Nonelectrolytic Coating Is Phosphorus- Or Chromium-containing (e.g., Phosphate, Chromate, Etc.) Patents (Class 205/197)
  • Patent number: 11015019
    Abstract: Provided are an epoxy resin including: an epoxidized product of monoalkyl dihydroxybenzene; and a compound that is detected in the molecular weight range from a molecular weight at the peak top of the epoxidized product of the monoalkyl dihydroxybenzene to the molecular weight at the peak top+20 to 40 and has a peak area % of 0.1% to 0.8% in a GPC chart, and an epoxy resin including an epoxidized product of monoalkyl catechol in which the ratio of the total content of a cyclic compound having a cyclic structure that has two adjacent oxygen atoms derived from the monoalkyl catechol as constituent atoms and a monoglycidyletherified product of the monoalkyl catechol to the content of a diglycidyletherified product of the monoalkyl catechol is in the range of 0.10 to 0.40 as measured by high performance liquid chromatography.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: May 25, 2021
    Assignee: DIC Corporation
    Inventors: Yousuke Hirota, Shota Tanii, Koji Hayashi, Kunihiro Morinaga
  • Publication number: 20150064495
    Abstract: A steel sheet used to manufacture a container, wherein the steel sheet includes a chromate film layer or a film layer including Zr on the Ni plating layer, the Ni plating layer includes one or more of a hydroxyl Ni and a Ni oxide, an adhesion amount of the Ni plating layer in terms of an amount of Ni is 0.3 g/m2 or more, a concentration of oxygen atoms of the Ni plating layer due to the hydroxyl Ni and the Ni oxide is 1 to 10 atomic %, an adhesion amount of the chromate film layer in terms of the amount of Cr is 1 to 40 g/m2, and an adhesion amount of the film layer including Zr in terms of an amount of Zr is 1 to 40 g/m2 or more.
    Type: Application
    Filed: October 15, 2013
    Publication date: March 5, 2015
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shigeru Hirano, Yoshiaki Tani
  • Patent number: 8871077
    Abstract: Methods of providing a corrosion-resistant plating on a steel bumper are provided. A galvanized zinc layer is deposited over a steel substrate. A plurality of nickel layers is deposited over the zinc layer. The plurality of zinc layers has at least a first porosity and a second porosity. A chrome layer is applied over the plurality of nickel layers. The porous nickel layer is immediately adjacent the chrome layer such that a stress applied to the chrome layer is distributed over the porous nickel layer. The porous nickel layer delocalizes a stress applied at an impact area to a dispersed area and the dispersed area is larger than the impact area.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: October 28, 2014
    Assignee: GM Global Technology Operations LLC
    Inventors: Guangling Song, William A. Schumacher
  • Patent number: 7422629
    Abstract: Electrolysis using a suitable electrolyte provides a completely nonsludging zinc phosphate conversion coating process that produces a high quality conversion coating in a very short time. The suitable electrolyte contains at least water, dissolved nitric acid, and dissolved zinc cations and optionally also contains m chemically distinct species of cations other than zinc and n chemically distinct species of anions other than anions derivable by ionization of phosphoric and nitric acids, each of m and n independently being zero or a positive integer.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: September 9, 2008
    Assignee: Henkel Kommanditgesellschaft Auf Aktien
    Inventors: Jun Kawaguchi, Kazuhiro Ishikura, Tomoyuki Manmi
  • Patent number: 7285191
    Abstract: A phosphate coating apparatus for depositing a phosphate coating on a metal material by electrolyzing the metal material in a predetermined electrolysis solution includes a positive electrode and a negative electrode, of which one electrode being disposed in contact with the metal material and the other electrode being disposed away from the metal material with a predetermined distance, and the other electrode being formed into a tubular shape so as to cover the entire length of the metal material.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: October 23, 2007
    Assignee: Fujisyoji Co.Ltd.
    Inventors: Hiroshi Asakawa, Tetsuo Imatomi, Naoyuki Kobayashi, Shigemasa Takagi, Yoshihiro Fujita, Tokujiro Moriyama
  • Patent number: 7195796
    Abstract: A process is provided for making a composite work article suitable for fabricating rigid sheet metal can components. A steel sheet having first and second surfaces is pre-treated to enhance reception and retention of a multi-layer polymer coating on the pre-treated first surface. The multi-layer polymer coating is melt extruded on the pre-treated first surface and beyond opposite lateral edges of the work article to establish overhang portions, then solidified. The multi-layer polymeric coating has a tie polymeric layer contacting the pre-treated first surface, and a finish-surface polymeric layer.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: March 27, 2007
    Assignee: ISG Technologies, Inc
    Inventors: John A. Sinsel, Mark V. Loen, Michael S. Bailey
  • Patent number: 6689268
    Abstract: A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: February 10, 2004
    Assignee: Olin Corporation
    Inventors: Szuchain Chen, Julius Fister, Andrew Vacco, Nina Yukov, A. James Brock
  • Patent number: 6475644
    Abstract: Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal and a radioisotope, which may be soluble or insoluble, and may further comprise a reducing agent. The radioactive sol-gel comprises at least one metal alkoxide and a radioisotope, which may be soluble or insoluble. Methods of making a substrate radioactive by coating with radioactive coating solutions or sol-gels are also disclosed, including electrodeposition, electroless deposition, spin coating and dip coating. In a particular embodiment, the radioactive coating formed by the method is a composite coating. Radioactive substrates are also disclosed, comprising a substrate and one or more radioactive coatings, which coatings may be the same or different.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: November 5, 2002
    Assignee: Radiovascular Systems, L.L.C.
    Inventors: Janet M. Hampikian, Neal A. Scott
  • Patent number: 6426146
    Abstract: This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 Å to about 80 Å; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.
    Type: Grant
    Filed: February 10, 2000
    Date of Patent: July 30, 2002
    Assignee: GA-TEK Inc.
    Inventors: Thomas J. Ameen, Edward Czapor
  • Patent number: 6419811
    Abstract: Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low roughness and produce a high peel strength to such resin base materials as polyimide resin which is weak in peel strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one rust-proofing treatment.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: July 16, 2002
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Hisanori Manabe, Masasto Takami, Masaru Hirose
  • Patent number: 6174426
    Abstract: A method is provided for enhancing the adhesion of organic polymer coatings to electrolytically passivated (CDC) tin-plated steel strip. The method includes applying a solution comprising 0.1 to 7 percent of an adhesion promoter to the electrolytically tin-plated strip during the processing of the strip on an electrolytic tin-plating line. The adhesion promoter may be at least one selected from the group consisting of: where n is within a range of from 4 to 99; (b) C16H33+N(CH3) 3 M where M is member of the halogen group; and (c) Rn—Si—(X)4−n where R is a non-hydrolyzable organic radical selected from the group consisting of glycol, epoxy, amine, diamine or mercapto groups, and mixtures thereof, containing from 3 to 10 carbon atoms; the number n is an integer from 1 to 3; and X is a hydrolyzable group selected from the group consisting of Cl—, OCH3, OCH2CH5, OOCCH3, OCH2OCH3, amine, diamine, triamine, acyloxy and alkoxysilanes, and mixtures thereof.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: January 16, 2001
    Assignee: USX Corporation
    Inventor: Gabriel Jeminiwa Osanaiye
  • Patent number: 6054225
    Abstract: A piston ring is formed with a nitrided layer over all surfaces and formed with a composite chromium plating film over the nitrided layer in the outer circumferential surface. The composite chromium plating film has a network of cracks formed on the outer surface and interior. Spherical alumina particles are fixed in these cracks. The average size of the spherical alumina particles is 0.7 to 10 .mu.m and the dispersion ratio of the spherical alumina particles is 3 to 15 percent by volume.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: April 25, 2000
    Assignee: Teikoku Piston Ring Co., Ltd.
    Inventors: Akira Harayama, Toshiaki Imai
  • Patent number: 5730809
    Abstract: A passivate for tungsten alloy electroplates. The passivate includes an effective quantity of CrO.sub.3 in an aqueous bath having a pH of from about 3.5 to about 7.5.
    Type: Grant
    Filed: November 9, 1994
    Date of Patent: March 24, 1998
    Assignee: Enthone-OMI, Inc.
    Inventor: Robert Tremmel
  • Patent number: 5700362
    Abstract: A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discoloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt by electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).
    Type: Grant
    Filed: June 19, 1996
    Date of Patent: December 23, 1997
    Assignee: Fukuda Metal Foil and Powder Co., Ltd.
    Inventors: Masami Yano, Masato Takami
  • Patent number: 5582709
    Abstract: A zinc-cobalt alloy-plating alkaline bath comprises a zinc compound, a cobalt compound, an alkali hydroxide and a reaction product of an alkyleneamine with an alkylene oxide and having a pH of not less than 13 and a method for forming a zinc-cobalt alloy plating film comprises the step of forming, on a substrate, a zinc-cobalt alloy plating film having a cobalt content ranging from 0.05 to 20% by weight and a zinc content ranging from 80 to 99.95 % by weight, while using the foregoing alkaline plating bath. The Zn-Co alloy-plating bath permits the achievement of a desired rate of Co-eutectoid even when a small amount of a chelating agent is incorporated into the bath and therefore, the bath is excellent in the disposability of waste water.
    Type: Grant
    Filed: October 3, 1994
    Date of Patent: December 10, 1996
    Assignee: Dipsol Chemicals Co., Ltd.
    Inventors: Katsuhide Oshima, Shigemi Tanaka, Toshio Igari, Takeshi Kunihiro
  • Patent number: 5550006
    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin.
    Type: Grant
    Filed: May 13, 1994
    Date of Patent: August 27, 1996
    Assignees: MacDermid, Incorporated, PPG Industries, Inc.
    Inventors: Gary B. Larson, Brian Jobson, James A. Johnson, Lance C. Sturni
  • Patent number: 5456817
    Abstract: There is disclosed a treating process whereby the thermal oxidation resistance on the shiny side of a copper foil is enhanced so that the shiny side will not discolor on heating to higher temperatures than usual, without impairing the foil's solder wettability, adhesion to resist, and other properties. A Zn-Ni alloy layer which comprises 50-97 wt % Zn and 3-50 wt % Ni or a Zn-Co alloy layer which comprises 50-97 wt % Zn and 3-50 wt % Co is formed on the shiny side of a copper foil at a deposition quantity of 100-500 .mu.g/dm.sup.2 and then the alloy surface is treated for Cr-base corrosion-preventive coating. The Cr-base corrosion-preventive treatment comprises (1) a treatment for forming a coating film of chromium oxide alone, (2) a treatment for forming a mixed coating film of chromium oxide and zinc and/or zinc oxide or (1)+(2). The roughened side of the copper foil may be treated to form thereon a layer of single metal or alloy of two or more metals chosen from among Cu, Cr, Ni, Fe, Co, and Zn.
    Type: Grant
    Filed: October 21, 1994
    Date of Patent: October 10, 1995
    Assignee: Nikko Gould Foil Co., Ltd.
    Inventors: Eiji Hino, Keisuke Yamanishi, Kazuhiko Sakaguchi
  • Patent number: 5447619
    Abstract: A surface of copper foil is protected from oxidation and tarnishing by electrodepositing on the surface a protective layer containing metallic zinc and one or more compound of tri-valent chromium, which protection layer is easily removable by dissolution in a dilute aqueous alkaline solution and which preferably has a zinc to chromium weight ratio of 1:1 or greater. An electrodeposited copper foil especially suited for multilayer printed circuit boards has such a protective layer electrodeposited on the matte side thereof and an electrodeposited copper bonding treatment on the shiny side thereof.
    Type: Grant
    Filed: November 24, 1993
    Date of Patent: September 5, 1995
    Assignee: Circuit Foil USA, Inc.
    Inventors: Adam M. Wolski, Paul Dufresne, Kurt Ac, Michel Mathieu
  • Patent number: 5356528
    Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.
    Type: Grant
    Filed: April 1, 1993
    Date of Patent: October 18, 1994
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Katsuhito Fukuda, Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima, Kenji Isihara
  • Patent number: 5348639
    Abstract: A surface treatment for a R-TM-X type of permanent magnet comprising the steps: Etching the magnet with nitric acid having a concentration of 0.2 to 10 vol %, then etching the magnet with a mixture of oxygenated water having a hydrogen peroxide concentration of 0.2 to 10 vol % and acetic acid having a concentration of 10-30 vol %, and next plating the magnet with a copper plating initially followed by a nickel plating. R represents an element or a mixture of rare earth elements, TM is mainly composed of iron and transition elements other than iron and X represents one or more of a mixture of elements to enhance the coercivity of the magnet. This improvement of the magnet material itself improves the corrosion resistance of the protective film on the magnet surface.
    Type: Grant
    Filed: August 6, 1991
    Date of Patent: September 20, 1994
    Assignee: Hitachi Magnetics Corporation
    Inventor: Katsuo Mitsuji
  • Patent number: 5294266
    Abstract: The invention is in a composition and process for the chromium free passivating postrinsing of conversion layers on metals before the application of a paint or adhesive. The conversion layers can be on the bases of phosphate layers, at least two polyvalent metal ions with complex formers, titanium, zirconium and/or hafnium. The postrinsing agent is an aqueous solution which has been adjusted to a pH value of up to 5 and which contains an aluminum fluorozirconate having an Al:Zr:F mole ratio of (0.15 to 8.0):1:(5 to 52), and in which solutions the total concentration of Al+Zr+F is 0.1 to 8.0 g/l. The postrinsing solutions may additionally contain at least one of the anions benzoate, caprylate, ethyl hexoate, salicylate in a total concentration of 0.05 to 0.5 g/1 and may preferably be adjusted to the required pH value with cations of volatile bases, such as ammonium, ethanolammonium and di- and triethanolammonium.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: March 15, 1994
    Assignee: Metallgesellschaft Aktiengesellschaft
    Inventors: Dieter Hauffe, Thomas Kolberg, Gerhard Muller, Horst Gehmecker, Werner Rausch, Peter Schubach, Thomas Wendel
  • Patent number: 5288377
    Abstract: Copper surfaces upon which organic resins are electrophoretically deposited to serve as plating or etch resists in the course of manufacturing printed circuits, are preliminarily provided with a uniformizing/passivating coating layer, such as a layer of copper oxide or phosphate conversion coating, over which the organic resin is electrophoretically deposited, resulting in the organic resin being deposited with substantial uniformity in thickness and properties.
    Type: Grant
    Filed: January 19, 1993
    Date of Patent: February 22, 1994
    Assignee: MacDermid, Incorporated
    Inventors: James A. Johnson, Brian Jobson, Gary B. Larson
  • Patent number: 5286366
    Abstract: A magnetically anisotropic magnet substrate is coated with a triple layer of nickel plating preferably followed by a chromate layer. The layer of nickel plating includes an inner layer of a non-bright nickel plating, followed by an intermediate nickel-strike layer, followed by an outer layer of a semi-bright nickel plating. The inner layer contains much less sulfur than the other two layers, whereby the resulting difference in electromotive force provides a localized battery that permits the outer layers to be sacrificed without permitting the inner layer to be destroyed. One embodiment adds a copper under-layer below the nickel plating.
    Type: Grant
    Filed: November 5, 1991
    Date of Patent: February 15, 1994
    Assignee: Hitachi Magnetic Corp.
    Inventor: Katsuo Mitsuji
  • Patent number: 5275716
    Abstract: A method for manufacturing a tin-electroplated cold-rolled steel strip, which comprises the steps of: continuously annealing a degreased cold-rolled steel strip; then, subjecting, following the continuous annealing treatment, the continuously annealed cold-rolled steel strip to a continuous tin-electroplating treatment in a tin-electroplating bath to form, on at least one surface of the cold-rolled steel strip, a tin-electroplating layer having a plating weight within a range of from 0.1 to 2.8 g/m.sup.2 per surface of the cold-rolled steel strip; and then, temper-rolling, following the continuous tin-electroplating treatment, the cold-rolled steel strip having the tin-electroplating layer on at least one surface thereof, at a reduction ratio within a range of from 1 to 5%.
    Type: Grant
    Filed: March 11, 1993
    Date of Patent: January 4, 1994
    Assignee: NKK Corporation
    Inventors: Katsumi Kojima, Mikiyuki Ichiba, Hiroki Iwasa, Toyofumi Watanabe
  • Patent number: 5268078
    Abstract: This invention relates to Al plates suitable for automobile body panels and also relates to a method of pretreatment for painting. The features are: A Zn plating layer having 0.05.about.0.38 g/m.sup.2 of coating weight is formed on the surface of an Al plate or Al alloy plate by a displacement plating process or electroplating process. The coated Al or Al alloy plate is subjected to chemical conversion treatment with zinc phosphate under conditions to completely dissolve the zinc plating layer. This invention prevents the occurrence of filiform rusting and blistering after painting.
    Type: Grant
    Filed: October 6, 1992
    Date of Patent: December 7, 1993
    Assignee: Sumitomo Light Metal Industries, Ltd.
    Inventors: Takahiro Koyama, Yoshihumi Hasegawa, Tatsumi Takahashi
  • Patent number: 5182172
    Abstract: An improved method for inhibiting corrosion of precious metal plated objects is provided wherein a thin dichromate film coats the precious metal outer surface and fills the precious metal outer surface pores using either immersion or electrolytic methods employing passivation plating techniques.
    Type: Grant
    Filed: April 18, 1991
    Date of Patent: January 26, 1993
    Assignee: Bausch & Lomb Incorporated
    Inventor: John F. Tucker
  • Patent number: 5071520
    Abstract: A technique for improving the peel strength of copper and copper based alloy materials, and particularly for copper or copper based alloy materials which may be wrought or electrolytically deposited copper foil having an antitarnish treatment applied thereto, preferably by the use of a chromate-containing solution. The material is subjected to a rinse containing a silane coupling agent, which preferably is an organofunctional silane, and more preferably is an alkoxysilane derivative. Both the original peel strength and the peel strength after storage of the material so treated is enhanced.
    Type: Grant
    Filed: October 30, 1989
    Date of Patent: December 10, 1991
    Assignee: Olin Corporation
    Inventors: Lifun Lin, Paul Menkin