Abstract: The process of forming a partial gold-plating pattern on a stainless substrate includes a first plating step, a second plating step, and a stripping step. In the first plating step, pretreatment is applied to a stainless substrate including opposite main planes and a processing site formed of a plane different from the main planes, after which a first gold-plating layer is formed all over the surface of the stainless substrate using a hydrochloric acid plating solution. In the second plating step, mask plating is used to form a second gold-plating layer on the first gold-plating layer that covers the processing site in a desired pattern, and in the stripping step, a portion of the first gold-plating layer in an area where there is none of the second gold-plating layer is stripped off using an alkaline stripping solution.

Abstract: A gold plating bath and a plating method is disclosed where gold cyanide or salts thereof provide the source of gold, a cobalt compound, and a reaction product of compound containing at least a nitrogen-containing heterocyclic compound and an epihalohydrin. The gold plating bath has high deposition selectivity.

Abstract: A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.

Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

Abstract: A method is described for plating adherent, hard decorative gold in one or two steps, eliminating multistage substrate stripping on chromium plated automobile emblems.

Abstract: The invention discloses a new electrode suitable for use as an anode for oxygen evolution from electrolytes containing fluorides or fluoride-complex anions even in high concentrations.The anode of the invention comprises a titanium substrate provided with a protective interlayer resistant to the aggressive action of fluorides, and an electrocatalytic coating for oxygen evolution.The protective interlayer is made of tungsten, oxides or oxyfluorides, optionally containing metals of the platinum group in minor quantities, metallo-ceramic compounds and intermetallic compounds either per se or as mixed oxides.

Abstract: Opportunistic decorative mass production gold plating solutions are described which are capable of plating gold at concentrations as low as one-half pennyweight per gallon based on an alkaline gold cyanide complex. The low concentration enables ecological operations as well as low working capital inventory operations. The solutions feature high efficiency "put through" replenishment of gold, and non 24 Karat gold deposition capabilities such as 18 and 14 Karats without the necessity of adding metal salts. The solutions operate over a pH range of one to seven without affecting the stability of the gold cyanide complex in the pH range of 1-2.5. A preferred embodiment of the invention comprises an electrolyte mixture of three buffer salts and two chelating agents capable of depositing bright hard 18 Karat gold colored deposits.

Abstract: A solution for electroplating gold-copper-zinc alloys. A solution containing excess cyanide and hydroxide ions, gold and copper each in the form of a cyanide complex, and zinc at least partially in the form of a zincate complex. Additives such as conductivity salts, chelating agents, surfactants or wetting agents, brightening agents, and reducing agents may also be present to impart a particular feature or characteristic to the solution. Also, a process for electroplating up to about 20 microns of a gold-copper-zinc alloy upon a substrate using these novel solutions. The alloy is deposited upon a substrate which is immersed in the solution by electroplating at a current density of between about 1 and 15 ASF (0.1 to 1.5 ASDM) at a temperature of about 60.degree. and 120.degree. F. for a sufficient time to obtain the desired thickness. Generally, thicknesses of 5 to 10 microns or more can be obtained without microcracking.