Forming Multiple Superposed Electrolytic Coatings Patents (Class 205/170)
  • Patent number: 10373730
    Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: August 6, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
  • Patent number: 10227671
    Abstract: A method for producing a corrosion-resistant steel sheet made of an unalloyed or low-alloy and cold-rolled steel having a carbon content of less than 0.1 wt %. The method includes the following steps: applying a metal coating to the steel sheet; annealing the coated steel sheet in a recrystallizing manner by heating the coated steel sheet to temperatures in the recrystallization range by electromagnetic induction in an inert-gas atmosphere; and quenching the coated and annealed steel sheet. The metal coating is fused on during the recrystallization annealing.
    Type: Grant
    Filed: October 14, 2013
    Date of Patent: March 12, 2019
    Assignee: THYSSENKRUPP RASSELSTEIN GMBH
    Inventors: Helmut Oberhoffer, Anika Szesni, Manuel Köhl, Dimitrios Nouskalis, Reiner Sauer
  • Patent number: 10196745
    Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: February 5, 2019
    Assignee: General Electric Company
    Inventors: Christopher Kapusta, Marco Francesco Aimi
  • Patent number: 9920415
    Abstract: A method of mitigating tin whisker formation on electronic assemblies includes exposing tin metal in the electronic assembly to a mitigating agent that interacts with the tin metal to produce a product that is resistant to forming tin whiskers.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: March 20, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Eric V Kline
  • Patent number: 9914115
    Abstract: Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: March 13, 2018
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Kristen M. Milum, Donald E. Cleary, Maria A. Rzeznik
  • Patent number: 9885421
    Abstract: A high cycle and speed valve (10) includes a body (12), a valve seat (20) fixed within the body, and a diaphragm (24) that moves between a closed position in which the diaphragm is forced against the valve seat, and an open position in which the diaphragm is released from the valve seat. The valve seat includes a static section (40) that is secured within the body, and a dynamic section (42) that is compressed by the diaphragm when the diaphragm is in the closed position. The static section includes a radially extending flange (44) that is received in a recess (46) formed in the body to secure the static section in the body. The valve includes a body cavity relief space (52) into which the dynamic section compresses in the closed position. The valve further includes a cap (26) that has a dry film lubricant layer (58) that serves as a dry lubricant between the cap and the diaphragm.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: February 6, 2018
    Assignee: Parker-Hannifin Corporation
    Inventors: Daniel P. Morgan, Thomas A. Austin
  • Patent number: 9850950
    Abstract: A bearing component part, a bearing component and a process for manufacturing the bearing component. The bearing component part comprises at least one circumferential peripheral surface, wherein the circumferential peripheral surface presents at least one groove extending along at least a part of the circumference of the peripheral surface, wherein the groove is arranged to receive a second material, the peripheral surface further presenting a first and a second portion located on opposite sides of the at least one groove along the circumference of the peripheral surface, wherein the bearing component part comprises a weldable metallic material.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: December 26, 2017
    Assignee: AKTIEBOLAGET SKF
    Inventor: Ingemar Strandell
  • Patent number: 9837105
    Abstract: A magnetoresistive element according to an embodiment includes: a first magnetic layer, a second magnetic layer, and an intermediate layer disposed between the first magnetic layer and the second magnetic layer, the intermediate layer including: a first layer containing oxygen and at least one element of Cu, Au, and Ag; and a second layer containing Mg and oxygen, the second layer being disposed between the first layer and the second magnetic layer.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: December 5, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Susumu Hashimoto, Satoshi Shirotori, Hitoshi Iwasaki
  • Patent number: 9771661
    Abstract: Methods for producing a high temperature oxidation and hot corrosion resistant MCrAlX coating on a superalloy substrate include applying an M-metal, chromium, and aluminum or an aluminum alloy comprising a reactive element to at least one surface of the superalloy component by electroplating at electroplating conditions below 100° C. in a plating bath thereby forming a plated component and heat treating the plated component.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: September 26, 2017
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Derek Raybould, Vincent Chung, George Reimer, Lee Poandl
  • Patent number: 9755377
    Abstract: A connector includes an outer connection element and an inner connection element. One of the outer connection element and inner connection element includes a plurality of fingers extending at an angle relative to a longitudinal axis of the connector.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: September 5, 2017
    Assignee: ASTRIUM LIMITED
    Inventors: Mark Anthony Kunes, Paul Thomas McMahon
  • Patent number: 9731322
    Abstract: A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2. The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25, the plating liquid supply units 29 and 30, the plating liquid drain unit 31. While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: August 15, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takashi Tanaka, Yusuke Saito, Mitsuaki Iwashita, Takayuki Toshima
  • Patent number: 9650692
    Abstract: The invention relates to a method for producing packaging steel consisting of a cold-rolled steel sheet made of unalloyed or low-alloy steel having a carbon content of less than 0.1%. In order to provide high-strength packaging steel that has good formability and high corrosion resistance and can be produced in as energy-saving a manner as possible, the steel sheet according to the invention is first coated with a metallic coating and then annealed in a recrystallizing manner at a heating rate of more than 75 K/s and preferably more than 100 K/s to temperatures of more than 700° C., such that the metallic coating melts. The coated and annealed steel sheet is then quenched to normal temperature at a cooling rate of at least 100 K/s.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: May 16, 2017
    Assignee: ThyssenKrupp Rasselstein GmbH
    Inventors: Anika Szesni, Helmut Oberhoffer, Martin Schlupp, Dirk Matusch, Reiner Sauer
  • Patent number: 9640428
    Abstract: A self-aligned repairing process for a barrier layer is provided. A repair layer is formed by chemical vapor deposition using an organometallic compound as a precursor gas. The precursor gas adsorbed on a dielectric layer exposed by defects in a barrier layer is transformed to an insulating metal oxide layer, and the precursor gas adsorbed on the barrier layer is transformed to a metal layer.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: May 2, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chien Chi, Chung-Chi Ko, Mei-Ling Chen, Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh
  • Patent number: 9320142
    Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: April 19, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min Baek, Yoon Su Kim, Jin Hyuck Yang, Chang Bae Lee
  • Patent number: 9255341
    Abstract: An apparatus, a method, and an electrolytic solution are described for electropolishing metallic stents made, for example, of high-strength medical alloys. The apparatus may include an electropolishing container made from material of low thermal conductivity. The apparatus may include at least one spiral cathode for optimization of solution agitation and/or voltage distribution in the electrolytic solution. Further, an electrolytic solution including at least dimethylsulfate is described. A method for improved electropolishing to consistently produce smooth surfaces is also described.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: February 9, 2016
    Assignee: ABBOTT LABORATORIES VASCULAR ENTERPRISES LIMITED
    Inventor: Elena Wulf
  • Patent number: 9075148
    Abstract: Anodes for proportional radiation counters and a process of making the anodes is provided. The nano-sized anodes when present within an anode array provide: significantly higher detection efficiencies due to the inherently higher electric field, are amenable to miniaturization, have low power requirements, and exhibit a small electromagnetic field signal. The nano-sized anodes with the incorporation of neutron absorbing elements (e.g., 10B) allow the use of neutron detectors that do not use 3He.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: July 7, 2015
    Assignee: SAVANNAH RIVER NUCLEAR SOLUTIONS, LLC
    Inventors: Joseph V. Cordaro, Steven M. Serkiz, Christopher S. McWhorter, Lindsay T. Sexton, Scott T. Retterer
  • Publication number: 20150147586
    Abstract: Methods for electrochemical deposition of a metal coating on a metal substrate are described. The method may use an ionic liquid as an electrolyte, and the substrate may comprise a first metallic element. Method steps may include pretreating the substrate by etching in an ionic liquid containing metal ions of a second metallic element, removing metal ions of the first metallic element from the substrate, wherein the metal ions of the first metallic element are received by the ionic liquid, depositing a transition layer on the substrate from the ionic liquid, wherein metal ions of the first and second metallic elements are incorporated in the transition layer, and depositing a coating on the transition layer by electrochemical deposition from an ionic liquid containing ions of the second metallic element.
    Type: Application
    Filed: June 6, 2013
    Publication date: May 28, 2015
    Inventors: Joost Remi Margueritte De Strycker, Philippe Jose Gaston Hubert Verpoort, Eva Diaz Gonzales, Krista Godelieve Oscar Van Den Bergh, Robbie Van De Coevering
  • Publication number: 20150108004
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Application
    Filed: December 31, 2014
    Publication date: April 23, 2015
    Inventor: Adam L. Cohen
  • Patent number: 9005420
    Abstract: Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: 2 nm-5 micron), entirely coarse-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: April 14, 2015
    Assignee: Integran Technologies Inc.
    Inventors: Klaus Tomantschger, Glenn Hibbard, Gino Palumbo, Iain Brooks, Jonathan McCrea, Fred Smith
  • Publication number: 20150037604
    Abstract: This relates to a coated substrate for packaging applications and a method for producing the coated substrate.
    Type: Application
    Filed: April 10, 2013
    Publication date: February 5, 2015
    Inventors: Jan Paul Penning, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
  • Publication number: 20150014174
    Abstract: A perpendicular write head, the write head having an air bearing surface, the write head including a magnetic write pole, wherein at the air bearing surface, the write pole has a trailing side, a leading side that is opposite the trailing side, and first and second sides; side gaps, wherein the side gaps are proximate the write pole along the first and second side edges; and side shields proximate the side gaps, wherein the side shields have gap facing surfaces and include at least one set of alternating layers of magnetic and non-magnetic materials, wherein only one kind of material makes up the gap facing surfaces at the air bearing surfaces.
    Type: Application
    Filed: September 29, 2014
    Publication date: January 15, 2015
    Inventors: Christina Laura Hutchinson, David Christopher Seets
  • Publication number: 20150004434
    Abstract: Coated articles and methods for applying coatings including a rhodium layer are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.
    Type: Application
    Filed: July 1, 2013
    Publication date: January 1, 2015
    Applicant: Xtalic Corporation
    Inventors: Trevor Goodrich, John Cahalen, Alan C. Lund, Christopher A. Schuh
  • Publication number: 20140346051
    Abstract: Techniques for electrodepositing selenium (Se)-containing films are provided. In one aspect, a method of preparing a Se electroplating solution is provided. The method includes the following steps. The solution is formed from a mixture of selenium oxide; an acid selected from the group consisting of alkane sulfonic acid, alkene sulfonic acid, aryl sulfonic acid, heterocyclic sulfonic acid, aromatic sulfonic acid and perchloric acid; and a solvent. A pH of the solution is then adjusted to from about 2.0 to about 3.0. The pH of the solution can be adjusted to from about 2.0 to about 3.0 by adding a base (e.g., sodium hydroxide) to the solution. A Se electroplating solution, an electroplating method and a method for fabricating a photovoltaic device are also provided.
    Type: Application
    Filed: August 13, 2014
    Publication date: November 27, 2014
    Inventors: Shafaat Ahmed, Hariklia Deligianni
  • Patent number: 8859049
    Abstract: A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: October 14, 2014
    Assignee: Ace Technologies Corp.
    Inventors: Hyun-Yeong Jung, Myoung-Joon Jung
  • Publication number: 20140216943
    Abstract: A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.
    Type: Application
    Filed: August 19, 2013
    Publication date: August 7, 2014
    Applicant: International Business Machines Corporation
    Inventors: Robert E. Fontana, JR., William J. Gallagher, Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang, Bucknell C. Webb
  • Publication number: 20140216939
    Abstract: A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.
    Type: Application
    Filed: February 6, 2013
    Publication date: August 7, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Robert E. Fontana, JR., William J. Gallagher, Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang, Bucknell C. Webb
  • Patent number: 8778164
    Abstract: Methods for producing a high temperature oxidation resistant coating on a superalloy component and the coated superalloy component produced thereby are provided. Aluminum or an aluminum alloy is applied to at least one surface of the superalloy component by electroplating in an ionic liquid aluminum plating bath to form a plated component. The plated component is heat treated at a first temperature of about 600° C. to about 650° C. and then further heat treated at a second temperature of about 700° C. to about 1050° C. for about 0.50 hours to about two hours or at a second temperature of about 750° C. to about 900° C. for about 12 to about 20 hours.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: July 15, 2014
    Assignee: Honeywell International Inc.
    Inventors: James Piascik, Derek Raybould, George Reimer
  • Publication number: 20140190836
    Abstract: The present disclosure relates to the application of anti-corrosion coatings for a ferrous substrate. The first coating applied to the ferrous substrate is an electrocoat composition comprising electrically conductive pigments. A dried a cured coating layer of the first electrocoat composition provides the basis for a second electrocoat composition.
    Type: Application
    Filed: May 23, 2012
    Publication date: July 10, 2014
    Inventor: Taddesse Gebregiorgis
  • Patent number: 8747642
    Abstract: Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component during machining. More specifically, techniques are disclosed to increase the rate of secondary metal deposition between primary metal features in order to prevent voiding in the sacrificial secondary metal and thus enhance structural support of the primary metal during machining.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: June 10, 2014
    Assignee: Advantest America, Inc.
    Inventor: Montray Leavy
  • Publication number: 20140120262
    Abstract: A method of forming a tool marking structure includes: a coloring step of coloring a predetermined position of the first protective layer so as to form a marking area with a color layer and forming the first protective layer on a bottom surface of the marking area, and a second-time surface processing step of forming a second protective layer on a non-marking area of the tool.
    Type: Application
    Filed: June 5, 2013
    Publication date: May 1, 2014
    Inventor: Leo Shih
  • Patent number: 8702954
    Abstract: The object of the present invention is to provide a process for producing a metal substrate of superior corrosion resistance and finish, and a surface-treated metal substrate obtained by the process; and a surface treatment process that is capable of providing a metal substrate of superior corrosion resistance and finish, and a surface-treated metal substrate obtained by the process. Specifically, the present invention provides a process for producing a surface-treated metal substrate, comprising the steps of immersing a metal substrate for use as a cathode in a treatment composition (I) comprising water and metal component (A), and applying electric current thereto for 10 to 600 seconds by superposing an AC voltage (Va) with a frequency of 0.1 to 1,000 Hz and a peak-to-peak voltage of 1 to 40 V onto a 1 to 50 V DC voltage (Vd).
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: April 22, 2014
    Assignee: Kansai Paint Co., Ltd.
    Inventor: Kentaro Kubota
  • Patent number: 8702956
    Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: April 22, 2014
    Assignee: Microfabrica Inc.
    Inventors: Uri Frodis, Adam L. Cohen, Michael S. Lockard
  • Publication number: 20130341197
    Abstract: Methods for producing a high temperature oxidation and hot corrosion resistant MCrAlX coating on a superalloy substrate include applying an M-metal, chromium, and aluminum or an aluminum alloy comprising a reactive element to at least one surface of the superalloy component by electroplating at electroplating conditions below 100° C. in a plating bath thereby forming a plated component and heat treating the plated component.
    Type: Application
    Filed: February 6, 2012
    Publication date: December 26, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Derek Raybould, Vincent Chung, George Reimer, Lee Poandl
  • Patent number: 8613846
    Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: December 24, 2013
    Assignee: Microfabrica Inc.
    Inventors: Ming Ting Wu, Rulon Joseph Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
  • Patent number: 8603316
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: December 10, 2013
    Assignee: University of Southern California
    Inventor: Adam L. Cohen
  • Publication number: 20130313124
    Abstract: This invention relates to apparatus for electrochemical deposition onto the surface of a substrate. The apparatus includes an anode electrode 13 a support 12 for supporting the substrate 11 with its one surface 21 exposed at a location, the support and the anode electrode 13 being relatively movable to alter the gap between the anode 13 and the location to define a chamber between them and an electrical power source 18 with an ohmic contact to the seed layer 20 for creating a potential difference across the gap. The apparatus further includes a seal 14 for sealing with the seed layer 20 to define the fluid chamber 23; and the flu inlet 16 and a fluid outlet 17 to the chamber 13.
    Type: Application
    Filed: December 8, 2011
    Publication date: November 28, 2013
    Applicant: PICO-FLUIDICS LIMITED
    Inventor: John Macneil
  • Patent number: 8586506
    Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. An exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinide, lanthanides, and oxides thereof. An exemplary article (150) may comprise a biaxially textured base material (130), and at least one biaxially textured layer (110) selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer (110) is formed by electrodeposition on the biaxially textured base material (130).
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: November 19, 2013
    Assignee: Alliance for Sustainable Energy, LLC
    Inventors: Raghu N. Bhattacharya, Sovannary Phok, Priscila Spagnol, Tapas Chaudhuri
  • Patent number: 8568899
    Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: October 29, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Naonori Michishita, Nobuhito Makino
  • Patent number: 8557382
    Abstract: The present disclosure relates to a microcapsule and a method of forming a microcapsule which may be used for oxygen sensitive materials. The microcapsule may comprise a shell encapsulating a core material having a surface, wherein the shell comprises a first organic or inorganic polyelectrolyte providing a plurality of cationic or anionic charges. This may then be followed by forming a first layer comprising an inorganic or organic polyelectrolyte on the microcapsule surface, where the polyelectrolyte of the first layer provides a plurality of cationic or anionic charges, opposite to the charge of the shell polyelectrolyte. This may then be followed by forming a second layer comprising a second organic or inorganic polyelectrolyte providing a plurality of cationic or anionic charges, opposite to the charge of the first layer polyelectrolyte.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: October 15, 2013
    Assignee: Southwest Research Institute
    Inventors: James D Oxley, Jenny J. Finkbiner, Darren E. Barlow
  • Patent number: 8551315
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: October 8, 2013
    Assignee: University of Southern California
    Inventor: Adam L. Cohen
  • Publication number: 20130243944
    Abstract: A method of manufacturing a hydrogen generating apparatus, the method including: forming an absorbent layer, the absorbent layer configured to absorb an aqueous solution; depositing a metal membrane over either side of the absorbent layer such that the absorbent layer is interposed between the metal membranes; and forming a support layer over one side of one of the metal membranes, the support layer configured to transport hydrogen generated by a reaction between the aqueous solution and the metal membrane.
    Type: Application
    Filed: May 1, 2013
    Publication date: September 19, 2013
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hye-Yeon CHA, Young-Soo Oh, Jae-Hyuk Jang, Chang-Ryul Jung, Jae-Hyoung Gil
  • Publication number: 20130243960
    Abstract: A method for coating a substrate includes immersion depositing a first coating layer onto a substrate such that the first coating layer is deposited in a wet state with regard to water and solvents in the first coating layer. While the first coating layer is in the wet state, a second coating layer is immersion deposited onto the first coating layer. The first coating layer and the second coating layer are then co-dried to substantially remove any water and solvents.
    Type: Application
    Filed: March 19, 2012
    Publication date: September 19, 2013
    Inventor: Nan Wei
  • Publication number: 20130221816
    Abstract: A manufacturing method of a casing of electronic device including the following steps is provided. A casing body is provided, and the material of the casing body being metal. An oxide ceramic layer is formed on a surface of the casing body, wherein the step of forming the oxide ceramic layer on the surface of the casing body is a Micro Arc Oxidation (MAO) process. A casing of electronic device including a casing body and an oxide ceramic layer is also disclosed. The material of the casing body is metal. The oxide ceramic layer is located on a surface of the casing body.
    Type: Application
    Filed: November 21, 2012
    Publication date: August 29, 2013
    Applicant: HTC CORPORATION
    Inventor: HTC CORPORATION
  • Publication number: 20130195580
    Abstract: A fastening mechanism includes a basic body made from a base metal, onto which at least one corrosion-resistant layer is applied. A further layer is applied at least partially onto the at least one corrosion-resistant layer. The further layer has a lower coefficient of friction than the at least one corrosion-resistant layer.
    Type: Application
    Filed: January 12, 2011
    Publication date: August 1, 2013
    Applicant: Robert Bosch GmbH
    Inventors: Harald Kast, Juergen Reiner
  • Publication number: 20130180861
    Abstract: A Ti02-based photocatalyst is fabricated as a composite of titania with adhered nanostructures which contain a non-noble metal in galvanic contact with a noble metal. The catalyst effectively overcome aging and/or deactivation effects observed in a system free of the non-noble metal. The composite material showed a corrosion protective effect on the photoactivity of fresh catalyst for over 180-240 days, and it enhanced the rate of the water reduction reaction relative to bare Ti02. Variations in porosity and non-noble metal content of the alloy portion of the nanostructures influenced the performance of the catalyst composite. The protective effect of the non-noble metal is through a cathodic corrosion protection mechanism.
    Type: Application
    Filed: September 16, 2011
    Publication date: July 18, 2013
    Applicant: NORTHEASTERN UNIVERSITY
    Inventors: Elizabeth J. Podlaha-Murphy, Savidra Lucatero
  • Publication number: 20130161809
    Abstract: A substrate structure, a semiconductor package device and a manufacturing method of substrate structure are provided. The substrate structure comprises a conductive structure comprising a first metal layer, a second metal layer and a third metal layer. The second metal layer is disposed on the first metal layer. The third metal layer is disposed on the second metal layer. Each of the second metal layer and the third metal layer has a first surface and a second surface opposite to the first surface. The first surface of the third metal layer is connected to the second surface of the second metal layer. The surface area of the first surface of the third metal layer is larger than that of the second surface of the second metal layer. A substrate structure, semiconductor package device, and a manufacturing method of substrate structure are provided. The substrate structure includes a conductive structure, comprising a first metal layer, a second metal layer, and a third metal layer.
    Type: Application
    Filed: November 29, 2012
    Publication date: June 27, 2013
    Applicant: ADVANPACK SOLUTIONS PTE LTD.
    Inventor: ADVANPACK SOLUTIONS PTE LTD.
  • Patent number: 8449948
    Abstract: A method for providing a structure in a magnetic recording transducer is described. The method includes plating a first layer in a plating bath using a first plurality of plating conditions. The first layer has a first galvanic potential. The method also includes modifying the plating bath and/or the first plurality of plating conditions to provide a modified plating bath and/or a second plurality of plating conditions. The method further includes plating a second layer using the modified plating bath and/or the second plurality of plating conditions. The second layer has a second galvanic potential. The first galvanic potential is between the second galvanic potential and a third galvanic potential of a third layer if the third layer adjoins the first layer. The second galvanic potential is between the first galvanic potential and the third galvanic potential of the third layer if the third layer adjoins the second layer.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: May 28, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Jose Antonio Medina, Keith Y. Sasaki
  • Patent number: 8409418
    Abstract: The present invention provides a method and precursor structure to form a Group IBIIIAIVA solar cell absorber layer. The method includes forming a Group IBIIIAVIA compound layer on a base by forming a precursor layer on the base through electrodepositing three different films, and then reacting the precursor layer with selenium to form the Group IBIIIAVIA compound layer on the base. The three films, described by the precursor layer, include in one embodiment a first alloy film comprising copper, indium and gallium, a second alloy film comprising copper and selenium formed on the first alloy film; and a selenium film formed on the second alloy film.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: April 2, 2013
    Assignee: SoloPower, Inc.
    Inventors: Serdar Aksu, Jiaxiong Wang, Mustafa Pinarbasi
  • Patent number: 8394507
    Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: March 12, 2013
    Assignee: Integran Technologies, Inc.
    Inventors: Klaus Tomantschger, Jonathan McCrea, Nandakumar Nagarajan, Francisco Gonzalez, Gino Palumbo, Konstantinos Panagiotopoulos, Herath Katugaha
  • Publication number: 20130052478
    Abstract: [Problems] To provide a bath for surface treatment capable of forming a surface-treating film having excellent corrosion resistance by a high-speed electrolytic treatment, and a method of producing a surface-treated steel plate having excellent corrosion resistance and closely adhering property to the coating maintaining good productivity. [Means for Solution] A bath for surface treatment used for forming a surface-treating film on the surface of a steel plate by cathodic electrolysis, the bath for surface treatment containing Zr and/or Ti, and a polycarboxylic acid.
    Type: Application
    Filed: May 27, 2011
    Publication date: February 28, 2013
    Applicants: TOYO SEIKAN KAISHA, LTD., TOYO KOHAN CO., LTD., NIPPON PAINT CO., LTD.
    Inventors: Wataru Kurokawa, Seitaro Kanazawa, Shinichi Taya, Kunihiro Yoshimura, Naomi Iida, Miwa Iida, Masahiko Matsukawa