Utilizing Organic Compound-containing Bath Patents (Class 205/259)
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Patent number: 11866841Abstract: Described are electrodeposition methods, and materials and structures prepared by electrodeposition methods, and devices prepared from the electrodeposited materials.Type: GrantFiled: March 15, 2018Date of Patent: January 9, 2024Assignee: SEAGATE TECHNOLOGY LLCInventors: Jie Gong, Steven C. Riemer, Wei Tian, Michael C. Kautzky
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Patent number: 11732375Abstract: An electrolyte solution for iron-tungsten plating is prepared by dissolving in an aqueous medium a divalent iron salt (e.g., iron (II) sulfate) and an alkali metal citrate (e.g., sodium citrate, potassium citrate, or other alkali metal citrate) to form a first solution, dissolving in the first solution a tungstate salt (e.g., sodium tungstate, potassium tungstate, or other potassium tungstate) to form a second solution, and dissolving in the second solution a citric acid to form the electrolyte solution. An iron-tungsten coating is formed on a substrate using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit iron and tungsten on the substrate.Type: GrantFiled: November 12, 2021Date of Patent: August 22, 2023Assignee: The Boeing CompanyInventors: Vijaykumar S. Ijeri, Om Prakash, Stephen P. Gaydos, Nitin Pandurang Wasekar, Govindan Sundararajan, Dameracharla Srinivasa Rao
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Patent number: 11408085Abstract: Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof wherein R1?C1-C18 hydrocarbon moiety comprising a SO3? group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R2?NR3R4 moiety, or OR5 moiety, or cyclic NR6 moiety, wherein R3, R4, R5=hydrogen, or C1-C18 aliphatic hydrocarbon moiety, or C1-C18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R3, R4 and R5 are identical or different; R6?C3-C8 hydrocarbon moiety, or C3-C8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.Type: GrantFiled: April 14, 2020Date of Patent: August 9, 2022Assignee: Atotech Deutschland GmbHInventor: Philipp Wachter
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Patent number: 8900436Abstract: The present invention relates to an electrolyte for the electrochemical deposition of palladium or palladium alloys on metallic or conductive substrates. The invention likewise relates to a corresponding electroplating process using this electrolyte and specific palladium salts which can be advantageously used in this process.Type: GrantFiled: May 7, 2008Date of Patent: December 2, 2014Assignee: Umicore Galvanotechnik GmbHInventors: Sascha Berger, Frank Oberst, Franz Simon, Uwe Manz, Klaus Bronder, Bernd Weyhmueller
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Publication number: 20140269235Abstract: A magnetoresistive data writer and reader may be generally configured at least with a magnetoresistive (MR) element contacting a magnetic shield that is contrasted of (Ni78Fe22)99.8O0.2 material. The magnetic shield may be formed with an electrodeposition process that uses ?-diketones derivatives to form nano-crystalline grain structure after a subsequent annealing at temperatures above 400° C.Type: ApplicationFiled: March 12, 2013Publication date: September 18, 2014Applicant: SEAGATE TECHNOLOGY LLCInventors: Jie Gong, Ibro Tabakovic, Steve Riemer, Michael Christopher Kautzky
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Patent number: 8795504Abstract: Aspects of the present disclosure are directed to electrochemical approaches for synthesis of platinum-iridium alloys with selected platinum-iridium ratio content and subsequently predetermined mechanical properties and electrochemical impedance properties. Such can provide a simple and cost-effective process for preparing these electrodes, as compared to conventional thin film processing techniques. A three-electrode electrochemical electrodeposition system is described including an electrochemical cell with a working electrode on which the electrodeposited film is deposited, a counter electrode to complete the electrochemical circuit and a reference electrode to measure and control surface potential. Mixed layers of platinum atoms and iridium atoms can be deposited from electrolyte solution onto the working electrode surface to create an electrically conductive surface with material properties related to the composition of the as-deposited film.Type: GrantFiled: August 27, 2010Date of Patent: August 5, 2014Assignee: University of Southern CaliforniaInventors: Artin Petrossians, Artak Arakelian, James D. Weiland, Florian B. Mansfeld, John J. Whalen, III
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Patent number: 8551316Abstract: This invention relates to a method for producing a metallic coating layer comprising nickel and molybdenum on an electrically conductive substrate by electrodeposition from an aqueous solution including nickel salts, gluconate anions and citrate anions wherein the substrate acts as the cathode and wherein molybdate is added and wherein the pH of the aqueous solution is adjusted between 5.0 and 8.5. The invention also relates to an electrically conductive substrate provided with such a metallic coating layer electrodeposited from the aqueous solution.Type: GrantFiled: July 11, 2008Date of Patent: October 8, 2013Assignee: Hille & Muller GmbHInventors: Jacques Hubert Olga Joseph Wijenberg, Daniël Adriaan De Vreugd, Ilja Portegies Zwart
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Patent number: 8524629Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.Type: GrantFiled: December 16, 2011Date of Patent: September 3, 2013Assignee: Energia Technologies, Inc.Inventors: Thien Duyen Thi Nguyen, Krishniah Parimi
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Patent number: 8507400Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.Type: GrantFiled: March 1, 2012Date of Patent: August 13, 2013Assignee: Energia Technologies, Inc.Inventors: Thien Duyen Thi Nguyen, Krishniah Parimi
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Patent number: 8357285Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.Type: GrantFiled: June 5, 2008Date of Patent: January 22, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Yutaka Morii, Masanori Orihashi
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Patent number: 8337688Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.Type: GrantFiled: August 15, 2011Date of Patent: December 25, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 8329018Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.Type: GrantFiled: September 6, 2011Date of Patent: December 11, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 8192607Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.Type: GrantFiled: July 7, 2008Date of Patent: June 5, 2012Assignee: Enthone Inc.Inventors: Andreas Königshofen, Danica Elbick, Christoph Werner, Wolfgang Clauberg, Peter Pies, Andreas Möbius
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Publication number: 20120118747Abstract: An object of the present invention is to provide a nickel-iron alloy plating solution which can suppress, in the nickel-iron alloy plating solution containing divalent iron ions and divalent nickel ions, oxidation of divalent iron ions to trivalent iron ions and can prevent occurrence of the precipitation of iron (III) hydroxide to allow stable continuous operations and also to provide a nickel-iron alloy plating solution which allows production of a soft magnetic film being stable in composition. The nickel-iron alloy plating solution of the present invention is characterized in that it comprises divalent iron ions, divalent nickel ions and a hydroxylamine salt and has a pH of 3.0 or lower.Type: ApplicationFiled: October 25, 2010Publication date: May 17, 2012Inventors: Masaomi Murakami, Junnosuke Sekiguchi
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Patent number: 8118990Abstract: A process is described for the fabrication, through electrodeposition, of FexCoyNiz (x=60-71, y=25-35, z=0-5) films that have, in their as-deposited form, a saturation magnetization of at least 24 kG and a coercivity of less than 0.3 Oe. A key feature is the addition of aryl sulfinates to the plating bath along with a suitable seed layer.Type: GrantFiled: May 10, 2006Date of Patent: February 21, 2012Assignee: Headway Technologies, Inc.Inventors: Xiaomin Liu, Feiyue Li, Cherng-Chyi Han
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Patent number: 8066864Abstract: The invention relates to polymers which comprise at least partially cross-linked main chains constructed from repeat units of the general formula I and possibly repeat units of the general formula II and also possibly repeat units comprising five- or six-membered aza aromatics or nitrogen-containing heterocycles. Polymers of this type are used as additive in electroplating baths since these enable a better layer thickness distribution of the electroplated layer.Type: GrantFiled: December 15, 2006Date of Patent: November 29, 2011Assignee: Coventya GmbHInventors: Alexander Jimenez, Thorsten Kühler
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Patent number: 8048284Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.Type: GrantFiled: April 2, 2008Date of Patent: November 1, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 8012334Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.Type: GrantFiled: April 2, 2008Date of Patent: September 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 8002961Abstract: An electrolyte and method of producing the same. In one embodiment, the electrolyte includes water, ascorbic acid, a phosphorous donor, ammonium perchlorate, ferrous perchlorate, cobalt perchlorate, and a buffering agent.Type: GrantFiled: September 10, 2007Date of Patent: August 23, 2011Assignee: Enpirion, Inc.Inventors: Trifon M. Liakopoulos, Robert W. Filas
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Publication number: 20100167087Abstract: This invention relates to a method for producing a metallic coating layer comprising nickel and molybdenum on an electrically conductive substrate by electrodeposition from an aqueous solution including nickel salts, gluconate anions and citrate anions wherein the substrate acts as the cathode and wherein molybdate is added and wherein the pH of the aqueous solution is adjusted between 5.0 and 8.5. The invention also relates to an electrically conductive substrate provided with such a metallic coating layer electrodeposited from the aqueous solution.Type: ApplicationFiled: July 11, 2008Publication date: July 1, 2010Applicant: Hille & muller GMBHInventors: Jacques Hubert Olga Joseph Wijenberg, Daniël Adriaan De Vreugd, Ilja Portegies Zwart
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Patent number: 7641783Abstract: A stable FePt plating solution is provided. Further, a process for electroplating is provided for producing an FePt magnetic material having an especially strong coercive force and excellent properties by using the plating solution. The plating solution contains ionic Fe, ionic Pt, and a complex agent, at a molar ratio (Fe/Pt) of the ionic Fe to the ionic Pt ranging from 0.75 to 3.Type: GrantFiled: January 14, 2005Date of Patent: January 5, 2010Assignee: Canon Kabushiki KaishaInventors: Shigeru Ichihara, Tohru Den, Nobuhiro Yasui
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Patent number: 7588675Abstract: In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) sulfur-containing compound represented by the formula Y—S—R1—SO3X??I wherein X is H or an alkali metal, R1 is an alkylene group containing from 1 to about 5 carbon atoms, Y is H, S—R1—SO3X, C(S)NR2?, C(S)OR?, C(NH2)NR2?, or a heterocyclic group, and each R? is independently H, or an alkyl group containing from 1 to about 5 carbon atoms. Optionally, the aqueous acidic iron phosphorus electroplating bath of the invention also may comprise aluminum irons. The alloys which are deposited on the substrates by the process of the present invention are characterized by the presence of iron, phosphorus and sulfur.Type: GrantFiled: December 23, 2008Date of Patent: September 15, 2009Assignee: Atotech Deutschland GmbHInventors: Carl Christian Fels, Shoichi Kamiya, Allen R. Jones
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Patent number: 7494578Abstract: In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) a sulfur-containing compound selected from sulfoalkylated polyethylene imines, sulfonated safranin dye, and mercapto aliphatic sulfonic acids or alkali metal salts thereof. Optionally, the aqueous acidic iron phosphorus electroplating bath of the invention also may comprise aluminum irons. The alloys which are deposited on the substrates by the process of the present invention are characterized by the presence of iron, phosphorus and sulfur.Type: GrantFiled: March 1, 2004Date of Patent: February 24, 2009Assignee: Atotech Deutschland GmbHInventors: Carl Christian Fels, Shoichi Kamiya, Allen R. Jones
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Patent number: 7396445Abstract: A soft magnetic film is formed of a CoFe alloy having an Fe content in the range of 68 to 80 mass %, thereby having a saturation magnetic flux density of 2.0 T or more. The center lain average roughness of the film surface is 9 nm or less. The soft magnetic film can achieve a corrosive resistant magnetic head with a high recording density.Type: GrantFiled: July 16, 2004Date of Patent: July 8, 2008Assignee: TDK CorporationInventors: Mitsuo Kawasaki, Yoshihiro Kanada
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Patent number: 7300563Abstract: An aqueous acidic plating bath for the electrodeposition of a nickel or nickel alloy deposit. The bath includes nickel ions and an additive having the general formula: H2C?CHCH2NR1R2 or [H2C?CHCH2N+R1R2R3]nXn? wherein R1, R2 and R3 are selected from the functional groups consisting of hydrogen, methyl, ethyl, propyl, allyl, propyn, propanediol and combinations thereof; and Xn? is an n-valent inorganic or organic anion.Type: GrantFiled: February 9, 2004Date of Patent: November 27, 2007Assignee: Pavco, Inc.Inventor: Leonard L. Diaddario, Jr.
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Patent number: 7267757Abstract: At least one of lower and upper magnetic cores is composed of magnetic films each of which contains two or more elements of Co, Ni, and Fe, which are formed by electroplating in a plating bath with pH 2 or less, and which have a saturation magnetic flux density of 23,000 gauss or more.Type: GrantFiled: September 18, 2003Date of Patent: September 11, 2007Assignee: Hitachi Global Storage Technologies Japan, Ltd.Inventors: Kazue Kudo, Gen Oikawa, Tetsuya Okai, Ichiro Oodake, Hiromi Shiina
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Patent number: 7144489Abstract: A method of photochemically reducing iron(III) species in an iron or iron alloy plating solution by adding an additive to the electroplating solution; contacting the additive with iron(III) species to form an iron(III)-additive species; and irradiating the electroplating solution, wherein the radiation is of sufficient energy to reduce the iron(III) in the iron(III)-additive species to iron(II). The additive comprises hydroxycarboxylic acids and their lactones.Type: GrantFiled: October 24, 2002Date of Patent: December 5, 2006Assignee: Enpirion, Inc.Inventor: Robert W. Filas
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Patent number: 7122108Abstract: A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate.Type: GrantFiled: April 11, 2003Date of Patent: October 17, 2006Assignee: Shipley Company, L.L.C.Inventors: Jochen Heber, André Egli
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Patent number: 7122105Abstract: A method of electroplating iron or an iron alloy with a solution containing an iron-chelating agent to catalytically cycle the undesirable Fe(III) species back to Fe(II) for electroplating. The iron-chelating agents may be siderophores, specifically, for example, desferrioxamine E, desferrioxamine B, alcaligin, bisucaberin, putrebactin, rhodotorulic acid, enterobactin, vibriobactin, azotochelin, myxochelin, fluvibactin, and serratiochelin.Type: GrantFiled: October 24, 2002Date of Patent: October 17, 2006Assignee: Enpirion, Inc.Inventor: Robert W. Filas
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Patent number: 7105082Abstract: A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyte. If the cloud point is greater than the electrodeposition temperature, an anion is also present in an amount sufficient to lower the cloud point of the polymer suppressor to a temperature approximately no greater than the electrodeposition temperature.Type: GrantFiled: February 27, 2003Date of Patent: September 12, 2006Assignee: Novellus Systems, Inc.Inventor: Vishwas Hardikar
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Patent number: 6994919Abstract: The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of the clad layer a plated layer of nickel-tin alloy, such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and have a composition with the proviso that the mol-ratio of Ni:Sn is in the range of 10:(0.5 to 9).Type: GrantFiled: July 18, 2003Date of Patent: February 7, 2006Assignees: Corus Aluminium Walzprodukte GmbH, Corus Technology BVInventors: Jacques Hubert Olga Joseph Wijenberg, Adrianus Jacobus Wittebrood, Joop Nicolaas Mooij
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Patent number: 6919014Abstract: In order to achieve an even satin-finished nickel or nickel alloy coating an acid nickel or nickel alloy electroplating bath is proposed which contains a sulfosuccinic acid compound of the general formula I additional to at least one quaternary ammonium compound, wherein R1, R2=hydrogen ion, alkali ion, alkaline earth ion, ammonium ion and/or C1-C18 hydrocarbon moiety, wherein R1 and R2 are identical or different with the proviso that at the most one of the groups R1 and R2=hydrogen ion, alkali ion and alkaline earth ion, and wherein K+=hydrogen ion, alkaline ion, alkaline earth ion, ammonium ionType: GrantFiled: May 9, 2001Date of Patent: July 19, 2005Assignee: Atotech Deutschland GmbHInventors: Klaus-Dieter Schulz, Wolfgang Dahms, Holger Weide
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Patent number: 6887366Abstract: A method for touching up and/or repairing minor surface damage in a large-format pressing plate or an endless strip 3 made of steel sheet, with a textured surface 4, for surface embossing of wood materials or laminate panels, has the damaged surface subjected to microgalvanic treatment. In order to simply repair the damage locations and to allow a longer tool life of the pressing sheets, it is provided, that an electrolyte solution that contains metal ions and iron is used, which is coordinated with the base material of the pressing plate or the endless strip 3. This yields the particular advantage that no color deviations are formed as compared with the damaged locations and that a conventional chromium-plating process can be used. Thus the damaged locations 2 are not washed out and thereby become visible again, during subsequent touch-up chromium-plating, because of the electrolyte used.Type: GrantFiled: September 27, 2002Date of Patent: May 3, 2005Assignee: Hueck Engraving GmbHInventor: Heinz-Peter Lettmann
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Patent number: 6855240Abstract: A cobalt-iron alloy film having saturation magnetization of at least about 2.30 Telsa. The film alloy includes about 55 wt % to about 75 wt. % iron and the remainder cobalt. The film is made by a process in which the film is electrodeposited from an aqueous medium which includes one or more ferrous salts, one or more cobaltous salts, a buffer having a pKa of about 6 to about 8, at least one carboxylic acid having a pKa of between about 3.5 and about 5.5, an aromatic sulfinic acid or its salt and optionally, a halide salt and/or a surfactant. The alloy film is useful as a write head in magnetic recording.Type: GrantFiled: June 9, 2003Date of Patent: February 15, 2005Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Emanuel Israel Cooper, Thomas Edward Dinan, Lubomyr Taras Romankiw, Hong Xu
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Patent number: 6797141Abstract: The invention deals with the technical problem to devise a process for the extended use of electrolytes which economically ensures a high electrolyte quality without having to accept production interruptions for regeneration. Especially, it is envisaged to conduct the process for the precipitation of non-glaring metal coatings in such a manner that work can proceed in three shifts for five days per week, without encountering production interruptions due to coagulation of the fine dispersal phase, respectively, and without the additional operating cost of a heating/cooling circuit. The invention solves the problem in that during the extended use of an electrolyte a partial flow is split off which is filtered and, if applicable, regenerated by the addition of active substances and reintegrated in the operating cycle.Type: GrantFiled: October 3, 2002Date of Patent: September 28, 2004Assignee: Enthone Inc.Inventors: Ralf Wilhelm Ludwig, Gerd Schöngen, Elmar Tolls
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Patent number: 6776891Abstract: A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co100−a−bFeaMb, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.Type: GrantFiled: May 18, 2001Date of Patent: August 17, 2004Assignee: Headway Technologies, Inc.Inventors: Chaopeng Chen, Kevin Lin, Jei Wei Chang
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Patent number: 6773573Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: GrantFiled: October 2, 2001Date of Patent: August 10, 2004Assignee: Shipley Company, L.L.C.Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
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Patent number: 6743346Abstract: An aqueous electrolysis bath of acidic pH for the electrochemical deposition of palladium and its alloys, the bath containing a palladium compound and optionally at least one compound of a secondary metal to be co-deposited in the form of an alloy with the palladium. The bath also contains ethylenediamine as a palladium complexing agent, and an organic brightening agent, 3-(3-pyridyl)acrylic acid, 3-(3-quinolyl)acrylic acid or a salt thereof. The invention is also directed to a process for the electroplating of palladium or a palladium alloy utilizing an electrolysis bath as defined above by using current densities of between 0.5 and 150 A/dm2.Type: GrantFiled: October 3, 2002Date of Patent: June 1, 2004Assignee: Metalor Technologies France Sas a French Simplified Joint Stock CompanyInventors: José Gonzalez, Lionel Chalumeau, Michel Limayrac
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Patent number: 6743950Abstract: A novel complex salt off palladium sulfate and ethylenediamine contains 31 to 41% by weight of palladium and has a molar ratio [SO4]:[Pd] of between 0.9 and 1.15 and a ratio [ethylenediamine ]:[Pd] of between 0.8 and 1.2. The invention further relates to a process for the preparation of this complex salt, and to the use of this complex salt for introducing palladium into an aqueous electrolysis bath of acidic pH for the electrochemical deposition of palladium or one of its alloys, or for adjusting the palladium concentration of such a bath.Type: GrantFiled: October 3, 2002Date of Patent: June 1, 2004Assignee: Metalor Technologies France SASInventors: José Gonzalez, Lionel Chalumeau, Michel Limayrac
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Patent number: 6736954Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: GrantFiled: October 2, 2001Date of Patent: May 18, 2004Assignee: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Publication number: 20040050712Abstract: The invention relates to a dip comprising an acid aqueous solution having no ammonium ion, fluoroborate ions or citrate ion and containing per litre: between 10 and 60 g of Zn2+ ions and between 20 and 100 g of Mn2+ ions. Said invention is characterised in that it comprises a buffer agent that maintains the pH at a value of between 3 and 7, preferably between 4.5 and 6 or better still between 4.8 and 5.5, and another agent, different from the buffer agent, which is used to bring together the deposition potentials of couple Zn/Zn2+ and couple Mn/Mn2+. The inventive dip used to deposit a Zn and Mn alloy by electrolysis.Type: ApplicationFiled: August 4, 2003Publication date: March 18, 2004Inventors: Lionel Thiery, Gianluigi Schiavon, Nicolas Pommier
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Patent number: 6699379Abstract: An improved plating method in combination with a low-temperature thermal treatment is disclosed. The method for reducing the stress in the nickel-based alloy plating comprises the steps of: (a) adding ceramic particles into a plating bath containing soluble nickel salts; and (b) placing a substrate in the plating bath and thereafter carrying out a pulse-current electroplating in the plating bath. The method of this invention can prevent substrate softening or deformation problems. The use of a post low-temperature thermal treatment can slightly increase the hardness of the coating products. The use of the low-temperature thermal treatment can reduce the stress of the coatings since the hydrogen embrittlement resulting from exist of hydrogen in the coatings is eliminated.Type: GrantFiled: November 25, 2002Date of Patent: March 2, 2004Assignee: Industrial Technology Research InstituteInventors: Shih-Tsung Ke, Jen-Chih Li, Ming-Der Ger, Le-Min Wang, Yeh Sung, Jauh-Jung Yang, Ya-Ru Huang
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Patent number: 6620304Abstract: A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-soluble protein material or amino acid and/or at least one water-soluble sulfonic acid, at least one water-soluble nitro-containing substance, at least one water-soluble surface-active agent and at least one vitamin. The bath system galvanostatically applies high quality layers with uniform quality. The bath system can be kept free of harmful substances such as cyanides, sulfites and hard complexing agents.Type: GrantFiled: December 4, 2001Date of Patent: September 16, 2003Inventor: Gerhard Hoffacker
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Publication number: 20030159940Abstract: In order to achieve an even satin-finished nickel or nickel alloy coating an acid nickel or nickel alloy electroplating bath is proposed which contains a sulfosuccinic acid compound of the general formula I additional to at least one quaternary ammonium compound, wherein R1, R2=hydrogen ion, alkali ion, alkaline earth ion, ammonium ion and/or C1-C18 hydrocarbon moiety, wherein R1 and R2 are identical or different with the proviso that at the most one of the groups R1 and R2=hydrogen ion, alkali ion and alkaline earth ion, and wherein K+=hydrogen ion, alkaline ion, alkaline earth ion, ammonium ion.Type: ApplicationFiled: March 17, 2003Publication date: August 28, 2003Inventors: Klaus-Dieter Schulz, Wolfgang Dahms, Holger Weide
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Publication number: 20030085131Abstract: High density magnetic recording requires the write head materials to have high saturation magnetic flux density. Preparation of such materials has been achieved by providing an aqueous solution of nickel, iron, and cobalt salts, each present within a specified concentration range, together with selected additives. When used, under the specified operating conditions, as the electrolyte during electro-deposition, said solution provides a ferromagnetic layer having improved magnetic properties, particularly high saturation magnetic flux density. One embodiment of the process teaches formation of pole tips for use in a magnetic write head.Type: ApplicationFiled: November 6, 2001Publication date: May 8, 2003Applicant: Headway Technologies, Inc.Inventors: Feiyue Li, Chyu Jiun Torng, Cherng-Chyi Han
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Publication number: 20030085130Abstract: A method for depositing a zinc-nickel alloy from a zinc-nickel electrolyte to which an additive has been added in order to broaden the usable current density range. An electrolyte suitable for this method is also presented. The additive is an aromatic or aliphatic carboxylic acid, salt, or derivative. The additive provides for the use of ammonium-free electrolytes.Type: ApplicationFiled: September 23, 2002Publication date: May 8, 2003Applicant: Enthone Inc.Inventors: Wilhelmus Maria Johannes Cornelis Verberne, Karl-Heinz Wandner, Thomas Helden
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Publication number: 20030044303Abstract: A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co100-a-bFeaMb, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.Type: ApplicationFiled: May 18, 2001Publication date: March 6, 2003Applicant: Headway Technologies, Inc.Inventors: Chaopeng Chen, Kevin Lin, Jei Wei Chang
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Patent number: 6428672Abstract: Disclosed is a technique for manufacturing a Ni—Fe alloy thin foil using a single-step electrodeposition-based plating process without requiring processes such as melting, casting, forging, and rolling. A manufacturing apparatus is provided which includes an electrolyzer adapted to receive an electrolyte containing, as a major component thereof, a solution of nickel and iron compounds, a cathode partially dipped in the electrolyte and arranged in such a fashion that it is rotatable, an anode completely dipped in the electrolyte and arranged in such a fashion that it faces the cathode while being spaced apart from the cathode by a desired distance, and a current supply device adapted to generate a flow of current between the cathode and the anode, whereby a Ni—Fe alloy thin film is electrodeposited to a desired thickness over a surface of the cathode facing the anode, and then peeled off from the surface of the cathode, so that a continuous Ni—Fe alloy thin foil is manufactured.Type: GrantFiled: August 16, 2000Date of Patent: August 6, 2002Assignees: Union Steel Manufacturing Co., Ltd., Korea Institute of Industrial TechnologyInventors: Janghyun Choi, Taihong Yim, Tak Kang, Heungyeol Lee, Joongbae Lee, Sanghyun Jeon, Yongbum Park
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Publication number: 20020100694Abstract: The invention provides a pretreatment process for electroplating aluminum parts or strip, in which the zincating solution is modified to improve the adhesion of the subsequent electroplate to the substrate. The aluminum part or strip, such as an aluminum coin blank or strip for coin blanks, is pretreated with an improved zincate solution which provides hydroxide ions in an amount in the range of 75-175 gpl, zinc ions in an amount in the range of 15-40 gpl, nickel ions in an amount in the range of 2-10 gpl and copper ions in an amount in the range of 1.5-5 gpl. The pretreatment process preferably includes a copper strike applied from a copper cyanide strike bath at a pH in the range of 8.5-11.0, using a current density in the range of 0.1-10 A/dm2. The pretreatment and electroplating steps arc preferably conducted by barrel plating, in accordance with another aspect of the invention.Type: ApplicationFiled: August 9, 2001Publication date: August 1, 2002Inventors: Louis Charles Morin, Angie Kathleen Molnar
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Publication number: 20020088717Abstract: Disclosed is an aluminium brazing product, such as a brazing sheet product, having a substrate (1) of an aluminium alloy comprising silicon in an amount in the of 2 to 18% by weight, and on at least one outer surface a layer (2) comprising nickel, wherein a separately deposited layer (3) is applied on one side of the layer (2) comprising nickel and the layer (3) comprising a metal such that taken together the aluminium base substrate (1) and all layers exterior thereto form a metal filler having a liquidus temperature in the range of 490 to 570° C., and preferably in the range of to 550° C. The invention also relates to a method of manufacturing such a brazing product and to a brazed assembly comprising at least one component made of the brazing sheet product.Type: ApplicationFiled: October 31, 2001Publication date: July 11, 2002Inventors: Adrianus Jacobus Wittebrood, Jacques Hubert Olga Joseph Wijenberg