Abstract: A surface treatment solution for autodeposition coating treatment of a metallic material, which is an aqueous solution comprising at least one tannin, at least one crosslinking agent having a crosslinking group capable of thermosetting reaction with a phenolic hydroxyl group and/or a phenolic nucleus, ferric ions, soluble type elemental fluorine, and an oxidizing agent, wherein the solids mass concentration ratio of the tannin to the crosslinking agent is in the range of from 1:1 to 1:10, the molar concentration of the soluble type elemental fluorine is at least 3-fold the molar concentration of the ferric ions, and the pH of the solution is from 2 to 6.

Abstract: The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system is characterized in that the anode (2) is in direct contact with a membrane (3) which completely separates the anode space from the cathode space. This anode system is therefore a direct-contact membrane anode.

Abstract: The present invention relates to a method for the metallizing pretreatment of galvanized and/or alloy-galvanized steel surfaces or joined metallic components having at least some zinc surfaces, wherein a thin surface layer of iron is deposited on the zinc surfaces from an aqueous electrolyte containing water-soluble compounds that are a source of iron cations. The method is performed at least partially or continuously under application of an electrolytic voltage, the galvanized and/or alloy-galvanized steel surfaces being connected as cathode. The aqueous electrolyte additionally contains an accelerator selected from oxo acids of the elements phosphorus, nitrogen and/or sulfur, the elements phosphorus, nitrogen and/or sulfur being present in moderate oxidation states.

Abstract: Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.

Abstract: The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing: at least one metal ion of an Sn ion, an Fe ion, and an Ni ion; Zr ion; a nitric acid ion: and an ammonium ion, in which the composite film contains at least one element of: Zr of 0.1 to 100 mg/m2 in equivalent units of metal Zr; Sn of 0.3 to 20 g/m2 in equivalent units of metal Sn; Fe of 5 to 2000 mg/m2 in equivalent units of metal Fe; and Ni of 5 to 2000 mg/m2 in equivalent units of metal Ni.

Abstract: Provided are device, method, and medium for generating an audio fingerprint and retrieving audio data. The device for generating an audio fingerprint includes: a coefficient extracting section partially decoding audio data in a compression area and extracting MDCT (Modified Discrete Cosine Transform) coefficients; a coefficient selecting section selecting an MDCT coefficient robust to noises from the extracted MDCT coefficients; a modulation spectrum generating section transforming the selected MDCT coefficient by the use of a Fourier transform method and generating a modulation spectrum; and a bit conversion section quantizing the generated modulation spectrum and generating an audio fingerprint. As a result, it is possible to accurately and rapidly retrieve the audio data recorded in a variety of environments. Since elements based on MP3 are used, it is possible to apply to MP3 applications in various manners.

Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.

Abstract: A process for the extraction of uranium compounds from wet-process phosphoric acid includes lowering the iron concentration of the wet-process phosphoric acid and reducing the valency of any remaining ferric iron in the wet-process phosphoric acid to ferrous iron, and then extracting uranium compounds from the wet-process phosphoric acid. The process can include separating a side stream from a feed stream of wet-process phosphoric acid, wherein the side stream has a greater concentration of the uranium compounds than the feed stream by filtration. Extracting uranium compounds from the wet-process phosphoric acid can be by ion exchange process or by solvent extraction.

Abstract: The invention relates to polymers which comprise at least partially cross-linked main chains constructed from repeat units of the general formula I and possibly repeat units of the general formula II and also possibly repeat units comprising five- or six-membered aza aromatics or nitrogen-containing heterocycles. Polymers of this type are used as additive in electroplating baths since these enable a better layer thickness distribution of the electroplated layer.

Abstract: This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Te, Re, Pt, Au, TI, Bi, or an alloy thereof, and there is a halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminum, magnesium, or boron to facilitate deposition of a smooth and even layer with much lower deposition metal requirements.

Abstract: The electrolyte composition is used in a method of depositing metals, in particular, onto substrates, especially solar cells. The electrolyte composition is particularly suitable for the deposition of metals, in particular silver, onto solar cells. The electrolyte composition is preferably free of cyanides and contains at least one metal, preferably silver, and an iminodisuccinate derivative, preferably a sodium or postassium iminodisuccinate.

Abstract: A method, including placing a substrate of a battery in a bath consisting of a metal M chosen from a metal group consisting of Fe, Ni, Co, Cu, W, V, and Mn, an oxidant selected from an oxidant group consisting of oxygen and sulfur, and a polymer. The method also includes applying an electrical current so as to form on the substrate a metal M compound cathode having a nanoscale grain structure.

Abstract: A surface treatment method of cladding a Sn or Sn alloy coating with one or more metals selected from among Mn, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, In, Ti, Ge, Pb, Sb and Bi continuously or discontinuously in such a way as to make the Sn or Sn alloy coating partially exposed, which method makes it possible to inhibit the generation of whiskers in an Sn or Sn alloy coating formed on the surface of a substrate to which other member is pressure-welded or the joint surface to be soldered. Cladding an Sn or Sn alloy coating with a prescribed metal continuously or discontinuously in such a way as to make the coating partially exposed inhibits the generation of whiskers by contact pressure in pressure welding, and further inhibits the generation of whiskers without impairing the solder wettability of the coating even when the cladding is not followed by heat treatment or reflowing.

Abstract: There is disclosed articles for and methods of confining volatile materials in the void volume defined by crystalline void materials. In one embodiment, the hydrogen isotopes are confined inside carbon nanotubes for storage and the production of energy. There is also disclosed a method of generating various reactions by confining the volatile materials inside the crystalline void structure and releasing the confined volatile material. In this embodiment, the released volatile material may be combined with a different material to initiate or sustain a chemical, thermal, nuclear, electrical, mechanical, or biological reaction.

Abstract: A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode and a reference electrode and can reduce the molar ratio [Fe+3]/[Fe+2] to 1 ppm without depositing Fe or other metals on the working electrode or causing hydrogen evolution. The process is applicable to electroplating soft magnetic films such as NiFe, FeCo, and CoNiFe and can be performed during plating or during cell idling. The process is cost effective by reducing the amount of hazardous waste and tool down time due to routine solution swap. Other benefits are improved uniformity in composition and thickness of plated films because issues associated with decomposed reducing agents are avoided.

Abstract: A method for preparing nano metallic particles comprises the steps of dipping a conductive substrate in an electroplating solution containing metallic ions and performing an electroplating process to form the nano metallic particles on the conductive substrate by the reduction reaction of the metallic ions. The nano metallic particles can be used as a catalyst to perform a chemical vapor deposition process to form carbon nanotubes on the conductive substrate. Subsequently, fluorescent material can be positioned on the carbon nanotubes to form a light-emitting device. When a predetermined voltage is applied between the conductive substrate and the fluorescent material, the carbon nanotubes on the conductive substrate emit electrons due to the point discharge effect, and the electrons bombard the fluorescent material to emit light beams.

Abstract: An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate metals without the need to add plating metal ions to the solution in the form of metal salts, chelates or complexes.

Abstract: A method of photochemically reducing iron(III) species in an iron or iron alloy plating solution by adding an additive to the electroplating solution; contacting the additive with iron(III) species to form an iron(III)-additive species; and irradiating the electroplating solution, wherein the radiation is of sufficient energy to reduce the iron(III) in the iron(III)-additive species to iron(II). The additive comprises hydroxycarboxylic acids and their lactones.

Abstract: A process for applying a metal layer to surfaces of light metals is proposed, in which iron is electrolytically deposited on the surfaces from a deposition bath containing Fe(II) compounds using dimensionally stable anodes insoluble in the deposition bath. The process is especially suitable for coating cylinder faces of internal combustion engines and of rotationally symmetrical parts with layers having very high wear resistance, especially of valves, nozzles and other parts of high-pressure injection systems for motor vehicle engines. In addition, the present invention pertains to nanocrystalline iron-phosphorus layers, which can be formed preferably by depositing iron in the presence of compounds containing orthophosphite and/or hypophosphite. These layers also have good corrosion resistance besides the good wear resistance.

Abstract: A method of electroplating iron or an iron alloy with a solution containing an iron-chelating agent to catalytically cycle the undesirable Fe(III) species back to Fe(II) for electroplating. The iron-chelating agents may be siderophores, specifically, for example, desferrioxamine E, desferrioxamine B, alcaligin, bisucaberin, putrebactin, rhodotorulic acid, enterobactin, vibriobactin, azotochelin, myxochelin, fluvibactin, and serratiochelin.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: A track width defining layer for defining a write track width of a thin-film magnetic head is made of a CoNiFe film formed through electroplating. The CoNiFe film contains 60 to 75 weight % cobalt, 10 to 20 weight % nickel, and 10 to 20 weight % iron, and has a crystal structure that is a mixture of a body-centered cubic structure phase and a face-centered cubic structure phase, in which Ib/If falls within the range of 0.3 to 0.7 inclusive where Ib represents the intensity of an X-ray diffracted from a (110)-plane of the body-centered cubic structure and If represents the intensity of an X-ray diffracted from a (111)-plane of the face-centered cubic structure. The pH of a plating bath for forming the CoNiFe film through electroplating is adjusted to 3.0 to 4.0 inclusive.

Abstract: A plating bath which accommodates an insoluble anode and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.

Abstract: A process for applying a metal layer to surfaces of light metals is proposed, in which iron is electrolytically deposited on the surfaces from a deposition bath containing Fe(II) compounds using dimensionally stable anodes insoluble in the deposition bath. The process is especially suitable for coating cylinder faces of internal combustion engines and of rotationally symmetrical parts with layers having very high wear resistance, especially of valves, nozzles and other parts of high-pressure injection systems for motor vehicle engines. In addition, the present invention pertains to nanocrystalline iron-phosphorus layers, which can be formed preferably by depositing iron in the presence of compounds containing orthophosphite and/or hypophosphite. These layers also have good corrosion resistance besides the good wear resistance.

Abstract: A process for the electrolytic deposition of a metal, preferably copper or an alloy of copper, directly onto a barrier layer coated on a dielectric layer. The process is advantageous because it electrolytically deposits metal in a pattern that is either the duplicate of a first conductive pattern under the dielectric or the inverse image of the first conductive pattern, depending on the first conductive pattern shape. Thus, metal is deposited on the barrier layer duplicating a first conductive pattern under the dielectric layer when the first pattern is a serpentine pattern and the metal deposits in the spaces between the conductive lines of a first conductive pattern of a discrete passive element such as a spiral.

Abstract: A process of producing an iron plating on a metal surface of a part is provided. The process includes the steps of forming and maintaining an electrolytic plating bath to comprise: 200-500 Gm/L ferrous sulfate; 20-70 Gm/L ferrous fluoborate; 10-35 Gm/L ammonium chloride; and an effective amount of wetting agent in an aqueous solution; maintaining the pH of the bath in the range of 1.5 to 4.2; maintaining the temperature of the bath in the range of 100° F. to 160° F.; and maintaining the current density in the bath in the range of 2 to 60 amps/sq.ft. At least the metal surface of the part to be plated is contacted with the electrolytic plating bath. According to a further aspect of the invention, during electroplating, the pH, the temperature, and/or the current density are changed within their specified ranges to control the microstructure of the electrodeposited iron.

Abstract: The present invention relates to the electrodeposition of transition metal and rare earth alloys from aqueous solutions to form thin films. The present invention which comprises the preparation of suitable mixtures of water soluble compounds containing the desired transition metal (TM) and rare earth (RE) elements, establishing appropriate bath conditions and applying specific current densities across the bath solution to cause a film with the desired properties to be deposited on a target substrate.

Abstract: An apparatus and method are provided for coating particles in a rotating container. A cathode forms an electrically conductive inner surface of a side wall of the container. An anode is positioned relative to the cathode so as to permit both the cathode and the anode to be immersed together in an electrically conductive fluid. A motor is connected to the container and arranged to cause the container to rotate so as to generate a centrifugal force. Particles are placed in the container, the container is filled with the electrically conductive fluid, and electrical current is caused to pass from the cathode to the anode through the electrically conductive fluid while the container is rotated. The particles rest against the electrically conductive inner surface of the side wall of the container while the electrical current passes from the cathode to the anode, so as to result in deposition of a coating material from the electrically conductive fluid onto the particles.

Abstract: An electroplating formulation and process is provided for electroplating an iron layer onto an aluminum or aluminum alloy substrate. The method entails immersing an iron-containing anode and an aluminum containing cathode in an electroplating bath including boric acid in a concentration of at least about 50 grams per liter, and ferrous ions, and then applying electrical current to the cathode. A preferred electroplating bath solution includes the following: (1) Fe+2 having a concentration ranging from about 0.65 to about 2.5 moles per liter of solution; (2) at least one anion associated with the Fe+2 ion; (3) a reducing agent in an amount sufficient to prevent oxidation of Fe+2 to Fe+3; (4) Cl− in an amount sufficient to promote dissolution of the anode and increase the conductivity of the solution; (5) a wetting agent in an amount sufficient to prevent pitting of the aluminum electroplated surface; and (6) boric acid in a concentration of at least about 50 grams per liter.

Abstract: Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25° C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed “stress relief” heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.

Abstract: A process for plating aluminum alloy substrates (10), such as 390 aluminum alloy pistons (12), with iron comprises (a) plating on the aluminum substrate a layer of zincate from a zincate bath; (b) plating on the zincate layer a layer (14) of nickel from an electroless nickel bath; (c) plating on the nickel layer a layer (16) of iron from an iron ammonium sulfate bath; and (d) plating on the iron layer a layer (18) of tin from an alkaline tin bath. During the electroless plating, the zincate layer, which protects the underlying aluminum against oxidation, is sacrificed. All of these baths are environmentally much safer than cyanide and chloride. They are also cost effective and can be utilized in a totally closed loop plating system.

Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, cadmium, indium, iron, tin/lead and tin/lead copper.

Abstract: A method and a device are described for the repair and/or touch-up of small surface flaws in large press plates or endless bands of sheet metal, especially steel sheet, having a structured metal coating and a hard-chrome plating for surface-embossing plastic-coated wooden or laminated panels. Each flaw is repaired by surrounding it with a mask, pickling, and galvanically metallizing it. For a simplified and cost-favorable repair or touch-up, a galvanic solution is applied to the masked and pickled flaw for microgalvanizing damaged areas smaller than 14 mm.sup.2 by dipping the tip of an electrode into the solution. The pickled flaw can first be provided with a thin, microgalvanically applied nickel layer, and it is then copper-plated. The copper build-up is restructured by hand, if necessary, and covered with a hardened cobalt layer.

Abstract: Methods for electrodepositing a metal-carbon coating on a substrate comprng immersing the substrate in an aqueous electrolyte, and passing a sufficient current through the electrolyte to effect electrolyte deposition of a metal-carbon alloy on the substrate. The aqueous electrolyte comprises from about 0.2 to about 0.6 mol/l of metal ions selected from the group consisting of iron, nickel, nickel-tungsten mixture and cobalt-tungsten mixture, greater than about 1.4 mol/l of an amidosulfonic acid or a salt thereof, ammonium ions, formic acid or a salt thereof, and water.

Abstract: Methods for electrodepositing a metal-carbon coating on a substrate comprng immersing the substrate in an aqueous electrolyte, and passing a sufficient current through the electrolyte to effect electrolyte deposition of a metal-carbon alloy on the substrate. The aqueous electrolyte comprises from about 0.2 to about 0.6 mol/l of metal ions selected from the group consisting of iron, nickel, nickel-tungsten mixture and cobalt-tungsten mixture, greater than about 1.4 mol/l of an amidosulfonic acid or a salt thereof, ammonium ions, formic acid or a salt thereof, and water.

Abstract: The present invention relates to an electrode preferably an insoluble electrode for an electrolytic cell. The electrode is located within an enclosure defining a chamber, a wall of said enclosure being formed by a membrane allowing ions to pass therethrough. The enclosure has an opening for feeding electrolyte, an opening for evacuating electrolyte and means conducting the upward current of electrolyte with a velocity in the vicinity of the electrode of at least 0.01 m/s. The invention relates also to plants and processes using such electrode for the plating or deplating of metal strips.

Abstract: Aluminum and aluminum alloy parts, such as pistons, are electroplated with iron employing a ferrous electroplating solution. The solution comprises (a) ferrous iron having a concentration ranging from about 0.65 to 2.0 Moles of Fe.sup.2+ per liter of solution; (b) at least one anion selected from the group consisting of sulfamate and ammonium sulfate and associated with the Fe.sup.2+ ions; (c) a reducing agent, such as ascorbic acid, in an amount sufficient to prevent oxidation of Fe.sup.2+ to Fe.sup.3+ ; (d) Cl.sup.- anion in an amount sufficient to promote dissolution of the iron anode; and (e) a wetting agent in an amount sufficient to prevent pitting of the aluminum cathode. The ferrous electroplating bath of the present invention permits plating of relatively thick layers of iron on aluminum, typically on the order of about 0.6 to 2 mils (0.0015 to 0.0051 cm), with a microhardness of at least about 40 (Rockwell C scale).

Abstract: A process for producing nanocrystalline materials, and in particular nanocrystalline nickel having an average grain size of less than about 11 nanometers and ternary and quaternary nickel-iron alloys, such as NiFeCr and NiFeCrMn alloys, having a grain size less than about 100 nm is described. The nanocrystalline nickel is electrodeposited onto the cathode in an aqueous acidic electrolytic cell by application of a pulsed D.C. current. The ternary and quaternary Nickel-Iron alloys and other binary, ternary and quaternary alloys may be produced by D.C. electroplating or by pulsed D.C. electroplating. The cell electrolyte also contains a stress reliever, such as saccharin, which helps to control the grain size. The novel products of the invention find utility as wear resistant coatings, hydrogen storage materials, magnetic materials and as catalysts for hydrogen evolution.

Abstract: An electroplating cell having soluble and insoluble anodes is provided with a primary power supply having a positive terminal connected to the soluble anodes and a negative terminal connected to a cathode including workpieces to be plated. An auxiliary power supply has a positive terminal connected to the insoluble anodes and a negative terminal connected to the negative terminal of the primary power supply so that the voltage applied to the insoluble anode is equal to the sum of the voltages applied by the two power supplies.

Abstract: Electroformed and/or electroplated iron with superior ferro-magnetic properties is prepared by an electrolytic process wherein the iron is deposited from an electrolyte bath containing iron salts and preferably substantially free of carbon. The bath and its environment are substantially free of oxygen and other oxidizing agents. A titanium-palladium alloy is a preferred electrode upon which to deposit the iron.