Simple Alternating Current Patents (Class 205/658)
  • Patent number: 9023663
    Abstract: The object of the present invention is to provide a method for preparing a nano-sheet array structure of a Group V-VI semiconductor, comprising: (A) providing an electrolyte containing a hydrogen ion and disposing an auxiliary electrode and a working electrode in the electrolyte, wherein the working electrode comprises a Group V-VI semiconductor bulk; and (B) applying a redox reaction bias to the auxiliary electrode and the working electrode to form a nano-sheet array structure on the bulk.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: May 5, 2015
    Assignee: National Tsing Hua University
    Inventors: Yu-Lun Chueh, Hung-Wei Tsai, Tsung-Cheng Chan
  • Patent number: 8974656
    Abstract: A method for surface roughening a metal work piece includes disposing a region of the workpiece to be roughened proximate to a counter electrode. The region of the workpiece to be roughened and the counter electrode are subsequently disposed together in an electrolyte. An electric potential with current flow is applied between the work piece and the counter electrode to roughen the metal surface to a desired roughness.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: March 10, 2015
    Assignee: General Electric Company
    Inventors: Andrew Lee Trimmer, Bin Wei, Joshua Leigh Miller, Nicholas Joseph Kray, Michael Scott Lamphere
  • Patent number: 8968530
    Abstract: An electrolytic treatment method and electrolytic treatment device are provided for electrolytic treatment of an aluminum web W by applying an alternating current to an upstream electrode and a downstream electrode disposed along a conveying direction a. At least one of a conveying velocity v of the aluminum web W, a frequency f of alternating current applied at the upstream electrode and the downstream electrode, and/or a web conveying direction separation distance d2 between the upstream electrode and the downstream electrode are set such that the alternating current and voltage waveform applied to the aluminum web W at the far end of the upstream electrode and the alternating current and voltage waveform applied to the aluminum web W at the near end of the downstream electrode do not reinforce each other.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: March 3, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Hisashi Hotta, Tsuyoshi Hirokawa
  • Patent number: 8882986
    Abstract: A system includes an electrolytic deburring tool, which includes a first electrode configured to be positioned at a first gap away from a first edge of a workpiece, a second electrode configured to be positioned at a second gap away from a second edge of the workpiece, a first electrolyte supply configured to flow a first electrolyte through the first gap between the first electrode and the first edge of the workpiece, a second electrolyte supply configured to flow a second electrolyte through the second gap between the second electrode and the second edge of the workpiece, and a power supply configured to flow an alternating current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first edge and the second edge.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: November 11, 2014
    Assignee: General Electric Company
    Inventors: Yuefeng Luo, William Edward Adis, Michael Lewis Jones
  • Publication number: 20140242805
    Abstract: A method for sharpening a nanotip involving a laser-enhanced chemical etching is provided. The method includes immersing a nanotip in an etchant solution. The nanotip includes a base and an apex, the apex having a diameter smaller than a diameter of the base. The method also includes irradiating the nanotip with laser fluence to establish a temperature gradient in the nanotip along a direction from the apex to the base of the nanotip such that the apex and base are etched at different rates.
    Type: Application
    Filed: December 4, 2013
    Publication date: August 28, 2014
    Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: ZhiHong MAI, Jeffrey C. LAM, Mohammed Khalid BIN DAWOOD, Tsu Hau NG
  • Patent number: 8673405
    Abstract: In a method for producing a starting material (M, N, N?) for the production of a wear layer (420), a coating (40) with a composition which corresponds to that of the wear layer (420) which is to be produced is chemically undissolved from its substrate (30) and is detached as a solid body, and that the starting material (M, N, N?) is formed by the layer material (60) of the detached coating (40).
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: March 18, 2014
    Assignee: Siemens Aktiengesellschaft
    Inventors: Rene Jabado, Jens Dahl Jensen, Ursus Krüger, Daniel Körtvelyessy, Volkmar Lüthen, Ralph Reiche, Michael Rindler, Raymond Ullrich
  • Publication number: 20120222968
    Abstract: A system includes an electrolytic deburring tool, which includes a first electrode configured to be positioned at a first gap away from a first edge of a workpiece, a second electrode configured to be positioned at a second gap away from a second edge of the workpiece, a first electrolyte supply configured to flow a first electrolyte through the first gap between the first electrode and the first edge of the workpiece, a second electrolyte supply configured to flow a second electrolyte through the second gap between the second electrode and the second edge of the workpiece, and a power supply configured to flow an alternating current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first edge and the second edge.
    Type: Application
    Filed: March 2, 2011
    Publication date: September 6, 2012
    Applicant: General Electric Company
    Inventors: Yuefeng Luo, William Edward Adis, Michael Lewis Jones
  • Publication number: 20120138480
    Abstract: The invention relates to a method for electrochemical processing of at least one workpiece, comprising at least the following steps: a) setting a first flow density during a first phase in an electrolyte, b) retaining the first flow density during a second phase following the first phase, c) increasing the first flow density during a third phase following the second phase to a second flow density at least 30% greater than the first flow density, and d) reducing the second flow density during a fourth phase following the third phase within a maximum of 100 microseconds to a maximum of 1% of the second flow density.
    Type: Application
    Filed: August 2, 2010
    Publication date: June 7, 2012
    Applicant: KENNAMETAL INC.
    Inventors: Patrick Matt, Michael Riester, Johannes Schreiner
  • Publication number: 20110174635
    Abstract: An electrolytic treatment method and electrolytic treatment device are provided for electrolytic treatment of an aluminum web W by applying an alternating current to an upstream electrode and a downstream electrode disposed along a conveying direction a. At least one of a conveying velocity v of the aluminum web W, a frequency f of alternating current applied at the upstream electrode and the downstream electrode, and/or a web conveying direction separation distance d2 between the upstream electrode and the downstream electrode are set such that the alternating current and voltage waveform applied to the aluminum web W at the far end of the upstream electrode and the alternating current and voltage waveform applied to the aluminum web W at the near end of the downstream electrode do not reinforce each other.
    Type: Application
    Filed: September 30, 2009
    Publication date: July 21, 2011
    Inventors: Hisashi Hotta, Tsuyoshi Hirokawa
  • Patent number: 7153410
    Abstract: Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece, a workpiece electrode, a first remote electrode, and a second remote electrode. The workpiece electrode is configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder. The first and second remote electrodes are spaced apart from the workpiece holder. The apparatus can also include an AC power supply, a DC power supply, and a switching assembly. The switching assembly is coupled to the workpiece electrode, the first remote electrode, the second remote electrode, the AC power supply, and the DC power supply.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: December 26, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Scott E. Moore, Whonchee Lee, Scott G. Meikle, Trung T. Doan
  • Patent number: 7144298
    Abstract: The object of the invention is to provide a method of manufacturing a semiconductor device and a processing apparatus for planarization wherein to form copper wiring in multiple layers. The removal of a residue of polishing by local electro polishing, the enhancement of the performance of planarization by using a grindstone and the reduction by small frictional force in electro polishing of damage, are enabled. To achieve the object, the following measures are taken. A residue of polishing of copper is removed by combining the detection of a local area including the residue of polishing of copper and local processing for electro polishing. As small-load processing for planarization is enabled by using electro polishing, multilayer interconnection structure using low-k material as a dielectric interlayer is also enabled.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: December 5, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Souichi Katagiri, Ui Yamaguchi
  • Patent number: 7107676
    Abstract: Manufacturing equipment and manufacturing process steps that improve upon prior art processes for the manufacturing of filament tube and arc tube light sources, their components and subassemblies, and lamps employing said light sources. A double ended, tipless filament tube or arc tube light source incorporates a drawn-down tubular body, and one piece foliated leads with spurs for process handling and for spudding into a filament with stretched-out legs. Bugled ends on the body provide a novel cutoff means, facilitate a flush-fill finishing process, and enhance mounting and support of the light sources in lamps. The foliated leads are made from a continuous length of wire in a process including foil hammering and two-bath AC electrochemical etching. Cost-reduced light source and lamp production enables affordable household consumer lamps, even when containing two series-connected halogen filament tubes.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: September 19, 2006
    Inventor: Elmer G. Fridrich
  • Patent number: 7022216
    Abstract: A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising: providing a substrate bearing on a major surface thereof a layer of electrolytically dissoluble metal, the metal layer serving as a dissoluble electrode and having a central region and an adjacent peripheral region; providing at least a first counterelectrode and a second counterelectrode; positioning the counterelectrodes opposite the metal layer and spaced from the metal layer and spaced from each other; in a first electrolytic step, passing an electric current between the first counterelectrode and the central region of the metal layer, wherein the first counterelectrode is cathodic with respect to the metal layer, and the first electrolytic step includes a first phase, a second phase, and a third phase and during the first phase the electric current is a low amperage current, during the second phase the electric current includes a train of anodi
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: April 4, 2006
    Assignee: Faraday Technology Marketing Group, LLC
    Inventors: E. Jennings Taylor, Heather Dyar
  • Patent number: 6837984
    Abstract: An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: January 4, 2005
    Assignee: ACM Research, Inc.
    Inventor: Hui Wang
  • Publication number: 20040256245
    Abstract: A metal layer formed on a surface of a wafer is electropolished using a wafer chuck and a moveable nozzle. The surface on which the metal layer is formed is the same surface on which features of devices are formed. The wafer chuck is configured to rotate the wafer when the wafer is placed on top of the wafer chuck. The moveable nozzle is disposed vertically above the wafer when the wafer is placed on top of the wafer chuck. The moveable nozzle is configured to move from a first position to apply a stream of electrolyte to a first portion of the metal layer to a second position to apply the stream of electrolyte to a second portion of the metal layer when the wafer is rotated by the wafer chuck, where the first and second portions of the metal layer are located at different radial positions on the wafer.
    Type: Application
    Filed: July 21, 2004
    Publication date: December 23, 2004
    Applicant: ACM Research, Inc.
    Inventor: Hui Wang
  • Publication number: 20040226831
    Abstract: An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
    Type: Application
    Filed: April 7, 2004
    Publication date: November 18, 2004
    Inventors: Chun Christine Dong, Wayne Thomas McDermott, Alexander Schwarz, Gregory Khosrov Arslanian, Richard E. Patrick, Gary A. Orbeck, Donald A. Seccombe
  • Patent number: 6780305
    Abstract: The invention provides a method for producing a support for planographic printing plates which comprises a step of roughening the surface of an aluminum plate and in which the surface-roughening step includes (1) a pre-electrolytic surface-roughening step of electrolytically roughening the surface of an aluminum plate in an aqueous hydrochloric acid solution, (2) an alkali-etching step of etching the roughened surface of the aluminum plate with an alkali solution, (3) a desmutting step of contacting the etched aluminum plate with an aqueous sulfuric solution having predetermined sulfuric acid and aluminum ion concentrations at a predetermined temperature for 1 to 180 seconds, and (4) an electrolytic surface-roughening step of processing the desmutted aluminum plate in an aqueous nitric acid solution with an alternating current being applied thereto. The invention enables stable and inexpensive production of planographic printing plate supports even from regenerated aluminum.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: August 24, 2004
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi
  • Patent number: 6682645
    Abstract: In a process for producing an aluminum support of a lithographic printing plate, the desired aluminum support is produced by imparting fine asperities to an aluminum plate and then roughening it electrochemically in an acidic aqueous solution. The roughened aluminum plate may be electropolished or chemically etched.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: January 27, 2004
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi
  • Patent number: 6679985
    Abstract: An electrochemical discharge machining method may include electrolytically machining a tool fed by a three-dimensional tool feeder which can accurately feed a tool in three dimensions. The electrolytic machining may be performed in a current controlled mode, during which a concentration and a height of an electrolyte may be regulated. Further, the method may include performing electrochemical discharge machining of the workpiece using the machined tool in a voltage controlled mode.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: January 20, 2004
    Inventors: Soo Hyun Kim, Young-Mo Lim, Hyung-Jun Lim
  • Patent number: 6596150
    Abstract: Disclosed is a production method of an aluminum support for a lithographic printing plate, capable of stable and low-cost production of an aluminum support for a lithographic printing plate, the support being scarcely subject to generation of treatment unevenness called streaks or grainy unevenness ascribable to the different in the aluminum dissolving rate due to the difference in the orientation of the crystal grain. The aluminum support is produced by surface graining and then polishing an aluminum plate or by polishing an aluminum plate while etching it in an aqueous acid or alkali solution. The aluminum plate may be subjected to polishing and then to anodization or may be subjected to polishing, to surface graining, again to or not to polishing and then to anodization. A production method for producing a high-quality support for a lithographic printing plate, free of local unevenness is also disclosed.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: July 22, 2003
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi, Masahiro Endo
  • Patent number: 6325912
    Abstract: This invention provides an apparatus and a method capable of electrolyzing a metal web at a high treating speed and high current density without a problem of uneven treatment, which a metal web is wound, arc-shaped electrodes allocated on the outside of the drum roller concentrically with a space, and an electrolytic solution put in the space, wherein the drum roller is made movable in the vertical direction, and a method using the apparatus.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: December 4, 2001
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Tsuyoshi Hirokawa, Toru Yamazaki
  • Publication number: 20010025799
    Abstract: In a process for producing an aluminum support of a lithographic printing plate, the desired aluminum support is produced by imparting fine asperities to an aluminum plate and then roughening it electrochemically in an acidic aqueous solution. The roughened aluminum plate may be electropolished or chemically etched.
    Type: Application
    Filed: June 5, 2001
    Publication date: October 4, 2001
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi
  • Patent number: 6238810
    Abstract: A surface active, viscosity modifying agent is used to promote additional tunnel initiation during the etching of high purity cubicity anode foil, preferably aluminum anode foil, to render it suitable for use in electrolytic capacitors. The anode foil is etched in the electrolyte bath composition by passing a charge rough the bath, resulting in an anode foil having a higher capacitance than foils etched using known methods or etching compositions. The etched anode foil is suitable for use in an electrolytic capacitor.
    Type: Grant
    Filed: April 7, 1999
    Date of Patent: May 29, 2001
    Assignee: Pacesetter, Inc.
    Inventors: Thomas Flavian Strange, Ralph Jason Hemphill
  • Patent number: 6221236
    Abstract: This invention provides an apparatus for electrolytic treatment capable of removing the ununiformity according to the frequency and can achieve high treating speed and high current density treatment, which comprises etching a metal web electrolytically using alternating waveform current continuously, wherein a frequency-variable means having an ability to vary frequency of an electric power supply of said alternating waveform current arbitrarily is provided, and a method therefor.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: April 24, 2001
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Tsuyoshi Hirokawa, Toru Yamazaki, Atsushi Matsuura
  • Patent number: 6143158
    Abstract: A method for producing an aluminum support for a lithographic printing plate comprising the steps of (a) electrolytic polishing an aluminum plate in an alkaline aqueous solution; and (b) electrochemically surface roughening the aluminum plate using direct or alternating current in an acidic aqueous solution in this order, and also a method for producing an aluminum support for a lithographic printing plate comprising an electrolytic polishing step of treating an aluminum plate used as an anode in an alkaline aqueous solution at a current density of 5 A/dm.sup.2 to 200 A/dm.sup.2 while allowing the alkaline aqueous solution to flow between the aluminum plate and an electrode at an average flow rate of 10 cm/second to 400 cm/second.
    Type: Grant
    Filed: April 24, 1998
    Date of Patent: November 7, 2000
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Akio Uesugi
  • Patent number: 6045681
    Abstract: Disclosed is a method of surface-roughening an aluminum support comprising the step of electrolytically surface-roughening an aluminum support in an electrolyte solution, supplying an alternating current with an alternating waveform having a positive polarity period and a negative polarity period in one cycle, and comprising arriving at the largest current value from a zero current value in the positive polarity period of one cycle and then falling, followed by rising to a current maximum in one cycle, wherein the time t.sub.1, which is required to arrive at the largest current value, has the following relationships:1 millisecond<t.sub.1 .ltoreq.10 milliseconds, and1 millisecond<t.sub.1 .ltoreq.one third of the positive polarity period time.
    Type: Grant
    Filed: June 18, 1998
    Date of Patent: April 4, 2000
    Assignee: Konica Corporation
    Inventor: Takahiro Mori
  • Patent number: 5997722
    Abstract: A method for producing a photoreceptor having a substrate subjected to a surface finishing treatment to result in a finished substrate surface, wherein the method includes:(a) analyzing the finished substrate surface by performing a first surface energy reading, a first ellipsometry reading, a first x-ray diffraction reading, and a first profilometry reading;(b) removing electrochemically via an alternating voltage or alternating current a portion of the finished substrate surface, thereby resulting in a cleaned substrate surface;(c) analyzing the cleaned substrate surface by performing a second surface energy reading, a second ellipsometry reading, a second x-ray diffraction reading, and a second profilometry reading, wherein the removing step (b) is accomplished to the extent that the second surface energy reading and the second ellipsometry reading are measurably changed from the first surface energy reading and the first ellipsometry reading, but the second x-ray diffraction reading and the second profilo
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: December 7, 1999
    Assignee: Xerox Corporation
    Inventors: Alexandra I. Vidal, William G. Herbert, Roberto W. Vidal, Gary J. Maier, Jodie L. Morris, James E. McNamara, Gene W. O'Dell
  • Patent number: 5993637
    Abstract: An electrode structure is constituted by a first electrode, and at least one second electrode providing a pair of opposite portions with a prescribed spacing therebetween at which the first electrode is disposed. The electrode structure is suitably used for electrolytic etching and is effective in providing an accurate etching pattern without damaging the surface of an etching object.
    Type: Grant
    Filed: December 3, 1997
    Date of Patent: November 30, 1999
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masaya Hisamatsu, Akio Hasebe, Tsutomu Murakami, Hirofumi Ichinose, Satoshi Shinkura, Yukie Ueno
  • Patent number: 5833835
    Abstract: Method of electrochemically machining an electrically conductive workpiece (2) in an electrolyte by applying bipolar electric pulses between the workpiece (2) and an electrically conductive electrode (6), one or more current pulses of normal polarity alternating with voltage pulses of opposite polarity. The amplitude (Un) of the voltage pulses is adjusted between two predetermined values (Un1, Un2) derived from the occurrence of a given surface quality of the workpiece (2) and the occurrence of wear of the electrode (6). The derivation is effected by means of at least one test which precedes the machining of the workpiece (2). During the test the amplitude (Un) of the voltage pulses is increased gradually from an initial value to a final value. The two predetermined values (Un1, Un2) are determined upon the occurrence of a sign reversal in the difference between successive values of a parameter which is representative of a property of a gap (5) between the electrode (6) and the workpiece (2).
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: November 10, 1998
    Assignee: U.S. Philips Corporation
    Inventors: Nasich Z. Gimaev, Aleksandr N. Zajcev, Aleksandr L. Belogorskij, Igor L. Agafonov, Naila A. Amirchanova, Viktor N. Kucenko, Rafail R. Muchutdinov
  • Patent number: 5792333
    Abstract: A method of surface-roughening a copper foil by subjecting at least one side of the copper foil to electro-plating using an alternating current, wherein a sulfuric acid bath or a sulfuric acid-copper sulfate bath is used as an electrolyte.
    Type: Grant
    Filed: June 13, 1997
    Date of Patent: August 11, 1998
    Assignee: Circuit Foil Japan Co., Ltd.
    Inventors: Ryoichi Oguro, Tadao Nakaoka, Kazuyuki Inoue, Kazuhiro Hoshino
  • Patent number: 5667666
    Abstract: A process for roughening a surface of a support for a lithographic printing plate in which an electric current is supplied between a metal web and an electrode facing the metal web in an electrolyte containing metal ions so that the metal web is subjected to electrochemical processing continuously, 1-20 pause sections are provided in the electrochemical processing and the time taken for passage through once processing pause section in the electrochemical processing is set to 1-30 seconds. With the process, the grain shape can be controlled with no troublesome condition setting to improve a scumming resistance without deteriorating a printing durability and a fill-in reduction so that the plate has superior performance.
    Type: Grant
    Filed: July 30, 1996
    Date of Patent: September 16, 1997
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsushi Matsuura, Akio Uesugi
  • Patent number: 5660708
    Abstract: It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolytic polishing of the blank to be continued for a long time by employing a contactless electrolytic polishing apparatus, and can form an electrolytically polished surface which is sufficiently smooth to allow it to be plated with a very good metal coating.The contactless electrolytic polishing apparatus is employed for applying a direct current with ripples having a frequency of 40 to 120 Hz alternately to the anode and cathode in an electrolytic polishing tank filled with an electrolytic polishing solution, so that the time for which the blank positioned between both electrodes functions as the anode may be at least 3.3 times longer than that for which it functions as the cathode, and the blank is, then, plated with a metal by employing a customary method.
    Type: Grant
    Filed: November 21, 1995
    Date of Patent: August 26, 1997
    Assignee: Sumitomo Metal Mining Company, Limited
    Inventors: Yoshimaro Tezuka, Katsuhisa Tokunaga, Mitsuyuki Kakimoto, Shigeki Ogawa, Miyuki Tani, Satoshi Kobayashi, Kiyotaka Sasaki, Motoyuki Tomizawa
  • Patent number: 5639363
    Abstract: An apparatus and a method for mirror surface grinding which enables high quality, stable ELID grinding; and a grinding wheel for electrolytic dressing. The apparatus comprises a grinding wheel 3 having a contact surface 2 for contacting a workpiece 1, an electrode 4 facing the surface 2, nozzles 5 for supplying conductive fluid between the grinding wheel 3 and the electrode 4, and a power source 6 and feeder 7 for applying a voltage between the grinding wheel and the electrode 4. The bond material, which is selected from among iron, ferrous metal, cobalt, nickel and combinations of two or more thereof, along with grains and sintering aid are molded together and sintered to obtain the conductive grinding wheel. Next, a conductive water-soluble grinding fluid containing an alkanolamine and anions is supplied between the grinding wheel and the electrode, and a pulse wave voltage is applied between the grinding wheel and the electrode to dress the grinding wheel electrolytically during grinding.
    Type: Grant
    Filed: February 14, 1995
    Date of Patent: June 17, 1997
    Assignee: Rikagaku Kenkyusho
    Inventors: Hitoshi Ohmori, Takeo Nakagawa, Katsuhiko Karikomi
  • Patent number: 5500101
    Abstract: The present invention relates to a method of etching aluminum foil for electrolytic capacitors that is improved in etching efficiency, wherein when the aluminum foil is etched by applying alternating current in an electrolytic solution containing chloride ions and the like, the alternating current contains, during the positive half period and the negative half period, two half waves having different waveforms, amplitudes, and applied times, and a rest period between the half waves with the amplitude being 0 or with microcurrent being applied on the positive side or the negative side at at most 1/15 of the maximum amplitude during a half period.
    Type: Grant
    Filed: December 9, 1994
    Date of Patent: March 19, 1996
    Assignee: Nihon Chikudenki Kogyo Kabushiki Kaisha
    Inventor: Yoshio Yoneyama