Abstract: A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic.

Abstract: A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned with the mask relative to an electric field applied by the electrolytic process. The second region separates the first region of the second conductive portion from the first conductive portion. The electrolytic process is concentrated relative to the second region such that removal occurs at a relatively higher rate in the second region than in the first region.

Abstract: A method for surface roughening a metal work piece includes disposing a region of the workpiece to be roughened proximate to a counter electrode. The region of the workpiece to be roughened and the counter electrode are subsequently disposed together in an electrolyte. An electric potential with current flow is applied between the work piece and the counter electrode to roughen the metal surface to a desired roughness.

Abstract: Radiopaque cobalt-based alloys having a smooth electropolished surface with rounded edges and methods for electropolishing such alloys. A cobalt-based alloy includes cobalt, chromium, and one or more radiopaque elements. In one embodiment, examples of radiopaque elements include so-called platinum group metals (i.e., platinum, palladium, ruthenium, rhodium, osmium, or iridium). Group 10 elements (i.e., platinum or palladium) are particularly preferred. Because of the presence of the platinum group metal(s), such alloys are generally difficult to electropolish. Electrolyte formulations and methods for electropolishing such alloys are also disclosed.

Abstract: In a method for producing a starting material (M, N, N?) for the production of a wear layer (420), a coating (40) with a composition which corresponds to that of the wear layer (420) which is to be produced is chemically undissolved from its substrate (30) and is detached as a solid body, and that the starting material (M, N, N?) is formed by the layer material (60) of the detached coating (40).

Abstract: This is a process to generate alternating current without an external source for cell-houses in electrowinning or electrorefining of copper or other products in which the electric source consists of a conventional rectifier-transformer group that supplies continuous electrical current to the cell-house, which is connected in parallel to a device characterized by having the capacity to extract an electrical current from the cell-house for a period of time and then return it in another period of time, whether periodically or semiperiodically and without changing the average value of the electrical current, supplied to the cell-house by the rectifier-transformer. This results in a electrical current in the cell-house that is the superimposition of a continuous and alternating current. This process is designed to overcome the barrier of electric potential produced by the presence of the pure continuous electric field in cell-houses through the electric agitation of an ion-rich electrolyte.

Abstract: An aluminum support is manufactured at lower cost by efficiently performing a surface roughening treatment with dispersed pits formed on the aluminum support. In an electrolytic surface roughening treatment method for performing an electrolytic surface roughening treatment on a strip-shaped metal as being conveyed in an acidic electrolytic solution by applying an alternating waveform voltage, the method includes a step of applying a negative voltage to the metal plate at least once while the alternating waveform voltage is being applied so that the metal plate assumes a negative polarity.

Abstract: An electric contact in the outer edge thereof, is used for electroplating substrates, e.g. as a wafer in a cup plater. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources (9?) and (9?) that can be individually adjusted. The partial cathode (12?) and the associated partial anode (7?) are supplied in the region of the diametrically remote partial cathode (12?). Conversely, the partial cathode (12?) is supplied via the base layer of the partial cathode (12?). The required levelling of the layer thickness distribution is inter alia carried out by alternate different adjustments of the quantity of the electroplating current of the two partial cells and by the electrodes (7,12) that rotate relative to each other.

Abstract: An electrochemical machining system for metals and alloys having a strongly passivating character including an electrolyte solution that is free of hydrofluoric acid, an electrode in contact with the electrolyte solution, a workpiece spaced apart from the electrode and in contact with the electrolyte solution and a power source including a first electrical lead electrically coupled to the electrode and a second electrical lead electrically coupled to the workpiece, the power source being configured to pass an electric current between the electrode and the workpiece, wherein the electric current includes anodic pulses and cathodic pulses, and wherein the cathodic pulses are interposed between at least some of the anodic pulses.

Abstract: Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece, a workpiece electrode, a first remote electrode, and a second remote electrode. The workpiece electrode is configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder. The first and second remote electrodes are spaced apart from the workpiece holder. The apparatus can also include an AC power supply, a DC power supply, and a switching assembly. The switching assembly is coupled to the workpiece electrode, the first remote electrode, the second remote electrode, the AC power supply, and the DC power supply.

Abstract: The present invention provides a method for indirect-electrification-type continuous electrolytic etching of a metal strip suitable for producing a low-core-loss, grain-oriented silicon steel sheet not susceptible to the deterioration of core loss after stress-relief annealing, and an apparatus for the indirect-electrification-type continuous electrolytic etching.

Abstract: A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising: providing a substrate bearing on a major surface thereof a layer of electrolytically dissoluble metal, the metal layer serving as a dissoluble electrode and having a central region and an adjacent peripheral region; providing at least a first counterelectrode and a second counterelectrode; positioning the counterelectrodes opposite the metal layer and spaced from the metal layer and spaced from each other; in a first electrolytic step, passing an electric current between the first counterelectrode and the central region of the metal layer, wherein the first counterelectrode is cathodic with respect to the metal layer, and the first electrolytic step includes a first phase, a second phase, and a third phase and during the first phase the electric current is a low amperage current, during the second phase the electric current includes a train of anodi

Abstract: A contact-discharge truing/dressing method and a device therefor, capable of very simply conducting truing/dressing of a superabrasive grindstone, especially a superabrasive grindstone having a metal binder. The contact-discharge truing/dressing method brings a rotated conductive grindstone into contact with a pair of electrodes to which a DC voltage or pulse voltage is applied, and subjecting the conductive grindstone to an intermittent truing/dressing by contact discharge produced when opening/closing a circuit of a positive electrode, electrode chips, a grindstone binder, electrode chips, a negative electrode, and parts of the side surfaces of dual-ring rotary electrodes insulated by an insulation layer being used as a pair of electrodes.

Abstract: The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.

Abstract: An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.

Abstract: A metal layer formed on a surface of a wafer is electropolished using a wafer chuck and a moveable nozzle. The surface on which the metal layer is formed is the same surface on which features of devices are formed. The wafer chuck is configured to rotate the wafer when the wafer is placed on top of the wafer chuck. The moveable nozzle is disposed vertically above the wafer when the wafer is placed on top of the wafer chuck. The moveable nozzle is configured to move from a first position to apply a stream of electrolyte to a first portion of the metal layer to a second position to apply the stream of electrolyte to a second portion of the metal layer when the wafer is rotated by the wafer chuck, where the first and second portions of the metal layer are located at different radial positions on the wafer.

Abstract: The present invention relates to an apparatus and method for electropolishing a metal wire layer on a semiconductor device. To electropolish the metal wiring layer, a wafer is dipped into an electrolyte solution, and positive and negative voltages are applied to the wafer and electrodes, respectively. The electrodes include a main electrode and a plurality of auxiliary electrodes disposed above the main electrode. In a preferred embodiment, the plurality of auxiliary electrodes are mesh-type electrodes and are annular in shape and concentrically disposed, and thus the electrolyte solution can readily flow between them. Further, the metal wiring layer is preferably sequentially electropolished outwardly from the center of the wafer by sequentially applying negative voltages to the plurality of annular auxiliary electrodes. In this manner, a uniform electropolishing process is performed.

Abstract: A method for improving an electrodeposited metal film uniformity and preventing metal deposition and peeling of deposited metal from an electrode during an electrodeposition and electropolishing process including providing a first anode electrode assembly and a semiconductor wafer plating surface disposed in an electrolyte bath including a plating metal for deposition onto the semiconductor wafer plating surface; providing at least one additional anode electrode assembly including the plating metal disposed peripheral to the first anode electrode assembly for selectively applying the cathodic electrical potential during an electropolishing process; and, periodically alternating between an electrodeposition process and electropolishing process with respect to the semiconductor wafer plating surface such that the plating metal is preferentially plated onto the at least one additional electrode assembly.

Abstract: In a process for producing an aluminum support of a lithographic printing plate, the desired aluminum support is produced by imparting fine asperities to an aluminum plate and then roughening it electrochemically in an acidic aqueous solution. The roughened aluminum plate may be electropolished or chemically etched.

Abstract: A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising:

Abstract: A surface of an electrolytically dissolvable material, e.g., an electrolytically dissolvable metal, is smoothed by a two-step electrochemical process wherein a the surface to be smoothed and a counterelectrode are contacted with an electrolyte and an electric current is passed between the substrate and counterelectrode, with the substrate as the anode. In a first step relatively large asperities on the substrate are reduced in height by maintaining a macroprofile regime by using a pulsed electric current with short pulses. In a second step, small asperities and the remainder of the large asperities are reduced or removed by maintaining a microprofile regime by using a pulsed current having longer pulses or a direct current.

Abstract: To avoid or minimize the occurrence of cross streaks or current streaks on a substrate that is transported through an electrolytic bath and roughened electrochemically in it, the current density is regulated in the electrolyte between a first alternating or three-phase current electrode and the substrate in such a way that at the beginning of a roughening zone, the current density has a lesser value than within the roughening zone, in the transport direction of the substrate. Downstream of the first alternating or three-phase current electrode, either a further alternating current electrode or a further three-phase current electrode acts on the substrate. In a preferred embodiment, the first alternating or three-phase current electrode has a rounded outline, which is composed of a curved portion and adjoining it a straight portion.

Abstract: An apparatus and method of electrochemical polishing a workpiece with ring-form electrode is provided. A mechanism with a tool electrode, a DC power supply and electrolysis-supply tank of the present invention can be installed on the traditional production equipment. The tool electrode is connected with the negative pole of the DC power supply, while the workpiece is connected with the positive pole of the DC power supply and kept a fixed distance from the tool electrode. The electrode or the workpiece advances at a predetermined feeding speed while the workpiece is electrochemically polished. The present invention uses the centrifugal force of rotational tool electrode to discharge electrolytic byproducts, making electrochemical polishing more effective.

Abstract: Electrochemical machining of metals and alloys is accomplished by using a pulsed electric current incorporating modulated reverse electric current. Reverse (cathodic) pulses are interposed between forward (anodic) pulses. The process is useful for electrochemical shaping of metals, electrochemically polishing metal surfaces, and electrochemical deburring of metal articles. The process is especially useful for electrochemical processing of metals and alloys that readily form passive surface layers.

Abstract: A method and apparatus for electrochemically roughening a support is disclosed to minimize the occurrence of surface discharges or electrical discharges on the support. A DC voltage acts on the support at the start of the movement of the support through the electrolyte bath. Subsequently, a three-phase or single-phase current acts on the support in the roughening zone. Three-phase electrodes are arranged in the electrolyte bath and are connected to the secondary of a three-phase transformer. The primary of the three-phase transformer is connected, via control transformers to a three-phase power transformer. A DC electrode is located upstream of the three-phase electrodes in the direction in which the support is transported through the bath. The DC electrode may be connected to the positive pole of a DC source while the negative pole of this DC source makes contact with the support.

Abstract: A method of electrochemically machining an electrically conductive workpiece in an electrolyte by applying electrical pulses between the workpiece and an electrically conductive electrode, one or more machining pulses alternating with passivation voltage pulses for depositing passivation layers on the workpiece. The amplitude of the passivation voltage pulses is adjusted during an adjustment procedure in which the amplitude of the passivation voltage pulses is increased gradually from zero to the voltage at which the workpiece starts to dissolve in the electrolyte. After each voltage increase the resistance of the gap between the electrode and the workpiece is measured. The voltage value for the highest gap resistance is stored in a memory and used during further machining. The time span of the passivation voltage pulses may be divided into time slices and for each time slice the voltage is adjusted for maximum gap resistance during that time slice.

Abstract: This invention provides an apparatus for electrolytic treatment capable of removing the ununiformity according to the frequency and can achieve high treating speed and high current density treatment, which comprises etching a metal web electrolytically using alternating waveform current continuously, wherein a frequency-variable means having an ability to vary frequency of an electric power supply of said alternating waveform current arbitrarily is provided, and a method therefor.

Abstract: A method and apparatus for deburring or radiusing articles made of TZM alloys by electrochemical machining uses a pulsating current and a binary salt electrolyte solution simultaneously applied across a gap between a tool electrode and a TZM workpiece. The pulse duration is typically in the range between about 0.5 milliseconds to about 100 milliseconds and the pulse interval is between 5 milliseconds and 150 milliseconds. The pulse voltage amplitude is typically in the range between about 8 volts to about 30 volts. The binary salt electrolyte solution is an aqueous salt solution with a total concentration typically in the range between about 14% to about 20% by weight of sodium chloride and sodium nitrate. The ratio of sodium chloride to sodium nitrate is typically in the range of between about 1:1 to about 1.5:1. The standoff distance, or gap, between the tool electrode and the TZM workpiece is typically in the range between 0.015 mm to about 3.0 mm.

Abstract: An electrode structure is constituted by a first electrode, and at least one second electrode providing a pair of opposite portions with a prescribed spacing therebetween at which the first electrode is disposed. The electrode structure is suitably used for electrolytic etching and is effective in providing an accurate etching pattern without damaging the surface of an etching object.

Abstract: A method for etching an object having a portion to be etched on the surface thereof, comprising a step of immersing said object in an electrolyte solution such that said object serves as a negative electrode; a step of arranging a counter electrode having a pattern corresponding to a desired etching pattern to be formed at said portion to be etched of said object in said electrolyte solution so as to maintain a predetermined interval between said counter electrode and said object, and a step of applying a direct current or a pulse current between said object and said counter electrode to etch said portion to be etched of said object into a pattern corresponding to said pattern of said counter electrode.

Abstract: The invention provides a method and system for automated sorting or articles such as railroad wheels. After the wheels are inspected and designated as fitting a particular category, the wheels are moved to a transfer car and the wheel and transfer car are moved to a wheel pick up station, where an overhead hoist awaits. As the wheel and transfer car are moved, a hook portion of the hoist is received in the wheel axles hole. The hoist raises the wheel out of the transfer car and then the hoist and wheel move laterally to a wheel drop off station corresponding with the category of the wheel. A shuttle car with an empty wheel receiving slots is below each wheel drop off station. The hoist lowers the wheel into the aligned wheel slot of the appropriate shuttle car for that category of wheel. After the wheel is deposited in the slot, the shuttle car indexes away from the hoist, freeing the wheel and hoist from one another. The hoist is then raised and returned to the wheel pick up station.

Abstract: A plate-, foil- or web-shaped workpiece of aluminum or an alloy thereof is subjected, in an electrolyte bath, to an alternating current at a frequency of 0.1 to 25 Hz. During the AC treatment, an anodic potential is imposed on the workpiece, in the range of 0 to 5 Volts. The total charge input is 10 to 60 kC/m.sup.2. Prior to the electrochemical graining, the workpiece is mechanically grained. After the graining steps, an etching treatment as well as an anodical oxidation and, thereafter, a hydrophilization are performed.

Abstract: A process for roughening a surface of a support for a lithographic printing plate in which an electric current is supplied between a metal web and an electrode facing the metal web in an electrolyte containing metal ions so that the metal web is subjected to electrochemical processing continuously, 1-20 pause sections are provided in the electrochemical processing and the time taken for passage through once processing pause section in the electrochemical processing is set to 1-30 seconds. With the process, the grain shape can be controlled with no troublesome condition setting to improve a scumming resistance without deteriorating a printing durability and a fill-in reduction so that the plate has superior performance.

Abstract: A tip and substrate preparation system for use with scanning probe microscopes (SPMs) includes a scanning tunneling microscope (STM) tip maker, STM tip coater, a substrate treatment method for producing clean, flat gold substrates for STM use and methods for preparing chemically activated substrates for use with an atomic force microscope (AFM). The tip maker includes a coater and an etcher which are preferably controlled by electronic controllers. The etcher provides fully automatic tip etching in a two-stage process in sodium hydroxide (NaOH) solution, permitting platinum alloys to be etched without the use of cyanide-containing chemicals. The coater is used to insulate the tips with soft polymer coatings so as to ensure very low tip leakage current (on the order of about 1 pA typical). The substrate treatment device comprises a quartz plate and a quartz torch for annealing substrates in a hydrogen flame.

Abstract: A method of producing a support for a planographic printing plate which comprises roughening a surface of an aluminum plate electrochemically, etching the surface by 0.01 to 20 g/m.sup.2 with alkali, and roughening the surface electrochemically in an electrolytic solution containing hydrochloric acid and/or a water-soluble hydrochloride salt which forms hydrochloride ion or nitric acid and/or a water-soluble nitrate salt which forms nitrate ion as the principle component.