Including Nonelectrolytic Erosion Patents (Class 205/647)
  • Patent number: 8974655
    Abstract: A method of removing a material from a surface includes providing a substrate comprising a material having a surface, contacting the surface with a polishing medium, applying a voltage to the substrate to remove material from the surface, and changing the voltage during the removing material from the surface. An electro-chemical mechanical polishing method includes providing a substrate having a surface, applying a platen to the surface, applying a first voltage to the substrate, rotating the platen and surface relative to each other at a first rotational speed, increasing to a second voltage, and decreasing to a second rotational speed.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: March 10, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Wayne Huang, Whonchee Lee
  • Patent number: 8470159
    Abstract: A surface treatment method is provided. A surface treatment method comprising steps of providing a first and a second conductors; applying an electrical field between the first and the second conductors; enclosing the first and the second conductors with a material whose viscosity is varied with an intensity of the electrical field; actuating the first and the second conductors such that the first and the second conductors are in a relative motion with respect to each other; and varying the intensity of the electrical field.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: June 25, 2013
    Assignee: National Taiwan University
    Inventors: Yao Yang Tsai, Chien Hoa Tzeng
  • Patent number: 8070933
    Abstract: The invention is an electrolytic microfinishing process which utilizes a conductive tool as a cathode and a conductive workpiece as an anode both connected to a power supply. Electrolytic fluid is pumped between the tool and workpiece, creating a decomposition of the workpiece surface allowing the surface of the workpiece to be removed or wiped away by the interaction of the flowing electrolyte and rotation of the tool without generating any heat at a rate significantly faster than any other known machining process. The tool has no contact with the workpiece and accordingly, requires very low clamping loads to hold the workpiece in the spindle during the finishing operation. Due to the low clamping loads, the distortion of the workpiece is completely eliminated. Modulating the power supply during the work cycle allows the use of a single tool for both roughing and finishing as a continuous cycle to significantly provide surface finishes previously unobtainable.
    Type: Grant
    Filed: May 6, 2006
    Date of Patent: December 6, 2011
    Assignee: Thielenhaus Microfinishing Corp.
    Inventor: Manfred G. Becker
  • Publication number: 20100038258
    Abstract: A feed control method for wire cutting electrochemical discharge machining is disclosed. The method determines whether a contact event has occurred using a wire electrode, based on variations in wire tension when being cut. A wire is cut with an ideal feed speed when the wire electrode is not in contact with a workpiece.
    Type: Application
    Filed: May 11, 2009
    Publication date: February 18, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jui-Kuan Lin, Hsiang-Kuo Lee, Yang-Xin Lin, Hsin-Chuan Su
  • Patent number: 7255784
    Abstract: A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: August 14, 2007
    Assignee: Sony Corporation
    Inventors: Shuzo Sato, Takeshi Nogami, Zenya Yasuda, Masao Ishihara
  • Patent number: 7250103
    Abstract: A method of removing material from a conductive surface of a workpiece while the conductive surface and an electrode are wetted by a process solution. The method comprises the steps of applying power between the conductive surface and the electrode, rendering the conductive surface anodic. The method includes the step of allowing a passivation layer to build up on the conductive surface/The method includes the step of applying an external influence to the conductive surface to periodically reduce the passivation layer thickness. Advantages of the invention include an efficient technique for electropolishing a workpiece.
    Type: Grant
    Filed: August 11, 2003
    Date of Patent: July 31, 2007
    Assignee: Novellus Systems, Inc.
    Inventor: Bulent M. Basol
  • Patent number: 7160432
    Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: January 9, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Feng Q. Liu, Liang-Yuh Chen, Stan D. Tsai, Alain Duboust, Siew S. Neo, Yongqi Hu, Yan Wang, Paul D. Butterfield
  • Patent number: 6858125
    Abstract: A multi-axis machine, with numerical control on each axis, is used to drive the tool and workpiece movements necessary to machining complex airfoil geometry. Tooling is typically made of a metal such as brass or other low cost material and rotates during machining. The tooling may be any shape(cylindrical, conical) and size depending on application. A DC power (continuous or pulsed) is used to provide voltage across the tool and workpiece. A medium such as water, de-ionized water, or electrolyte (such as sodium nitrite) is provided between the tool and workpiece. Workpiece metal is removed in a controlled manner by high intensity thermal erosion.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: February 22, 2005
    Assignee: General Electric Company
    Inventors: Bin Wei, Roger Etherington, Michael Lamphere
  • Publication number: 20020173854
    Abstract: Method for making a mesh-and-plate surgical implant includes the steps of applying maskant to first and second faces of a metal sheet, selectively ablating the maskant on both faces, affixing a first tape to the first face to cover same and maskant thereon, but leaving an exposed portion for a screw hole, affixing a second tape to the second face to cover same and maskant thereon, etching the first face screw hole portion to form a crater, removing the first tape, etching the crater and other exposed portions of the first face, removing the second tape, etching opposite the crater and other exposed portions of the second face to provide openings in communication with the crater, and other second face openings extending to the first face, and removing remaining maskant to provide the implant configured to include a pliable mesh portion and a rigid plate portion, and having a screw hole therein.
    Type: Application
    Filed: December 12, 2001
    Publication date: November 21, 2002
    Applicant: Tecomet, Inc.
    Inventor: Mark P. Amrich
  • Patent number: 5624626
    Abstract: The present invention provides a method for treating a ceramic body to provide a wettable surface on the ceramic body. According to the present invention, a ceramic body is immersed in an alkaline hydroxide solution. The ceramic body is connected to form the anode and a suitable metal is connected to form the cathode of an electrolytic cell. A difference in electrical potential is imposed across the electrolytic cell which is sufficient to remove portions of the ceramic body to provide a pitted surface on the ceramic body which is wettable.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: April 29, 1997
    Inventors: Thomas J. Walz, Issak S. Rossovsky