Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

Abstract: A thermal barrier coating system having an improved life as a result of a preoxidation treatment applied to a single phase platinum aluminide bond coat. After coating the substrate to form a diffusion platinum aluminum bond coat, the surface finish of the bond coat was grit blasted with an inert grit of preselected size at a preselected pressure to achieve a predetermined surface finish. After the grit blasting, but before application of the ceramic top coat of yttria-stabilized zirconia (YSZ), the coating was preoxidized to form a thin alumina scale by heat treating the diffusion platinum aluminide bond coat at an elevated temperature at a preselected partial pressure of oxygen.

Abstract: A fuel-cell electrode and a method of manufacturing the fuel-cell electrode achieves a high catalyst utilization ratio and makes it possible to obtain higher output characteristics with a smaller amount of catalyst. The fuel-cell electrode includes a catalytic layer composed of an ion conductive substance, an electron conductive substance and catalytic activation substances. The catalytic activation substances are electrolytically deposited on the electron conductive substance.

Abstract: A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (3) a molecular layer comprising at least one molecule having a hydrophilic region and a hydrophobic region, wherein the hydrophilic region at least partially extends into the partially-filled aperture. Also, provided are coated metallic meshes having bilayers and a method of providing a molecular layer to a coated mesh.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting the metal mesh to a relatively fast deposition of an electrodeposited material so as to substantially uniformly coat said mesh with electrodeposited material; and (3) subjecting the product of the relatively fast deposition step to a relatively slow deposition of an electrodeposited material so as to reduce at least one dimension greater than nanometer scale size to a size of nanometer scale. Also provided are metallic meshes so prepared and spectral filters.

Abstract: A structure that is endowed with electric conductivity by plate-coating with a titanium nitride layer or by generation of a titanium nitride layer on a surface of a base material made of an inorganic material or an organic material, and a method of electroplating a cathode with a simple metal or an alloy, wherein the structure is used as an anode and/or a cathode. The structure is corrosion-resistant and has high electroconductivity, and thus the electroplating method using the structure allows the simplification and the cost reduction of an electroplating process.

Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, platinum, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.

Abstract: The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.

Abstract: A method of making a set of metallic deposits includes injection molding a substrate, where a pattern of channels is in a surface of the substrate, applying a metallic layer on the surface, to form metallic deposits in the pattern, and removing a portion of the metallic layer, to expose a portion of the surface. The set of metallic deposits can form an electrode set for an electrochemical sensor strip.

Abstract: An article substrate is protected by a protective structure overlying a surface of the article substrate. The protective structure includes a protective coating that is formed by depositing a layer of iridium overlying the surface of the substrate, depositing a layer of aluminum overlying the layer of iridium, and heating the substrate, the layer of iridium, and the layer of aluminum to form an iridium-aluminum protective coating overlying the substrate. A ceramic thermal barrier coating may be applied over the protective coating.

Abstract: A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-soluble protein material or amino acid and/or at least one water-soluble sulfonic acid, at least one water-soluble nitro-containing substance, at least one water-soluble surface-active agent and at least one vitamin. The bath system galvanostatically applies high quality layers with uniform quality. The bath system can be kept free of harmful substances such as cyanides, sulfites and hard complexing agents.

Abstract: A recovery system for platinum electrolytic baths operating at low current densities is disclosed. An oxidizing system is provided in a closed-loop recirculation system for platinum plating at low current densities. The oxidizing system reoxidizes Pt+2 ions, which are typically formed at low current densities, to Pt+4 ions by using oxidizers, for example peroxide. A sensor may be also provided to detect the relative concentration of [Pt+2] ions to [Pt+4] ions and to tailor the relative concentrations to a predetermined level.

Abstract: A nickel base single crystal compliant layer on a ceramic blade has the capability to sustain high stresses and high operating temperature. Layers of nickel and platinum bonded on a single crystal superalloy over a sputtered gold-chromium layer support the high stress levels at elevated temperature without extrusion of the soft platinum or nickel layer and without destruction of an NiO compliant surface. The compliant layers have survived stress and temperature conditions without failure to the ceramic blade and the system can be stressed/heated and unloaded/cooled repeatedly without damage to the ceramic blades. A single crystal nickel base superalloy (i.e., SC180) has high strength properties at elevated temperature. Thin layers of chromium followed by gold are e-beam evaporated on one side of a polished surface of the alloy. Pure nickel is electroplated over this e-beam gold-chromium layer. Platinum is either electroplated or plated electrolessly over the nickel layer.

Abstract: A capacitor having an electrode formed by electroplating, and a manufacturing method thereof are disclosed. According to an embodiment of the invention, a conductive film is formed on a conductive plug connected to an active region of a semiconductor substrate, and on an interlayer dielectric (ILD) film formed around the conductive plug. Then, a non-conductive pattern exposing a part of the conductive film on the conductive plug is formed on the conductive film, and a lower electrode, which is formed of a platinum (Pt) group metal, is formed on the conductive film by electroplating. In addition, the lower electrode can have a rectangular, T-shaped, reverse trapezoid or barrel-shaped cross-section. Electroplating can similarly form an upper electrode of the capacitor.

Abstract: A thermal barrier coating for nickel based superalloy articles such as turbine engine vanes and blades that are exposed to high temperature gas is disclosed. The coating includes a columnar grained ceramic layer applied to a platinum modified Ni3Al gamma prime phase bond coat having a high purity alumina scale. The preferred composition of the bond coat is 5 to 16% by weight of aluminum, 5 to 25% by weight of platinum with the balance, at least 50% by weight, nickel. A method for making the bond coat is also disclosed.

Abstract: The invention concerns a bath for the electrochemical deposition of high-gloss white rhodium coatings and a whitening agent for the same.

Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.

Abstract: A protected article includes a substrate, such as a nickel-base superalloy, a protective coating comprising aluminum overlying a surface of the substrate, and an iridium-containing oxygen barrier layer overlying the protective coating. A ceramic thermal barrier coating may overlie the protective coating and the oxygen barrier layer.

Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

Abstract: A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brightness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.

Abstract: An electrolyte for use in electrolytic platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, Pt(NH3)2(NO2)2 or variants thereof and 0.1 to 240 g/lit of alkali metal carbonate M2CO3 or bicarbonate MHCO3 where M is selected from a group comprising lithium (Li), sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs). A method of improving oxidation resistance of a platinum modified aluminide diffusion coating on a substrate, comprises electroplating the substrate using this electrolyte and then aluminizing the electroplated substrate at an elevated temperature to grow a platinum modified aluminide diffusion coating.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: A process for the electrolytic deposition of a metal, preferably copper or an alloy of copper, directly onto a barrier layer coated on a dielectric layer. The process is advantageous because it electrolytically deposits metal in a pattern that is either the duplicate of a first conductive pattern under the dielectric or the inverse image of the first conductive pattern, depending on the first conductive pattern shape. Thus, metal is deposited on the barrier layer duplicating a first conductive pattern under the dielectric layer when the first pattern is a serpentine pattern and the metal deposits in the spaces between the conductive lines of a first conductive pattern of a discrete passive element such as a spiral.

Abstract: An electroplating apparatus is provided with a metal target and a device for supporting a semiconductor wafer (or other workpiece) in an electroplating solution. The target (anode) may be located relatively far from the wafer surface (cathode) at the beginning of the plating process, until a sufficient amount of metal is plated. When an initial amount of metal is built up on the wafer surface, the target may be moved closer to the wafer for faster processing. The movement of the target may be controlled automatically according to one or more process parameters.

Abstract: The present invention is directed to an improved electroplating method, chemistry, and production worthy apparatus for depositing noble metals (e.g., platinum) and their alloys onto the surface of the workpiece, such as a semiconductor wafer, pursuant to manufacturing a microelectronic device, circuit, and/or component. The reliability of the noble metal material deposited using the disclosed method, chemistry, and/or apparatus is significantly better than the reliability of noble metal structures deposited using the teachings of the prior art. This is largely attributable to the low stress of films that are deposited using the teachings disclosed herein. The metals, which can be deposited, include gold, silver, platinum, palladium, ruthenium, iridium, rhodium, osmium and alloys containing these metals.

Abstract: MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator.

Abstract: An electrolyte for use in electrolytic platinum platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, Pt(NH3)2(NO2)2 or variants thereof and 0.1 to 240 g/lit of alkali metal carbonate M2CO3 or bicarbonate MHCO3 where M is selected from a group comprising lithium (Li), sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs).

Abstract: Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25° C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed “stress relief” heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.

Abstract: A curved component such as a turbine airfoil, shroud, or combustor centerbody is prepared with a platinum or a platinum-aluminide protective coating over only a portion of the surface thereof. The coating may serve as an environmental coating, or as a bond coat of a thermal barrier coating system. The partial coverage is achieved by depositing platinum only over a portion of the surface of the component, typically including the concave portion in the case of an airfoil, optionally depositing an aluminum layer, and optionally interdiffusing the platinum and aluminum layers.

Abstract: The specification describes novel rhodium sulfate complex solutions which have a minimum of metal to metal complexing and are mostly complexed through the sulfate groups. Use of these solutions as electrolytes for plating rhodium results in electroplated layers with improved brightness and reduced stress.

Abstract: Thin, light weight bipolar plates for use in electrochemical cells are rapidly, and inexpensively manufactured in mass production by die casting, stamping or other well known methods for fabricating magnesium or aluminum parts. The use of a light metal, such as magnesium or aluminum minimizes weight and simultaneously improves both electrical and thermal conductivity compared to conventional carbon parts. For service in electrochemical cells these components must be protected from corrosion. This is accomplished by plating the surface of the light weight metal parts with a layer of denser, but more noble metal. The protective metal layer is deposited in one of several ways. One of these is deposition from an aqueous solution by either electroless means, electrolytic means, or a combination of the two. Another is deposition by electrolytic means from a non-aqueous solution, such as a molten salt.

Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.

Abstract: An electrolyte for the galvanic deposition of stress-relieved, crack-resistant ruthenium layers containing ruthenium in complexed form. The additive for the electrolyte is pyridine or an N-alkylated pyridinium salts of formula I ##STR1## wherein R.sup..crclbar. is --(CH.sub.2).sub.3 --SO.sub.3.sup..crclbar., --CH.sub.2 --CHOH--CH.sub.2 --SO.sub.3.sup..crclbar., or ##STR2## R' and H is, alkyl with 1-6 C atoms, --CH.dbd.CH.sub.2, or --CO.sub.2 Na.

Abstract: An apertured and porous metal article can find use, for example, in diaphragm or membrane electrolysis cells. The article may comprise a thin and flexible metal foam of small pores which, typically, has been perforated with large apertures. The article may also be provided with an electrocatalytic coating. It can be in substantial physical contact with a membrane or diaphragm separator used in the cell for separating anode and cathode members or compartments. There is also disclosed the preparation of the article and an electrolysis cell utilizing the resulting apertured and porous metal article.

Abstract: The invention discloses a new electrode suitable for use as an anode for oxygen evolution from electrolytes containing fluorides or fluoride-complex anions even in high concentrations.The anode of the invention comprises a titanium substrate provided with a protective interlayer resistant to the aggressive action of fluorides, and an electrocatalytic coating for oxygen evolution.The protective interlayer is made of tungsten, oxides or oxyfluorides, optionally containing metals of the platinum group in minor quantities, metallo-ceramic compounds and intermetallic compounds either per se or as mixed oxides.

Abstract: Disclosed is a method of reactivating a deactivated anode that has a coating of a noble metal or noble metal oxide on a substrate. A coating of a noble metal is deposited on the anode either electrolessly or electrolytically. The noble metal in the deposited coating can be platinum, palladium, iridium, rhodium, ruthenium, osmium, or a mixture thereof.

Abstract: Chlorine ion-containing water supplied from one of water discharge pipelines of an electrolysis vessel of an apparatus for continuously forming electrolyzed water is caused to flow backwardly to one of electrode chambers and a water supply branch pipe thereof, passed through a water supply branch pipe of the other of the electrode chambers and/or a water supply pipeline at the upstream thereof and discharged through the other of the electrode chambers and from the other of the water discharge pipe lines. In this state, water in the electrolysis vessel is electrolyzed while operating the electrode of the electrode chamber in which water is caused to flow backwardly as an anode, and the electrolysis vessel and water channels at the upstream thereof are cleaned and sterilized by electrolyzed cleaning water in which hypochlorous acid is formed.

Abstract: A rapid single step assay suitable for the detection or quantification of enzymes, in particular, hydrolases, especially, aminopeptidases and esterases. The enzymatic reaction causes the cleavage of a metal ligand labelled hydrolase substrate. The cleaved ligand alters the electrochemiluminescence of bidentate aromatic heterocyclic nitrogen-containing ligand reagent. The change in electrochemiluminescence correlates to the presence of hydrolase activity present in the sample. The assay can be performed on an IGEN Origen.RTM. Analyzer.

Abstract: Crack-free, bright platinum layers with thicknesses of more than 100 .mu.m are obtained from electroplating baths which contain 5 to 30 g/l platinum as amminesulphamato complex and 20 to 400 g of a strong acid if the content of free amidosulphuric acid amounts to less than 5 g/l.

Abstract: The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size. The platinum electroforming or electroplating bath comprises at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum and a hydroxylated alkali metal, 20-100 g/l.

Abstract: The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size utilizing an electrolyte bath comprising at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum; a hydroxylated alkali metal, 20-100 g/l; and a soluble carboxylate.

Abstract: The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size. The platinum electroforming or electroplating bath comprises at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum and a hydroxylated alkali metal, 20-100 g/l.

Abstract: Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismaleimide and its derivatives on the surface of the metal sheet. The resulting metal sheet is particularly adapted for being bonded to a polyimide film for the preparation of, for example, a printed circuit board. Also disclosed is a method of bonding the metal sheet of the present invention to a polyimide substrate. Precursor of polyimide are coated on the surface of the plate metal sheet and then thermal imidizing of the precursors takes place. No additional adhesives are needed for this bonding.

Abstract: Enclosed herein is a process for extracting and concentrating rhodium metal from its ores or from secondary sources which comprises electrolysis of an aqueous solution of halide ions at a selected pH so as to generate a reactive species and causing metallic rhodium or a rhodium-containing mixture to remain in intimate contact with said solution. Rhodium is dissolved by the solution and is obtained in a concentrated form by either subsequent redeposition on the cathode of the cell or by removal of the electrolyte solution as it becomes enriched in ionic rhodium species. Rhodium is conveniently separated from the cathode of the cell or the electrolyte and purified using techniques known to those skilled in the art. The use of extreme reaction conditions, and the need for on-site storage of certain dangerous chemicals are avoided. As a result, health and environmental risks are diminshed, and plant equipment undergoes less corrosion than a prior art.

Abstract: An effective bath for plating platinum or platinum alloys contains a complexed platinum (II) salt in which the anion component is a group or radical derived from an organic acid or inorganic acid other than a hydrohalic acid, in alkaline aqueous solution. The bath is more efficient and stable than known baths and permits good plating deposits to be achieved.