Simple Alternating Current Patents (Class 205/658)
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Patent number: 9023663Abstract: The object of the present invention is to provide a method for preparing a nano-sheet array structure of a Group V-VI semiconductor, comprising: (A) providing an electrolyte containing a hydrogen ion and disposing an auxiliary electrode and a working electrode in the electrolyte, wherein the working electrode comprises a Group V-VI semiconductor bulk; and (B) applying a redox reaction bias to the auxiliary electrode and the working electrode to form a nano-sheet array structure on the bulk.Type: GrantFiled: April 30, 2014Date of Patent: May 5, 2015Assignee: National Tsing Hua UniversityInventors: Yu-Lun Chueh, Hung-Wei Tsai, Tsung-Cheng Chan
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Patent number: 8974656Abstract: A method for surface roughening a metal work piece includes disposing a region of the workpiece to be roughened proximate to a counter electrode. The region of the workpiece to be roughened and the counter electrode are subsequently disposed together in an electrolyte. An electric potential with current flow is applied between the work piece and the counter electrode to roughen the metal surface to a desired roughness.Type: GrantFiled: June 30, 2011Date of Patent: March 10, 2015Assignee: General Electric CompanyInventors: Andrew Lee Trimmer, Bin Wei, Joshua Leigh Miller, Nicholas Joseph Kray, Michael Scott Lamphere
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Patent number: 8968530Abstract: An electrolytic treatment method and electrolytic treatment device are provided for electrolytic treatment of an aluminum web W by applying an alternating current to an upstream electrode and a downstream electrode disposed along a conveying direction a. At least one of a conveying velocity v of the aluminum web W, a frequency f of alternating current applied at the upstream electrode and the downstream electrode, and/or a web conveying direction separation distance d2 between the upstream electrode and the downstream electrode are set such that the alternating current and voltage waveform applied to the aluminum web W at the far end of the upstream electrode and the alternating current and voltage waveform applied to the aluminum web W at the near end of the downstream electrode do not reinforce each other.Type: GrantFiled: September 30, 2009Date of Patent: March 3, 2015Assignee: FUJIFILM CorporationInventors: Hisashi Hotta, Tsuyoshi Hirokawa
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Patent number: 8882986Abstract: A system includes an electrolytic deburring tool, which includes a first electrode configured to be positioned at a first gap away from a first edge of a workpiece, a second electrode configured to be positioned at a second gap away from a second edge of the workpiece, a first electrolyte supply configured to flow a first electrolyte through the first gap between the first electrode and the first edge of the workpiece, a second electrolyte supply configured to flow a second electrolyte through the second gap between the second electrode and the second edge of the workpiece, and a power supply configured to flow an alternating current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first edge and the second edge.Type: GrantFiled: March 2, 2011Date of Patent: November 11, 2014Assignee: General Electric CompanyInventors: Yuefeng Luo, William Edward Adis, Michael Lewis Jones
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Publication number: 20140242805Abstract: A method for sharpening a nanotip involving a laser-enhanced chemical etching is provided. The method includes immersing a nanotip in an etchant solution. The nanotip includes a base and an apex, the apex having a diameter smaller than a diameter of the base. The method also includes irradiating the nanotip with laser fluence to establish a temperature gradient in the nanotip along a direction from the apex to the base of the nanotip such that the apex and base are etched at different rates.Type: ApplicationFiled: December 4, 2013Publication date: August 28, 2014Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.Inventors: ZhiHong MAI, Jeffrey C. LAM, Mohammed Khalid BIN DAWOOD, Tsu Hau NG
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Patent number: 8673405Abstract: In a method for producing a starting material (M, N, N?) for the production of a wear layer (420), a coating (40) with a composition which corresponds to that of the wear layer (420) which is to be produced is chemically undissolved from its substrate (30) and is detached as a solid body, and that the starting material (M, N, N?) is formed by the layer material (60) of the detached coating (40).Type: GrantFiled: July 9, 2007Date of Patent: March 18, 2014Assignee: Siemens AktiengesellschaftInventors: Rene Jabado, Jens Dahl Jensen, Ursus Krüger, Daniel Körtvelyessy, Volkmar Lüthen, Ralph Reiche, Michael Rindler, Raymond Ullrich
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Publication number: 20120222968Abstract: A system includes an electrolytic deburring tool, which includes a first electrode configured to be positioned at a first gap away from a first edge of a workpiece, a second electrode configured to be positioned at a second gap away from a second edge of the workpiece, a first electrolyte supply configured to flow a first electrolyte through the first gap between the first electrode and the first edge of the workpiece, a second electrolyte supply configured to flow a second electrolyte through the second gap between the second electrode and the second edge of the workpiece, and a power supply configured to flow an alternating current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first edge and the second edge.Type: ApplicationFiled: March 2, 2011Publication date: September 6, 2012Applicant: General Electric CompanyInventors: Yuefeng Luo, William Edward Adis, Michael Lewis Jones
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Publication number: 20120138480Abstract: The invention relates to a method for electrochemical processing of at least one workpiece, comprising at least the following steps: a) setting a first flow density during a first phase in an electrolyte, b) retaining the first flow density during a second phase following the first phase, c) increasing the first flow density during a third phase following the second phase to a second flow density at least 30% greater than the first flow density, and d) reducing the second flow density during a fourth phase following the third phase within a maximum of 100 microseconds to a maximum of 1% of the second flow density.Type: ApplicationFiled: August 2, 2010Publication date: June 7, 2012Applicant: KENNAMETAL INC.Inventors: Patrick Matt, Michael Riester, Johannes Schreiner
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Publication number: 20110174635Abstract: An electrolytic treatment method and electrolytic treatment device are provided for electrolytic treatment of an aluminum web W by applying an alternating current to an upstream electrode and a downstream electrode disposed along a conveying direction a. At least one of a conveying velocity v of the aluminum web W, a frequency f of alternating current applied at the upstream electrode and the downstream electrode, and/or a web conveying direction separation distance d2 between the upstream electrode and the downstream electrode are set such that the alternating current and voltage waveform applied to the aluminum web W at the far end of the upstream electrode and the alternating current and voltage waveform applied to the aluminum web W at the near end of the downstream electrode do not reinforce each other.Type: ApplicationFiled: September 30, 2009Publication date: July 21, 2011Inventors: Hisashi Hotta, Tsuyoshi Hirokawa
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Patent number: 7153410Abstract: Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece, a workpiece electrode, a first remote electrode, and a second remote electrode. The workpiece electrode is configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder. The first and second remote electrodes are spaced apart from the workpiece holder. The apparatus can also include an AC power supply, a DC power supply, and a switching assembly. The switching assembly is coupled to the workpiece electrode, the first remote electrode, the second remote electrode, the AC power supply, and the DC power supply.Type: GrantFiled: March 4, 2002Date of Patent: December 26, 2006Assignee: Micron Technology, Inc.Inventors: Scott E. Moore, Whonchee Lee, Scott G. Meikle, Trung T. Doan
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Patent number: 7144298Abstract: The object of the invention is to provide a method of manufacturing a semiconductor device and a processing apparatus for planarization wherein to form copper wiring in multiple layers. The removal of a residue of polishing by local electro polishing, the enhancement of the performance of planarization by using a grindstone and the reduction by small frictional force in electro polishing of damage, are enabled. To achieve the object, the following measures are taken. A residue of polishing of copper is removed by combining the detection of a local area including the residue of polishing of copper and local processing for electro polishing. As small-load processing for planarization is enabled by using electro polishing, multilayer interconnection structure using low-k material as a dielectric interlayer is also enabled.Type: GrantFiled: May 20, 2005Date of Patent: December 5, 2006Assignee: Hitachi, Ltd.Inventors: Souichi Katagiri, Ui Yamaguchi
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Patent number: 7107676Abstract: Manufacturing equipment and manufacturing process steps that improve upon prior art processes for the manufacturing of filament tube and arc tube light sources, their components and subassemblies, and lamps employing said light sources. A double ended, tipless filament tube or arc tube light source incorporates a drawn-down tubular body, and one piece foliated leads with spurs for process handling and for spudding into a filament with stretched-out legs. Bugled ends on the body provide a novel cutoff means, facilitate a flush-fill finishing process, and enhance mounting and support of the light sources in lamps. The foliated leads are made from a continuous length of wire in a process including foil hammering and two-bath AC electrochemical etching. Cost-reduced light source and lamp production enables affordable household consumer lamps, even when containing two series-connected halogen filament tubes.Type: GrantFiled: November 5, 2003Date of Patent: September 19, 2006Inventor: Elmer G. Fridrich
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Patent number: 7022216Abstract: A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising: providing a substrate bearing on a major surface thereof a layer of electrolytically dissoluble metal, the metal layer serving as a dissoluble electrode and having a central region and an adjacent peripheral region; providing at least a first counterelectrode and a second counterelectrode; positioning the counterelectrodes opposite the metal layer and spaced from the metal layer and spaced from each other; in a first electrolytic step, passing an electric current between the first counterelectrode and the central region of the metal layer, wherein the first counterelectrode is cathodic with respect to the metal layer, and the first electrolytic step includes a first phase, a second phase, and a third phase and during the first phase the electric current is a low amperage current, during the second phase the electric current includes a train of anodiType: GrantFiled: June 11, 2003Date of Patent: April 4, 2006Assignee: Faraday Technology Marketing Group, LLCInventors: E. Jennings Taylor, Heather Dyar
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Patent number: 6837984Abstract: An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.Type: GrantFiled: April 10, 2002Date of Patent: January 4, 2005Assignee: ACM Research, Inc.Inventor: Hui Wang
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Publication number: 20040256245Abstract: A metal layer formed on a surface of a wafer is electropolished using a wafer chuck and a moveable nozzle. The surface on which the metal layer is formed is the same surface on which features of devices are formed. The wafer chuck is configured to rotate the wafer when the wafer is placed on top of the wafer chuck. The moveable nozzle is disposed vertically above the wafer when the wafer is placed on top of the wafer chuck. The moveable nozzle is configured to move from a first position to apply a stream of electrolyte to a first portion of the metal layer to a second position to apply the stream of electrolyte to a second portion of the metal layer when the wafer is rotated by the wafer chuck, where the first and second portions of the metal layer are located at different radial positions on the wafer.Type: ApplicationFiled: July 21, 2004Publication date: December 23, 2004Applicant: ACM Research, Inc.Inventor: Hui Wang
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Publication number: 20040226831Abstract: An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.Type: ApplicationFiled: April 7, 2004Publication date: November 18, 2004Inventors: Chun Christine Dong, Wayne Thomas McDermott, Alexander Schwarz, Gregory Khosrov Arslanian, Richard E. Patrick, Gary A. Orbeck, Donald A. Seccombe
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Patent number: 6780305Abstract: The invention provides a method for producing a support for planographic printing plates which comprises a step of roughening the surface of an aluminum plate and in which the surface-roughening step includes (1) a pre-electrolytic surface-roughening step of electrolytically roughening the surface of an aluminum plate in an aqueous hydrochloric acid solution, (2) an alkali-etching step of etching the roughened surface of the aluminum plate with an alkali solution, (3) a desmutting step of contacting the etched aluminum plate with an aqueous sulfuric solution having predetermined sulfuric acid and aluminum ion concentrations at a predetermined temperature for 1 to 180 seconds, and (4) an electrolytic surface-roughening step of processing the desmutted aluminum plate in an aqueous nitric acid solution with an alternating current being applied thereto. The invention enables stable and inexpensive production of planographic printing plate supports even from regenerated aluminum.Type: GrantFiled: February 12, 2002Date of Patent: August 24, 2004Assignee: Fuji Photo Film Co., Ltd.Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi
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Patent number: 6682645Abstract: In a process for producing an aluminum support of a lithographic printing plate, the desired aluminum support is produced by imparting fine asperities to an aluminum plate and then roughening it electrochemically in an acidic aqueous solution. The roughened aluminum plate may be electropolished or chemically etched.Type: GrantFiled: June 5, 2001Date of Patent: January 27, 2004Assignee: Fuji Photo Film Co., Ltd.Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi
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Patent number: 6679985Abstract: An electrochemical discharge machining method may include electrolytically machining a tool fed by a three-dimensional tool feeder which can accurately feed a tool in three dimensions. The electrolytic machining may be performed in a current controlled mode, during which a concentration and a height of an electrolyte may be regulated. Further, the method may include performing electrochemical discharge machining of the workpiece using the machined tool in a voltage controlled mode.Type: GrantFiled: January 14, 2002Date of Patent: January 20, 2004Inventors: Soo Hyun Kim, Young-Mo Lim, Hyung-Jun Lim
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Patent number: 6596150Abstract: Disclosed is a production method of an aluminum support for a lithographic printing plate, capable of stable and low-cost production of an aluminum support for a lithographic printing plate, the support being scarcely subject to generation of treatment unevenness called streaks or grainy unevenness ascribable to the different in the aluminum dissolving rate due to the difference in the orientation of the crystal grain. The aluminum support is produced by surface graining and then polishing an aluminum plate or by polishing an aluminum plate while etching it in an aqueous acid or alkali solution. The aluminum plate may be subjected to polishing and then to anodization or may be subjected to polishing, to surface graining, again to or not to polishing and then to anodization. A production method for producing a high-quality support for a lithographic printing plate, free of local unevenness is also disclosed.Type: GrantFiled: May 27, 1999Date of Patent: July 22, 2003Assignee: Fuji Photo Film Co., Ltd.Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi, Masahiro Endo
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Patent number: 6325912Abstract: This invention provides an apparatus and a method capable of electrolyzing a metal web at a high treating speed and high current density without a problem of uneven treatment, which a metal web is wound, arc-shaped electrodes allocated on the outside of the drum roller concentrically with a space, and an electrolytic solution put in the space, wherein the drum roller is made movable in the vertical direction, and a method using the apparatus.Type: GrantFiled: February 24, 2000Date of Patent: December 4, 2001Assignee: Fuji Photo Film Co., Ltd.Inventors: Tsuyoshi Hirokawa, Toru Yamazaki
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Publication number: 20010025799Abstract: In a process for producing an aluminum support of a lithographic printing plate, the desired aluminum support is produced by imparting fine asperities to an aluminum plate and then roughening it electrochemically in an acidic aqueous solution. The roughened aluminum plate may be electropolished or chemically etched.Type: ApplicationFiled: June 5, 2001Publication date: October 4, 2001Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi
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Patent number: 6238810Abstract: A surface active, viscosity modifying agent is used to promote additional tunnel initiation during the etching of high purity cubicity anode foil, preferably aluminum anode foil, to render it suitable for use in electrolytic capacitors. The anode foil is etched in the electrolyte bath composition by passing a charge rough the bath, resulting in an anode foil having a higher capacitance than foils etched using known methods or etching compositions. The etched anode foil is suitable for use in an electrolytic capacitor.Type: GrantFiled: April 7, 1999Date of Patent: May 29, 2001Assignee: Pacesetter, Inc.Inventors: Thomas Flavian Strange, Ralph Jason Hemphill
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Patent number: 6221236Abstract: This invention provides an apparatus for electrolytic treatment capable of removing the ununiformity according to the frequency and can achieve high treating speed and high current density treatment, which comprises etching a metal web electrolytically using alternating waveform current continuously, wherein a frequency-variable means having an ability to vary frequency of an electric power supply of said alternating waveform current arbitrarily is provided, and a method therefor.Type: GrantFiled: June 24, 1999Date of Patent: April 24, 2001Assignee: Fuji Photo Film Co., Ltd.Inventors: Tsuyoshi Hirokawa, Toru Yamazaki, Atsushi Matsuura
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Patent number: 6143158Abstract: A method for producing an aluminum support for a lithographic printing plate comprising the steps of (a) electrolytic polishing an aluminum plate in an alkaline aqueous solution; and (b) electrochemically surface roughening the aluminum plate using direct or alternating current in an acidic aqueous solution in this order, and also a method for producing an aluminum support for a lithographic printing plate comprising an electrolytic polishing step of treating an aluminum plate used as an anode in an alkaline aqueous solution at a current density of 5 A/dm.sup.2 to 200 A/dm.sup.2 while allowing the alkaline aqueous solution to flow between the aluminum plate and an electrode at an average flow rate of 10 cm/second to 400 cm/second.Type: GrantFiled: April 24, 1998Date of Patent: November 7, 2000Assignee: Fuji Photo Film Co., Ltd.Inventors: Atsuo Nishino, Yoshitaka Masuda, Akio Uesugi
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Patent number: 6045681Abstract: Disclosed is a method of surface-roughening an aluminum support comprising the step of electrolytically surface-roughening an aluminum support in an electrolyte solution, supplying an alternating current with an alternating waveform having a positive polarity period and a negative polarity period in one cycle, and comprising arriving at the largest current value from a zero current value in the positive polarity period of one cycle and then falling, followed by rising to a current maximum in one cycle, wherein the time t.sub.1, which is required to arrive at the largest current value, has the following relationships:1 millisecond<t.sub.1 .ltoreq.10 milliseconds, and1 millisecond<t.sub.1 .ltoreq.one third of the positive polarity period time.Type: GrantFiled: June 18, 1998Date of Patent: April 4, 2000Assignee: Konica CorporationInventor: Takahiro Mori
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Patent number: 5997722Abstract: A method for producing a photoreceptor having a substrate subjected to a surface finishing treatment to result in a finished substrate surface, wherein the method includes:(a) analyzing the finished substrate surface by performing a first surface energy reading, a first ellipsometry reading, a first x-ray diffraction reading, and a first profilometry reading;(b) removing electrochemically via an alternating voltage or alternating current a portion of the finished substrate surface, thereby resulting in a cleaned substrate surface;(c) analyzing the cleaned substrate surface by performing a second surface energy reading, a second ellipsometry reading, a second x-ray diffraction reading, and a second profilometry reading, wherein the removing step (b) is accomplished to the extent that the second surface energy reading and the second ellipsometry reading are measurably changed from the first surface energy reading and the first ellipsometry reading, but the second x-ray diffraction reading and the second profiloType: GrantFiled: June 24, 1998Date of Patent: December 7, 1999Assignee: Xerox CorporationInventors: Alexandra I. Vidal, William G. Herbert, Roberto W. Vidal, Gary J. Maier, Jodie L. Morris, James E. McNamara, Gene W. O'Dell
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Patent number: 5993637Abstract: An electrode structure is constituted by a first electrode, and at least one second electrode providing a pair of opposite portions with a prescribed spacing therebetween at which the first electrode is disposed. The electrode structure is suitably used for electrolytic etching and is effective in providing an accurate etching pattern without damaging the surface of an etching object.Type: GrantFiled: December 3, 1997Date of Patent: November 30, 1999Assignee: Canon Kabushiki KaishaInventors: Masaya Hisamatsu, Akio Hasebe, Tsutomu Murakami, Hirofumi Ichinose, Satoshi Shinkura, Yukie Ueno
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Patent number: 5833835Abstract: Method of electrochemically machining an electrically conductive workpiece (2) in an electrolyte by applying bipolar electric pulses between the workpiece (2) and an electrically conductive electrode (6), one or more current pulses of normal polarity alternating with voltage pulses of opposite polarity. The amplitude (Un) of the voltage pulses is adjusted between two predetermined values (Un1, Un2) derived from the occurrence of a given surface quality of the workpiece (2) and the occurrence of wear of the electrode (6). The derivation is effected by means of at least one test which precedes the machining of the workpiece (2). During the test the amplitude (Un) of the voltage pulses is increased gradually from an initial value to a final value. The two predetermined values (Un1, Un2) are determined upon the occurrence of a sign reversal in the difference between successive values of a parameter which is representative of a property of a gap (5) between the electrode (6) and the workpiece (2).Type: GrantFiled: July 12, 1996Date of Patent: November 10, 1998Assignee: U.S. Philips CorporationInventors: Nasich Z. Gimaev, Aleksandr N. Zajcev, Aleksandr L. Belogorskij, Igor L. Agafonov, Naila A. Amirchanova, Viktor N. Kucenko, Rafail R. Muchutdinov
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Patent number: 5792333Abstract: A method of surface-roughening a copper foil by subjecting at least one side of the copper foil to electro-plating using an alternating current, wherein a sulfuric acid bath or a sulfuric acid-copper sulfate bath is used as an electrolyte.Type: GrantFiled: June 13, 1997Date of Patent: August 11, 1998Assignee: Circuit Foil Japan Co., Ltd.Inventors: Ryoichi Oguro, Tadao Nakaoka, Kazuyuki Inoue, Kazuhiro Hoshino
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Patent number: 5667666Abstract: A process for roughening a surface of a support for a lithographic printing plate in which an electric current is supplied between a metal web and an electrode facing the metal web in an electrolyte containing metal ions so that the metal web is subjected to electrochemical processing continuously, 1-20 pause sections are provided in the electrochemical processing and the time taken for passage through once processing pause section in the electrochemical processing is set to 1-30 seconds. With the process, the grain shape can be controlled with no troublesome condition setting to improve a scumming resistance without deteriorating a printing durability and a fill-in reduction so that the plate has superior performance.Type: GrantFiled: July 30, 1996Date of Patent: September 16, 1997Assignee: Fuji Photo Film Co., Ltd.Inventors: Atsushi Matsuura, Akio Uesugi
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Patent number: 5660708Abstract: It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolytic polishing of the blank to be continued for a long time by employing a contactless electrolytic polishing apparatus, and can form an electrolytically polished surface which is sufficiently smooth to allow it to be plated with a very good metal coating.The contactless electrolytic polishing apparatus is employed for applying a direct current with ripples having a frequency of 40 to 120 Hz alternately to the anode and cathode in an electrolytic polishing tank filled with an electrolytic polishing solution, so that the time for which the blank positioned between both electrodes functions as the anode may be at least 3.3 times longer than that for which it functions as the cathode, and the blank is, then, plated with a metal by employing a customary method.Type: GrantFiled: November 21, 1995Date of Patent: August 26, 1997Assignee: Sumitomo Metal Mining Company, LimitedInventors: Yoshimaro Tezuka, Katsuhisa Tokunaga, Mitsuyuki Kakimoto, Shigeki Ogawa, Miyuki Tani, Satoshi Kobayashi, Kiyotaka Sasaki, Motoyuki Tomizawa
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Patent number: 5639363Abstract: An apparatus and a method for mirror surface grinding which enables high quality, stable ELID grinding; and a grinding wheel for electrolytic dressing. The apparatus comprises a grinding wheel 3 having a contact surface 2 for contacting a workpiece 1, an electrode 4 facing the surface 2, nozzles 5 for supplying conductive fluid between the grinding wheel 3 and the electrode 4, and a power source 6 and feeder 7 for applying a voltage between the grinding wheel and the electrode 4. The bond material, which is selected from among iron, ferrous metal, cobalt, nickel and combinations of two or more thereof, along with grains and sintering aid are molded together and sintered to obtain the conductive grinding wheel. Next, a conductive water-soluble grinding fluid containing an alkanolamine and anions is supplied between the grinding wheel and the electrode, and a pulse wave voltage is applied between the grinding wheel and the electrode to dress the grinding wheel electrolytically during grinding.Type: GrantFiled: February 14, 1995Date of Patent: June 17, 1997Assignee: Rikagaku KenkyushoInventors: Hitoshi Ohmori, Takeo Nakagawa, Katsuhiko Karikomi
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Patent number: 5500101Abstract: The present invention relates to a method of etching aluminum foil for electrolytic capacitors that is improved in etching efficiency, wherein when the aluminum foil is etched by applying alternating current in an electrolytic solution containing chloride ions and the like, the alternating current contains, during the positive half period and the negative half period, two half waves having different waveforms, amplitudes, and applied times, and a rest period between the half waves with the amplitude being 0 or with microcurrent being applied on the positive side or the negative side at at most 1/15 of the maximum amplitude during a half period.Type: GrantFiled: December 9, 1994Date of Patent: March 19, 1996Assignee: Nihon Chikudenki Kogyo Kabushiki KaishaInventor: Yoshio Yoneyama