Abstract: A metal surface treated to have a distinct cosmetic appearance such as an integral layer that is glossy may be used in electronic devices. The surface treatment may include polishing a metal surface, texturing the polished metal surface, polishing the textured surface, followed by anodizing the surface, and then polishing the anodized surface. The metal surface may also be dyed to impart a rich color to the surface.

Abstract: A capacitor for use in relatively high voltage environments is provided. The solid electrolyte is formed from a plurality of pre-polymerized particles in the form of a dispersion. In addition, the anode is formed such that it contains at least one longitudinally extending channel is recessed therein. The channel may have a relatively high aspect ratio (length divided by width), such as about 2 or more, in some embodiments about 5 or more, in some embodiments from about 10 to about 200, in some embodiments from about 15 to about 150, in some embodiments from about 20 to about 100, and in some embodiments, from about 30 to about 60.

Abstract: A shower tray having a heat exchanger that is arranged beneath the shower tray for recovering heat from waste water in order to heat up clean water, wherein a first heat-exchanger surface is in contact with the waste water and a second heat-exchanger surface is in contact with the clean water, and the first heat-exchanger surface forms the floor, or part of the floor, of the shower tray. The shower tray here is produced from one metal material and, in the region of the tray floor, beneath the shower tray, a base plate made of some other metal is fastened on the tray floor, so as to form a heat-conducting connection to the tray floor is formed substantially over the entire surface of the base plate. Beneath the base plate, tubes are connected to the base plate in an integral manner. The tubes form the second heat-exchanging surface.

Abstract: A method for driving a flat panel display is provided. The flat panel display has n scan lines, wherein n is a positive integer. Each of the scan lines is coupled to a plurality of pixels. The driving method according to the invention includes the steps as follows: when pixels coupled to a kth scan line are enabled, pixels coupled to the scan lines from the first to k?1th are disabled and pixels coupled to at least a part of scan lines from k+1th to nth are enabled, thus pre-charging the enabled pixels of scan lines from k+1th to nth is performed thereby, wherein k is a positive integer.

Abstract: The invention relates to a method for manufacturing a steel strip with a cathodic corrosion protection coating, in which the steel strip is hot rolled and then cold rolled; the steel strip is subjected to an electrolytic galvanization and after the electrolytic galvanization, the steel strip is heat treated in a bell-type annealing furnace at temperatures of 250° C. to 350° C. for a period of 4 to 48 hours and this produces a zinc/iron layer.

Abstract: A metal substrate with an insulating layer, which is capable of being produced by a simple process, exhibits heat resistance during semiconductor processing, is superior in voltage resistance, and has small leakage current, and an Al base material that realizes the metal substrate are provided. The metal substrate with an insulating layer is formed by administering anodic oxidation on at least one surface of the Al base material. The Al base material includes only precipitous particles of a substance which is anodized by anodic oxidation as precipitous particles within an Al matrix.

Abstract: The present invention relates to an electrocatalytic coating and an electrode having the coating thereon, wherein the coating is a mixed metal oxide coating, preferably platinum group metal oxides with or without valve metal oxides, and containing a transition metal component such as palladium, rhodium or cobalt. The electrocatalytic coating can be used especially as an anode component of an electrolysis cell for the electrolysis of a halogen-containing solution wherein the palladium component reduces the operating potential of the anode and eliminates the necessity of a “break-in” period to obtain the lowest anode potential.

Abstract: A conductive diamond electrode including an electrode substrate comprising a material selected from the group consisting of a valve metal and an alloy based on the valve metal, at least a surface of the metal or alloy having been subjected to plasticization processing, or heat treatment in vacuum or inert atmosphere; and a conductive diamond film formed on the plasticization processed surface of the electrode substrate. When the electrode substrate is subjected to plasticization processing and heat treatment, peeling resistance of the conductive diamond film is improved, thereby an electrode life is prolonged.

Abstract: A method for treating a hinge holder includes the following steps: polishing a surface of the hinge holder; degreasing the hinge holder; cleaning the hinge holder; baking the hinge holder; cooling the hinge holder; screen-printing a part of the surface of the hinge holder; and plating the other part of the surface of the hinge holder with chromium or a chromium-containing compound. The plated hinge holder has a layer of chromium or chromium nitride on the surface, which renders the surface of the hinge holder more attractive and more wear-resistant. Therefore, it is not as easily scratched during assembly and frequent use.

Abstract: A method for treating a hinge holder includes the following steps: polishing a surface of the hinge holder; degreasing the hinge holder; cleaning the hinge holder; baking the hinge holder; cooling the hinge holder; screen-printing a part of the surface of the hinge holder; and plating the other part of the surface of the hinge holder with chromium or a chromium-containing compound. The plated hinge holder has a layer of chromium or chromium nitride on the surface, which renders the surface of the hinge holder more attractive and more wear-resistant. Therefore, it is not as easily scratched during assembly and frequent use.

Abstract: Methods to at least partially reduce a niobium oxide are described wherein the process includes heat treating the niobium oxide in the presence of a getter material and in an atmosphere which permits the transfer of oxygen atoms from the niobium oxide to the getter material, and for a sufficient time and at a sufficient temperature to form an oxygen reduced niobium oxide. Niobium oxides and/or suboxides are also described as well as capacitors containing anodes made by fabricating a pellet of niobium oxide and heat treating the pellet in an atmosphere which permits the transfer of oxygen to a getter material, and for a sufficient time and temperature to form an electrode body, and anodizing the electrode body.

Abstract: A process for selectively forming a metal barrier layer on a surface of an interconnect of a wiring substrate comprising the steps of abrading the substrate and simultaneously feeding onto the substrate a plating solution having said metal dissolved therein. The abrading step comprises contacting the substrate against an abrasive surface and causing relative linear and/or rotary motion between the abrasive surface and the substrate while the substrate is in contact with the abrasive surface. Growth of the metal barrier layer on a portion of the wiring substrate other than the interconnect layer is suppressed and the metal barrier layer thus formed is thinner, exhibits improved uniformity and superior prevention against Cu diffusion.

Abstract: The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of the polymeric dielectric layer, applying a seed layer to the polymeric dielectric layer and applying a conductive layer to the seed layer. The invention also comprises a printed circuit structure produced by the method of the present invention.

Abstract: A scanning apparatus has a luminous flux deflector and a single f.theta. lens. The deflector deflects a convergent luminous flux on a scanned surface at a uniform angular velocity. The f.theta. lens is arranged between the deflector and the scanned surface. The f.theta. lens is bi-convex in a main scanning direction and is made of a material having a refractive index of at most 1.6. One surface of the f.theta. lens in a main scanning direction is so curved that a radius of curvature in the main scanning direction A decreases as an angle of view in the main scanning direction increases.

Abstract: The subject of the invention is a process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a step of nickel plating of said surface and a step of nickel removal therefrom, wherein:a preparation of said surface, comprising in succession an operation of cleaning said bare surface, an operation of pickling said bare surface in an oxidizing acid medium and an operation of brightening said bare surface, is carried out;then, an operation of nickel plating of said bare surface is carried out by electroplating, by placing said element as the cathode in an electrolyte consisting of an aqueous nickel sulfamate solution containing from 60 to 100 g/l of nickel;then, after said element has been used, an operation of partially or completely removing the nickel from said surface electrolytically is carried out, by placing said element as the anode in an electrolyte consisting of an aqueous nickel sulfamate solution containing fro

Abstract: A method of making, for cathode ray tubes and the like, an inner shield material that has superior magnetic characteristics and rust resistance. The method does not require conventional blackening processes. Sheet steel or strip is nickel-plated with a nickel-iron diffusion layer and then annealed. The annealing improves the magnetic characteristics. The sheet is cold-rolled prior to annealing to provide a roughened surface, which decreases the chances of sticking during the annealing process. In one embodiment the sheet is pickled, cold-rolled, annealed, cold rolled again, nickel plated, and then annealed again. Annealing between the first and second cold-rolling operations improves the magnetic characteristics.

Abstract: A method for manufacturing a nickel alloy electroplated cold-rolled steel sheet excellent in press-formability and phosphating-treatability, which comprises the steps of: (a) cold-rolling a hot-rolled steel sheet at a reduction ratio of from 60 to 85% to prepare a cold-rolled steel sheet consisting essentially of: up to 0.06 wt. % carbon, up to 0.5 wt. % silicon, up to 2.5 wt. % manganese, up to 0.1 wt. % phosphorus, up to 0.025 wt. % sulfur, up to 0.10 wt. % soluble aluminum, up to 0.05 wt. % nitrogen, and the balance being iron and incidental impurities; then, (b) subjecting the cold-rolled steel sheet to a continuous annealing treatment which comprises heating the cold-rolled steel sheet to a recrystallization temperature and then slowly cooling same; then, (c) forming, on at least one surface of the annealed cold-rolled steel sheet, a nickel alloy electroplating layer having a plating weight of from 5 to 60 mg/m.sup.

Abstract: An infrared radiation element and a process for producing the same. An aluminum alloy material consists essentially of 0.3 to 4.3 weight % of Mn, balance Al, and impurities. The alluminum alloy material is heated for dispersing a precipitate of an Al--Mn intermetallic compound at a density of at a minimum 1.times.10.sup.5 /mm.sup.3 for a size of 0.1 .mu.m to 3 .mu.m. The heated aluminum alloy material is anodized to form an anodic oxide layer thereon.

Abstract: The method of forming a high temperature resistant copper coating on a ceramic and/or enamel substrate, includes the steps of chemically depositing a copper layer having a thickness of at least 3 .mu.m on the substrate, heating the copper layer formed thereon at a temperature of from 200.degree. to 450.degree. C., mechanically treating the copper layer with brush and polishing means to consolidate an upper surface thereof and galvanically depositing an additional copper layer having a thickness of 3 .mu.m on the upper surface. The high temperature resistant copper coating for the ceramic or enamel substrate can stand a higher thermal load for a longer time than similar conventional coatings and can act to rapidly dissipate heat generated by electronic components.