution. After the removal of the photoresist pattern using a stripping solution, the organic film is etched to expose the pad electrode with the inorganic film that remains after the dry etching of the inorganic film using plasma serving as a mask.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: May 9, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroaki Sano, Yuto Nozaki
  • Patent number: 9281094
    Abstract: This invention relates to a method of forming a copper film on a Mo/SUS flexible substrate, which enables the copper film to be uniformly formed on the Mo/SUS flexible substrate in a short period of time by applying current and in which the copper film becomes thicker in proportion to an increase in a concentration of a copper precursor aqueous solution or in a current density.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: March 8, 2016
    Assignee: Korea University Research and Business Foundation
    Inventors: Chi-Woo Lee, Mi-Kyung Oh, Jeom-Sik Yang, Su-Byeong Chae, Sang-Min Lee
  • Patent number: 9023187
    Abstract: A method for electroplating titanium alloy coating into plastic and carbon foam comprises the steps of activating the given specimen, deposition of electroless nickel and electroplating process of titanium alloy to the surface of the specimen. The electroplating process of electroplating titanium alloy coating includes a direct current method and a pulse plating method. The direct current method characterized by lager sized grains and the pulse plating method characterized by smaller sized grains. The advantages of proposed electroplating processes are: a) low cost, b) very broad applications and c) relatively low number of the process steps. Unique combination of physical, mechanical and chemical properties makes the electroplating methods of titanium coating an attractive technology for medicine, biotechnology, sports, defense, aeronautic, and auto industries.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 5, 2015
    Assignee: Crista Chemical Company LLC
    Inventors: Margaret E Parker, Piotr Cieplak, Barbara Gorecka
  • Publication number: 20140272117
    Abstract: Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    Type: Application
    Filed: June 2, 2014
    Publication date: September 18, 2014
    Applicant: INTEGRAL TECHNOLOGIES, INC.
    Inventor: THOMAS AISENBREY
  • Publication number: 20140227827
    Abstract: The present technology generally relates to methods for metallizing an aluminum paste comprising contacting the aluminum paste with a cleaner, contacting the aluminum paste with an oxidation inhibiting deposit solution to deposit a layer of an oxidation inhibiting composition onto the aluminum paste and contacting the aluminum paste with conductive metal deposit solution to deposit a layer of a conductive metal onto the aluminum paste. Specifically, the present technology includes methods metallizing an aluminum paste comprising contacting the aluminum paste with an acidic cleaner, contacting the aluminum paste with an acid zincate solution to deposit zinc onto the aluminum paste and contacting the aluminum paste with an electroless nickel deposit solution to coat the aluminum paste with a nickel-phosphorus layer.
    Type: Application
    Filed: February 8, 2013
    Publication date: August 14, 2014
    Inventors: Richard Bellemare, Denis Morrissey, Anthony Piano
  • Publication number: 20140102770
    Abstract: The present invention relates to a core substrate, a manufacturing method thereof, and a structure for a metal via. In accordance with an embodiment of the present invention, a core substrate including: an insulation layer; a plurality of metal vias passing through the insulation layer and formed to become wider from upper and lower surfaces to a middle part of the insulation layer; and a conductive layer formed on the upper and lower surfaces of the insulation layer and connected to the plurality of metal vias. Further, a manufacturing method thereof and a structure for a metal via are provided.
    Type: Application
    Filed: September 10, 2013
    Publication date: April 17, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hoon CHOI, Jong Kuk HONG
  • Patent number: 8552730
    Abstract: The present invention provides a pH sensing apparatus that includes a flexible polymer substrate, one or more amorphous iridium oxide film sensor electrodes disposed on the flexible polymer substrate, and a reference electrode corresponding to each amorphous iridium oxide film sensor electrode. Each reference electrode is disposed on the flexible polymer substrate in close proximity to the corresponding amorphous iridium oxide film sensor electrode. The amorphous iridium oxide film sensor electrodes provide a potential in reference to the reference electrodes that varies according to a pH of a substance contacting the amorphous iridium oxide film sensor electrodes and the reference electrodes.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: October 8, 2013
    Assignee: Board of Regents, The University of Texas System
    Inventors: Jung-Chih Chiao, Wen-Ding Huang
  • Publication number: 20130134045
    Abstract: Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, and an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating. The anode chamber may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the anode chamber and the ionically resistive ionically permeable element during electroplating. The anode chamber may include an insulating shield oriented between the anode and the ionically resistive ionically permeable element, with opening in a central region of the insulating shield.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 30, 2013
    Inventors: David W. PORTER, Jonathan D. REID, Frederick D. WILMOT
  • Publication number: 20130122202
    Abstract: Disclosed herein is a component comprising a substantially homogeneous composition of at least one polymer selected from the group consisting of epoxies, acetals, polyesters, non-ionic rubbers, non-ionic polyurethanes, polyether sulfones, polyether ether ketones, polyether imides, polystyrenes, polyethylene terephthalates, polyamides, polyimides, polyvinylchlorides, polyphenylene oxides, polycarbonates, acrylonitrile-butadiene-styrene terpolymers, silicones, fluropolymers, and polyolefins, a filler, and a metal plating catalyst. A method of making a component also is described comprising obtaining a polymeric material, a liquid, a filler and a metal plating catalyst; combining the metal plating catalyst with the polymeric material, liquid, and filler to form a substantially homogeneous mixture; and evaporating and/or curing the mixture to form a solidified component.
    Type: Application
    Filed: December 21, 2012
    Publication date: May 16, 2013
    Applicant: XEROX CORPORATION
    Inventor: XEROX CORPORATION
  • Publication number: 20130078481
    Abstract: Metal coated molded polymer articles are described made from a polyoxymethylene polymer. In accordance with the present disclosure, the molded articles are produced from a polymer composition containing a functionalized polyoxymethylene polymer combined with a metal pigment. The functionalized polyoxymethylene polymer may comprise a polyoxymethylene polymer that has a significant amount of hydroxyl groups present in the terminal positions. The terminal positions can be on the end of the polymer chain or on the side of the polymer chain. In one embodiment, the metal coating is applied to the molded article using an electrolytic plating process. Electrolytic coatings applied to substrates made in accordance with the present disclosure have displayed excellent peel strengths.
    Type: Application
    Filed: September 27, 2012
    Publication date: March 28, 2013
    Applicant: Ticona LLC
    Inventor: Ticona LLC
  • Publication number: 20130001091
    Abstract: Provided is an electroplating apparatus including: a water tank that is filled with a non-polar solvent having a higher specific gravity than an electrolyte in which an electrolyte layer is formed on top of the non-polar solvent; a copper electrode that is installed at a portion where the electrolyte layer of the water tank is positioned; an insulating substrate that is disposed to be inserted into and withdrawn from the water tank and on which seed electrodes are formed; an actuator that escalates the insulating substrate up and down; and a power supply that applies electric current between the copper electrode and each of the seed electrodes, to thereby uniformly form thickness of a metal thin film on a large substrate and guarantee grain size.
    Type: Application
    Filed: July 14, 2011
    Publication date: January 3, 2013
    Inventors: Seung Ki JOO, Seung Jae YUN
  • Publication number: 20120312691
    Abstract: Functionalized membranes for use in applications, such as electrodeionization, can be prepared simply and efficiently by contacting a conductive carbon nanotube and polymer membrane with a solution containing at least one electrochemically active and functional compound under conditions suitable for electrochemically depositing the electrochemically active and function compound on a surface of the membrane.
    Type: Application
    Filed: June 13, 2011
    Publication date: December 13, 2012
    Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC
    Inventor: Seth Adrian Miller
  • Patent number: 8263488
    Abstract: The invention relates to the deposition or attachment of materials to surfaces. It relates to a process for coating a surface with a first material and a second material, comprising the following steps: placing the first material on the said surface, inserting into the first material placed on the said surface precursor molecules of the second material, converting the said precursor molecules of the second material inserted into the first material into the said second material such that this second material becomes formed on the said surface to be coated and within the said first material placed on the said surface. The object of the process of the invention is to allow the deposition of materials of any type onto surfaces of any type.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: September 11, 2012
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Pascal Viel, Sami Ameur, Christophe Bureau
  • Publication number: 20120193240
    Abstract: A carbon paste electrode is modified with a chemical agent that is selective for a plurality of lanthanides and actinides (f-series) elements. The modified carbon paste electrode selectively has different voltages applied thereto where a first voltage is used to cause the deposition of one or more lanthanides or actinides from an industrial or environmental sample onto the electrode, and, subsequent to removal of the electrode from the sample and insertion into a second sample where concentration of lanthanides or actinides is preferred, a second voltage is used to cause the deposited lanthanides and/or actinides to be discharged from the electrode for concentration into the second sample.
    Type: Application
    Filed: January 20, 2012
    Publication date: August 2, 2012
    Inventors: Sue B. Clark, Paul D. Schumacher
  • Publication number: 20120132532
    Abstract: Aluminum-plated components of semiconductor material processing apparatuses are disclosed. The components include a substrate and an optional intermediate layer formed on at least one surface of the substrate. The intermediate layer includes at least one surface. An aluminum plating is formed on the substrate, or on the optional intermediate layer. The surface on which the aluminum plating is formed is electrically-conductive. An anodized layer can optionally be formed on the aluminum plating. The aluminum plating or optional the anodized layer comprises a process-exposed surface of the component. Semiconductor material processing apparatuses including one or more aluminum-plated components, methods of processing substrates, and methods of making the aluminum-plated components are also disclosed.
    Type: Application
    Filed: January 31, 2012
    Publication date: May 31, 2012
    Applicant: Lam Research Corporation
    Inventors: Ian J. Kenworthy, Kelly W. Fong, Leonard J. Sharpless
  • Patent number: 8152914
    Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: April 10, 2012
    Assignee: Atotech Deutschland GmbH
    Inventors: Sigrid Schadow, Brigitte Dyrbusch, Carl Christian Fels
  • Publication number: 20120055801
    Abstract: Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.
    Type: Application
    Filed: September 2, 2010
    Publication date: March 8, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shafaat Ahmed, Hariklia Deligianni
  • Publication number: 20120031656
    Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer.
    Type: Application
    Filed: April 13, 2010
    Publication date: February 9, 2012
    Inventors: Yoshio Oka, Takashi Kasuga, Issei Okada, Katsunari Mikage, Naota Uenishi, Yasuhiro Okuda
  • Publication number: 20110297550
    Abstract: The prevent disclosure discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is possible.
    Type: Application
    Filed: August 19, 2011
    Publication date: December 8, 2011
    Applicant: Industrial Technology Research Institute
    Inventors: Jung-Fang Chang, Te-Chi Wong, Chien-Te Hsieh, Chin-Jen Huang, Yu-Hung Chen
  • Publication number: 20110262813
    Abstract: The present invention relates to a process for producing current collectors, current collectors made by such a process, and batteries containing current collectors made by such a process. The current collector is produced from a polymer substrate that is rendered electro-conductive and is electroplated at temperatures that are less than a softening temperature of the substrate. The substrate can be rendered electro-conductive by applying an electro-conductive material and/or by including a powder in the substrate, wherein the powder is carbon powder, a metal powder, or a metal-alloy powder.
    Type: Application
    Filed: March 11, 2011
    Publication date: October 27, 2011
    Applicant: EVT POWER INC.
    Inventor: Joey Chung Yen JUNG
  • Patent number: 8011100
    Abstract: In a method for producing plastic sanitary articles having surfaces metallized by electroplating, the sanitary article has at least one electrically nonconductive component, before said article is metallized by electroplating using an external current source. This component at least partially decouples the water-bearing regions of the sanitary article from the current flow during metallization by electroplating using the external current source. The component is preferably a separate component which can be reversibly connected to the sanitary article. The invention also includes the component for decoupling the current itself, and a sanitary article which is provided with the component.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: September 6, 2011
    Assignee: Hansgrohe AG
    Inventor: Andreas Fath
  • Publication number: 20110198229
    Abstract: The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate electrically, and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises a plurality of anode elements arranged in rows.
    Type: Application
    Filed: April 28, 2011
    Publication date: August 18, 2011
    Inventors: SARAVJEET SINGH, Manoocher Birang, Nicolay Y. Kovarsky, Aron Rosenfeld
  • Publication number: 20110140703
    Abstract: The present invention provides a pH sensing apparatus that includes a flexible polymer substrate, one or more amorphous iridium oxide film sensor electrodes disposed on the flexible polymer substrate, and a reference electrode corresponding to each amorphous iridium oxide film sensor electrode. Each reference electrode is disposed on the flexible polymer substrate in close proximity to the corresponding amorphous iridium oxide film sensor electrode. The amorphous iridium oxide film sensor electrodes provide a potential in reference to the reference electrodes that varies according to a pH of a substance contacting the amorphous iridium oxide film sensor electrodes and the reference electrodes.
    Type: Application
    Filed: October 25, 2010
    Publication date: June 16, 2011
    Applicant: BOARD OF REGENTS, UNIVERSITY OF TEXAS SYSTEM
    Inventors: Jung-Chih Chiao, Wen-Ding Huang
  • Publication number: 20090269606
    Abstract: The present invention provides a method for forming a metal film including: (a1) a step of providing, on a substrate, a polymer layer that includes a polymer containing a functional group that interacts with a metal ion or a metal salt, the polymer directly chemically bonding to the substrate; (a2) a step of applying a metal ion or a metal salt to the polymer layer; (a3) a step of reducing the metal ion or the metal salt to form a conductive layer having a surface resistivity of from 10 to 100 k?/square; and (a4) a step of forming a conductive layer having a surface resistivity of 1×10?1 ?/square or less by electroplating.
    Type: Application
    Filed: November 8, 2006
    Publication date: October 29, 2009
    Applicant: FUJIFLIM Corporation
    Inventor: Kazuhiko Matsumoto
  • Publication number: 20090183992
    Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.
    Type: Application
    Filed: March 26, 2009
    Publication date: July 23, 2009
    Inventors: Mikael FREDENBERG, Patrik Moller, Peter Wiwen-Nilsson
  • Patent number: 7560015
    Abstract: Apparatus and method for electrolytic coating of a mould, the internal surfaces of which demarcate a mould cavity, with a coating material for the purpose of achieving or re-achieving intended mould cavity dimensions. The mould, as the cathode, and an anode positioned in the mould cavity and an electrolyte containing the coating material are used. The electrolyte serving as the carrier of the coating material flows through the mould cavity in a controlled manner. During the electrolytic coating, only the internal surfaces of the mould cavity come into contact with the electrolyte and the external surfaces of the s mould therefore do not have to be covered. The mechanical properties can be kept largely uniform over the entire region. The coating can be achieved more rapidly than with the conventional processes.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: July 14, 2009
    Assignee: Concast AG
    Inventor: Adrian Stilli
  • Publication number: 20090176090
    Abstract: Disclosed is a method of forming an Al—C covalent bond between aluminum and a carbon material by applying an electric arc to a mixture of the aluminum and the carbon material under vacuum, heated and pressurized conditions. In order to enhance the reactivity of the carbon material, the method may include the step of introducing defects in the carbon material and thus functionalizing the carbon material by treating the carbon material with acid, a microwave, or plasma.
    Type: Application
    Filed: July 24, 2008
    Publication date: July 9, 2009
    Applicants: Sungkyunkwan University Foundation for Corporate Collaboration, Dayou Smart Aluminium Co., Ltd.
    Inventors: Kang Pyo So, Young Hee Lee, Kay Hyeok An
  • Publication number: 20080286585
    Abstract: The present invention is directed to a method for the adhesiveless deposition of metal, and especially copper, to the surface of polyimides and derivatives of polyimide. More specifically, the invention is directed to the method for surface modification of polyimides and derivatives of polyimides by plasma graft co-polymerization with the vapor deposition of an appropriate functional monomer followed by subsequent deposition of metal of interest through a process of electroless and electrolytic plating. The so deposited metal-polyimide interface exhibit a T-peel adhesive strength in excess of 10 N/cm with polyimide films with a thickness of 75 .mu.m.
    Type: Application
    Filed: November 10, 2006
    Publication date: November 20, 2008
    Inventor: Hon Pong Lem
  • Publication number: 20080265218
    Abstract: A layer (20) on a composite (22) of aluminum (26) and a non-conductive material (24) and a method of forming the layer (20) are described. A first embodiment comprises a method of forming a composite layer (101) comprising combining a non-conductive material (24) and aluminum (26) to form a composite (22), and electrochemically oxidizing (103) the aluminum (26) on a surface of the composite (22) to form aluminum oxide (28). In a particular embodiment, the non-conductive material (24) is diamond. In other particular embodiments, the step of combining (101) the non-conductive material (24) and aluminum (26) comprises at least one of cold spraying and electrolytic codeposition. In another particular embodiment, the oxidizing step (103) comprises anodizing. In yet another particular embodiment, the oxidizing step (103) comprises hard anodizing.
    Type: Application
    Filed: April 24, 2007
    Publication date: October 30, 2008
    Inventor: Alexandre D. Lifchits
  • Patent number: 7431816
    Abstract: A method for manufacturing a heat resistant resin film with a metal thin film is configured to include the steps of: biasing a conductive material to one surface of the heat resistant resin film; and applying electrolytic plating to the heat resistant resin film while using the conductive material biased to the one surface of the heat resistant resin film as an electrode, so as to form a metal thin film on the heat resistant resin film.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: October 7, 2008
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Ryuichiro Maeyama, Kazuyoshi Itoh, Yasutaka Naito, Hideaki Ohara
  • Patent number: 6866764
    Abstract: An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowing miniaturization of electronic components and/or increased interconnect capacity. The process may also be used for providing conductive pathways between opposite sides of a dielectric substrate and in decorative metallization applications.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: March 15, 2005
    Assignee: Michigan Molecular Institute
    Inventors: David A. Dalman, Petar R. Dvornic
  • Publication number: 20040222103
    Abstract: A process for direct metal-plating of a plastic substrate (14). The process comprises the steps of: (i) activating a surface of modified polyolefin substrate to produce an active surface (16), the active surface (16) having at least about 7% of carbon atoms in the form of carbonyl; (ii) electrochemically depositing metal layer (18) on the active surface (16).
    Type: Application
    Filed: October 7, 2002
    Publication date: November 11, 2004
    Inventors: Andrea Marsales, William E. Armstrong, Gary F. Chevalier
  • Patent number: 6803228
    Abstract: The present invention relates to a method to produce a biochip and to a biochip, said biochip being composed particularly of biological probes grafted onto a conductive polymer. The method according to the invention comprises the following steps: a) structuring of a substrate so as to obtain on said substrate microtroughs comprising in their base a layer of a material capable of initiating and promoting the adhesion onto said layer of a film of a pyrrole and functionalised pyrrole copolymer by electropolymerisation, b) collective electropolymerisation, so as to form an electropolymerised film of a pyrrole and functionalised pyrrole copolymer on the base of said microtroughs, c) direct or indirect fixation of functionalised oligonucleotides by microdeposition or a liquid jet printing technique.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: October 12, 2004
    Assignee: Commissariart A L'Energie Atomique
    Inventors: Patrice Caillat, Charles Rosilio
  • Publication number: 20040112755
    Abstract: The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate solution; treating the substrate surfaces with an acidic aqueous solution or an acidic microemulsion of aqueous base containing at least one thiophene compound and at least one alkane sulfonic acid selected from the group comprising methane sulfonic acid, ethane sulfonic acid and ethane disulfonic acid; electrolytically metallizing the substrate surfaces.
    Type: Application
    Filed: September 17, 2003
    Publication date: June 17, 2004
    Inventors: Regina Czeczka, Lutz Stamp
  • Publication number: 20040058088
    Abstract: Disclosed is a processing method for forming a thick film having an improved adhesion to a surface-modified substrate and an apparatus thereof enabling to form a thick film having the improved adhesion to a polymeric surface by modifying the polymeric surface to have a hydrophilic property. The method includes the steps of preparing a substrate of a polymer material, surface-modifying the substrate, forming a seed layer on the substrate, and forming the thick film on the seed layer. The apparatus includes an unloading area supplying a substrate of a polymer material, a surface treating area modifying a surface of the substrate, a seed layer formation area forming a seed layer on the surface-modified substrate, a thick film formation area forming a thick film on the seed layer, and a loading area loading the substrate.
    Type: Application
    Filed: September 2, 2003
    Publication date: March 25, 2004
    Inventors: Young-Whoan Beag, Sung Han, Jun-Sik Cho, Cheol-Su Lee, Sung-Soo Koh, Jin-Woo Seok
  • Publication number: 20040026254
    Abstract: Method for selectively metallizing dielectric materials, the method includes: adhesively covering dielectric materials with an activating layer comprising a conductive material, which layer is subsequently structured by way of laser ablation; and using a subsequent laser treatment to structure the activating layer in such a way that discrete conductive structures are formed, which are subsequently metallized.
    Type: Application
    Filed: August 4, 2003
    Publication date: February 12, 2004
    Inventors: Jurgen Hupe, Walter Kronenberg, Jorg Kickelhain, Dieter J. Meier
  • Patent number: 6680092
    Abstract: The invention concerns a method for producing high resolution patterns on a support comprising the following steps: high resolution printing of a varnish on the support; treating the support by electrolysis; washing and drying the support.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: January 20, 2004
    Assignee: Cabinet Erman S.A.R.L.
    Inventor: Michel Levy
  • Publication number: 20030155248
    Abstract: An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowing miniaturization of electronic components and/or increased interconnect capacity. The process may also be used for providing conductive pathways between opposite sides of a dielectric substrate and in decorative metallization applications.
    Type: Application
    Filed: February 21, 2002
    Publication date: August 21, 2003
    Inventors: David A. Dalman, Petar R. Dvornic
  • Publication number: 20030150740
    Abstract: A complex porous structure of a reticulated foam, felt or fabric types, wherein their metallisation over their entire developed surface, by electrolysis of lead or lead alloys, is made possible by a specific preliminary conductive activation treatment obtained by using two consecutive phases of coating the developed surface of the structures, comprising a first deposition of a conductive polymer, which provides the structures with the required conductivity, and a second thin deposition of conductive lacquer or varnish which ensures the surface protection of the conductive polymer against the deactivating effect of the conductive nature of the latter, due to the cathodic polarisation of the said structures in the electrolytic lead-coating bath.
    Type: Application
    Filed: January 30, 2003
    Publication date: August 14, 2003
    Inventors: Bernard Bugnet, Denis Doniat
  • Patent number: 6582581
    Abstract: A method for manufacture of a circuit method board which comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: June 24, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert L. Goldberg, Charles R. Shipley
  • Patent number: 6546751
    Abstract: A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of heat fusible material, such as glass or plastic, with a metal having a particle size less than about 500 mesh constituting at least 50% of the mixture, to the substrate in the desired pattern, heating the so-applied mixture until the heat fusible material fuses and bonds to the substrate, cleaning the substrate with the pattern thereon, and a electroplating the pattern with the desired finish metal. In one method in which the mixture includes glass, a negative resist is adhesively secured to the substrate and the mixture is applied. The resist disintegrates upon heating. In another method, used when the substrate is plastic, a mixture of plastic and metal in past form is applied to the substrate by silk screening or pad printing to form the pattern.
    Type: Grant
    Filed: August 16, 1999
    Date of Patent: April 15, 2003
    Inventor: Peter Jaeger
  • Publication number: 20020074234
    Abstract: An electroplating process for filling damascene structures on substrates, such as wafers having partially fabricated integrated circuits thereon, includes immersing a substrate, under bias, into a copper plating solution to eliminate thin seed layer dissolution and reduce copper oxide, an initiation step to repair discontinuities in a copper seed layer, superfill plating to fill the smallest features, reverse plating to remove the adsorbed plating additives and their by-products from the substrate, a second superfill plating to fill intermediate size features, a second reverse plating to remove adsorbed plating additives and their by-products from the substrate, and a bulk fill plating with high current density to fill large features. The superfill and reverse plating operations may be repeated more than twice prior to bulk filling in order to provide the desired surface morphology.
    Type: Application
    Filed: December 18, 2000
    Publication date: June 20, 2002
    Inventors: Valery M. Dubin, Dave W. Jentz, Christopher Collazo-Davila
  • Patent number: 6350609
    Abstract: A method of fabricating deposits of non-volatile substances, including biomacromolecules, in the form of spots and filing on a substrate surface by electrospray, where the deposits are used to determine the interaction of the deposited non-volatile substances to other substances. Also included in this method is the mass fabrication on a single chip of an array of single and multicomponent microsamples.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: February 26, 2002
    Assignee: New York University
    Inventors: Victor Morozov, Tamara Ya. Morozova
  • Publication number: 20010053647
    Abstract: The invention concerns the manufacture of complex metallic or metallized porous structures, wherein the electroplating metal over the entire developed surface is preceded by a specific pre-metallization of the basic structure. The pre-metallization is obtained by depositing a conductive polymer, which is deposited on the entire developed surface of the structure by the steps of an oxidizing pre-treatment of the structure, depositing in the liquid phase, a monomer having a polymerized foam that is electrically conductive, and polymerizing oxidation-doping of the monomer. The structures according to the invention are particularly intended for use as electrodes for the electrolysis of liquid effluents, as electrode supports for electrochemical generators, as catalyst supports, filtration media, phonic insulation, electromagnetic and nuclear protection structures, or for other applications.
    Type: Application
    Filed: July 12, 2001
    Publication date: December 20, 2001
    Inventors: Bernard Bugnet, Max Costa, Denis Doniat
  • Patent number: 6294111
    Abstract: Apparatus and methods for manufacturing electrochromic cells. Layers of various inks are printed on substrates by high speed printing means. The electrochromic cells comprise layers of electrode, electrolyte, and counter electrode ink materials which are printed on at least one substrate. When an electrical voltage differential is introduced between the electrode and counter electrode layers, an electrochemical reaction occurs in the electrochemical cell.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: September 25, 2001
    Assignee: Steinbeis IBL GmbH
    Inventors: James H. Shacklett, III, Philip M. Henry, Richard Snyder, Robert Anthony
  • Patent number: 6258241
    Abstract: A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter &xgr; less than approximately 10 such that the metal layer is of substantially uniform thickness. The polarization parameter &xgr; of less than approximately 10 for the electroplating bath can be achieved by numerous means, such as by providing a low metal ion concentration in the electroplating bath or by adding one or more additives to the electroplating bath. The present invention may be used with a variety of metals and resistive substrates.
    Type: Grant
    Filed: December 10, 1997
    Date of Patent: July 10, 2001
    Assignee: Lucent Technologies, Inc.
    Inventor: Ken M. Takahashi