Abstract: To be able to form a copper-zinc-tin alloy which optionally comprises at least one chalcogenide and thus forms a semiconductor without the use of toxic substances a metal plating composition for the deposition of a copper-zinc-tin alloy is disclosed, wherein said metal plating composition comprises at least one copper plating species, at lease one zinc plating species, at least one tin plating species and at least one complexing agent and further, if the alloy contains at least one chalcogen, at least one chalcogen plating species.

Abstract: The present invention describes a method of producing a p-type light-absorbing semiconductor copper zinc tin selenide/sulfide (Cu2(ZnxSn2-x)(SySe1-y)4) (abbreviated CZTS) with electrochemical deposition. It can be used in the production of solar cell when combined with an n-type inorganic or an organic semiconductor layer. The present method comprises a one-step or a sequence of depositions using electroplating to fabricate a low-cost and large-area CZTS solar cell, without using expensive and complicated deposition techniques or highly toxic and flammable chemicals in the production process. The present method significantly reduces the cost and energy requirement for production of solar cell.

Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.

Abstract: The present invention relates to an electrolyte and a process for depositing bronze alloys on consumer goods and industrial articles. The electrolyte of the invention comprises, in addition to the metals to be deposited and additives such as wetting agents, complexing agents and brighteners, in particular sulfur compounds which have a positive effect in the corresponding process for the deposition of the bronzes.

Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.

Abstract: The invention relates to an anti-fretting layer (5) for a multi-layer plain bearing (1), the anti-fretting layer being composed of a copper-based alloy, which in addition to copper as the main alloying element contains at least one element from the group comprising germanium, tin, indium, zinc, nickel, cobalt, bismuth, lead, silver and antimony and unavoidable impurities originating from production, wherein the total fraction of said alloying elements is at least 1 wt. % and at most 30 wt. %, and wherein copper mixed-crystal grains comprising copper and the at least one element are present in the copper alloy, wherein the copper mixed-crystal grains are oriented in such a way that an orientation index M{hkl} according to formula (I) M ? { hkl } = I ? { hkl } ? ? I 0 ? { hkl } I 0 ? { hkl } ? ? I ? { hkl } of each of the lattice plane sets {hkl} has a value of less than 3.

Abstract: A swash plate includes aluminum (Al) as a main component and 35˜45 wt % of zinc (Zn), 1.5˜3.5 wt % of copper (Cu), 6˜10 wt % of silicon (Si), 0.2˜0.5 wt % of magnesium (Mg) and other inevitable impurities. A method of manufacturing the swash plate is also provided.

Abstract: Consumer goods and industrial articles are electro-plated with bronze layers for decorative reasons and to protect them against corrosion. The electrolytes used hitherto for producing decorative bronze layers are either cyanide-containing or, as in the case of baths based on organosulphonic acids, highly corrosive or have, as in the case of cyanide-free baths based on diphosphoric acid, unsatisfactory long-term stabilities. Electrolytes which are used for applying solderable bronze layers in the electronics industry usually contain toxic or very toxic thio compounds. The present invention provides a non-toxic electrolyte which displays long-term stability for the electrolytic deposition of decorative bronze layers and a corresponding process for the application of such decorative bronze layers to consumer goods and industrial articles.

Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.

Abstract: Provided is a copper-zinc alloy electroplating bath which can form a copper-zinc alloy plating coating having an improved throwing property and a plating method using the same. Also provided is a copper-zinc alloy electroplating bath containing, as an additive, at least one selected from the group consisting of the compounds represented by the following formulae (I) to (III): (wherein R1 represents a lower alkylene group, R2 represents H or a lower alkyl group, and the weight-average molecular weight is 103 to 105); and Na—SO3—(CH2)3—S—S—(CH2)3—SO3—Na (III) These additives can be used alone, and two or more of these can be used in combination.

Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.

Abstract: The invention relates to an anti-friction coating (4) made from a tin-based alloy which, in addition to tin, contains at least one other element from the group comprising antimony and copper, optionally lead and/or bismuth, and optionally at least one element form a group comprising zirconium, silicon, zinc, nickel and silver, and the proportion of antimony is at most 20% by weight, the proportion of copper is at most 10% by weight, the total proportion of lead and bismuth is at most 1.5% by weight, the total proportion of copper and antimony is at least 2% by weight and the total proportion of zirconium, silicon, zinc, nickel and silver is at most 3% by weight, and tin is present bonded in the form of inter-metallic phases and freely as a tin phase with beta-tin grains.

Abstract: The invention relates to a modified copper-tin electrolyte which is free of toxic constituents such as cyanides or thio compounds. The invention further relates to a process for the deposition of decorative bronze layers on consumer goods and industrial articles using the electrolyte of the invention. The electrolyte comprises an additive formed from epichlorohydrin and hexamethylenetetramine and contains carbonate or hydrogencarbonate ions.

Abstract: Disclosed is a cyanide-free copper-zinc alloy electroplating bath which can form a uniform and glossy plated layer having the desired composition in a large current density range, and a plating method using the same. The copper zinc alloy electroplating bath contains a copper salt, a zinc salt, an alkali metal pyrophosphate or an alkali metal tartrate, and nitrate ions. The concentration of the nitrate ions is preferably 0.001 to 0.050 mol/L. Further, the pH of the copper-zinc alloy electroplating bath is preferably in the range of 8 to 14. Furthermore, in addition to the copper salt, the zinc salt, the alkali metal pyrophosphate and the nitrate ions, at least one selected from amino acids or salts thereof is preferably included, and histidine can be used favorably as the amino acid.

Abstract: A cyanide-free copper-zinc alloy electroplating bath is provided which can form a uniform and glossy alloy layer having the desired composition even at a higher current density than that for a conventional electroplating bath, and which is excellent in productivity. The copper-zinc alloy electroplating bath comprises at least one selected from a copper salt, zinc salt, alkali metal pyrophosphate, and amino acid or a salt thereof, and has a pH of 8.5 to 14. The pH is preferably 10.5 to 11.8; and the concentration of the amino acid or a salt thereof is preferably 0.08 mol/L to 0.22 mol/L, more preferably 0.1 mol/L to 0.13 mol/L. As the amino acid or a salt thereof, histidine or a salt thereof may be preferably used.

Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.

Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.

Abstract: An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate metals without the need to add plating metal ions to the solution in the form of metal salts, chelates or complexes.

Abstract: Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The selective membrane prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment. A conduit may be employed in the electrochemical cell to permit one way flow of anolyte to the catholyte compartment thereby replenishing tin to the catholyte compartment.

Abstract: A method of fabricating a semiconductor device, having a reduced-oxygen Cu—Zn alloy thin film (30) electroplated on a Cu surface (20) by electroplating, using an electroplating apparatus, the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing agents, a pH adjuster, and surfactants; and annealing the electroplated Cu—Zn alloy thin film (30); and a semiconductor device thereby formed. The method controls the parameters of pH, temperature, and time in order to form a uniform reduced-oxygen Cu—Zn alloy thin film (30), having a controlled Zn content, for reducing electromigration on the Cu—Zn/Cu structure by decreasing the drift velocity therein which decreases the Cu migration rate in addition to decreasing the void formation rate, for improving device reliability, and for increasing corrosion resistance.

Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive. In addition, the electroplating bath may also comprise carboxylic acids, ammonium salts, aldehyde compounds and a variety of co-brighteners.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: A method of producing a roughening-treated copper foil, comprising (A) a copper foil, (B) a composite metal layer, which is formed on a bonding surface of the copper foil and comprises (I) copper, (II) at least one metal selected from the group consisting of tungsten and molybdenum and (III) at least one metal selected from the group consisting of nickel, cobalt, iron and zinc, and (C) a roughened layer comprising copper, which is formed on the composite metal layer.

Abstract: The invention provides a pretreatment process for electroplating aluminum parts or strip, in which the zincating solution is modified to improve the adhesion of the subsequent electroplate to the substrate. The aluminum part or strip, such as an aluminum coin blank or strip for coin blanks, is pretreated with an improved zincate solution which provides hydroxide ions in an amount in the range of 75-175 gpl, zinc ions in an amount in the range of 15-40 gpl, nickel ions in an amount in the range of 2-10 gpl and copper ions in an amount in the range of 1.5-5 gpl. The pretreatment process preferably includes a copper strike applied from a copper cyanide strike bath at a pH in the range of 8.5-11.0, using a current density in the range of 0.1-10 A/dm2. The pretreatment and electroplating steps arc preferably conducted by barrel plating, in accordance with another aspect of the invention.

Abstract: A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a twostep process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

Abstract: A smooth layer of a metal is electroplated onto a microrough electrically conducting substrate by immersing the substrate and a counterelectrode in an electroplating bath of the metal to be electroplated and passing a modulated reversing electric current between the electrodes. The current contains pulses that are cathodic with respect to said substrate and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle less than about 50% and said anodic pulses have a duty cycle greater than about 50%, the charge transfer ratio of the cathodic pulses to the anodic pulses is greater than one, and the frequency of said pulses ranges from about 10 Hertz to about 12000 Hertz. The plating bath is substantially devoid of levelers and may be devoid of brighteners.

Abstract: A metallized structure for use in a microelectronic circuit is set forth. The metallized structure comprises a dielectric layer, an ultra-thin film bonding layer disposed exterior to the dielectric layer, and a low-Me concentration, copper-Me alloy layer disposed exterior to the ultra-thin film bonding layer. The Me is a metal other than copper and, preferably, is zinc. The concentration of the Me is less than about 5 atomic percent, preferably less than about 2 atomic percent, and even more preferably, less than about 1 atomic percent. In a preferred embodiment of the metallized structure, the dielectric layer, ultra-thin film bonding layer and the copper-Me alloy layer are all disposed immediately adjacent one another. If desired, a primary conductor, such as a film of copper, may be formed exterior to the foregoing layer sequence. The present invention also contemplates methods for forming the foregoing structure as well as electroplating baths that may be used to deposit the copper-Me alloy layer.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, nickel, zinc, cadmium, tin/zinc, zinc/nickel and tin/nickel.

Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.

Abstract: A zinc-containing waste article is recycled by a method in which the zinc of the waste article is recovered in a molten state while the unmolten nickel/copper electroplating layer of the waste article is dissolved in an acidic solution to form a nickel-zinc alloy or a nickel-zinc-copper alloy electroplating solution.

Abstract: A method for preparing a nickel-zinc-copper or nickel-zinc alloy electroplating solution from at least one electroplating waste solution and/or at least one acidic leach solution of metal scrap containing nickel and/or zinc ions is disclosed. The method involves mixing two or more than two of solutions of the electroplating waste solutions and the acidic leach solutions, and optionally water, so that the ion concentrations of Ni, Zn, Cu, Fe, Cr and Pb of the resulting mixed solution are within the following ion concentrations:15 gdm.sup.-3 <Ni.sup.2+ <58 gdm.sup.-3, 28 gdm.sup.-3 <Zn.sup.2+ <44 gdm.sup.-3, 0<Cu.sup.2+ <1430 gm.sup.-3, 0<Fe.sup.2+ +Fe.sup.3+<5000 gm.sup.-3, 0<Cr.sup.3+ <1000 gm.sup.-3 and 0<Pb.sup.2+ <50 gm.sup.-3.

Abstract: The present invention provides a non-cyanide brass plating bath composition containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the composition does not contain cyanide. The present invention also provides a method of making metallic foil having a brass layer including the steps of providing a metallic foil; contacting the metallic foil with a non-cyanide brass plating bath containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the brass plating bath does not contain cyanide; applying a current to the brass plating bath; and recovering the metallic foil having a brass layer.

Abstract: A copper foil for a printed wiring board which has a carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon is produced by dipping a copper foil in a non-cyanide copper-zinc electroplating bath containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode to form on at least one surface of the copper foil a carbon-containing copper-zinc coating.

Abstract: Workpieces of non-corrosion-resistant metals are provided with a wear-resistant, non-metallic layer of a nitride, carbide, boride, oxide or silicide of an element of the fourth to the sixth subgroup applied by PVD (physical vapor deposition) after a corrosion-resistant intermediate layer had been previously applied. An intermediate layer consisting of a copper-tin alloy with 45 to 80% copper, 10 to 55% tin and 0 to 15% zinc proved to be corrosion-resistant and noble and in addition does not cause any skin allergy.

Abstract: A novel method for making metals and homogeneous metal alloys comprises the steps of (a) providing a polymetallic complex of the general formula(.mu..sub.4 -0)L.sub.4 M'M"M'"M""X.sub.nwherein L is a ligand selected from the group consisting of organic and inorganic ligands, wherein M', M", M'", and M"" are metal atoms two or more of which may be the same, wherein X is a halogen atom, and wherein n is an integer ranging from 4 to 6; and (b) electrochemically depositing at least one of the metals from said polymetallic complex.

Abstract: An improved treatment for copper foil comprising electrodepositing a metallic barrier layer of copper, zinc and antimony on at least one side of the foil which, preferably, has a matte surface formed prior to forming the barrier layer. The so-treated foil provides a high bonding strength when laminated to polymeric substrates and resists undercutting by mineral acid etchants and rinses during production of printed circuit boards.