Including Tin (e.g., Bronze, Etc.) Patents (Class 205/241)
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Patent number: 11866843Abstract: The present invention relates to an electrolytic copper foil for a secondary battery, having excellent physical properties at a low temperature, and a method for producing the electrolytic copper foil. The electrolytic copper foil for a secondary battery shows little change in the physical properties, such as tensile strength and elongation, of a copper foil even at a low temperature and thereby exhibits excellent cycle properties at the low temperature. The electrolytic copper foil for a secondary battery is produced from a plating solution, containing total organic carbon (TOC), cobalt, iron and zinc, by using a drum and coated with a cathode active material, wherein the ratio between the TOC, cobalt, iron and zinc contained in the electrolytic copper foil follows the following formula 1: TOC/(cobalt+iron+zinc)=1.0-1.2.Type: GrantFiled: April 13, 2021Date of Patent: January 9, 2024Assignee: LOTTE ENERGY MATERIALS CORPORATIONInventors: Sun Hyoung Lee, Tae Jin Jo, Seul-Ki Park, Ki Deok Song
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Patent number: 11508967Abstract: The present invention relates to an electrolytic copper foil for a secondary battery and a method of producing the same, and more particularly, to an electrolytic copper foil for a secondary battery, which has little change in a physical property of a copper foil before and after vacuum drying in a process of producing an electrolytic copper foil, thereby exhibiting excellent cycle life in a battery test at a high-density negative electrode, and preventing cracking. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC), zinc, and iron by using a drum, in which a ratio of the TOC to the zinc and the iron contained in the electrolytic copper foil follows Formula 1 below: TOC/(zinc+iron)=1.3 to 1.5.Type: GrantFiled: January 10, 2021Date of Patent: November 22, 2022Assignee: ILJIN MATERIALS CO., LTD.Inventors: Sun Hyoung Lee, Tae Jin Jo, Seul-Ki Park, Ki Deok Song
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Patent number: 11293111Abstract: An electroplated article is provided comprising a polymeric substrate bearing an electroplated metal layer comprising copper and tin in an atomic ratio of less than 96:4, in some embodiments less than 87:13 and in some embodiments less than 82:18; wherein the atomic ratio of copper to tin is greater than 55:45, and wherein the electroplated metal layer comprises at least 3.5 weight % tin. The electroplated metal layer comprises an alloy having a melting point of less than 1050° C. and in some cases less than 800° C. The electroplated metal layer has a Young's Modulus of less than 15.0 GPa, in some embodiments less than 13.0 GPa, and in some less than 10.0 GPa. In addition, an electroplating solution is provided comprising Cu(II) ions, Sn (II) ions, Zn(II) ions, 1-methionine, and no cyanide anion.Type: GrantFiled: June 13, 2016Date of Patent: April 5, 2022Assignee: 3M Innovative Properties CompanyInventors: Steven Y. Yu, Gene B. Nesmith, Larry S. Hebert
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Patent number: 10985006Abstract: An electrolytic plating apparatus includes a plating tank that is filled with plating liquid; a moving mechanism configured to vertically move a processing target substrate in a direction normal to a surface of the plating liquid; a seal member that is disposed at a peripheral edge portion of a processing target surface of a processing target substrate and is configured to seal the plating liquid to a center side of the processing target surface when the processing target substrate is immersed in the plating tank; and a contact member that is separated from the seal member and is electrically connected to the processing target surface.Type: GrantFiled: August 27, 2018Date of Patent: April 20, 2021Assignee: TOSHIBA MEMORY CORPORATIONInventors: Fumito Shoji, Tatsuo Migita, Masahiko Murano
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Patent number: 10662541Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.Type: GrantFiled: October 8, 2015Date of Patent: May 26, 2020Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLCInventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
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Patent number: 9871010Abstract: Disclosed is a tin-based electroplating solution for forming solder bumps of a flip chip package. The tin-based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonic acid, a fluorinated surfactant, an aromatic polyoxyalkylene ether, and water. Also disclosed is a method for forming solder bumps by using the electroplating solution. The method includes (1) electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper/nickel plating solution to form copper or copper/nickel pillars on the under bump metallurgy layer and (2) electroplating the pillars with the tin-based electroplating solution to form solder bumps.Type: GrantFiled: July 27, 2015Date of Patent: January 16, 2018Assignee: APCT CO., LTDInventors: Jung Woo Ko, Jeong Hun Oh, Kyu Bin Park, Hyun Kook Park, Heung Su Jung
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Patent number: 9562300Abstract: Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.Type: GrantFiled: December 28, 2015Date of Patent: February 7, 2017Assignee: Rohm and Haas Electronic Materials LLCInventors: Weijing Lu, Zuhra I Niazimbetova, Maria Anna Rzeznik
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Patent number: 9512529Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.Type: GrantFiled: June 4, 2013Date of Patent: December 6, 2016Inventors: Adolphe Foyet, Margit Clauss, Wan Zhang-Beglinger, Julia Woertink, Yi Qin, Jonathan Prange, Pedro O Lopez Montesinos
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Patent number: 9506158Abstract: A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.Type: GrantFiled: May 7, 2012Date of Patent: November 29, 2016Assignee: Atotech Deutschland GmbHInventors: Dirk Rohde, Bernd Roelfs, Jun Higuchi
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Patent number: 8974752Abstract: Methods of treating of stannous oxide particles having at least a partial surface crust of stannic oxide by contacting the particles with a reducing agent for a period of time sufficient to produce stannous oxide are provided. The stannous oxide particles produced are readily soluble in organic sulfonic acids.Type: GrantFiled: September 30, 2012Date of Patent: March 10, 2015Assignee: Dow Global Technologies LLCInventor: Matthew L. Grandbois
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Patent number: 8956523Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.Type: GrantFiled: September 16, 2012Date of Patent: February 17, 2015Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Publication number: 20140124376Abstract: A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings.Type: ApplicationFiled: December 9, 2013Publication date: May 8, 2014Applicant: ATOTECH DEUTSCHLAND GMBHInventors: Philip Hartmann, Klaus-Dieter Schulz, Lars Kohlmann, Heiko Brunner
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Patent number: 8647491Abstract: An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterized in that it further contains (ii) N-methyl pyrrolidone is described.Type: GrantFiled: February 5, 2009Date of Patent: February 11, 2014Assignee: Atotech Deutschland GmbHInventors: Philip Hartmann, Lars Kohlmann, Heiko Brunner, Klaus-Dieter Schulz
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Patent number: 8603315Abstract: A method for electrochemically plating tin or tin alloy onto a workpiece to provide a tin or tin alloy deposit on said workpiece having a stress differential and workpieces characterized by a tin or tin alloy deposit having a stress differential.Type: GrantFiled: January 5, 2007Date of Patent: December 10, 2013Assignee: Faraday Technology, Inc.Inventors: E. Jennings Taylor, Jenny J. Sun
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Patent number: 8562847Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.Type: GrantFiled: September 9, 2011Date of Patent: October 22, 2013Assignee: Dai Nippon Insatsu Kabushiki KaishaInventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
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Publication number: 20130252020Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.Type: ApplicationFiled: December 6, 2011Publication date: September 26, 2013Inventor: George Hradil
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Publication number: 20130140185Abstract: The present invention relates to an electrolyte and a process for depositing bronze alloys on consumer goods and industrial articles. The electrolyte of the invention comprises, in addition to the metals to be deposited and additives such as wetting agents, complexing agents and brighteners, in particular sulfur compounds which have a positive effect in the corresponding process for the deposition of the bronzes.Type: ApplicationFiled: August 12, 2011Publication date: June 6, 2013Applicant: UMICORE GALVANOTECHNIK GMBHInventors: Bernd Weyhmueller, Klaus Bronder, Uwe Manz, Frank Oberst, Mario Tomazzoni, Sascha Berger
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Patent number: 8444840Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.Type: GrantFiled: June 30, 2011Date of Patent: May 21, 2013Assignee: Eveready Battery Company, Inc.Inventors: Jason L. Stimits, Jeffrey S. Dreger
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Publication number: 20130051715Abstract: The invention relates to an anti-fretting layer (5) for a multi-layer plain bearing (1), the anti-fretting layer being composed of a copper-based alloy, which in addition to copper as the main alloying element contains at least one element from the group comprising germanium, tin, indium, zinc, nickel, cobalt, bismuth, lead, silver and antimony and unavoidable impurities originating from production, wherein the total fraction of said alloying elements is at least 1 wt. % and at most 30 wt. %, and wherein copper mixed-crystal grains comprising copper and the at least one element are present in the copper alloy, wherein the copper mixed-crystal grains are oriented in such a way that an orientation index M{hkl} according to formula (I) M ? { hkl } = I ? { hkl } ? ? I 0 ? { hkl } I 0 ? { hkl } ? ? I ? { hkl } of each of the lattice plane sets {hkl} has a value of less than 3.Type: ApplicationFiled: April 14, 2011Publication date: February 28, 2013Applicant: Miba Gleitlager GmbHInventor: Jakob Zidar
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Patent number: 8337688Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.Type: GrantFiled: August 15, 2011Date of Patent: December 25, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 8329018Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.Type: GrantFiled: September 6, 2011Date of Patent: December 11, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 8303792Abstract: A method of preparing an additive suspension circuit for a hard disk drive suspension includes electrodepositing an alloy of copper using an electrolytic bath containing copper sulfate, tin, iron, sulfuric acid, and hydrochloric acid, using pulsed current of about 10-45 amperes per square foot.Type: GrantFiled: August 29, 2008Date of Patent: November 6, 2012Assignee: Magnecomp CorporationInventors: Christopher Schreiber, Peter Hahn, Christopher Dunn
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Patent number: 8211285Abstract: Consumer goods and industrial articles are electro-plated with bronze layers for decorative reasons and to protect them against corrosion. The electrolytes used hitherto for producing decorative bronze layers are either cyanide-containing or, as in the case of baths based on organosulphonic acids, highly corrosive or have, as in the case of cyanide-free baths based on diphosphoric acid, unsatisfactory long-term stabilities. Electrolytes which are used for applying solderable bronze layers in the electronics industry usually contain toxic or very toxic thio compounds. The present invention provides a non-toxic electrolyte which displays long-term stability for the electrolytic deposition of decorative bronze layers and a corresponding process for the application of such decorative bronze layers to consumer goods and industrial articles.Type: GrantFiled: January 24, 2008Date of Patent: July 3, 2012Assignee: Umicore Galvanotechnik GmbHInventors: Klaus Bronder, Bernd Weyhmueller, Frank Oberst, Sascha Berger, Michael Lauster
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Patent number: 8048284Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.Type: GrantFiled: April 2, 2008Date of Patent: November 1, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 8043519Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.Type: GrantFiled: May 21, 2008Date of Patent: October 25, 2011Assignee: Dai Nippon Insatsu Kabushiki KaishaInventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
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Publication number: 20110233065Abstract: This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Te, Re, Pt, Au, TI, Bi, or an alloy thereof, and there is a halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminum, magnesium, or boron to facilitate deposition of a smooth and even layer with much lower deposition metal requirements.Type: ApplicationFiled: July 8, 2009Publication date: September 29, 2011Applicant: ENTHONE INC.Inventors: Andreas Königshofen, Danica Elbick, Helmut Starke
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Patent number: 8012334Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.Type: GrantFiled: April 2, 2008Date of Patent: September 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 7993508Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.Type: GrantFiled: November 1, 2007Date of Patent: August 9, 2011Assignee: Eveready Battery Company, Inc.Inventors: Jason L. Stimits, Jeffrey S. Dreger
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Publication number: 20110089043Abstract: The invention relates to a modified copper-tin electrolyte which is free of toxic constituents such as cyanides or thio compounds. The invention further relates to a process for the deposition of decorative bronze layers on consumer goods and industrial articles using the electrolyte of the invention. The electrolyte comprises an additive formed from epichlorohydrin and hexamethylenetetramine and contains carbonate or hydrogencarbonate ions.Type: ApplicationFiled: March 31, 2009Publication date: April 21, 2011Applicant: UMICORE GALVANOTECHNIK GMBHInventors: Bernd Weyhmueller, Klaus Bronder, Frank Oberst, Sascha Berger, Uwe Manz
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Patent number: 7780839Abstract: Electrolytes for white bronzes are disclosed as well as methods of depositing the white bronzes. The electrolytes for depositing the white bronzes are cyanide free and provide a uniform white color.Type: GrantFiled: December 10, 2008Date of Patent: August 24, 2010Assignee: Rohm and Haas Electronic Materials LLCInventors: Andre Egli, Qing Chen
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Publication number: 20100147696Abstract: Consumer goods and industrial articles are electro-plated with bronze layers for decorative reasons and to protect them against corrosion. The electrolytes used hitherto for producing decorative bronze layers are either cyanide-containing or, as in the case of baths based on organosulphonic acids, highly corrosive or have, as in the case of cyanide-free baths based on diphosphoric acid, unsatisfactory long-term stabilities. Electrolytes which are used for applying solderable bronze layers in the electronics industry usually contain toxic or very toxic thio compounds. The present invention provides a non-toxic electrolyte which displays long-term stability for the electrolytic deposition of decorative bronze layers and a corresponding process for the application of such decorative bronze layers to consumer goods and industrial articles.Type: ApplicationFiled: January 24, 2008Publication date: June 17, 2010Inventors: Klaus Bronder, Bernd Weyhmuller, Frank Oberst, Sascha Berger, Michael Lauster
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Publication number: 20090188807Abstract: Electrolytes for white bronzes are disclosed as well as methods of depositing the white bronzes. The electrolytes for depositing the white bronzes are cyanide free and provide a uniform white color.Type: ApplicationFiled: December 10, 2008Publication date: July 30, 2009Applicant: Rohm and Haas Electronic Materials LLCInventors: Andre Egli, Qing Chen
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Patent number: 7563353Abstract: A method of forming an Sn—Ag—Cu ternary alloy thin-film of the present invention forms the ternary alloy thin-film by electroplating. A plating bath contains an Sn compound, an Ag compound, a Cu compound, an inorganic chelating agent and an organic chelating agent. The inorganic chelating agent is one of a polymerized phosphate-based chelating agent and a chelating agent represented by a chemical formula (I): MFX(X—Y)— . . . (I) where M is an arbitrary metal, X is an arbitrary natural number and Y is an oxidation number of M. The organic chelating agent is one of porphyrins, dipivaloylmethane, phthalocyanines and a compound represented by a chemical formula (II): R—(CH2CH2O)n-A . . . (II) where R is an alkyl group having a carbon number of 8 to 30, A is CH2COONa or CH2SO4Na and n is a natural number.Type: GrantFiled: October 19, 2005Date of Patent: July 21, 2009Assignee: FCM Co., Ltd.Inventor: Shigeki Miura
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Patent number: 7465384Abstract: An acid electrolyte and method of using the electrolyte to both deposit tin and tin-alloys on iron containing substrates and at the same time perform as a flux to inhibit the formation of haze and stains on the tin and tin-alloys. The electrolytes and methods are suitable for plating on steel.Type: GrantFiled: February 28, 2006Date of Patent: December 16, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: Peter R. Levey, Neil D. Brown
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Publication number: 20080257745Abstract: The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.Type: ApplicationFiled: June 4, 2008Publication date: October 23, 2008Applicants: NIHON NEW CHROME CO., LTD., YKK SNAP FASTENERS JAPAN CO., LTD.Inventors: Kazuya URATA, Kazuhito KITAGAWA, Yukio OGAWA, Kenji KASEGAWA
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Publication number: 20080230394Abstract: A surface treatment with a zirconium ion that enables sufficient throwing power, and superior anti-corrosion properties to be exhibited when thus surface treated metal base material is subjected to cation electrodeposition coating is provided. A metal surface treatment liquid for cation electrodeposition coating includes zirconium ions and tin ions, and has a pH of 1.5 to 6.5, in which: the concentration of zirconium ions is in the range of 10 to 10,000 ppm; and the content of the tin ions to the zirconium ions is 0.005 to 1 on a mass basis. Furthermore, a polyamine compound, copper ions, fluorine ions, and a chelate compound may also be included.Type: ApplicationFiled: March 19, 2008Publication date: September 25, 2008Inventors: Toshio Inbe, Hiroshi Kameda, Thomas Kolberg
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Publication number: 20080226976Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.Type: ApplicationFiled: April 25, 2008Publication date: September 18, 2008Inventor: Jason L. Stimits
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Publication number: 20080102360Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.Type: ApplicationFiled: November 1, 2007Publication date: May 1, 2008Inventors: Jason L. Stimits, Jeffrey S. Dreger
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Patent number: 7273540Abstract: An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being 0.5 to 5 mol/L, 0.21 to 2 mol/L, 0.002 to 0.02 mol/L, and 0.01 to 0.1 mol/L, respectively, a mole ratio of the silver-ion concentration to the copper-ion concentration being in a range of 4.5 to 5.58; and separating a solution around a soluble anode containing 90 percent or more of tin from the plating solution on a cathode side by a non-ionic micro-porous membrane having a pore diameter of 0.01 to 0.05 ?m and a thickness of 5 to 100 ?m.Type: GrantFiled: January 24, 2005Date of Patent: September 25, 2007Assignee: Shinryo Electronics Co., Ltd.Inventors: Hiromi Sonoda, Katsuji Nakamura
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Patent number: 7179362Abstract: The invention relates to an acid electrolyte for depositing tin-copper alloys. Said electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin(II) salts, one or more soluble copper(II) salts, and one or more organic sulfur compounds having one or more thioether functions and/or ether functions of general formula —R—Z—R?—(R and R? are the same or different non-aromatic organic radicals, and Z represents S or O). The invention also relates to a method, which involves the use of the electrolyte, to the coating obtained using said method, and to the use of the electrolyte for coating electronic components.Type: GrantFiled: September 20, 2001Date of Patent: February 20, 2007Assignee: Dr.-Ing. Max Schlotter GmbH & Co.KGInventors: Michael Dietterle, Manfred Jordan, Gernot Strube
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Patent number: 7151049Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.Type: GrantFiled: April 2, 2004Date of Patent: December 19, 2006Assignee: Rohm and Haas Electronic Materials LLCInventors: Rozalia Beica, Neil D. Brown, Kai Wang
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Patent number: 6875332Abstract: The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has been put to a practical use in such a way that the function of existing alloy plating of this type has been significantly improved to eliminate toxic plating from various kinds of electronic components for use in electronic devices so that it is useful in protecting the environment.Type: GrantFiled: September 27, 2002Date of Patent: April 5, 2005Assignee: Nishihara Rikoh CorporationInventor: Masaaki Ishiyama
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Publication number: 20040245113Abstract: Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The selective membrane prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment. A conduit may be employed in the electrochemical cell to permit one way flow of anolyte to the catholyte compartment thereby replenishing tin to the catholyte compartment.Type: ApplicationFiled: June 6, 2003Publication date: December 9, 2004Inventors: George S. Bokisa, William E. Eckles, Robert E. Frischauf
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Patent number: 6808614Abstract: In accordance with the present invention, an electroplating solution is provided for electroplating satin bright tin-copper alloy solder coatings at high speed. The preferred solution comprises sulfonic acid, tin sulfonate, copper sulfonate, non-ionic surfactant, satin brightener and an antioxidant catechol. The preferred surfactant is polyoxyethylene-block-polyoxypropylene. The preferred satin brightener is formed by the oxidation of an aqueous solution of 1-phenyl-3-parazolidinone. The preferred sulfonic acid is methanesulfonic acid.Type: GrantFiled: January 17, 2002Date of Patent: October 26, 2004Assignee: Lucent Technologies Inc.Inventors: Oscar Khaselev, Igor S. Zavarine, Yun Zhang
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Patent number: 6773568Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.Type: GrantFiled: July 16, 2003Date of Patent: August 10, 2004Assignee: Shipley Company, L.L.C.Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
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Patent number: 6759142Abstract: A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.Type: GrantFiled: July 30, 2002Date of Patent: July 6, 2004Assignee: Kobe Steel Ltd.Inventors: Toshihisa Hara, Yasuhiro Shintani, Masayasu Nishimura, Ryoichi Ozaki, Masahiro Kawaguchi
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Patent number: 6736954Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: GrantFiled: October 2, 2001Date of Patent: May 18, 2004Assignee: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6706418Abstract: The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.Type: GrantFiled: June 29, 2001Date of Patent: March 16, 2004Assignee: Shipley Company L.L.C.Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
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Publication number: 20040035714Abstract: The invention relates to an acid electrolyte for depositing tin-copper alloys. Said electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin(II) salts, one or more soluble copper(II) salts, and one or more organic sulfur compounds having one or more thioether functions and/or ether functions of general formula —R—Z—R′—(R and R′ are the same or different non-aromatic organic radicals, and Z represents S or O). The invention also relates to a method, which involves the use of the electrolyte, to the coating obtained using said method, and to the use of the electrolyte for coating electronic components.Type: ApplicationFiled: September 5, 2003Publication date: February 26, 2004Inventors: Michael Dietterle, Manfred Jordan, Gernot Strube
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Publication number: 20030188974Abstract: Embodiments of the invention may generally provide a method for plating a homogenous copper tin alloy onto a semiconductor substrate. The method generally includes providing a plating solution to a plating cell, wherein the plating solution contains an acid, a copper ion source, and a tin ion source, the copper ion source including up to about 98.5% of the metal ions and the tin ions including up to about 1.5% of the metal ions, providing a plating bias to a conductive layer formed on the semiconductor substrate while the conductive layer is in fluid contact with the plating solution, the plating bias being configured to overlap a plating potential range of both copper and tin, and simultaneously plating copper and tin ions onto the conductive layer from the plating solution to form a homogenous copper tin alloy layer on the conductive layer.Type: ApplicationFiled: January 24, 2003Publication date: October 9, 2003Applicant: Applied Materials, Inc.Inventors: Deenesh Padhi, Sivakami Ramanathan, Chris R. McGuirk, Srinivas Gandikota, Girish Dixit