Depositing Predominantly Single Metal Coating Patents (Class 205/261)
  • Patent number: 10337086
    Abstract: A magnesium alloy suitable for use as a corrodible downhole article. The alloy has a corrosion rate of at least 50 mg/cm2/day in 15% KCl at 93° C. and a 0.2% proof strength of at least 50 MPa when tested using standard tensile test method ASTM B557-10.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: July 2, 2019
    Assignee: Magnesium Elektron Limited
    Inventors: Timothy E Wilks, Mark Turski
  • Patent number: 9881709
    Abstract: A technique that uses a thermoelectric generator for generating electrical power employs a safe, initially dormant, stable, non-radioactive fuel sample which is activated on-demand by a neutron source to initiate and control activation of the fuel sample. The technique allows thermoelectric generators to be fully assembled and stored for extended periods of time before they are deployed for use, and then activated on demand only when the need arises for them to generate power.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: January 30, 2018
    Assignee: AAI Corporation
    Inventors: Rodney B. Beach, Robert J. Neugebauer
  • Patent number: 9340893
    Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: May 17, 2016
    Assignee: Novellus Systems, Inc.
    Inventors: Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot
  • Patent number: 9145616
    Abstract: A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.
    Type: Grant
    Filed: February 23, 2013
    Date of Patent: September 29, 2015
    Inventors: Adolphe Foyet, Wan Zhang-Beglinger, Michael P. Toben, Jonas Guebey
  • Publication number: 20150144496
    Abstract: A method is provided for manufacturing a component. The method includes connecting a component comprising an internal passage and formed by an additive manufacturing process to a power supply, the component functioning as an anode, connecting a cathode to the power supply, the cathode being disposed in an electrolyte solution, the cathode being positioned externally to the internal passage of the component, contacting the internal passage of the component with the electrolyte solution, and using the power supply, applying a potential difference and current flow between the component and the cathode.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 28, 2015
    Inventors: Mark C. Morris, Klaus Helmut Schwarz, Donald G. Godfrey, Andy Szuromi
  • Publication number: 20150144495
    Abstract: A method of depositing aluminum onto a substrate is disclosed. In this method, the substrate is disposed as cathode in an electrochemical cell with an anode and a liquid electrodeposition composition comprising an ionic liquid and a source of aluminum, and aluminum is electroplated onto the substrate. Residual water content in the electroplating bath is controlled by exposure to light in the presence of a photo-oxidation catalyst to decompose the water or species associated with water.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 28, 2015
    Applicant: Sikorsky Aircraft Corporation
    Inventors: Lei Chen, Xiaomei Yu, William P. Fallon
  • Publication number: 20150140357
    Abstract: A contact layer for an electrical contact is disclosed having bismuth and being tin-free.
    Type: Application
    Filed: January 30, 2015
    Publication date: May 21, 2015
    Applicant: TYCO ELECTRONICS AMP GMBH
    Inventors: Helge Schmidt, Stefan Thoss
  • Publication number: 20150136610
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Application
    Filed: December 10, 2014
    Publication date: May 21, 2015
    Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
  • Publication number: 20150136611
    Abstract: Reaction products of guanidine compounds or salts thereof, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate with good surface properties of the metal deposits and good physical reliability.
    Type: Application
    Filed: November 21, 2013
    Publication date: May 21, 2015
    Inventors: Julia KOZHUKH, Zuhra I. NIAZIMBETOVA, Maria Anna RZEZNIK
  • Publication number: 20150096895
    Abstract: For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
    Type: Application
    Filed: April 16, 2013
    Publication date: April 9, 2015
    Applicant: Atotech Deutschland GmbH
    Inventors: Dominik Britz, Bernd Schmitt, Bernd Böse, Frank Mücklich, Christian Selzner
  • Publication number: 20150083604
    Abstract: The present invention relates to an electrolyte solution comprising at least one solvent as component A, at least one electrolyte as component B and from 0.1 to 20% by weight, based on the total electrolyte solution, of at least one heteroaromatic compound of the general formula (I) as component C, the use of such a compound in electrolyte solutions, the use of such an electrolyte solution in an electrochemical cell or for metal plating, and also electrochemical cells comprising a corresponding electrolyte solution.
    Type: Application
    Filed: December 3, 2014
    Publication date: March 26, 2015
    Applicant: BASF SE
    Inventors: Xiao STEIMLE, Itamar Michael Malkowsky, Klaus Leitner
  • Publication number: 20150075994
    Abstract: The present disclosure provides methods and systems for electrorefining high-purity materials, for example, silicon. An exemplary system includes at least one cathode, an anode, and a reference electrode. At least one controller, for example a potentiostat, is used to control the potential difference between a reference electrode and a cathode or anode. The system can be operated in a single phase or multiple phase operation to produce high-purity materials, such as solar-grade silicon.
    Type: Application
    Filed: November 24, 2014
    Publication date: March 19, 2015
    Inventor: Meng Tao
  • Publication number: 20150027899
    Abstract: Provided is an anode for electroplating which uses an aqueous solution as an electrolytic solution, and the anode which is low in potential when compared with a conventional anode, able to decrease an electrolytic voltage and an electric energy consumption rate and may also be used as an anode for electroplating various types of metals, and which is low in cost. Also provided is a method for electroplating which uses an aqueous solution as an electrolytic solution, in which the anode is low in potential and electrolytic voltage, thereby making it possible to decrease the electric energy consumption rate. The anode for electroplating of the present invention is an anode for electroplating which uses an aqueous solution as an electrolytic solution, in which a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate.
    Type: Application
    Filed: August 31, 2012
    Publication date: January 29, 2015
    Applicant: THE DOSHISHA
    Inventor: Masatsugu Morimitsu
  • Patent number: 8940433
    Abstract: The present invention relates to an electrolyte solution comprising at least one solvent as component A, at least one electrolyte as component B and from 0.1 to 20% by weight, based on the total electrolyte solution, of at least one heteroaromatic compound of the general formula (I) as component C, the use of such a compound in electrolyte solutions, the use of such an electrolyte solution in an electrochemical cell or for metal plating, and also electrochemical cells comprising a corresponding electrolyte solution.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: January 27, 2015
    Assignee: BASF SE
    Inventors: Xiao Steimle, Itamar Michael Malkowsky, Klaus Leitner
  • Patent number: 8940149
    Abstract: Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: January 27, 2015
    Assignee: International Business Machines Corporation
    Inventors: Shafaat Ahmed, Hariklia Deligianni
  • Publication number: 20150014178
    Abstract: Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device 1A includes at least a positive electrode 11, a negative electrode 12, a solid electrolyte membrane 13 arranged on a surface of the positive electrode 12, between. the positive electrode and a substrate to serve as the negative electrode, and a power supply unit E adapted to apply a voltage across the positive electrode 11 and the substrate B. A voltage is applied across the positive electrode 11 and the substrate B to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane 13, whereby a metal film F made of metal is formed, The positive electrode 11 is made of a porous body that allows a solution L containing metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane 13.
    Type: Application
    Filed: February 21, 2013
    Publication date: January 15, 2015
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Motoki Hiraoka, Hiroshi Yanagimoto, Yuki Sato, Takayasu Yoshioka
  • Publication number: 20140348450
    Abstract: A sliding bearing having a composite layer comprising carbon nanostructures (6) incorporated within a metallic matrix (5), and a method of manufacture of such a sliding bearing by electroplating.
    Type: Application
    Filed: December 6, 2012
    Publication date: November 27, 2014
    Applicants: Mahle International GmbH, Mahle Engine Systems UK Limited
    Inventor: Roohollah Kachoosangi
  • Patent number: 8877391
    Abstract: The present invention relates to an electrochemical cell for generating electrical power that includes an anode, a cathode, a charging electrode and an ionically conductive medium containing at least metal fuel ions and poly(ethylene glycol)tetrahydrofurfuryl. The present invention also relates to a method for charging the cell by electrodeposition of metal fuel on the anode thereof.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: November 4, 2014
    Assignee: Fluidic, Inc.
    Inventors: Cody A. Friesen, Todd Trimble
  • Publication number: 20140311915
    Abstract: An electrode for electrochemical processes comprises a substrate of titanium or other valve metal, an intermediate protection layer based on valve metal oxides and a catalytic layer based on oxides of tin and of iridium doped with small amounts of oxides of elements selected between bismuth, antimony, tantalum and niobium. The electrode used in electrometallurgical processes, for example in the electrowinning of metals, as anode for anodic oxygen evolution presents a reduced overvoltage and a higher duration.
    Type: Application
    Filed: June 22, 2012
    Publication date: October 23, 2014
    Applicant: INDUSTRIE DE NORA S.p.A.
    Inventors: Fabio Timpano, Alice Calderara
  • Patent number: 8840770
    Abstract: Techniques for electrodepositing selenium (Se)-containing films are provided. In one aspect, a method of preparing a Se electroplating solution is provided. The method includes the following steps. The solution is formed from a mixture of selenium oxide; an acid selected from the group consisting of alkane sulfonic acid, alkene sulfonic acid, aryl sulfonic acid, heterocyclic sulfonic acid, aromatic sulfonic acid and perchloric acid; and a solvent. A pH of the solution is then adjusted to from about 2.0 to about 3.0. The pH of the solution can be adjusted to from about 2.0 to about 3.0 by adding a base (e.g., sodium hydroxide) to the solution. A Se electroplating solution, an electroplating method and a method for fabricating a photovoltaic device are also provided.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: September 23, 2014
    Assignee: International Business Machines Corporation
    Inventors: Shafaat Ahmed, Hariklia Deligianni
  • Publication number: 20140262792
    Abstract: The invention provides a system and a process that allow for the selective electrochemical conversion of carbon dioxide to carbon monoxide with high energy efficiency, using a cathode comprised of bismuth in combination with an anode such as an anode comprised of platinum. The electrolysis system may be comprised of a single or two compartment cell and may employ an organic electrolyte or an ionic liquid electrolyte. The invention permits the storage of solar, wind or conventional electric energy by converting carbon dioxide to carbon monoxide and liquid fuels.
    Type: Application
    Filed: March 6, 2014
    Publication date: September 18, 2014
    Applicant: University of Delaware
    Inventors: John L. DiMeglio, Jonnathan Medina-Ramos, Joel Rosenthal
  • Publication number: 20140251435
    Abstract: The present invention describes a method of producing a p-type light-absorbing semiconductor copper zinc tin selenide/sulfide (Cu2(ZnxSn2-x)(SySe1-y)4) (abbreviated CZTS) with electrochemical deposition. It can be used in the production of solar cell when combined with an n-type inorganic or an organic semiconductor layer. The present method comprises a one-step or a sequence of depositions using electroplating to fabricate a low-cost and large-area CZTS solar cell, without using expensive and complicated deposition techniques or highly toxic and flammable chemicals in the production process. The present method significantly reduces the cost and energy requirement for production of solar cell.
    Type: Application
    Filed: February 12, 2014
    Publication date: September 11, 2014
    Applicant: Nano and Advanced Materials Institute Limited
    Inventors: Kam Piu HO, Paul Kwok Keung HO, Man Wah LIU, Ranshi WANG, Wai Chun LUK, Wing Ho CHOI, Fulin ZHENG, Kwong Chau KWOK, Mei Mei HSU, Ivan Ka Yu LAU
  • Publication number: 20140246326
    Abstract: The subject of the present invention is a method of the electrolytic isolation of arsenic from industrial electrolytes including waste electrolytes used in the electrorafination of copper after its prior decopperisation.
    Type: Application
    Filed: October 19, 2012
    Publication date: September 4, 2014
    Applicant: NANO-TECH SP. Z O.O.
    Inventors: Michal Gieron, Slawomir Ruta, Przemyslaw Zaprzalski
  • Publication number: 20140246483
    Abstract: An aluminium alloy sheet product or extruded product for fluxless brazing, including an aluminium alloy core having on at least one face an aluminium filler clad layer containing 4% to 15% of Si, the filler clad layer having an inner-surface and an outer-surface, the inner-surface is facing the aluminium alloy core and the outer-surface is facing a coating layer of 2 to 45 mg/sq.m of Bi or of a Bi-based alloy. Furthermore, a method of brazing a brazed assembly incorporating at least one member made from the brazing sheet material.
    Type: Application
    Filed: November 9, 2012
    Publication date: September 4, 2014
    Applicant: ALERIS ROLLED PRODUCTS GERMANY GMBH
    Inventors: Adrianus Jacobus Wittebrood, Steven Kirkham, Achim Bürger, Klaus Vieregge
  • Patent number: 8795505
    Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: August 5, 2014
    Assignees: Samsung Electronics Co., Ltd., Adeka Corporation
    Inventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
  • Publication number: 20140202870
    Abstract: An electroplating solution and method for producing an electroplating solution containing a gallium salt, an ionic compound and a solvent that results in a gallium thin film that can be deposited on a substrate.
    Type: Application
    Filed: September 4, 2012
    Publication date: July 24, 2014
    Applicant: Alliance for Sustainable Energy, LLC
    Inventor: Raghu N. Bhattacharya
  • Publication number: 20140183051
    Abstract: A system and method generate atomic hydrogen (H) for deposition of a pure metal in a three-dimensional (3D) structure. The method includes forming a monolayer of a compound that includes the pure metal. The method also includes depositing the monolayer on the 3D structure and immersing the 3D structure with the monolayer in an electrochemical cell chamber including an electrolyte. Applying a negative bias voltage to the 3D structure with the monolayer and a positive bias voltage to a counter electrode generates atomic hydrogen from the electrolyte and deposits the pure metal from the monolayer in the 3D structure.
    Type: Application
    Filed: January 2, 2013
    Publication date: July 3, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael P. Chudzik, Min Dai, Rishikesh Krishnan, Joseph F. Shepard, JR.
  • Publication number: 20140110379
    Abstract: An electrode wire for electro-discharge machining includes a core wire including a first metal including copper and having one of phases ?, ?+??, and ??, a first alloy layer formed at a boundary region between the core wire and a second metal plated on an outer surface of the core wire due to mutual diffusion between the core wire and the second metal and having a phase ??, and a second alloy layer formed due to diffusion of the first metal to the second metal and having a phase ? and/a phase ?. A core wire material is erupted onto a surface of the electrode wire for electro-discharge machining, which includes the core wire, the first alloy layer, and the second alloy layer, along cracks appearing on the second alloy layer, so that a plurality of grains are formed on the surface of the electrode wire.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 24, 2014
    Inventors: Ki-Chul SEONG, Hyun-Soo SEONG, Hyun-Kook SEONG
  • Publication number: 20140103330
    Abstract: A gas sensor operable at ambient conditions, the sensor includes functionalized feather-like tellurium (Te) nanostructures on single-walled carbon nanotube (SWNTs) networks.
    Type: Application
    Filed: October 10, 2013
    Publication date: April 17, 2014
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Nosang V. MYUNG, Miluo Zhang
  • Patent number: 8679317
    Abstract: A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: March 25, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura
  • Publication number: 20140076730
    Abstract: A method of harvesting Group I metals from waste materials, including agitating Group I metal-containing materials in water to define a Group I metal-rich aqueous solution, removing any solid material from the Group I metal-rich aqueous solution, and filling the cathode portion of an electrochemical cell with the Group I metal-rich aqueous solution. A current collector is introduced into the Group I metal-rich aqueous solution, a steel electrode is operationally connected to the cathode portion, and the cathode portion is operated to deposite Group I metal onto the steel electrode.
    Type: Application
    Filed: March 4, 2013
    Publication date: March 20, 2014
    Inventor: Indiana University Research and Technology Corporation
  • Publication number: 20130327650
    Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 12, 2013
    Inventors: Steven Mayer, Jingbin Feng, Zhian He, Jonathan Reid, Seshasayee Varadarajan
  • Patent number: 8585885
    Abstract: Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: November 19, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Nathaniel E. Brese, Edit Szocs, Felix J. Schwager, Michael P. Toben, Martin W. Bayes
  • Publication number: 20130299339
    Abstract: An aluminum alloy component has a surface region alloyed with an anodic metal to increase corrosion resistance in aqueous environments with high salinity or sulfur content.
    Type: Application
    Filed: June 17, 2013
    Publication date: November 14, 2013
    Inventors: Thomas J. Watson, Thomas J. Garosshen
  • Patent number: 8562847
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: October 22, 2013
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Publication number: 20130270117
    Abstract: Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.
    Type: Application
    Filed: June 6, 2013
    Publication date: October 17, 2013
    Inventors: Edit SZOCS, Felix J. SCHWAGER, Thomas GAETHKE, Nathaniel E. BRESE, Michael P. TOBEN
  • Publication number: 20130264215
    Abstract: The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system is characterized in that the anode (2) is in direct contact with a membrane (3) which completely separates the anode space from the cathode space. This anode system is therefore a direct-contact membrane anode.
    Type: Application
    Filed: December 8, 2011
    Publication date: October 10, 2013
    Applicant: UMICORE GALVANOTECHNIK GMBH
    Inventors: Bernd Weyhmueller, Franz Kohl, Uwe Manz, Klaus Bronder, Frank Oberst, Mario Tomazzoni
  • Publication number: 20130256146
    Abstract: Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging.
    Type: Application
    Filed: March 29, 2013
    Publication date: October 3, 2013
    Inventors: Lee Peng Chua, Steven T. Mayer, Thomas A. Ponnuswamy, Santosh Kumar
  • Patent number: 8545689
    Abstract: Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: October 1, 2013
    Assignee: International Business Machines Corporation
    Inventors: Shafaat Ahmed, Hariklia Deligianni
  • Publication number: 20130252020
    Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.
    Type: Application
    Filed: December 6, 2011
    Publication date: September 26, 2013
    Inventor: George Hradil
  • Publication number: 20130224515
    Abstract: A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.
    Type: Application
    Filed: February 23, 2013
    Publication date: August 29, 2013
    Inventor: ROHM AND HAAS ELECTRONIC MATERIALS LLC
  • Publication number: 20130199936
    Abstract: Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.
    Type: Application
    Filed: June 13, 2012
    Publication date: August 8, 2013
    Applicant: BATTELLE MEMORIAL INSTITUTE
    Inventors: Jiguang Zhang, Wu Xu, Gordon L. Graff, Xilin Chen, Fei Ding, Yuyan Shao
  • Publication number: 20130192996
    Abstract: An aluminum alloy component has a surface region alloyed with an anodic metal to increase corrosion resistance in aqueous environments with high salinity or sulfur content.
    Type: Application
    Filed: January 29, 2013
    Publication date: August 1, 2013
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventor: United Technologies Corporation
  • Publication number: 20130192982
    Abstract: An aluminum alloy component has a surface region alloyed with an anodic metal to increase corrosion resistance in aqueous environments with high salinity or sulfur content.
    Type: Application
    Filed: February 1, 2012
    Publication date: August 1, 2013
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Thomas J. Watson, Thomas J. Garosshen
  • Publication number: 20130186680
    Abstract: A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.
    Type: Application
    Filed: January 23, 2013
    Publication date: July 25, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Samsung Electronics Co., Ltd.
  • Publication number: 20130183581
    Abstract: An improved substrate is disclosed for an electrode of an electrochemical cell. The improved substrate includes a core material surrounded by a coating. The coating is amorphous such that the coating includes substantially no grain boundaries. The core material may be one of lead, fiber glass, and titanium. The coating may be one of lead, lead-dioxide, titanium nitride, and titanium dioxide. Further, an intermediate adhesion promoter surrounds the core material to enhance adhesion between the coating and the core material.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Applicant: Energy Power Systems LLC
    Inventors: Subhash Dhar, Fabio Albano, Srinivasan Venkatesan, William Koetting, Lin Higley
  • Publication number: 20130168258
    Abstract: The purpose of the present invention is to provide an aluminum electroplating solution that allows aluminum electroplating to be conducted efficiently and in a short period of time, can increase the amount of electricity in the current of electroplating, and has high solubility in a nonaqueous solvent. This aluminum electroplating solution is characterized by comprising an aluminum metal salt, an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt, and an organic solvent having a dielectric constant of 8 or less. It is preferable for the volume percentage of the organic solvent in relation to the total volume of the ionic liquid and the organic solvent to be at least 30%, and for at least one of the following to be included as the organic solvent having a dielectric constant of 8 or less: hexane, toluene, diethyl ether, ethylacetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, and dioxane.
    Type: Application
    Filed: September 1, 2011
    Publication date: July 4, 2013
    Applicant: HITACHI, LTD.
    Inventors: Hiroshi Nakano, Yoshinori Negishi, Haruo Akahoshi
  • Publication number: 20130168257
    Abstract: A composite particle comprises a core, a shielding layer deposited on the core, and further comprising an interlayer region formed at an interface of the shielding layer and the core, the interlayer region having a reactivity less than that of the core, and the shielding layer having a reactivity less than that of the interlayer region, a metallic layer not identical to the shielding layer and deposited on the shielding layer, the metallic layer having a reactivity less than that of the core, and optionally, an adhesion metal layer deposited on the metallic layer.
    Type: Application
    Filed: February 28, 2013
    Publication date: July 4, 2013
    Applicant: Baker Hughes Incorporated
    Inventors: Oleg A. Mazyar, Michael H. Johnson, Randall V. Guest, Nicholas Carrejo, Wayne R. Furlan, Sean L. Gaudette
  • Publication number: 20130157498
    Abstract: In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate.
    Type: Application
    Filed: November 12, 2012
    Publication date: June 20, 2013
    Applicant: Massachusetts Institute of Technology
    Inventors: Jorg Scholvin, Anthony Zorzos, Clifton Fonstad, Edward Boyden
  • Patent number: 8460533
    Abstract: Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: June 11, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Edit Szocs, Felix J. Schwager, Thomas Gaethke, Nathaniel E. Brese, Michael P. Toben