Abstract: Embodiments of the present disclosure generally relate to a magnetic media drive employing a magnetic recording device. The magnetic recording device comprises a trailing gap disposed adjacent to a first surface of a main pole, a first side gap disposed adjacent to a second surface of the main pole, a second side gap disposed adjacent to a third surface of the main pole, and a leading gap disposed adjacent to a fourth surface of the main pole. A side shield surrounds the main pole and comprises a heavy metal first layer and a magnetic second layer. The first layer surrounds the first, second, and third surfaces of the main pole, or the second, third, and fourth surfaces of the main pole. The second layer surrounds the second and third surfaces of the main pole, and may further surround the fourth surface of the main pole.

Abstract: Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component during machining. More specifically, techniques are disclosed to increase the rate of secondary metal deposition between primary metal features in order to prevent voiding in the sacrificial secondary metal and thus enhance structural support of the primary metal during machining.

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract: Disclosed is a resin-metal bonded body of an aluminum metal member and a thermoplastic resin member, which has improved bonding strength and good durability. Also disclosed is a method for producing such a resin-metal bonded body. Specifically disclosed is a resin-metal bonded body which is obtained by bonding an aluminum metal member with a thermoplastic resin member. In this resin-metal bonded body, the aluminum metal member and the thermoplastic resin member are bonded together by an anodic oxide coating having a film thickness of 70-1500 nm or an anodic oxide coating having a triazine thiol in the inner and upper portions. The anodic oxide coating has an infrared absorption spectrum peak intensity ascribed to OH group at 0.0001-0.16.

Abstract: An article includes an electrodeposited metallic material including Co with a minimum content of 75% by weight. The metallic material has a microstructure which is fine-grained with an average grain size between 2 and 5,000 nm and/or an amorphous microstructure. The metallic material forms at least part of an exposed surface of the article. The metallic material has an inherent contact angle for water of less than 90 degrees at room temperature when measured on a smooth exposed surface portion of the metallic material which has a maximum surface roughness Ra of 0.25 microns. The metallic material has an exposed patterned surface portion having surface structures having a height of between at least 5 microns to about 100 microns incorporated therein to increase the contact angle for water at room temperature of the exposed patterned surface portion to over 100 degrees.

Abstract: A manufacturing method of a casing of electronic device including the following steps is provided. A casing body is provided, and the material of the casing body being metal. An oxide ceramic layer is formed on a surface of the casing body, wherein the step of forming the oxide ceramic layer on the surface of the casing body is a Micro Arc Oxidation (MAO) process. A casing of electronic device including a casing body and an oxide ceramic layer is also disclosed. The material of the casing body is metal. The oxide ceramic layer is located on a surface of the casing body.

Abstract: Anodized aluminum cookware having an exposed copper base or ring is formed by anodizing the completed vessel using a protective cap to cover most of the copper. The portion of copper that is exposed to the anodizing bath only tarnishes slightly and is preferably polished off after a protective lacquer is applied, creating a clean even margin with the anodized aluminum portion of the vessel.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the workpiece, relative movement between the workpiece and the workpiece-surface-influencing device is established so that an additive in the electrolyte solution disposed on the workpiece and which is adsorbed onto the top surface is removed or otherwise its amount or concentration changed with respect to the additive on the cavity surface of the workpiece. Plating of the conductive material can place prior to, during and after usage of the workpiece-surface-influencing device, particularly after the workpiece surface influencing device no longer contacts any portion of the top surface of the workpiece, to achieve desirable semiconductor structures.

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract: A brass-plated steel wire for reinforcing rubber articles capable of surely improving adhesiveness between brass-plated steel wire and rubber and a method for manufacturing the same.

Abstract: The invention relates to a method for producing a hardened profiled structural part from a hardenable steel alloy with cathodic corrosion protection. The method includes applying a coating to a sheet made of a hardenable steel alloy, wherein the coating comprises zinc, and the coating further comprises one or several elements with affinity to oxygen in a total amount of 0.1 weight-% to 15 weight-% in relation to the total coating. After applying the coating, the coated sheet steel is roller-profiled in a profiling device, so that the sheet tape is formed into a roller-formed profiled strand. Thereafter, the coated sheet steel is brought, at least in parts and with the admission of atmospheric oxygen, to a temperature required for hardening and is heated to a structural change required for hardening. A skin made of an oxide of the element(s) with affinity to oxygen is formed on the surface of the coating.

Abstract: In order to provide sanitary fittings, in particular, water supply fittings and sanitary shut-off devices, in general, which visually and haptically are very similar to or scarcely distinguishable (stainless steel finish) from the stainless steel surface of stainless steel sinks, using starting materials which can be processed more cost-effectively, it is proposed that a fitting or fitting parts be manufactured from brass; the fittings or fitting parts be ground and polished; the visible surface of the fittings or fitting parts be nickel-plated; the nickel-plated surface of the fittings or fitting parts be ground and/or brushed; and the ground and/or brushed nickel-plated surface of the fittings or fitting parts be chromium-plated.

Abstract: The invention relates to a method for producing a hardened profiled structural part from a hardenable steel alloy with cathodic corrosion protection. The method includes applying a coating to a sheet made of a hardenable steel alloy, wherein the coating comprises zinc, and the coating further comprises one or several elements with affinity to oxygen in a total amount of 0.1 weight-% to 15 weight-% in relation to the total coating. After applying the coating, the coated sheet steel is roller-profiled in a profiling device. Thereafter, the coated sheet steel is heated to a structural change required for hardening. A skin made of an oxide of the element(s) with affinity to oxygen is formed on the surface of the coating. After sufficient heating the sheet is cooled, wherein the rate of cooling is set in such a way that hardening of the sheet alloy is achieved.

Abstract: A method for making a porous structure, includes producing, by anodization of an aluminum substrate, an outer surface layer (3), part of the thickness of which is formed by an ordered porous structure (7), characterized in that it includes an anodization step on a smooth aluminum substrate for a duration sufficient for obtaining a thickness of ordered porous structure (7). The method further includes removing by mechanical machining a portion of the thickness of the layer (3) formed by anodization, the thickness portion extending from the outer surface of the layer (3) formed by anodization, while maintaining an ordered porous structure (7) with a non-zero thickness, so that the ordered porous structure defines the free outer surface of the residual layer.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the workpiece, relative movement between the workpiece and the workpiece-surface-influencing device is established so that an additive in the electrolyte solution disposed on the workpiece and which is adsorbed onto the top surface is removed or otherwise its amount or concentration changed with respect to the additive on the cavity surface of the workpiece. Plating of the conductive material can place prior to, during and after usage of the workpiece-surface-influencing device, particularly after the workpiece surface influencing device no longer contacts any portion of the top surface of the workpiece, to achieve desirable semiconductor structures.

Abstract: A method for fabricating a conductive bump structure of a circuit board is disclosed. The circuit board with a plurality of electrical connection pads is provided. An insulating protective layer and a resist layer are successively applied on the circuit board, wherein openings are formed in the layers at positions corresponding to the pads to expose the pads. Then, a conductive layer is formed on surfaces of the resist layer and openings, and a metal layer is formed on the conductive layer via electroplating and filled in the openings. Subsequently, the metal layer and conductive layer formed on the resist layer are removed via thinning, so as to form metal bumps on the pads. After the resist layer is removed, the metal bumps are covered by an adhesive layer to form a conductive bump structure for electrically connecting the circuit board to the external electronic component.

Abstract: The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract: A process of ceramic coatings on silver or silver-plated articles is developed in order to prevent surface tarnish, which is employed as ornaments on bags, garments or accessories such as necklaces, earrings, etc. The process comprises the steps of: forming a beryllium film on the surface of the article by fixing a stainless steel plate to an anode, fixing the silver or silver-plated article to a cathode and plating the surface of the silver or silver-plated article with beryllium in an electrolyte containing beryllium sulfate (BeSO4.4H2O) by an electroplating method; buffing the article coated with the beryllium film; washing and drying the buffed article using a surfactant; forming the resultant ceramic coating by dipping the dried article in ceramic coating solution which includes 20 to 80 cc of glass water No. 1 (liquid sodium silicate), 5 to 60 g of sodium metasilicate, 5 to 30 g of sodium tungstate, 5 to 10 g of molybdic acid in 1 liter of water; and drying the wetted article.

Abstract: A method and apparatus for improving the corrosion resistance of chrome plated materials. After the materials to be chrome plated are mechanically abrasively polished, but before they are reverse etched, they are power washed with a high-pressure liquid. A sprayer with nozzles directed inwardly towards the materials directs water onto the material at pressures in the range of 1000 or 2500 to 3000 psi. After the materials are chrome plated, they are heated above the melting point of a buffing compound, and then the heated materials with the buffing compound applied are buffed. An induction heater is used, before or after the buffing compound is applied. Computer controls, responsive to operator input of the cross-sectional size, composition and/or speed of movement of the chrome plated materials, to in turn regulate the power to an induction coil heater.

Abstract: A thin film magnetic head capable of shortening a manufacturing time and a method of manufacturing the same are provided. After forming a write gap layer by using a non-magnetic conductive material such as copper, a top pole is formed on the write gap layer by growing a plating film with the write gap layer used as a seed layer. Unlike the case where the write gap layer is formed by using a non-magnetic insulating material such as alumina, a step of newly forming a seed layer aside from the write gap layer and a step of selectively removing the newly formed seed layer become unnecessary. Therefore, the number of manufacturing processes is reduced, and the manufacturing time of the thin film magnetic head is shortened.

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract: According to an aspect of an embodiment, a method for manufacturing a magnetic head includes: providing a substrate; forming a first magnetic layer having a pattern for forming a magnetic pole on the substrate; forming a stopper layer of non-magnetic material on the top and the sides of the first magnetic layer; reducing the thickness of the stopper layer on the top of the first magnetic layer; and forming a second magnetic layer on the stopper layer. The method further includes: polishing the second magnetic layer to expose the stopper layer on the top of the first magnetic layer; and removing the stopper layer on the top of the first magnetic layer, so as to expose the top of the first magnetic layer.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the workpiece, relative movement between the workpiece and the workpiece-surface-influencing device is established so that an additive in the electrolyte solution disposed on the workpiece and which is adsorbed onto the top surface is removed or otherwise its amount or concentration changed with respect to the additive on the cavity surface of the workpiece. Plating of the conductive material can place prior to, during and after usage of the workpiece-surface-influencing device, particularly after the workpiece surface influencing device no longer contacts any portion of the top surface of the workpiece, to achieve desirable semiconductor structures.

Abstract: The invention provides a method of determining at least one electrochemical characteristic of a chemical-mechanical or electrochemical-mechanical polishing system comprising application of a potential between a polishing substrate and an electrode to generate a current, and determining the at least one electrochemical characteristic by analysis of the current as a function of time.

Abstract: A disclosed form of mechanically assisted electroplating leads to a flat, thin, overburden. In one example, an accelerator is deposited on a copper surface and mechanically removed in a simplified CMP-like apparatus. The wafer is then plated in an electrolyte containing little or no accelerating additives.

Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.

Abstract: There are provided a plating method for a roll and a grinding method before a cell is formed in which copper sulfate plating having a uniform thickness without any particles or pits can be applied to the roll for a gravure printing, both a middle finish grinding and a mirror surface finish grinding not depending on a grinding stone grinding can be carried out in a short period of time and a high quality roll can be provided. The grinding is carried out after applying the copper sulfate plating to the roll to attain a mirror surface finish state. The copper sulfate plating is carried out in such a way that non-soluble anode having a length more than the maximum roll length is ascended to the rotating process roll and approached to the lower surface of the roll, plating liquid having some avoidable impurities becoming a cause of particles or pits removed through a filter so as to perform a plating having no thickened portions at both ends of the roll.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: Multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching Operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching Operations may be separated by intermediate post processing activities, they may be separated by cleaning Operations, or barrier material removal Operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.

Abstract: Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is deposited. Accordingly, subsequent processing (e.g., material removal) can be consistent and efficient for wafers with different feature sizes (particularly different depths), and for wafers at different metallization levels.

Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Abstract: The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by selectively removing portions of a seed layer from a top surface of a substrate and then depositing a conductive material in the cavities of the substrate, where portions of the seed layer remains in the cavities. Another method includes forming an oxide layer on the top surface of the substrate such that the conductive material can be deposited in the cavities without the material being formed on the top surface of the substrate. The present invention also discloses methods for forming multi-level interconnects and the corresponding structures.

Abstract: In advanced electrolytic polish (AEP) method, a metal wafer (10) acts as an anodic electrodes and another metal plate (65) is used as a cathodic electrode. A voltage differential is applied to the anode and cathode under a predetermined anodic dissolution current density. This causes a reaction that provides a planarized surface on the metal wafers. Additives are included in the electrolyte solution (55) which adsorb onto the wafer surface urging a higher removal rate at higher spots and a lower removal rate at lower spots. Also, in another embodiment of the present invention is a pulsed-electrolytic process (260) in which positive and negative potentials are applied to the anodic and cathodic electrodes alternately, further encouraging surface planarization. AEP can be used either as a first step followed by a mechanical polish or a second step between initial CMP polish and a third step mechanical polish.

Abstract: An apparatus for performing an electrochemical process on a metallic surface of a workpiece, comprised of a substantially incompressible workpiece support plate. A platen for supporting the workpiece support plate, has at least one opening coupled to a source of electrolyte for receiving an electrolyte solution therethrough and placing the electrolyte solution in contact with the support plate and workpiece. A first conductive element is coupled to, a first potential and positioned proximate the metallic surface, and the carrier is configured to position the workpiece proximate the support plate.

Abstract: The methods and systems described provide for an in-situ detection of planarity of a layer that is deposited on or etched off the surface of a substrate. Planarity can be detected using various detection mechanisms, including optical, electrical, mechanical and acoustical, in combination with the electrochemical mechanical processing methods, including electrochemical mechanical deposition and electrochemical mechanical etching. Once planarity is detected, a planarity signal can be used to terminate or alter a process that has been previously initiated, or begin a new process. In a preferred embodiment, an optical detection system is used to detect planarity during the formation of planar conductive layers obtained by electrochemical mechanical processing.

Abstract: Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary method, the workpiece surface influencing device is occasionally placed in contact with a conditioning substrate coated with an inert material, and the bias applied to the electrodeposition system is reversed. According to another exemplary method, the workpiece surface influencing device is conditioned using mechanical contact members, such as brushes, and conditioning of the workpiece surface influencing device occurs, for example, through physical brushing of the workpiece surface influencing device with the brushes. According to a further exemplary method, the workpiece surface influencing device is rotated in different direction during electrodeposition.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the workpiece, relative movement between the workpiece and the workpiece-surface-influencing device is established so that an additive in the electrolyte solution disposed on the workpiece and which is adsorbed onto the top surface is removed or otherwise its amount or concentration changed with respect to the additive on the cavity surface of the workpiece. Plating of the conductive material can place prior to, during and after usage of the workpiece-surface-influencing device, particularly after the workpiece surface influencing device no longer contacts any portion of the top surface of the workpiece, to achieve desirable semiconductor structures.

Abstract: The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and apparatus that plates a conductive material on a workpiece surface in a “proximity” plating manner while a pad type material or other fixed feature is making contact with the workpiece surface in a “cold worked” manner. In this manner, energy stored in the cold worked regions of the plated layer is used to accelerate and enhance micro-structural recovery and growth. Thus, large grain size is obtained in the plated material at a lower annealing temperature and a shorter annealing time.

Abstract: A polishing method and polishing apparatus able to easily flatten an initial unevenness with an excellent efficiency of removal of excess copper film and suppress damage to a lower interlayer insulation film, and a plating method and plating apparatus able to deposit a flat copper film. The polishing method comprises the steps of measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region thereof, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, performing electrolytic polishing by electrolytic elution or anodic oxidation and chelation and removal of a chelate film in the same region preferentially from projecting portions of the film until removing the target amount of film obtained from the thickness equivalent data, and repeating steps of moving the cathode member to another region to flattening the regions over the entire surface.

Abstract: An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

Abstract: A resin plate having wiring pattern recesses and via through holes is made. All of the surfaces of the resin plate including inner walls of the wiring pattern recesses and via through holes are coated with a metal film. An electro-plating is applied using the metal film as a power-supply layer to fill a plated metal into the wiring pattern recesses and via through holes. The metal film formed on the resin plate except for the inner walls of the wiring pattern recesses and via through holes is removed, so that wiring pattern and via are exposed on a surface the same as that of the resin plate.

Abstract: A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching.

Abstract: There is provided an electrolytic processing apparatus and method that can improve the flatness of a plated film on a substrate even when fine grooves and large grooves are co-present in the surface of the substrate, enabling a later CMP processing to be carried out in a short time while preventing dishing during the CMP processing.

Abstract: A method of forming a solid inter-layer conductive rod. A printed circuit board comprising an insulating core layer, a first conductive layer and a second conductive layer is provided. The insulating core layer is sandwiched between the first conductive layer and the second conductive layer. A first opening that exposes a portion of the insulating core layer is formed in the first conductive layer. The exposed insulating core layer is removed by laser drilling to form a second opening that exposes a portion of the second conductive layer. An electroplating process is conducted using the second conductive layer as a negative electrode so that conductive material solidly fills the first opening and the second opening to form a solid conductive rod.

Abstract: A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.

Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

Abstract: In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.

Abstract: A highly corrosion-resistant material and a corrosion-resistant member which are improved in corrosion resistance, adhesion, contact electrical resistance, electrical conductivity, airtightness, etc. and are suitable for use as, e.g., a metallic separator for polymer electrolyte fuel cells (PEFC); and a process for producing them. A thin noble-metal layer is formed on the desired part of the surface of a metallic base and then subjected to compression working. The coated base may further be subjected to anticorrosive treatment with a liquid phase containing a peroxide or ozone or with an active gas atmosphere.

Abstract: The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.