Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.

Abstract: A method for electropolishing a manufactured metallic article, the method comprising: contacting the metallic article with an electropolishing electrolyte; and electropolishing the metallic article in the electropolishing electrolyte through the application of an applied current regime comprising: at least one electropolishing regime, each electropolishing regime comprising a current density of at least 2 A/cm2 and a voltage comprising a shaped waveform having a frequency from 2 Hz to 300 kHz, a minimum voltage of at least 0 V and a maximum voltage of between 0.5 to 500 V.

Abstract: A method for smoothing and polishing metals via ion transport by free solid bodies. The method includes connecting a part to be treated to a pole of a current generator and subjecting the part to friction with a set of particles that includes electrically charged and electrically conductive free solid bodies in a gaseous environment.

Abstract: To provide a dental stereolithography-type three-dimensional printing material in which the total preparing time required from modeling with using a 3D printer to a final curing is short, work efficiency is excellent, temporal shrinkage deformation of a dental three-dimensional modeled object is suppressed and a dimensional accuracy is excellent. The dental stereolithography-type three-dimensional printing material of the present invention comprises at least one or more (a) monofunctional acrylate monomer having an aromatic ring and (b) photopolymerization initiator, wherein an electronegativity difference between adjacent atoms which are bonded by covalent bond in all atoms constituting the (a) monofunctional acrylate monomer having an aromatic ring is less than 1.0.

Abstract: The present disclosure relates to methods for manufacturing porous mesh plates for use in ultrasonic mesh nebulizers, and the porous mesh plates manufactured by those methods. Cone-shaped dimples are first drilled in a substrate (e.g. a plate), but do not penetrate the bottom of the substrate. Next, the substrate (e.g. a plate) is subject to an electrochemical process to remove a layer of material from the surface of the substrate. Enough material is removed to allow the dimples to penetrate the substrate, thereby creating holes in the substrate. The size of the holes can be controlled by the conditions of the electrochemical process.

Abstract: A flowing junction reference electrode comprising a liquid junction member matched with a filter. The junction member and the filter are situated between a reference electrolyte solution and a sample solution. An array of nanochannels spans the junction member and provides fluid communication between the electrolyte solution and the sample solution. The filter is configured to allow a greater flux of electrolyte than that associated with the junction member. Preferably, the number of pores is greater than the number of nanochannels. The filter is preferably configured to have pores with an inner diameter that is the same or less than the inner diameter of the nanochannels. In some embodiment, the resistance of the filter is made lower relative to the resistance of the junction member by selecting suitable length, number, and inner diameter size for the pores of the filter relative to the nanochannels of the junction member.

Abstract: A cylinder block plate processing apparatus in which one end side of an inner peripheral surface of a cylinder of a cylinder block is sealed to circulate a process liquid to perform pre-plating or plating processing of the cylinder inner peripheral surface. The apparatus includes: an apparatus body having a workpiece mount table on which the cylinder block is placed; a workpiece holding tool that is provided on the workpiece mount table so as to be vertically movable; an electrode support member including an electrode cylinder mounted to the apparatus body; a processing solution supply member that supplies a processing solution to the electrode support member; an electrode operated by the electrode cylinder; a sealing jig provided to one end of the electrode; a driving mechanism that drives the sealing jig; and a control circuit that controls operations of the processing solution supply member and the driving mechanism.

Abstract: According to various embodiment, a system includes an electrolytic cutting tool. The electrolytic cutting tool includes a first cathode configured to be positioned at a first gap away from a first side of a workpiece, a second cathode configured to be positioned at a second gap away from a second side of the workpiece. The first and second cathodes are positioned opposite from one another. The electrolytic cutting tool also includes a first electrolyte passage configured to flow a first electrolyte through the first gap between the first cathode and the workpiece, a second electrolyte passage configured to flow a second electrolyte through the second gap between the second cathode and the workpiece, and a power supply configured to flow current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first side and the second side.

Abstract: Electrochemical machining method and apparatus wherein in one aspect of the invention, the machining voltage is selected to maintain the highest current without initiating substantial hydrolysis of the electrolyte flushed between the work piece anode and tool cathode. In another aspect of the invention, the Low Machining Potential Voltage (LPMV) and High Machining Potential Voltage (HMPV) for a particular work piece material are identified and the work piece is machined using a voltage at or between the LMPV and HMPV. In yet another aspect of the invention, direct perturbation of the Beta Insulating Layer (BIL) is carried out in an optimally small (between about near zero to about 100 inter-electrode gap (IEG) with constant and simultaneous pulling in and pushing out of the electrolyte through the IEG.

Abstract: The invention concerns a surface treatment electrode (11) to treat at least one object (1). It comprises at least one cavity (23) enclosing the object (1) to be treated during the treatment, having a geometry ensuring free movement of the object (1), this cavity (23) being delimited by a wall (24) comprising at least one opening (25) communicating the inside of the cavity (23) with a treatment solution (5) in which the electrode (11) is immersed during the surface treatment. The cavity (23) is substantially cylindrical and its diameter is approximately 50 to 100 micrometers larger than a maximum size of the object (1).

Abstract: According to various embodiment, a system includes an electrolytic cutting tool. The electrolytic cutting tool includes a first cathode configured to be positioned at a first gap away from a first side of a workpiece, a second cathode configured to be positioned at a second gap away from a second side of the workpiece. The first and second cathodes are positioned opposite from one another. The electrolytic cutting tool also includes a first electrolyte passage configured to flow a first electrolyte through the first gap between the first cathode and the workpiece, a second electrolyte passage configured to flow a second electrolyte through the second gap between the second cathode and the workpiece, and a power supply configured to flow current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first side and the second side.

Abstract: A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.

Abstract: An apparatus and method are provided for electrochemically etching grooves in a working surface. In an aspect, a frame holds a working surface about an axis and facing an electrode movable along the axis. The electrode, axially movable, has surface carrying a groove pattern to fix on the working surface. A source of electrolyte is pumped at a fixed static pressure rate between the surface of the movable electrode and the working surface. In an aspect, a support fixture supports the electrode for movement toward and away from the working surface with minimal frictional restriction. A force biases the electrode surface toward the working surface so that a gap through which the electrolyte flows between the surface of the movable electrode and the working surface is determined primarily by the static flow rate of the electrolyte and the force bias of the electrode toward the working surface.

Abstract: A system for removing a thin metal film is disclosed. The system comprises an inclined metal plate electrode for guiding a downward electrolyte flow, an auxiliary electrode placed on either the upstream or downstream side of the metal plate electrode such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film on the surface of an insulator by making the electrolyte flowing down the metal plate electrode strike against the metal thin film while the DC voltage is applied to the metal plate electrode and auxiliary electrode.

Abstract: A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.

Abstract: A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.

Abstract: A device and method for increasing the mass transport rate of a chemical or electrochemical process at the solid and fluid interface in a fluid cell. The device includes a membrane in close contact with surface of the work piece, to separate the process cell into two chambers, so that fluid velocity at the work piece is controlled separately from the main cell flow. Thus the diffusion boundary layer is controlled and minimized by the rate that fluid is withdrawn from the work piece chamber.

Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.

Abstract: An electrochemical machining apparatus comprises a machining chamber for holding ultrapure water, a cathode/anode immersed in the ultrapure water held in the machining chamber, and a workpiece holding portion for holding a workpiece at a predetermined distance from the cathode/anode so that a surface, to be machined, of the workpiece is brought into contact with the ultrapure water. The electrochemical machining apparatus further comprises an anode/cathode contact brought into contact with the workpiece held by the workpiece holding portion so that the workpiece serves as an anode/cathode, a catalyst having a strongly basic anion exchange function or a strongly acidic cation exchange function, a power source for applying a voltage between the cathode/anode and the workpiece, and a moving mechanism for relatively moving the workpiece and the catalyst. The catalyst is disposed between the cathode/anode and the workpiece held by the workpiece holding portion.

Abstract: The device etches semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. A sample head is mounted inside the etching trough, and is provided with a device for holding at least one semiconductor wafer. The device is tilted to promote turbulent electrolyte flow in a space between a bottom surface of the semiconductor wafer and top surface of the trough-shaped receptacle.

Abstract: Disclosed is a reel-to-reel substrate tape polishing and cleaning system including precleaning, electropolishing section and post cleaning sections and which is suitable for polishing and cleaning long lengths of metal substrate tape used in the manufacture of HTS-coated tape.

Abstract: A method and apparatus for forming a fluid dynamic pressure groove in a fluid dynamic pressure bearing is provided. The method is accomplished by initially positioning and securing multiple workpieces to be machined to their respective machining devices. An electrochemical dissolving effect is imparted to each target surface of the multiple workpieces and then at least one fluid dynamic pressure groove is formed on each target surface of the multiple workpieces. Each groove may have a specified shape, dimension and surface condition. An electrolyte is directed from a common electrolyte tank to each of the machining devices used on the multiple workpieces.

Abstract: An apparatus, method and means is provided for electrochemical machining of hydrodynamic bearing assemblies in spindle motors. In an aspect, a cartridge is provided that receives and accurately positions an electrode in three dimensions in a near frictionless manner. The electrode reaches and maintains an equilibrium position in response to a first and second predetermined force, the equilibrium position being a predetermined three dimensional orientation relative to the work piece and defining a critical orifice with the work piece. In an aspect, a hydrostatic bearing is employed within the electrode for radially adjusting the electrode.

Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

Abstract: A method and apparatus which uses a plating electrode in an electrolyte bath. The plating electrode works to purify an electrolyte polishing solution during the electro-polishing process. Preferably, the plating electrode is employed in a closed loop feedback system. The plating electrode may be powered by a power supply which is controlled by a controller. A sensor may be connected to the controller and the sensor may be configured to sense a characteristic (for example, but not limited to: resistance, conductance or optical transmission, absorption of light, etc.) of the electrolyte bath, which tends to indicate the level of saturation. Preferably, the plating electrode is easily replaceable.

Abstract: An internal magnetic-force polishing system is disclosed for finishing a interior metal surface of a material. The system comprises a magnetic electrolysis-polishing which is adapted for finishing the interior metal surface of the material. A cathode terminal is provided for contacting pre-finished material and a transfer unit is also provided for transferring material from the cathode terminal to the magnetic electrolysis-polishing unit. The system has an electrolyte feeding unit which stores electrolytes and supplies the electrolyte to the magnetic electrolysis-polishing unit. A control unit is provided for controlling the transfer unit, the magnetic electrolysis-polishing unit and the electrolyte feeding unit.

Abstract: A method and system for preventing gas bubble formation on a selected region of a wafer surface as the surface is brought in contact with a process solution for an electrochemical process is provided. The present invention employs the process solution to prevent or remove gas bubbles from the wafer surface during or before the electrochemical processing of the wafer surface. Accordingly, during the process, the wafer surface is initially brought in proximity of the surface of the process solution. Next, a process solution flow is directed towards the selected region of the wafer surface for a predetermined time. In the following step, the selected region of the wafer surface is contacted with the process solution flow for the predetermined time to prevent bubble formation, and the wafer surface is immersed into the process solution for electrochemical processing.

Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

Abstract: An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract: A method for the production of pipe segments from a pipe (10) in which the pipe (10) is rotated about its longitudinal axis, while an electrode (20) is positioned in the vicinity of the outer surface (11) of the pipe (10) and electrolyte (30) is fed to the space between the pipe (10) and the electrode (20). The electrode (20) and the pipe (10) are connected to a voltage source (40), with the result that an electric current is brought about via the electrolyte (30). Thus, the pipe (10) is divided into pipe segments in an electrochemical way.

Abstract: A drive head for a bolt, fastener, coupling, nut or other driveable head made from a less malleable metal such as a powder metal nickel alloy. The drive head has an upper drive portion having at least six convex corners spaced around the outer periphery thereof, each corner terminating in an edge. The drive head also has a lower flange portion adjacent to the drive portion and having an edge extending radially outwardly to at least the edge of each corner. The drive portion and the flange portion of the drive head is formed by subjecting a blank having a generally circular head to electrochemical machining (ECM). A tool is also provided for the ECM method to form the drive portion and flange portion of the drive head.

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract: An electrochemical machining technique involves moving a cathode (2) towards an anodic workpiece (1). A current is passed through an electrolyte which flows between the cathode (2) and workpiece (1) so as to cause material to be removed electrolytically from the workpiece (1). A vibratory movement is imposed on the cathode (2) and the current passed between the cathode (2) and workpiece (1) is also varied. The vibratory movement may consist of a main sinusoidal oscillation and a secondary ultrasonic vibration, and the current variation is synchronized with the main vibration so that current pulses, and ultrasonic vibration pulses, coincide, with a predetermined small phase shift, with peaks of the main vibration corresponding to the smallest gap between the cathode (2) and workpiece (1).

Abstract: The present invention provides an edge cleaning system and method in which a directed stream of a mild etching solution is supplied to an edge area of a rotating workpiece, including the front surface edge and bevel, while a potential difference between the workpiece and the directed stream is maintained. In one aspect, the present invention provides an edge cleaning system that is disposed in the same processing chamber that is used for deposition or removal processing of the workpiece. In another aspect, the mild etching solution used for edge removal is also used to clean the front surface of the wafer, either simultaneously with or sequentially with the edge removal process.

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

Abstract: An electrochemical machining apparatus comprises a machining chamber for holding ultrapure water, a cathode/anode immersed in the ultrapure water held in the machining chamber, and a workpiece holding portion for holding a workpiece at a predetermined distance from the cathode/anode so that a surface, to be machined, of the workpiece is brought into contact with the ultrapure water. The electrochemical machining apparatus further comprises an anode/cathode contact brought into contact with the workpiece held by the workpiece holding portion so that the workpiece serves as an anode/cathode, a catalyst having a strongly basic anion exchange function or a strongly acidic cation exchange function, a power source for applying a voltage between the cathode/anode and the workpiece, and a moving mechanism for relatively moving the workpiece and the catalyst. The catalyst is disposed between the cathode/anode and the workpiece held by the workpiece holding portion.

Abstract: This invention relates to an improved apparatus and method for electrolytic descaling of steel strips. The apparatus comprises electrodes integrated with nozzles having jet openings for dispensing electrolyte onto the surface of the steel strips. By jetting the electrolyte to the steel strip in the air and applying a voltage to the electrode, the scale on the surface of the steel strip is removed. This jetting of electrolyte reduces the size requirement of the electrolyte tank storing the electrolyte because the required quantity of electrolyte decreases. The present invention does not require immersion of the electrodes in the electrolyte and thus avoids the problem of short-circuiting that occurs with submerged electrodes. This results in a significant improvement in electric power efficiency.

Abstract: Generally, a method and apparatus for electro-chemical polishing a metal layer disposed on a substrate is provided. In one embodiment, the electro-chemical polishing apparatus generally includes a substrate support having a plurality of contact members, a cathode and at least one nozzle. The nozzle is adapted to centrally dispose a polishing fluid on the substrate supported by the substrate support. The cathode is adapted to couple the polishing fluid to a negative terminal of a power source. A positive terminal of the power source is electrically coupled through the contact members to the conductive layer of the substrate. The nozzle creates a turbulent flow in the portion of the polishing fluid boundary layer proximate the center of the substrate which enhances the polishing rate at the center of the substrate.

Abstract: This invention relates to the electroforming device for manufacturing fine metal tubular material in an effort to obtain a uniform thickness of metal deposit on the wire core, to promote high accuracy in the outer diameter and even roundness, and to produce high precision coaxial cylindrical very fine metal tubular material.

Abstract: The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.

Abstract: Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and size of the stent to be implanted, electrochemically forming the stent with desired pattern of meshes and implanting the stent into patient. The method comprises using a cathode with desired pattern of meshes and a tubular blank, from which the stent is formed. Between the cathode and the blank is delivered an electrolyte and the cathode and the blank are simultaneously rotated during electrochemical forming process.

Abstract: Method for deburring and/or rounding a side face of a thin-sheet and annular metal element (1), such as a ring element (1) for use in a push belt for continuously variable transmission, wherein the ring element (1), in a machining step, is received in a device for electrochemical machining (“ECM”) of the ring element (1), an electrode (5) being positioned in the device opposite an axially oriented side face (3) of the ring element (1), which electrode (5), as seen in a thickness or radial direction of the ring element (1), has a dimension which is at least twice as great as a dimension of the ring element (1) in the said thickness direction.

Abstract: The present invention is an electropolishing process and device for electropolishing an inner surface of a long tube, especially applied to a long tube of greater than two meters and a diameter range between 0.3 and 5 cm. Wherein, the present invention comprises at least one tube, and one complex electrode. An inner surface of the tube is for electropolishing process, and it is an anode as well. The electrode is a cathode and placed on a center of a partition. An end of electrode connects to a cable, the cable is driven by an axial mechanism to be moved the electrode toward the axial mechanism itself. Inside of the tube is full o electrolyte, which is an electrifying medium to connect both anode and cathode. Further, electrolyte cooperates with the electrode to perform the electropolishing process on the inner surface of tube.

Abstract: A method for clean processing wherein an object and a high pressure nozzle are disposed a specific distance apart from each other inside a washing tank containing only ultra-pure water, an ion exchange material or catalyst material that increases the amount of hydroxide ions is provided between the processing surface of said workpiece and the distal end of the high pressure nozzle facing said surface, a voltage is applied using the high pressure nozzle as the cathode and the object as the anode and the hydroxide ions produced from the ultra-pure water are supplied to the surface of the object.

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electrochemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract: A method for the production of pipe segments from a pipe (10) is described. The pipe (10) is rotated about its longitudinal axis, while an electrode (20) is positioned in the vicinity of the outer surface (11) of the pipe (10) and electrolyte (30) is fed to the space between the pipe (10) and the electrode (20). The electrode (20) and the pipe (10) are connected to a voltage source (40), with the result that an electric current is brought about via the electrolyte (30). Thus, the pipe (10) is divided into pipe segments in an electrochemical way.

Abstract: A method for producing a separator integrated with a gas flow channel of fuel cells efficiently at low costs without deteriorating processing accuracy and the like. A plane-facing electrode nozzle 30 is placed oppositely to the face to be processed, which is partially covered with a mask M, of base material B of a separator. While feeding electricity to the electrode nozzle 30 and the base material B of a separator, an electrolytic solution is injected and fed from the side of the electrode nozzle 30 to the face to be processed of the base material B from a direction that is almost perpendicular to the face. Thereby, the unmasked portion undergoes electrolytic etching with the electrolytic solution lying between the face to be processed and the electrode nozzle 30 to form recessed portions for making a gas flow channel.

Abstract: The present invention provides an edge cleaning system and method in which a directed stream of a mild etching solution is supplied to an edge area of a rotating workpiece, including the front surface edge and bevel, while a potential difference between the workpiece and the directed stream is maintained. In one aspect, the present invention provides an edge cleaning system that is disposed in the same processing chamber that is used for deposition or removal processing of the workpiece. In another aspect, the mild etching solution used for edge removal is also used to clean the front surface of the wafer, either simultaneously with or sequentially with the edge removal process.