Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

Abstract: Methods for electrodeposition using aqueous electrolytes where water molecules are depleted are described herein. Methods of electrodepositing superconducting thin films from aqueous electrolytes where water molecules are depleted are also described herein.

Abstract: A tin alloy plating solution includes a soluble tin salt, a soluble salt of a metal more noble than tin, and a sulfide compound represented by General Formula (1). In the General Formula (1), (A) is a hydrocarbon group including no oxygen atom and having 1 to 2 carbon atoms, or (A) is a hydrocarbon group including one or more oxygen atoms and having 2 to 6 carbon atoms. The metal which is more noble than tin is preferably silver, copper, gold or bismuth.

Abstract: A method for providing application functionality protection. The method includes accessing a distributed computer system having a cluster including a plurality of nodes, and receiving an indication of an application failure. The method further includes attempting to restore the application through a number of application restart attempts, and receiving an indication that the restart attempts have not restored the application. An image history is then accessed to obtain a last known good point in time image of the application. The application is restored in accordance with the last known good point in time image.

Abstract: In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.

Abstract: Methods and apparatus for forming devices using nanotubes. In one embodiment, an apparatus for depositing nanotubes onto a workpiece comprises a vessel configured to contain a deposition fluid having a plurality of nanotubes including first nanotubes having a first characteristic and second nanotubes having a second characteristic. The apparatus further includes a sorting unit in the vessel configured to selectively isolate or otherwise sort the first nanotubes from the second nanotubes, and a field unit in the vessel configured to attach the first nanotubes to the workpiece. For example, the field unit can attach the first nanotubes to the workpiece such that the first nanotubes are at least generally parallel to each other and in a desired orientation relative to the workpiece.

Abstract: An article comprises a metal alloy substrate and a plated wear interface layer disposed over a surface of the metal alloy substrate. The wear interface layer has a chemical composition including between about 0.005 wt % and about 0.050 wt % of antimony (Sb), and the balance silver (Ag) and incidental impurities.

Abstract: Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.

Abstract: A sliding bearing having a composite layer comprising carbon nanostructures (6) incorporated within a metallic matrix (5), and a method of manufacture of such a sliding bearing by electroplating.

Abstract: Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity.

Abstract: An aluminium alloy sheet product or extruded product for fluxless brazing, including an aluminium alloy core having on at least one face an aluminium filler clad layer containing 4% to 15% of Si, the filler clad layer having an inner-surface and an outer-surface, the inner-surface is facing the aluminium alloy core and the outer-surface is facing a coating layer of 2 to 45 mg/sq.m of Bi or of a Bi-based alloy. Furthermore, a method of brazing a brazed assembly incorporating at least one member made from the brazing sheet material.

Abstract: A silver-containing alloy electrolytic plating bath that can produce silver-containing alloy plated products having excellent resistance to oxidation suitable for electronic members, decoration members, and dental members, is described, along with a method for electrolytic plating using the same. The silver-containing alloy plated products have excellent resistance to oxidation and can be manufactured by using the plating bath that contains (a) a silver compound containing 99.9% to 46% by mass of silver on the basis of the total metal mass therein, (b) a gadolinium compound containing 0.1% to 54% by mass of gadolinium on the basis of the total metal mass therein, (c) at least one kind of complexing agent, and (d) a solvent.

Abstract: Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract: Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.

Abstract: Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.

Abstract: A transition element-doped aluminum powder metal and a method of making this powder metal are disclosed. The method of making includes forming an aluminum-transition element melt in which a transition element content of the aluminum-transition element melt is less than 6 percent by weight. The aluminum-transition element melt then powderized to form a transition element-doped aluminum powder metal. The powderization may occur by, for example, air atomization.

Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.

Abstract: Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.

Abstract: The present invention is directed to the fabrication of rigid memory disks, including a metal plating composition which impedes deposition of non-metallic particles during a plating process. The plating composition includes at least one sulfated fatty acid ester additive, or mixtures or salts thereof, of formula: wherein R1 is selected from the group consisting of OH, OCH2, H2CH3, C1-C7 alkyl, linear or branched; R2 selected from H and C1-C7 alkyl, linear or branched; m=1 to about 5; n=2 to about 30; o=0 to about 10; M+ is a metal or pseudo metal ion or H+. The additive has a zeta potential which impedes deposit of non-metallic particles. The invention is further directed to a method for electroless plating utilizing the additive composition in a bath with at least a stabilizing agent, complexing agent and reducing agent and source of metal ions.

Abstract: The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system is characterized in that the anode (2) is in direct contact with a membrane (3) which completely separates the anode space from the cathode space. This anode system is therefore a direct-contact membrane anode.

Abstract: Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.

Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.

Abstract: The present invention relates to CIGS solar cell fabrication. The invention discloses a method for fabricating CIGS thin film solar cells using a roll-to-roll apparatus. The invention discloses method to fabricate semiconductor thin film Cu(InGa)(SeS)2 by sequentially electroplating a stack of multiple precursor layers comprising of copper, indium, gallium, and selenium elements or their alloys followed by selenization at a temperature between 450° C. and 700° C.

Abstract: Methods for coating a metal substrate or a metal alloy with electrically conductive titania-based material. The methods produce metal components for electrochemical devices that need high electrical conductance, corrosion resistance and electrode reaction activities for long term operation at a low cost.

Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.

Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.

Abstract: A method for manufacturing a main body (10) of a faucet equipped with a valve (V) for blocking a water flow at an upper portion and a lever (L) for adjusting the valve. The method includes the steps of: separately molding each component of the main body (10) made of a brass material, the components including a base body (11) equipped with the valve, a first assembly (12) with a hot water inlet (12a), a second assembly (14) with a cold water inlet (14a) and a third assembly (16) with a water discharge port (16a); double injection molding a polyamide resin composition into the base body (11) and the first through third assemblies (12, 14, 16) to form internal molding assemblies (22, 24, 26, 28); combining the base body (11) and the first through third assemblies (12, 14, 16); and plating nickel-chromium onto the exterior of the welded structure.

Abstract: An electrochemical co-deposition method and solution to plate uniform, defect free and smooth (In,Ga)—Se films with repeatability and controllable molar ratios of (In,Ga) to Se are provided. Such layers are used in fabrication of semiconductor and electronic devices such as thin film solar cells. In one embodiment, the present invention provides an alkaline electrodeposition solution that includes an In salt, a Se acid or oxide, a tartrate salt as complexing agent for the In species, and a solvent to electrodeposit an In—Se film possessing sub-micron thickness on a conductive surface.

Abstract: The invention provides an electroplating composition, method, and improved apparatus, which enables electroplating tin-silver alloys at high speed and without burning. The composition is an aqueous acidic solution including salts of stannous tin and a monovalent silver, and a complexing agent selected from the group consisting of thiocarbazides and thiohydrazides, and optionally an aldehyde and/or dialdehyde organic brightener compound. A sulfonic acid and a surfactant may also be included. The improved apparatus provides a protective structure substantially surrounding the anode(s) to decrease turbulence and the problematic silver displacement reaction.

Abstract: The embodiment described herein relate to pulse electroplating methods and solutions.

Abstract: There is provided a mixture having a freezing point of up to 100° C. formed by a process comprising the step of contacting: (A) from 1 to 2 equivalents of a compound of formula (I) AlX3 (I) wherein each X independently represents Cl, Br or F; with (B) 1 equivalent of a compound of formula (II) R1—C(O)—N(R2)(R3) (II) wherein R1 to R3 have meanings given in the description. There is also provided further mixtures containing additional components, as well as methods of using the mixtures in various applications, such as for the electroreduction of the mixtures to produce aluminium metal.

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.

Abstract: A semiconductor device includes a semiconductor chip, a contact pad of the semiconductor chip and a first layer arranged over the contact pad. The first layer includes niobium, tantalum or an alloy including niobium and tantalum.

Abstract: The present invention relates to the use of phosphinic acids and/or phosphonic acids and salts thereof, preferably as surface-active compounds, in redox processes, in particular in electroplating technology, particularly preferably in electroplating baths, and to electroplating baths comprising these compounds.

Abstract: Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.

Abstract: An intelligent client agent and a method for using the client agent to operate a hybrid online/offline client application. A mobile client device is configured with a client agent comprising a dispatcher for receiving and responding to page requests from a client browser, a cache for storing the presentation formats of pages, a database for storing data for the pages, a voice engine for interaction with the application user in audio, and a script engine for assembling a page to be presented graphically or aurally. Instead of storing each page (e.g., of an application) as a static composition, the presentation format of the page is stored separate from content (e.g., data). At the time of assembly, the desired content is retrieved and bound to the presentation format and provided to the user.

Abstract: An electrochemical co-deposition method and solution to plate uniform, defect free and smooth (In,Ga)—Se films with repeatability and controllable molar ratios of (In,Ga) to Se are provided. Such layers are used in fabrication of semiconductor and electronic devices such as thin film solar cells. In one embodiment, the present invention provides an alkaline electrodeposition solution that includes an In salt, a Se acid or oxide, a tartrate salt as complexing agent for the In species, and a solvent to electrodeposit an In—Se film possessing sub-micron thickness on a conductive surface.

Abstract: There is described an open cell porous structure the cells of which are optionally filled with an elastomeric or thermosetting plastic comprising a nanocrystalline metallic or nanocrystalline metal matrix composite coating wherein the nanocrystals have a crystallite size of from about 5 nm to about 150 nm. A process for preparing the coated open cell porous structures is also disclosed.

Abstract: A method for the electro-chemical-deposition (ECD) of alloys of iron (Fe) and gallium (Ga) to electro-deposit magnetostrictive “Galfenol” thin films. Various uses and applications for said Galfenol thin films are also disclosed.

Abstract: There is provided a method for preparation of a transition metal electroplated porous carbon nanofiber composite for hydrogen storage. Specifically, the preparation method of a transition metal electroplated porous carbon nanofiber composite for hydrogen storage according to the present invention comprises electroplating a transition metal with a controlled particle diameter and a surface dispersion ratio on a porous carbon nanofiber with specific surface area from 500 to 3000 m2/g, pore volume from 0.1 to 2.0 cc/g and diameter from 10 to 500 nm. With increased hydrogen storage capacity, the transition metal electroplated porous carbon nanofiber composite provided by the present invention can be utilized as hydrogen storage medium of active material for electrodes of electrochemical devices, such as fuel cell, secondary cell and supercapcitor.

Abstract: Coated articles, electrodeposition baths, and related systems are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.

Abstract: A method of making colloidal sphere templates and the sphere-templated porous materials made from the templates. The templated porous materials or thin films comprise micron and submicron-scaled spheres in ordered, disordered, or partially ordered arrays. The invention is useful in the synthesis of submicron porous, metallic tin-based and other high capacity anode materials with controlled pore structures for application in rechargeable lithium-ion batteries. The expected benefits of the resulting nanostructured metal films include a large increase in lithium storage capacity, rate capability, and improved stability with electrochemical cycling.

Abstract: Embodiments of the inventions provide methods and apparatus to electroplate films of tellurides such as CdTe, or its alloys on multiple large area workpieces. In one embodiment a method of forming a solar cell absorber film on multiple work pieces uses a self adjusting mechanism taking advantage of the high resistivity of the solar cell absorber film. Larger deposits of the plating material onto one workpiece, due for example, to non-uniformity of solution flow, results in larger resistance thus decreasing the current flowing through that workpiece. The decreased current then deposits less material over that workpiece. In another embodiment multiple workpieces can be electroplated using a single power supply in a single plating bath.

Abstract: An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.