Abstract: A device for performing anodizing treatment on a part, the device including a treatment chamber including a part for anodizing together with a counter-electrode situated facing the part to be treated, the part to be treated constituting a first wall of the treatment chamber; a generator, a first terminal of the generator being electrically connected to the part to be treated and a second terminal of the generator being electrically connected to the counter-electrode; and a system for storing and circulating an electrolyte, the system including a storage vessel, different from the treatment chamber, for containing the electrolyte; and a circuit for circulating the electrolyte in order to enable the electrolyte to flow between the storage vessel and the treatment chamber.

Abstract: An electroplating apparatus including a reference electrode to control the potential during an electro-deposition process. The electroplating apparatus may include a bath containing a plating electrolyte and an anode present in a first portion of the bath containing the plating electrolyte. A cathode is present in a second portion of the bath containing the plating electrolyte. A reference electrode is present at a perimeter of the cathode. The electroplating apparatus also includes a control system to bias the cathode and the anode to provide a potential. A measuring system is provided in electrical communication with the reference electrode to measure the potential of the cathode. Methods of using the above described electroplating apparatus are also provided. Structures and method for electroless deposition are also provided.

Abstract: The object of the present invention is to provide a method for preparing a nano-sheet array structure of a Group V-VI semiconductor, comprising: (A) providing an electrolyte containing a hydrogen ion and disposing an auxiliary electrode and a working electrode in the electrolyte, wherein the working electrode comprises a Group V-VI semiconductor bulk; and (B) applying a redox reaction bias to the auxiliary electrode and the working electrode to form a nano-sheet array structure on the bulk.

Abstract: An electrolytic machining system includes a controller, a drive member coupled to the controller, a power supply, a diving circuit, a detecting circuit, and an electrode module. The diving circuit is coupled to the power supply module and configured to divide a total voltage taken from the power supply module into a plurality of independent working voltages. The detecting circuit is coupled to the dividing circuit and the electrode assembly. The detecting circuit detects each independent working voltage and feeds back information as to the level of the independent working voltage to the controller as the electrode assembly is moved towards a workpiece. When the detection indicates an incorrect working voltage, the controller controls the drive member to move the electrode assembly away from the workpiece.

Abstract: A production apparatus is provided for producing a near field optical head that includes, during its production process, a substrate, at least one protuberance extending from a surface of the substrate, an electrically conductive shielding film covering the protuberance and the substrate, and a parent film, as a mother material for an air bearing, covering the shielding film. The production apparatus has an etchant for etching the parent film and a container for storing the etchant and for containing the substrate, the shielding film, and the parent film so that the substrate, the shielding film, and the parent film are immersed in the etchant. At least one electrode is fixedly mounted in the container so as to be immersed in the etchant. A measuring device measures an electrical characteristic between the electrode and the shielding film.

Abstract: A method for monitoring machining in an electroerosion assembly having a power supply and an electrode arranged across a gap from a workpiece, includes measuring a voltage at a point in a voltage waveform after a time delay td of one half of a pulse width of the voltage waveform. The measurements are repeated for multiple pulses of the voltage waveform to obtain multiple voltages, each of the voltages corresponding to a point in respective pulses. The voltages are averaged to obtain an average voltage, which is compared with at least one threshold voltage, to determine whether the machining is in control. A control signal is generated if the comparison indicates that the process is not in control, the control signal being configured to regulate an operating parameter of the power supply, and the control signal is supplied to the power supply, if generated.

Abstract: The present invention relates to electrochemical machining (ECM) of conductive materials and can be used for manufacturing stamps, mould tools and other workpieces of complex shape at the finishing stage of the machining process. Method for electrochemical machining with an oscillating machining electrode comprises the step of applying rectangular microsecond current pulses synchronized with the moment when a machining electrode and workpiece electrode are moved to a minimum distance towards each other. During the machining process, the amplitude of current pulses is increased and the pulse duration is adjusted in such a manner that the trailing edge of each pulse corresponds to the moment of maximum electrical conductivity of the interelectrode gap, the amplitude being increased until a predetermined roughness of the surface to be machined is achieved.

Abstract: The invention relates to electrochemical pulse machining (ECM) of high alloy steel, alloys and conducting composite materials that include components with substantially different electrochemical properties. In particular, the invention can be used to perform various copy-piercing operations when producing intricately shaped surfaces of machines and tools made of WC—Co, WC—TiC—Co alloys. The method comprises machining at low interelectrode gaps using anode or bipolar high-frequency current pulses supplied in bursts which are synchronized with the moments of maximum convergence between an oscillating tool electrode and a workpiece, and additional singular pulses of opposite polarity supplied during pauses between pulse bursts, wherein a ratio of parameters for the pulses of normal and opposite polarity is adjusted based on the initial electrolyte acidic value.

Abstract: A method and system are provided for the shaping and polishing of the surface of a material selected from the group consisting of electrically semi-conductive materials and conductive materials. An electrically non-conductive polishing lap incorporates a conductive electrode such that, when the polishing lap is placed on the material's surface, the electrode is placed in spaced-apart juxtaposition with respect to the material's surface. A liquid electrolyte is disposed between the material's surface and the electrode. The electrolyte has an electrochemical stability constant such that cathodic material deposition on the electrode is not supported when a current flows through the electrode, the electrolyte and the material. As the polishing lap and the material surface experience relative movement, current flows through the electrode based on (i) adherence to Faraday's Law, and (ii) a pre-processing profile of the surface and a desired post-processing profile of the surface.

Abstract: Components which are subject to operating loads can often be passed for refurbishment by means of an acid treatment. The time for which the components remain in the acid has hitherto been determined empirically, which means that individual loads are not taken into account. The process according to the invention for the surface treatment of a component proposes that at least repeatedly a measurement voltage be applied to the component, resulting in the flow of a current, the time profile of which represents the state of the surface treatment and is used to decide upon when to terminate or interrupt the acid treatment.

Abstract: A method and an arrangement (1) for determining an actual value of the gap (4) between the work piece (2) and the electrode (3) during a process of electrochemical machining. According to the invention first process control means (30) are arranged to supply a set of machining current pulses (Im) to the electrode and the work piece. Second process control means (32) are arranged to perform a measurement of an operational parameter (U) representing a value of the gap (4) in real time under operational conditions. The second process control means (32) comprise means to determine the actual value of the gap (55a) based on the measurement of the operational parameter and logical unit (55b) to actuate the positioning means (8) to translate the electrode (3) in case the measured value of the gap deviates from the preset value of the gap.

Abstract: Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.

Abstract: For an electromechanical machining of a work piece there is an optimal pulse duration for the machining pulses corresponding to the maximum copying accuracy. Such an optimal pulse duration corresponds to a certain value of the gap. By alternating the machining pulses with measurement pulses it is possible to obtain an accurate information about the gap dimensions on-line during the electrochemical machining process. The process control means (20) are used to automate the electromechanical machining, while keeping it in the optimal mode. For this purpose the process control means (20) comprise the pulse control unit (26) to establish the pulse duration of the voltage pulses to be applied across the gap (4).

Abstract: A method for manufacturing a resistor function in an electric conductor on the surface of a carrier, preferably a conductor on printed circuit boards, substrates and chips. By etching using an anisotropic etching technique, the conductor is provided with at least one portion which has a smaller cross-sectional area than the conductor surrounding the portion, the length and width of the portion being such that a predetermined resistance is obtained in the conductor. A resistor according to the invention is on both sides connected to a conductor on a carrier, such as a printed circuit board, a substrate or a chip. The resistor comprises a conductor portion positioned on the carrier and having a significantly smaller cross-sectional area than the conductor on both sides of the resistor.

Abstract: A method for on-line removal of cathode depositions during electrochemical process. The process control means (30) are arranged to alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2 to the work piece (2) and the cathode (3). The process control means comprise an arrangement to determine the amount of cathode depositions on-line based on the operational parameter. Only in case the operational parameter exceeds the allowable level, the process control means (30) alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2. In this case the cathode wear is minimized.

Abstract: For an electromechanical machining of a work piece there is an optimal pulse duration for the machining pulses corresponding to the maximum copying accuracy. Such an optimal pulse duration corresponds to a certain value of the gap. By alternating the machining pulses with measurement pulses it is possible to obtain an accurate information about the gap dimensions on-line during the electrochemical machining process. The process control means (20) are used to automate the electromechanical machining, while keeping it in the optimal mode. For this purpose the process control means (20) comprise the pulse control unit (26) to establish the pulse duration of the voltage pulses to be applied across the gap (4).