Abstract: A fuel tank device for a vehicle that includes a plastic fuel tank having a conductive outer layer, a plastic filler pipe for filling the fuel tank, at least one metallic component, and an electrical connector to connect the metallic component to the conductive outer layer of the filler pipe. The metallic component is grounded via the electrical connector and the conductive outer layer of the filler pipe.

Abstract: An article includes a substrate formed of a molybdenum-based alloy. A barrier layer is disposed on the substrate. The barrier layer is formed of at least one noble metal.

Abstract: A plug-in connector and a semi-finished product include a strip of an aluminum alloy and at least one bonding layer of a copper/tin alloy electrolytically applied directly onto the aluminum alloy strip. The bonding layer has a thickness of at most 50 nm. A further metal layer or alloy layer is applied onto the bonding layer.

Abstract: Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.

Abstract: Disclosed herein is a method of coating, comprising providing an article having an internal passage therein to be coated; electrolytically applying a first layer that comprises chromium or a chromium alloy onto a surface of the internal passage; electrolytically applying a second layer comprising aluminum or an aluminum alloy onto the first layer; and heat treating the article to promote interdiffusion between the first layer and the second layer.

Abstract: A process of constructing a forming screen through metal deposition in a nonconductive preform structure to achieve a desired aspect ratio of the forming screen thickness to open area.

Abstract: A process for manufacturing a coated metal strip having a metallic corrosion protection coating is provided. The process includes passing a metal strip through a molten metal bath comprising from 2 to 8 wt % aluminum, 0 to 5 wt % magnesium, up to 0.3 wt % additional elements, and a balance including zinc and inevitable impurities, to yield a molten metal coated metal strip, wiping the molten metal coated metal strip with a nozzle spraying a gas on either side of the molten metal coated metal strip and cooling the coating in a controlled manner until the coating has completely solidified, to obtain the coated metal strip. A temperature of the molten metal bath is from 350 to 700° C., and the cooling is conducted at a rate less than 15° C./s between a temperature on leaving a unit where the wiping occurs and a start of solidification of the coating, and then at a rate greater than or equal to 15° C./s between a start and an end of solidification of the coating.

Abstract: An article includes a substrate formed of a molybdenum-based alloy. The molybdenum-based alloy has a composition that includes molybdenum, silicon, and boron. A barrier layer is disposed on the substrate. The barrier layer is formed of at least one noble metal.

Abstract: A Ni-plated steel sheet according to the present invention includes a steel sheet, a first Ni-plated layer which is formed at least on a one-sided surface of the steel sheet and contains Ni, and a second Ni-plated layer which is formed on the first Ni-plated layer and contains Ni. An average central-line roughness Ra at an interface between the first Ni-plated layer and the second Ni-plated layer is less than 0.1 ?m, an average central-line roughness Ra of a surface of the second Ni-plated layer is 0.1 ?m to 100 ?m, and a coating amount of Ni in the entirety of the first Ni-plated layer and the second Ni-plated layer is 20 mg/m2 to 2500 mg/m2 per one-sided surface in terms of metal Ni.

Abstract: A semiconductor device includes a first bonding surface disposed on a first component of the semiconductor device. A bond material is disposed on the first bonding surface, and a second bonding surface is disposed on a second component of the semiconductor device. The bond material is disposed on the second bonding surface. A first electroplated bond connects the bond material and the first bonding surface, and a second electroplated bond connects the bond material and the second bonding surface.

Abstract: A semiconductor device includes a first bonding surface disposed on a first component of the semiconductor device. A bond material is disposed on the first bonding surface, and a second bonding surface is disposed on a second component of the semiconductor device. The bond material is disposed on the second bonding surface. A first electroplated bond connects the bond material and the first bonding surface, and a second electroplated bond connects the bond material and the second bonding surface.

Abstract: This relates to a coated substrate for packaging applications including a recrystallisation annealed single reduced steel substrate or a double reduced steel substrate subjected to recrystallisation annealing between the first and second cold rolling treatment, wherein one or both sides of the substrate is coated with an iron-tin alloy layer which contains at least 80 weight percent (wt. %) of FeSn (50 at. % iron and 50 at. % tin) and wherein the iron-tin alloy layer or layers are provided with a chromium metal-chromium oxide coating layer produced by a trivalent chromium electroplating process, and wherein the thickness of the chromium metal—chromium oxide coating layer corresponds to at least 20 mg Cr/m2 and a process for producing the coated substrate.

Abstract: A lithium-ion battery having an anode including an array of nanowires electrochemically coated with a polymer electrolyte, and surrounded by a cathode matrix, forming thereby interpenetrating electrodes, wherein the diffusion length of the Li+ ions is significantly decreased, leading to faster charging/discharging, greater reversibility, and longer battery lifetime, is described. The battery design is applicable to a variety of battery materials. Methods for directly electrodepositing Cu2Sb from aqueous solutions at room temperature using citric acid as a complexing agent to form an array of nanowires for the anode, are also described. Conformal coating of poly-[Zn(4-vinyl-4?methyl-2,2?-bipyridine)3](PF6)2 by electroreductive polymerization onto films and high-aspect ratio nanowire arrays for a solid-state electrolyte is also described, as is reductive electropolymerization of a variety of vinyl monomers, such as those containing the acrylate functional group.

Abstract: There are provided a hot-dip galvanized steel pipe in which the plating layer thereof is less liable to peel off even if the steel pipe is worked, and a method of manufacturing the hot-dip galvanized steel pipe. The hot-dip galvanized steel pipe includes a steel pipe and the plating layer formed on the surface of the steel pipe. Throughout the entire depth of plating layer, the fn defined by the following formula is at least 99.9: fn=Fe+Al+Zn where, the symbol of an element in the formula represents the content (mass %) of that element in the plating layer.

Abstract: Provided are a surface-treated metal sheet which includes a nickel layer having improved corrosion resistance and a method of manufacturing a formed article. In a surface-treated metal sheet where a nickel layer is formed on a substrate, the proportion of (200) planes to a total of (111) planes, (200) planes, (220) planes and (311) planes with respect to the crystal plane orientations of the nickel layer is set to 40% or less. In a method of manufacturing a formed article using a surface-treated metal sheet where a nickel layer is formed on a substrate, the surface-treated metal sheet having the nickel layer where the proportion of (200) planes to a total of (111) planes, (200) planes, (220) planes and (311) planes is set to 40% or less with respect to the crystal plane orientations of the nickel layer is worked using a mold.

Abstract: Aspects include recording media with enhanced areal density through reduction of head media spacing, head keeper spacing, or head to soft underlayer spacing. Such aspects comprise replacing currently non-magnetic components of devices, such as interlayers and overcoats with components and compositions comprising magnetic materials. Other aspects relate to magnetic seed layers deposited within a recording medium. Preferably, these aspects, embodied as methods, systems and/or components thereof reduce effective magnetic spacing without sacrificing physical spacing.

Abstract: Iron containing substrates are electrically polarized in a pre-plating composition which activates the surface of the steel substrate to receive thin tin or tin alloy. The thin tin or tin alloy is electroplated onto the activate surface of the steel substrate. The thin tinplate and alloy have reduced amounts of pores in the surface.

Abstract: An electrode suitable for use as hydrogen-evolving cathode in electrolytic processes is obtained by thermal decomposition of a precursor consisting of an acetic solution of nitrates of ruthenium, and optionally of rare earths. The electrode displays a low cathodic hydrogen evolution overpotential, an improved tolerance to current reversal phenomena and a high duration in industrial operating conditions.

Abstract: The invention relates to an electrode for electrolytic processes, particularly to a cathode suitable for hydrogen evolution in an industrial electrolysis process comprising a metal substrate coated with an external catalytic layer containing crystalline ruthenium oxide having a highly ordered rutile-type structure with Ru Ru and Ru O bond length characterized by a Debye-Waller factor lower than a critical value. The catalytic outer layer may contain rare earth oxides, such as praseodymium. The electrode may also comprise an internal catalytic thin layer platinum-based, which gives an enhanced protection against accidental current reversal events.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: It is aimed to provide a plated member and a plated terminal for connector, to which a large current can be applied and which have both a low friction coefficient and high heat resistance, at low cost and provide a method for producing such a plated member and a method for producing such a plated terminal for connector. A silver-tin alloy layer for coating a surface of a base material made of copper or copper alloy and a silver coating layer for coating the silver-tin alloy layer and to be exposed on an outermost surface are simultaneously formed by heating to obtain a plated member after tin and silver plating layers are alternately laminated on the surface of the base material with the outermost surface formed by the silver plating layer.

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract: Coated articles and methods for applying coatings including a rhodium layer are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

Abstract: Al—Mnx/Al—Mny multilayers with a wide range of structures ranging from microcrystalline to nanocrystalline and amorphous were electrodeposited using a single bath method under galvanostatic control from room temperature ionic liquid. By varying the Mn composition by ?1-3 at. % between layers, the grain sizes in one material can be systematically modulated between two values. For example, one specimen alternates between grain sizes of about 21 and 52 nm, in an alloy of average composition of 10.3 at. % Mn. Nanoindentation testing revealed multilayers with finer grains and higher Mn content exhibited better resistance to plastic deformation. Other alloy systems also are expected to be electrodeposited under similar circumstances.

Abstract: The present invention describes a method of producing a p-type light-absorbing semiconductor copper zinc tin selenide/sulfide (Cu2(ZnxSn2-x)(SySe1-y)4) (abbreviated CZTS) with electrochemical deposition. It can be used in the production of solar cell when combined with an n-type inorganic or an organic semiconductor layer. The present method comprises a one-step or a sequence of depositions using electroplating to fabricate a low-cost and large-area CZTS solar cell, without using expensive and complicated deposition techniques or highly toxic and flammable chemicals in the production process. The present method significantly reduces the cost and energy requirement for production of solar cell.

Abstract: A circuit board material includes an electrical resistance material layer having a preselected resistivity adhered to the support layer, and a barrier layer adhered to the electrical resistive layer, and a conductive layer adhered to the barrier layer, wherein the barrier layer is plated on the conductive material such that the resistance of the subsequently applied resistive layer does not vary substantially during exposure to printed circuit board processing chemistries. The process for making the material is directed to adjusting the electro deposition of the barrier layer by using the time for etching the resistive layer of the circuit board material in a standard etching bath.

Abstract: Methods for producing a high temperature oxidation resistant coating on a superalloy component and the coated superalloy component produced thereby are provided. Aluminum or an aluminum alloy is applied to at least one surface of the superalloy component by electroplating in an ionic liquid aluminum plating bath to form a plated component. The plated component is heat treated at a first temperature of about 600° C. to about 650° C. and then further heat treated at a second temperature of about 700° C. to about 1050° C. for about 0.50 hours to about two hours or at a second temperature of about 750° C. to about 900° C. for about 12 to about 20 hours.

Abstract: An aluminum alloy component is protected by an electrodeposited aluminum coating. An electrodeposited intermediate aluminum-transition metal alloy and/or rare earth metal alloy layer between the aluminum alloy substrate and the protective coating enhances coating adhesion and corrosion resistance. The intermediate layer is formed by room temperature electrodeposition in ionic liquids.

Abstract: Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer is an alloy layer containing Cu6Sn5 as a major proportion and having a compound in which a part of Cu in the Cu6Sn5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an average thickness of the Sn-based surface layer is 0.2 ?m or more and 0.6 ?m or less; an oil-sump depth Rvk of the Cu—Sn alloy layer is 0.2 ?m or more; an area rate of the Cu—Sn alloy layer exposed at a surface of the Sn-based surface layer is 10% or more and 40% or less; and dynamic friction coefficient is 0.3 or less.

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract: The invention relates to a substrate with a corrosion resistant coating comprising at least one nickel layer and at least one chromium layer as finish. Between these layers, at least one tin-nickel alloy layer is deposited for suppression of corrosion reactions determined by CASS and Russian mud tests. The invention relates also to a method for producing such substrates with corrosion resistant coating.

Abstract: A Ni-containing-surface-treated steel sheet for a can, which is formed by stamping, includes a steel sheet having a first surface which becomes an outer surface of the can after the stamping; a Ni containing layer arranged on the first surface of the steel sheet; and a Ni—W alloy plating layer arranged on the Ni containing layer. The Ni containing layer includes a Fe—Ni diffusion alloy layer; a Ni content included in the Ni containing layer is from 5 g/m2 to 89 g/m2; a thickness of the Ni—W alloy plating layer is from 0.02 ?m to 2 ?m; and a W concentration in the Ni—W alloy plating layer is from 10% to 65% by mass %.

Abstract: Methods for producing a high temperature oxidation and hot corrosion resistant MCrAlX coating on a superalloy substrate include applying an M-metal, chromium, and aluminum or an aluminum alloy comprising a reactive element to at least one surface of the superalloy component by electroplating at electroplating conditions below 100° C. in a plating bath thereby forming a plated component and heat treating the plated component.

Abstract: This invention relates to a method for producing a metallic coating layer comprising nickel and molybdenum on an electrically conductive substrate by electrodeposition from an aqueous solution including nickel salts, gluconate anions and citrate anions wherein the substrate acts as the cathode and wherein molybdate is added and wherein the pH of the aqueous solution is adjusted between 5.0 and 8.5. The invention also relates to an electrically conductive substrate provided with such a metallic coating layer electrodeposited from the aqueous solution.

Abstract: White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.

Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.

Abstract: The present invention provides a method and precursor structure to form a solar cell absorber layer. The method includes electrodepositing a first layer including a film stack including at least a first film comprising copper, a second film comprising indium and a third film comprising gallium, wherein the first layer includes a first amount of copper, electrodepositing a second layer onto the first layer, the second layer including at least one of a second copper-indium-gallium-ternary alloy film, a copper-indium binary alloy film, a copper-gallium binary alloy film and a copper-selenium binary alloy film, wherein the second layer includes a second amount of copper, which is higher than the first amount of copper, and electrodepositing a third layer onto the second layer, the third layer including selenium; and reacting the precursor stack to form an absorber layer on the base.

Abstract: The present invention provides a method and precursor structure to form a Group IBIIIAIVA solar cell absorber layer. The method includes forming a Group IBIIIAVIA compound layer on a base by forming a precursor layer on the base through electrodepositing three different films, and then reacting the precursor layer with selenium to form the Group IBIIIAVIA compound layer on the base. The three films, described by the precursor layer, include in one embodiment a first alloy film comprising copper, indium and gallium, a second alloy film comprising copper and selenium formed on the first alloy film; and a selenium film formed on the second alloy film.

Abstract: The method of plating a stainless steel substrate including depositing a first plating metal layer over the stainless steel substrate), forming an interdiffusion layer in which elements of the stainless steel substrate and elements of the first plating metal layer interdiffuse, by applying a heat treatment to the stainless steel substrate coated by the first plating metal layer, and coating a second plating metal layer over the surface of the stainless steel substrate over which the interdiffusion layer is coated.

Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.

Abstract: Photovoltaic devices and methods for preparing a p-type semiconductor generally include electroplating a layer of gallium or a gallium alloy onto a conductive layer by contacting the conductive layer with a plating bath free of complexing agents including a gallium salt, methane sulfonic acid or sodium sulfate and an organic additive comprising at least one nitrogen atom and/or at least one sulfur atom, and a solvent; adjusting a pH of the solution to be less than 2.6 or greater than 12.6. The photovoltaic device includes an impurity in the p-type semiconductor layer selected from the group consisting of arsenic, antimony, bismuth, and mixtures thereof. Various photovoltaic precursor layers for forming CIS, CGS and CIGS p-type semiconductor structures can be formed by electroplating the gallium or gallium alloys in this manner. Also disclosed are processes for forming a thermal interface of gallium or a gallium alloy.

Abstract: The present invention relates to an ultra thin copper foil with a very low profile copper foil as a carrier, comprising a carrier foil a release layer and an ultra thin copper foil. The copper foil with the Very Low Profile, smooth on both sides (i.e. VLP copper foil) is used as the carrier foil, the said very low profile copper foil for supporting the ultra thin copper foil can bring advantages of no pinhole, excellent thickness uniformity and low surface roughness. The impact of a release layer on the bond strength between the carrier foil and the ultra thin copper foil is very significant, the release layer is composed of a quaternary metal alloy with peelability.

Abstract: Rubber-cord complex 9 having improved wet heat adhesive property between rubber and cord. The rubber-cord complex includes cord 10 comprising drawn plated wire 17 prepared by providing brass plated layer 16E on surface of element wire 15 and drawing the resulting plated wire and rubber 12 vulcanized and bonded to cord 10. The rubber-cord complex 9 has adhesion reaction layer 25 (formed by cross-linking sulfur and copper) between rubber 12 and brass plated layer 16E. Adhesion reaction layer 25 has average thickness of 50-1,000 nm. Interface S between adhesion reaction layer 25 and the rubber has a fractal dimension of 1.001-1.300 in a wet heat deterioration state after being subjected to vulcanization to bond rubber 12 thereto and being held at a temperature of 50-100° C. and a humidity of 60-100% for one hour to 20 days.

Abstract: Methods for producing a high temperature oxidation resistant coating on a superalloy component and the coated superalloy component produced thereby are provided. Aluminum or an aluminum alloy is applied to at least one surface of the superalloy component by electroplating in an ionic liquid aluminum plating bath to form a plated component. The plated component is heat treated at a first temperature of about 600° C. to about 650° C. and then further heat treated at a second temperature of about 700° C. to about 1050° C. for about 0.50 hours to about two hours or at a second temperature of about 750° C. to about 900° C. for about 12 to about 20 hours.

Abstract: A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver alloy layer onto the substantially pure tin layer.

Abstract: A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu—Sn alloy layer onto the second copper layer from a Cu—Sn electroplating solution; and electroplating a chromium layer onto the Cu—Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.

Abstract: A perpendicular write head, the write head having an air bearing surface, the write head including a magnetic write pole, wherein at the air bearing surface, the write pole has a trailing side, a leading side that is opposite the trailing side, and first and second sides; side gaps, wherein the side gaps are proximate the write pole along the first and second side edges; and side shields proximate the side gaps, wherein the side shields have gap facing surfaces and include at least one set of alternating layers of magnetic and non-magnetic materials, wherein only one kind of material makes up the gap facing surfaces at the air bearing surfaces.

Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.

Abstract: An electrochemical deposition method to form uniform and continuous Group IIIA material rich thin films with repeatability is provided. Such thin films are used in fabrication of semiconductor and electronic devices such as thin film solar cells. In one embodiment, the Group IIIA material rich thin film is deposited on an interlayer that includes 20-90 molar percent of at least one of In and Ga and at least 10 molar percent of an additive material including one of Cu, Se, Te, Ag and S. The thickness of the interlayer is adapted to be less than or equal to about 20% of the thickness of the Group IIIA material rich thin film.

Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.