Abstract: A polishing method and polishing apparatus able to easily flatten an initial unevenness with an excellent efficiency of removal of excess copper film and suppress damage to a lower interlayer insulation film, and a plating method and plating apparatus able to deposit a flat copper film. The polishing method comprises the steps of measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region thereof, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, performing electrolytic polishing by electrolytic elution or anodic oxidation and chelation and removal of a chelate film in the same region preferentially from projecting portions of the film until removing the target amount of film obtained from the thickness equivalent data, and repeating steps of moving the cathode member to another region to flattening the regions over the entire surface.

Abstract: A target material is electropolished by applying a voltage between an anode electrode and a counter electrode while bringing the anode electrode into contact with the surface of the target material. The anode electrode is formed of an electrode material having a current density not higher than 10 mA/cm2 upon application of a voltage of +2.5V vs. silver/silver chloride electrode within a 0.1 M perchloric acid solution in an electrochemical measurement using a potentiostat.

Abstract: The present invention pertains to apparatus and methods for electroplanarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by use of a flexible planar cathode and a spacing pad thereon. Methods of the invention are electropolishing methods. During electroplanarization, the flexible planar cathode conforms to the global contour of the work piece (e.g. a wafer) while the spacing pad conforms to local topography of the metal layer being planarized. In this way, dishing is reduced in the final planarized metal layer.

Abstract: A method for determining an end point of a planarization process for removing metal from a surface of a substrate submerged in an electrolytic solution or slurry. A first electrode is provided which is operable to contact the surface of the substrate, such as a working electrode of a potentiostat system. A second electrode is provided which is operable to contact the electrolytic solution, such as a reference electrode of the potentiostat system. The first electrode is contacted to the surface of the substrate and an electrochemical property is measured, such as the electrochemical potential between the first and second electrodes, where the electrochemical property is indicative of an electrochemical characteristic of the substrate-slurry system. The planarization process is preferably stopped when a substantial change in the electrochemical potential of the system is measured.

Abstract: For an electromechanical machining of a work piece there is an optimal pulse duration for the machining pulses corresponding to the maximum copying accuracy. Such an optimal pulse duration corresponds to a certain value of the gap. By alternating the machining pulses with measurement pulses it is possible to obtain an accurate information about the gap dimensions on-line during the electrochemical machining process. The process control means (20) are used to automate the electromechanical machining, while keeping it in the optimal mode. For this purpose the process control means (20) comprise the pulse control unit (26) to establish the pulse duration of the voltage pulses to be applied across the gap (4).

Abstract: The present invention relates to a control loop to be used in a system for stripping a coating from a part. The control loop comprises an electrometer for measuring a potential between the part and a reference electrode and generating a voltage output signal, an operational amplifier for comparing the voltage output signal to a set point voltage and for producing an output signal to be used to reduce the difference between the voltage output signal and the set point voltage, and a high current power transistors for supplying a current to the part.

Abstract: There is proposed a nitrogen treating method for nitrogen compounds which is capable of removing nitrogen compounds efficiently and achieving a downsizing of equipment and a decrease in costs. The nitrogen treating method is a method for treating nitrogen compounds in for-treatment water by an electrochemical process, wherein as a metal material which constitutes a cathode, a conductive material containing or covered with an element in the group Ib or IIb of the periodic table is used.

Abstract: A device and method for etching a wire to manufacture it into a tip for a scanning probe microscope or the like. The wire etching device generates a voltage signal for determining the level of a wire etching voltage, and applies the etching voltage of the level determined depending on the generated voltage signal to the wire to primarily etch it. The wire etching device measures the amount of etching current generated during the primary etching process and controls the level of the voltage signal according to the measured etching current amount so as to control the level of the etching voltage. Then, the device secondarily etches the wire with the level-controlled voltage signal. Therefore, the wire etching device can manufacture the tip while controlling its curvature radius and aspect ratio and reducing the amount of oxide on its surface.

Abstract: A method for on-line removal of cathode depositions during electrochemical process. The process control unit (30) is arranged to alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2 to the work piece (2) and the cathode (3). The process control unit comprises an arrangement to determine the amount of cathode depositions on-line based on the operational parameter. Only in case the operational parameter exceeds the allowable level, the process control unit (30) alternates the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2. In this case the cathode wear is minimized.

Abstract: An electrochemical process using current density controlling techniques is disclosed. In the electrochemical process of this invention, a carbon cathode rod activated with a negative voltage and an electrode activated with a positive voltage are sunk into an electrolyte contained in a container, and so the electrode is electrochemically etched while properly controlling both the metal ion dissolving rate and the metal ion diffusing rate of the electrode by controlling the amount of applied current to maintain the two rates at a desired balance. This process thus creates a diffusion effect thickening the tip of the cylindrical electrode, and compensates for a conventional geometric effect sharpening the tip of the electrode. Therefore, this process produces a precise product having a uniform diameter along its length.

Abstract: For an electromechanical machining of a work piece there is an optimal pulse duration for the machining pulses corresponding to the maximum copying accuracy. Such an optimal pulse duration corresponds to a certain value of the gap. By alternating the machining pulses with measurement pulses it is possible to obtain an accurate information about the gap dimensions on-line during the electrochemical machining process. The process control means (20) are used to automate the electromechanical machining, while keeping it in the optimal mode. For this purpose the process control means (20) comprise the pulse control unit (26) to establish the pulse duration of the voltage pulses to be applied across the gap (4).

Abstract: A method for on-line removal of cathode depositions during electrochemical process. The process control means (30) are arranged to alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2 to the work piece (2) and the cathode (3). The process control means comprise an arrangement to determine the amount of cathode depositions on-line based on the operational parameter. Only in case the operational parameter exceeds the allowable level, the process control means (30) alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2. In this case the cathode wear is minimized.

Abstract: A procedure and a device for the electroerosive or electrochemical machining of bent surfaces of a work piece (2) by means of an electrode (1; 1′; 1″) which is generally independent of the form of the bent surface, in which the electrode (1; 1′; 1″) is led for the machining of the bent surface along a forward feed device (V) above the work piece surface. The invention is distinguished by the fact that the electrode (1; 1′; 1″) is led across the work piece surface at an inclined angle to the forward feed device (V) with the forward feed device (V) placed tangentially to the work piece surface.

Abstract: An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer includes an end-point detector. The end-point detector is disposed adjacent the nozzle used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.

Abstract: An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.

Abstract: Methods and apparatus are used for triggering and controlling an initial induction period in which a substrate is immersed in an electrochemical bath prior to actual electrochemical processing. This is accomplished by sensing a change in cell potential upon immersion of the substrate or a counter electrode in an electrochemical bath. Appropriate logic then holds the cell potential or current at a fixed value for a defined delay period. After that period ends, the logic allows the cell potential or current to increase to a level where electrochemical processing begins.

Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

Abstract: A pipe electrochemical polishing system (10, 10a) for in place polishing of a pipe (28(has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a non horizontal portion (72) of the pipe (28) and further is presently traveling generally downward, then the direction of flow of the electrolyte (24) is reversed to carry any bubbles in the electrolyte (24) away from the area of the cathode (14).

Abstract: A pipe electrochemical polishing system (10, 10a) for in place polishing of a pipe (28) has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a non horizontal portion (72) of the pipe (28) and further is presently traveling generally downward, then the direction of flow of the electrolyte (24) is reversed to carry any bubbles in the electrolyte (24) away from the area of the cathode (14).

Abstract: Disclosed is an electrochemical machining process for fabrication of cylindrical microprobes, which is effected by the tool acting as the cathode against the workpiece acting as the anode, taking advantage of a chemical reaction occurring between the workpiece and the tool, both being beneath the surface of an electrolyte, under such a controlled electric field that the workpiece can be machined to have a uniform diameter throughout its entire length. The electrochemical machining can be carried out with greater precision because a precise machining process because the volume to be additionally processed owing to the surface tension generated when the workpiece is dipped into the electrolyte is taken into consideration.

Abstract: A method of shaping a tool comprises the steps of defining a shape of an article to be formed with the tool as a plurality of first elements; defining an initial shape of the tool as a plurality of second elements; determining an electric potential of each of the first and second elements; determining an equipotential line between the article and the initial shape of the tool based on the electric potential of the first and second elements; and forming the tool to have a shape coincident with the equipotential line.

Abstract: The electrochemical processing of a component such as an injection nozzle, must be calibrated in order to compare the throughput of the nozzle to a standard nozzle. Both throughput rates are determine at the same high pressure which is far above 100 bar. As a throughput medium, electrolyte is used in an ecm unit. From this a sufficient quantity is delivered into a temporarily pressure chamber in which another fluid has been supplied by a high pressure pump. A predetermined high pressure is built up which by way of a highly accurate control valve is maintained during the calibration procedure.

Abstract: An electrochemical machining process is monitored by embedding an ultrasonic sensor in an electrochemical machining tool to provide a tool assembly, placing the tool assembly in a spatial relationship with a workpiece, disposing an electrolytic fluid at least in a gap between the tool and the workpiece, connecting the tool and the workpiece to an electrical power source, generating an acoustic wave from the ultrasonic sensor to propagate through the electrolytic fluid to the workpiece and reflect back from the workpiece, and, based on the propagation and reception of the acoustic wave, calculating measurement of at least the size of the gap or the thickness of the workpiece.

Abstract: An integrated compressor disk and compressor blade (BLISK) having a specified shape is prepared by an electrochemical machining process having a cathode defined by a set of cathode shape parameters. A trial BLISK is prepared using a cathode defined by a set of trial shape parameters, and a set of deviations of the trial shape from the specified shape at a plurality of surface grid points on a surface of the trial article is measured. A set of revised cathode shape parameters is determined using at least one reshaping routine specific to the BLISK. A reshaped article is prepared using the electrochemical machining process and a reshaped cathode defined by the revised cathode shape parameters.

Abstract: An apparatus for electrochemically machining of a workpiece by means of an electrode has an actuator for setting a gap between the electrode and the workpiece. The apparatus further has a channel for flushing the gap with an electrolyte and a container for containing the electrolyte. Power cords and are provided for feeding an electric current I supplied by a power supply through the electrolyte in the gap. Near the gap an antenna is provided to pick up electromagnetic waves radiated from the gap. The antenna is connected to a band-pass filter which passes signals in a frequency band of 40 to 100 MHz to a level detector. The level detector compares the amplitude of the filtered signal with a threshold value and supplies a stop signal to the control unit when the amplitude exceeds the threshold value. The control unit is programmed to open a switch in the power supply in response to the stop signal.

Abstract: Eliminating exposure of PN junctions to light capable of invoking a photovoltaic effect and/or inhibiting the oxidation and reduction reactions induced by the photovoltaic effect prevents the electrochemical dissolution of metal components on semiconductor devices by electrolysis. A darkened enclosure for use on tools for wafer CMP, brush cleaning, unloading, and rinsing will eliminate exposure. Alternatively, illumination of a semiconductor wafer can be limited to wavelengths of light that do not provide enough energy to induce a photovoltaic effect. An inhibitor in the CMP slurry and/or post-CMP water rinse blocks the oxidation and/or reduction reactions. A blocking agent, such as a high molecular weight surfactant, will interfere with both the oxidation and reduction reactions at the metal surface. Also, a poisoning agent will impede the reduction portion of electrolysis.

Abstract: In a method for anisotropic etching of a structure in an electrically conductive substance to be etched, use is made of an etchant which in concentrated solution is usable for isotopic etching of structures in the substance to be etched. The substance to be etched is contacted with the etchant in a solution which is so diluted that the etchant is unusable for isotropic etching. The etchant is subjected, adjacent to the substance to be etched, to an electric field of such a strength that anisotropic etching of the substance to be etched is accomplished. Moreover, an etching fluid is described, comprising an etchant in dilute solution, in which the etchant is present in a concentration of 200 mM at most, and use of such an etching fluid for making structures which are 50 &mgr;m or less is also described.

Abstract: A method of electrochemically machining an electrically conductive workpiece in an electrolyte by applying electrical pulses between the workpiece and an electrically conductive electrode, one or more machining pulses alternating with passivation voltage pulses for depositing passivation layers on the workpiece. The amplitude of the passivation voltage pulses is adjusted during an adjustment procedure in which the amplitude of the passivation voltage pulses is increased gradually from zero to the voltage at which the workpiece starts to dissolve in the electrolyte. After each voltage increase the resistance of the gap between the electrode and the workpiece is measured. The voltage value for the highest gap resistance is stored in a memory and used during further machining. The time span of the passivation voltage pulses may be divided into time slices and for each time slice the voltage is adjusted for maximum gap resistance during that time slice.

Abstract: In the electrochemical drilling of a hole completely through a workpiece, the present invention proposes operating the power supply in a current regulating mode. Initially, a hollow cathode is positioned adjacent to a workpiece in which one or more holes are to be drilled. An electrolyte is flowed through the cathode and against the workpiece. A constant electrical current is applied between the cathode and the workpiece across the electrolyte. Then the cathode is advanced at a constant rate toward the workpiece for the drilling of the hole(s), while maintaining the electrolyte flow and current substantially constant.

Abstract: An electrochemical machining method in which a work piece and a machining electrode are opposed to each other and dipped in an electrolyte solution, and a surface of the work piece is machined by causing an electrolytic reaction between the surface of the work piece and a tip of the machining electrode in a state where a separating distance between the surface of the work piece and the tip of the machining electrode is adjusted and a desired separating distance is maintained, wherein a zero contact reference position where the surface of the work piece and the tip of the machining electrode are brought into contact with each other and the separating distance between the work piece and the machining electrode is nullified is electrically detected, moving distances of the work piece and the machining electrode from the zero contact reference position are detected, a relative separating distance between the surface of the work piece and the tip of the machining electrode is calculated based on a result of the de

Abstract: A method of making a needle electrode is such that a neck portion is formed in a thin wire made of a tungsten single crystal and the thin wire is cut at the neck portion by feeding an electric current in electrolyte.

Abstract: The present application describes apparatus and method for monitoring and controlling the etching of quartz crystals to a desired target frequency by means of monitoring the frequency of a monitor blank that is immersed in the etchant simultaneously with the etch load. Since during etching the thickness removal is the same for monitor and etch load, one can predetermine a monitor target frequency in terms of the load target frequency. The process is terminated upon reaching the monitor target.

Abstract: Process for electrolytic treatment of continuous running material in which the material runs through an electrolytic liquid and electric potential is applied to the material. In order to guarantee freedom from differential potential in the material to be treated in any form of electrolytic treatment, the differential potential in the treated material is measured after electrolytic treatment and at least the same degree of inverse compensating potential is applied to the material.

Abstract: A method for performing fine working of a material by electrochemical reaction comprises a two-step scanning operation in which a surface topography of the material is obtained during a first scan which is used to control the position of a probe during a second scan in which an electrochemical reaction is performed. During the first scan, an electrochemical cell is constructed with a four-electrode system, including the probe, a material to be worked, a reference electrode and a counter electrode. The potential of each of the probe and the material to be worked is set so that no electrochemical reaction occurs during the first scan. Data representative of the surface topography is stored and used to control the position of the probe during the second scan in which an electrochemical cell is constructed with a three-electrode system, including the probe, the material, and the reference electrode.

Abstract: The invention relates to an electrode for electrochemical machining. An electrode comprising a plurality of electrode segments separated by insulating material. As desired, different voltages are applied to each of the electrode segments giving control over the amount of material locally removed from the metal piece. The invention also relates to a method of electrochemical machining.

Abstract: A method for forming a minute pattern in a metal workpiece, comprising the steps of forming a mask pattern on the metal workpiece and electro-chemically etching the metal workpiece. The workpiece is electro-chemically etched in a electrolyte bath following formation of the mask pattern.

Abstract: Method of electrochemically machining an electrically conductive workpiece (2) in an electrolyte by applying bipolar electric pulses between the workpiece (2) and an electrically conductive electrode (6), one or more current pulses of normal polarity alternating with voltage pulses of opposite polarity. The amplitude (Un) of the voltage pulses is adjusted between two predetermined values (Un1, Un2) derived from the occurrence of a given surface quality of the workpiece (2) and the occurrence of wear of the electrode (6). The derivation is effected by means of at least one test which precedes the machining of the workpiece (2). During the test the amplitude (Un) of the voltage pulses is increased gradually from an initial value to a final value. The two predetermined values (Un1, Un2) are determined upon the occurrence of a sign reversal in the difference between successive values of a parameter which is representative of a property of a gap (5) between the electrode (6) and the workpiece (2).

Abstract: Electrochemical machining (ECM) techniques utilizing real-time parameter monitoring, alarms and feedback control for improved machining of a workpiece are disclosed. The ECM device utilizes one or more cathodes, an electrolyte and a positively charged workpiece to achieve electrolytic action. A number of controlling variables, such as cathode feed rate, electrolyte flow rate and voltage, are balanced in response to measured system parameters. The following parameters are preferably monitored in order to adjust the controlling variables: the drive parameters of feed rate and cathode depth; the pump parameters of flow rate and pressure; and the power components of voltage and current. The flow rate in each of the cathodes, or a corresponding Reynolds number, is preferably utilized to provide an alarm to the operator if a statistically significant change in flow is detected.

Abstract: A method and apparatus for forming a passage with a variable diameter along its length in a conductive workpiece are disclosed. The workpiece is mounted in a fixture and an externally insulated hollow electrode is positioned proximate to a surface location of the workpiece into which the passage is to be formed. A first selected voltage is connected between the electrode and the workplace with the voltage being connected to cause the electrode to act as a cathode and the workpiece to act as an anode. A pump causes an acidic electrolyte to flow through the electrode at a chosen pressure and onto the workpiece surface. The electrode is moved toward the workpiece at a first selected feed rate by a CNC controller to cause a portion of the passage to be formed at a first predetermined diameter.

Abstract: The present invention comprises a method of characterizing a group III-V epitaxial semiconductor wafer in a characterization profiling apparatus having an electrolytic cell. The wafer contains at least a Group III-V compound first-layer and a thin etch stop layer atop of the first layer and at least one second layer atop of the etch stop layer having a differing composition from the etch stop layer. The wafer is placed in the electrolytic cell and the surface of the at-least second layer is etched with a citrate buffer solution of citric acid and a salt of citric acid under anodic bias conditions. The etchant is highly selective and etching terminates upon reaching the etch stop layer. A Schottky diode is formed between the wafer and the solution, and the wafer is characterized in situ by performing capacitance-voltage measurements which are evaluated to determine the threshold voltage of the semiconductor wafer.

Abstract: A tip and substrate preparation system for use with scanning probe microscopes (SPMs) includes a scanning tunneling microscope (STM) tip maker, STM tip coater, a substrate treatment method for producing clean, flat gold substrates for STM use and methods for preparing chemically activated substrates for use with an atomic force microscope (AFM). The tip maker includes a coater and an etcher which are preferably controlled by electronic controllers. The etcher provides fully automatic tip etching in a two-stage process in sodium hydroxide (NaOH) solution, permitting platinum alloys to be etched without the use of cyanide-containing chemicals. The coater is used to insulate the tips with soft polymer coatings so as to ensure very low tip leakage current (on the order of about 1 pA typical). The substrate treatment device comprises a quartz plate and a quartz torch for annealing substrates in a hydrogen flame.

Abstract: A wet-etch method which determines a desired etch-ending point includes the steps of providing an etchant solution in a bath, perform a wet-etch process by dipping a material to be etched in the bath, measuring a PH variation value of the etchant solution during the wet-etch process, calculating a thickness variation value of the material by using the measured PH variation value, and stopping the wet-etch process when the thickness variation value reaches a preset value.

Abstract: Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.

Abstract: An apparatus is provided for electrolytically polishing the inside surface of tubular products such as rifled stock, or fiream or artillery barrels. The apparatus comprises a first and second reservoir in fluid communication through the tubular product with an electrolyte flow system. A cathode head is provided that is displaced from one reservoir to the other in the presence of flowing electrolyte and at a current density of between 1 and 5 amp-min/sq. in. A method of electrolytically polishing tubular products is also provided.