Abstract: An resistive switch having a first platinum layer, an electrolyte layer that is formed by extrusion based additive manufacturing, a silver layer, and a second platinum layer, and methods of manufacturing and using the resistive switch.

Abstract: A method for producing a wired circuit board including a stainless steel supporting layer having a stainless steel terminal includes a first step of preparing the stainless steel supporting layer having a passive film formed on the surface thereof and a second step of forming a first gold plating layer on the surface of the stainless steel terminal. In the second step, the stainless steel supporting layer is immersed in a first gold plating solution containing a weak acid and a gold compound without containing a strong acid, and electricity is supplied to the stainless steel supporting layer so that the passive film is removed and the first gold plating layer is formed on the surface of the stainless steel terminal.

Abstract: Various embodiments described herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. In some cases, one or more membrane may be provided in contact with an ionically resistive element to minimize the degree to which electrolyte passes backwards from a cross flow manifold, through the ionically resistive element, and into an ionically resistive element manifold during electroplating. The membrane may be designed to route electrolyte in a desired manner in some embodiments. In these or other cases, one or more baffles may be provided in the ionically resistive element manifold to reduce the degree to which electrolyte is able to bypass the cross flow manifold by flowing back through the ionically resistive element and across the electroplating cell within the ionically resistive element manifold. These techniques can be used to improve the uniformity of electroplating results.

Abstract: A rolling bearing of the present invention includes an inner ring, an outer ring and a rolling element which are all made of a steel material, and (A) a surface of the rolling element is formed with an Ag coating film, and a raceway of at least one of the inner ring and the outer ring is formed with a Cr coating film or (B) a surface of the rolling element is formed with a Cr coating film, and a raceway of at least one of the inner ring and the outer ring is formed with a Cr coating film.

Abstract: The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.

Abstract: Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

Abstract: A plated material includes a base metal made from Cu or an alloy containing Cu as a main raw material, an underlayer made from Ni formed on the base metal, and an Ag plated layer formed on the underlayer. A thickness of the underlayer is 0.1 ?m to 1.0 ?m. A thickness of the Ag plated layer is 1.0 ?m or less.

Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.

Abstract: A method for producing a corrosion-resistant steel sheet made of an unalloyed or low-alloy and cold-rolled steel having a carbon content of less than 0.1 wt %. The method includes the following steps: applying a metal coating to the steel sheet; annealing the coated steel sheet in a recrystallizing manner by heating the coated steel sheet to temperatures in the recrystallization range by electromagnetic induction in an inert-gas atmosphere; and quenching the coated and annealed steel sheet. The metal coating is fused on during the recrystallization annealing.

Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.

Abstract: A method of mitigating tin whisker formation on electronic assemblies includes exposing tin metal in the electronic assembly to a mitigating agent that interacts with the tin metal to produce a product that is resistant to forming tin whiskers.

Abstract: Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.

Abstract: A high cycle and speed valve (10) includes a body (12), a valve seat (20) fixed within the body, and a diaphragm (24) that moves between a closed position in which the diaphragm is forced against the valve seat, and an open position in which the diaphragm is released from the valve seat. The valve seat includes a static section (40) that is secured within the body, and a dynamic section (42) that is compressed by the diaphragm when the diaphragm is in the closed position. The static section includes a radially extending flange (44) that is received in a recess (46) formed in the body to secure the static section in the body. The valve includes a body cavity relief space (52) into which the dynamic section compresses in the closed position. The valve further includes a cap (26) that has a dry film lubricant layer (58) that serves as a dry lubricant between the cap and the diaphragm.

Abstract: A bearing component part, a bearing component and a process for manufacturing the bearing component. The bearing component part comprises at least one circumferential peripheral surface, wherein the circumferential peripheral surface presents at least one groove extending along at least a part of the circumference of the peripheral surface, wherein the groove is arranged to receive a second material, the peripheral surface further presenting a first and a second portion located on opposite sides of the at least one groove along the circumference of the peripheral surface, wherein the bearing component part comprises a weldable metallic material.

Abstract: A magnetoresistive element according to an embodiment includes: a first magnetic layer, a second magnetic layer, and an intermediate layer disposed between the first magnetic layer and the second magnetic layer, the intermediate layer including: a first layer containing oxygen and at least one element of Cu, Au, and Ag; and a second layer containing Mg and oxygen, the second layer being disposed between the first layer and the second magnetic layer.

Abstract: Methods for producing a high temperature oxidation and hot corrosion resistant MCrAlX coating on a superalloy substrate include applying an M-metal, chromium, and aluminum or an aluminum alloy comprising a reactive element to at least one surface of the superalloy component by electroplating at electroplating conditions below 100° C. in a plating bath thereby forming a plated component and heat treating the plated component.

Abstract: A connector includes an outer connection element and an inner connection element. One of the outer connection element and inner connection element includes a plurality of fingers extending at an angle relative to a longitudinal axis of the connector.

Abstract: A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2. The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25, the plating liquid supply units 29 and 30, the plating liquid drain unit 31. While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.

Abstract: The invention relates to a method for producing packaging steel consisting of a cold-rolled steel sheet made of unalloyed or low-alloy steel having a carbon content of less than 0.1%. In order to provide high-strength packaging steel that has good formability and high corrosion resistance and can be produced in as energy-saving a manner as possible, the steel sheet according to the invention is first coated with a metallic coating and then annealed in a recrystallizing manner at a heating rate of more than 75 K/s and preferably more than 100 K/s to temperatures of more than 700° C., such that the metallic coating melts. The coated and annealed steel sheet is then quenched to normal temperature at a cooling rate of at least 100 K/s.

Abstract: A self-aligned repairing process for a barrier layer is provided. A repair layer is formed by chemical vapor deposition using an organometallic compound as a precursor gas. The precursor gas adsorbed on a dielectric layer exposed by defects in a barrier layer is transformed to an insulating metal oxide layer, and the precursor gas adsorbed on the barrier layer is transformed to a metal layer.

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract: An apparatus, a method, and an electrolytic solution are described for electropolishing metallic stents made, for example, of high-strength medical alloys. The apparatus may include an electropolishing container made from material of low thermal conductivity. The apparatus may include at least one spiral cathode for optimization of solution agitation and/or voltage distribution in the electrolytic solution. Further, an electrolytic solution including at least dimethylsulfate is described. A method for improved electropolishing to consistently produce smooth surfaces is also described.

Abstract: Anodes for proportional radiation counters and a process of making the anodes is provided. The nano-sized anodes when present within an anode array provide: significantly higher detection efficiencies due to the inherently higher electric field, are amenable to miniaturization, have low power requirements, and exhibit a small electromagnetic field signal. The nano-sized anodes with the incorporation of neutron absorbing elements (e.g., 10B) allow the use of neutron detectors that do not use 3He.

Abstract: Methods for electrochemical deposition of a metal coating on a metal substrate are described. The method may use an ionic liquid as an electrolyte, and the substrate may comprise a first metallic element. Method steps may include pretreating the substrate by etching in an ionic liquid containing metal ions of a second metallic element, removing metal ions of the first metallic element from the substrate, wherein the metal ions of the first metallic element are received by the ionic liquid, depositing a transition layer on the substrate from the ionic liquid, wherein metal ions of the first and second metallic elements are incorporated in the transition layer, and depositing a coating on the transition layer by electrochemical deposition from an ionic liquid containing ions of the second metallic element.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: 2 nm-5 micron), entirely coarse-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.

Abstract: This relates to a coated substrate for packaging applications and a method for producing the coated substrate.

Abstract: A perpendicular write head, the write head having an air bearing surface, the write head including a magnetic write pole, wherein at the air bearing surface, the write pole has a trailing side, a leading side that is opposite the trailing side, and first and second sides; side gaps, wherein the side gaps are proximate the write pole along the first and second side edges; and side shields proximate the side gaps, wherein the side shields have gap facing surfaces and include at least one set of alternating layers of magnetic and non-magnetic materials, wherein only one kind of material makes up the gap facing surfaces at the air bearing surfaces.

Abstract: Coated articles and methods for applying coatings including a rhodium layer are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

Abstract: Techniques for electrodepositing selenium (Se)-containing films are provided. In one aspect, a method of preparing a Se electroplating solution is provided. The method includes the following steps. The solution is formed from a mixture of selenium oxide; an acid selected from the group consisting of alkane sulfonic acid, alkene sulfonic acid, aryl sulfonic acid, heterocyclic sulfonic acid, aromatic sulfonic acid and perchloric acid; and a solvent. A pH of the solution is then adjusted to from about 2.0 to about 3.0. The pH of the solution can be adjusted to from about 2.0 to about 3.0 by adding a base (e.g., sodium hydroxide) to the solution. A Se electroplating solution, an electroplating method and a method for fabricating a photovoltaic device are also provided.

Abstract: A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.

Abstract: A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

Abstract: A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

Abstract: Methods for producing a high temperature oxidation resistant coating on a superalloy component and the coated superalloy component produced thereby are provided. Aluminum or an aluminum alloy is applied to at least one surface of the superalloy component by electroplating in an ionic liquid aluminum plating bath to form a plated component. The plated component is heat treated at a first temperature of about 600° C. to about 650° C. and then further heat treated at a second temperature of about 700° C. to about 1050° C. for about 0.50 hours to about two hours or at a second temperature of about 750° C. to about 900° C. for about 12 to about 20 hours.

Abstract: The present disclosure relates to the application of anti-corrosion coatings for a ferrous substrate. The first coating applied to the ferrous substrate is an electrocoat composition comprising electrically conductive pigments. A dried a cured coating layer of the first electrocoat composition provides the basis for a second electrocoat composition.

Abstract: Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component during machining. More specifically, techniques are disclosed to increase the rate of secondary metal deposition between primary metal features in order to prevent voiding in the sacrificial secondary metal and thus enhance structural support of the primary metal during machining.

Abstract: A method of forming a tool marking structure includes: a coloring step of coloring a predetermined position of the first protective layer so as to form a marking area with a color layer and forming the first protective layer on a bottom surface of the marking area, and a second-time surface processing step of forming a second protective layer on a non-marking area of the tool.

Abstract: The object of the present invention is to provide a process for producing a metal substrate of superior corrosion resistance and finish, and a surface-treated metal substrate obtained by the process; and a surface treatment process that is capable of providing a metal substrate of superior corrosion resistance and finish, and a surface-treated metal substrate obtained by the process. Specifically, the present invention provides a process for producing a surface-treated metal substrate, comprising the steps of immersing a metal substrate for use as a cathode in a treatment composition (I) comprising water and metal component (A), and applying electric current thereto for 10 to 600 seconds by superposing an AC voltage (Va) with a frequency of 0.1 to 1,000 Hz and a peak-to-peak voltage of 1 to 40 V onto a 1 to 50 V DC voltage (Vd).

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract: Methods for producing a high temperature oxidation and hot corrosion resistant MCrAlX coating on a superalloy substrate include applying an M-metal, chromium, and aluminum or an aluminum alloy comprising a reactive element to at least one surface of the superalloy component by electroplating at electroplating conditions below 100° C. in a plating bath thereby forming a plated component and heat treating the plated component.

Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: This invention relates to apparatus for electrochemical deposition onto the surface of a substrate. The apparatus includes an anode electrode 13 a support 12 for supporting the substrate 11 with its one surface 21 exposed at a location, the support and the anode electrode 13 being relatively movable to alter the gap between the anode 13 and the location to define a chamber between them and an electrical power source 18 with an ohmic contact to the seed layer 20 for creating a potential difference across the gap. The apparatus further includes a seal 14 for sealing with the seed layer 20 to define the fluid chamber 23; and the flu inlet 16 and a fluid outlet 17 to the chamber 13.

Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. An exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinide, lanthanides, and oxides thereof. An exemplary article (150) may comprise a biaxially textured base material (130), and at least one biaxially textured layer (110) selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer (110) is formed by electrodeposition on the biaxially textured base material (130).

Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.

Abstract: The present disclosure relates to a microcapsule and a method of forming a microcapsule which may be used for oxygen sensitive materials. The microcapsule may comprise a shell encapsulating a core material having a surface, wherein the shell comprises a first organic or inorganic polyelectrolyte providing a plurality of cationic or anionic charges. This may then be followed by forming a first layer comprising an inorganic or organic polyelectrolyte on the microcapsule surface, where the polyelectrolyte of the first layer provides a plurality of cationic or anionic charges, opposite to the charge of the shell polyelectrolyte. This may then be followed by forming a second layer comprising a second organic or inorganic polyelectrolyte providing a plurality of cationic or anionic charges, opposite to the charge of the first layer polyelectrolyte.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: A method for coating a substrate includes immersion depositing a first coating layer onto a substrate such that the first coating layer is deposited in a wet state with regard to water and solvents in the first coating layer. While the first coating layer is in the wet state, a second coating layer is immersion deposited onto the first coating layer. The first coating layer and the second coating layer are then co-dried to substantially remove any water and solvents.

Abstract: A method of manufacturing a hydrogen generating apparatus, the method including: forming an absorbent layer, the absorbent layer configured to absorb an aqueous solution; depositing a metal membrane over either side of the absorbent layer such that the absorbent layer is interposed between the metal membranes; and forming a support layer over one side of one of the metal membranes, the support layer configured to transport hydrogen generated by a reaction between the aqueous solution and the metal membrane.

Abstract: A manufacturing method of a casing of electronic device including the following steps is provided. A casing body is provided, and the material of the casing body being metal. An oxide ceramic layer is formed on a surface of the casing body, wherein the step of forming the oxide ceramic layer on the surface of the casing body is a Micro Arc Oxidation (MAO) process. A casing of electronic device including a casing body and an oxide ceramic layer is also disclosed. The material of the casing body is metal. The oxide ceramic layer is located on a surface of the casing body.