Defined Electrolyte Movement Or Pressure Patents (Class 205/672)
  • Publication number: 20030106807
    Abstract: The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface influencing device extended between a supply spool and a receiving spool. During the process, the surface of the workpiece is placed in proximity of the workpiece surface influencing device and the process solution is flowed through the process section and onto the surface while a potential difference is applied between the electrode and the surface of the workpiece.
    Type: Application
    Filed: November 4, 2002
    Publication date: June 12, 2003
    Inventors: Bulent M. Basol, Halit N. Yakupoglu, Cyprian E. Uzoh, Homayoun Talieh
  • Publication number: 20030098245
    Abstract: The present invention is an electropolishing process means for an inner surface of a long tube, especially applied to a long tube of greater than two meters and a diameter range between 0.3 to 5 cm. Wherein, the present invention comprises at least one tube, one complex electrode; an inner surface of the tube is for electropolishing process, and it is an anode as well; the electrode is a cathode and placed on a center of a partition; an end of electrode connects to a cable, the cable is driven by an axial mechanism to be moved toward the axial mechanism itself; inside tube are full of electrolyte, which is an electrifying medium to connect both anode and cathode, further, electrolyte cooperates with electrode to move for electropolishing process the inner surface of tube.
    Type: Application
    Filed: February 19, 2002
    Publication date: May 29, 2003
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Hung Lin, Chen-Der Tsai, Yun-Sheng Chung, Chin-Ching Wu, Yuh-Feng Chen, Hann-Tsong Wang
  • Patent number: 6547945
    Abstract: An electrochemical cell for use in electrochemical processes, such as plating processes, has a first electrode which extends circumferentially about at least a portion of an electrode chamber. The article being treated is the second electrode and is disposed within the chamber. Electrolyte is flowed between the two electrodes. Various construction details of the electrochemical cell are developed which facilitate a plating process. In one embodiment, a supply conduit to the electrode chamber has a swirler.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: April 15, 2003
    Assignee: United Technologies Corporation
    Inventors: Christopher T. Shallow, Robert B. Parrish
  • Patent number: 6547950
    Abstract: A cathode station (10) for a pipe electrochemical polishing system (12) has a valve (20) for preventing a cleaning fluid (56) from entering into a pipe (28). A cathode (14) is pulled into the cathode station (10) by a cathode puller cable (16) after a polishing operation (62) is completed. In a rinse cathode operation (66) the cleaning fluid (56) is introduced into the cathode station (10) through a fluid inlet (52) and removed from a fluid outlet (54). In a finish operation (68) the cathode (14) and cathode station (10) are removed from the pipe electrochemical polishing system (12).
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: April 15, 2003
    Assignee: Therma Corporation, Inc.
    Inventor: Thomas A. Lorincz
  • Patent number: 6544403
    Abstract: A method for manufacturing a fluid bearing is provided. A mask member having at least two sets of grooves provided at least two places along an axial direction is affixed to an outer surface of an electrode section of a fluid bearing manufacturing tool. Each of the groove sets consists of multiple grooves in a shape corresponding to designed fluid bearing grooves on a work piece, such as, for example, a sleeve section of the fluid bearing. The fluid bearing manufacturing tool is inserted into a hole created in the work piece, wherein a power source for electrolytic machining is connected between the fluid bearing manufacturing tool and the work piece. An electrolytic solution between the manufacturing tool and the work piece is allowed to flow to form fluid bearing grooves on an inner surface of the work piece through electrolytic machining.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: April 8, 2003
    Assignee: Sankyo Seiki Mfg., Co., Ltd.
    Inventor: Motonori Usui
  • Patent number: 6544402
    Abstract: A method and an apparatus for manufacturing a wire, particularly a sawtooth wire for all-steel sawtooth wire card clothings, wherein the surface of a wire-shaped intermediate product, such as a wire already provided with sawteeth, is smoothened in an electropolishing process in an electrolyte bath containing an electrolyte. A relative movement is produced between the electrolyte and the intermediate product during the electropolishing process. The apparatus includes a device for producing a relative movement between the electrolyte and the intermediate product contained in the electrolyte bath.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: April 8, 2003
    Assignee: Graf + Cie AG
    Inventor: Ralph A. Graf
  • Publication number: 20030024826
    Abstract: Generally, a method and apparatus for electrochemical polishing a metal layer disposed on a substrate is provided. In one embodiment, the electrochemical polishing apparatus generally includes a substrate support having a plurality of contact members, a cathode and at least one nozzle. The nozzle is adapted to centrally dispose a polishing fluid on the substrate supported by the substrate support. The cathode is adapted to couple the polishing fluid to a negative terminal of a power source. A positive terminal of the power source is electrically coupled through the contact members to the conductive layer of the substrate. The nozzle creates a turbulent flow in the portion of the polishing fluid boundary layer proximate the center of the substrate which enhances the polishing rate at the center of the substrate.
    Type: Application
    Filed: August 1, 2001
    Publication date: February 6, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Joseph Yahalom, Srinivas Gandikota, Christopher R. McGuirk, Deenesh Padhi
  • Patent number: 6447668
    Abstract: An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer includes an end-point detector. The end-point detector is disposed adjacent the nozzle used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: September 10, 2002
    Assignee: ACM Research, Inc.
    Inventor: Hui Wang
  • Patent number: 6428681
    Abstract: A pipe electrochemical polishing system (10, 10a) for in place polishing of a pipe (28(has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a non horizontal portion (72) of the pipe (28) and further is presently traveling generally downward, then the direction of flow of the electrolyte (24) is reversed to carry any bubbles in the electrolyte (24) away from the area of the cathode (14).
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: August 6, 2002
    Assignee: Therma Corporation, Inc.
    Inventor: Thomas A. Lorincz
  • Patent number: 6413403
    Abstract: An apparatus capable of assisting in controlling an electrolyte flow and distribution of an electric field, a magnetic field, or an electromagnetic field in order to process a substrate is provided with improved fluid distribution. A support member having a top surface and a bottom surface contains at least one support member electrolyte channel. Each support member electrolyte channel forms a passage between the top surface and the bottom surface and allows the electrolyte to flow therethrough. A pad is attachable to the support member and contains at least one set of pad electrolyte channels also allowing for electrolyte flow therethrough to the substrate. Each support member electrolyte channel is connected to one set of pad electrolyte channels by fluid distribution structure. A method of assisting in control of the electrolyte flow and distribution of the electric field, the magnetic field, or the electromagnetic field, utilizing the apparatus, is also provided.
    Type: Grant
    Filed: July 21, 2000
    Date of Patent: July 2, 2002
    Assignee: NuTool Inc.
    Inventors: Paul Lindquist, Bulent Basol, Cyprian Uzoh, Homayoun Talieh
  • Publication number: 20020074238
    Abstract: The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.
    Type: Application
    Filed: September 28, 2001
    Publication date: June 20, 2002
    Inventors: Steven T. Mayer, Robert J. Contolini, Eliot K. Broadbent, John S. Drewery
  • Publication number: 20020066675
    Abstract: A pipe electrochemical polishing system (10, 10a) for in place polishing of a pipe (28) has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a non horizontal portion (72) of the pipe (28) and further is presently traveling generally downward, then the direction of flow of the electrolyte (24) is reversed to carry any bubbles in the electrolyte (24) away from the area of the cathode (14).
    Type: Application
    Filed: December 6, 2000
    Publication date: June 6, 2002
    Inventor: Thomas A. Lorincz
  • Patent number: 6387242
    Abstract: A machining process for forming a raised area in a wall of a predrilled hole includes distributing electrolyte via a workpiece internal cavity to a number of predrilled holes. Next, position a template including at least one electrode coated with an insulating material in a pattern defining the raised area to be formed in the wall of the predrilled hole below the workpiece such that the electrode is positioned within a predrilled hole and machining by passing electric current between the electrode and the workpiece wall and circulating electrolyte through the hole.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: May 14, 2002
    Assignee: General Electric Company
    Inventors: Bin Wei, Hsin-Pang Wang
  • Patent number: 6379528
    Abstract: The back side recessed cooling surface of a shroud defining in part the hot gas path of a turbine is electrochemically machined to provide surface roughness elements and spaces therebetween to increase the heat transfer coefficient. To accomplish this, an electrode with insulating dielectric portions and non-insulating portions is disposed in opposition to the cooling surface. By passing an electrolyte between the cooling surface and electrode and applying an electrical current between the electrode and a shroud, roughness elements and spaces therebetween are formed in the cooling surface in opposition to the insulating and non-insulating portions of the electrode, hence increasing the surface area and heat transfer coefficient of the shroud.
    Type: Grant
    Filed: December 12, 2000
    Date of Patent: April 30, 2002
    Assignee: General Electric Company
    Inventors: Ching-Pang Lee, Robert Alan Johnson, Bin Wei, Hsin-Pang Wang
  • Publication number: 20020046951
    Abstract: An electrochemical cell for use in electrochemical processes, such as plating processes, has a first electrode which extends circumferentially about at least a portion of an electrode chamber. The article being treated is the second electrode and is disposed within the chamber. Electrolyte is flowed between the two electrodes. Various construction details of the electrochemical cell are developed which facilitate a plating process. In one embodiment, a supply conduit to the electrode chamber has a swirler.
    Type: Application
    Filed: January 5, 2001
    Publication date: April 25, 2002
    Inventors: Christopher T. Shallow, Robert B. Parrish
  • Patent number: 6368493
    Abstract: An anode as a workpiece, and a cathode opposed to the anode with a predetermined spacing are placed in ultrapure water. A catalytic material promoting dissociation of the ultrapure water and having water permeability is disposed between the workpiece and the cathode. A flow of the ultrapure water is formed inside the catalytic material, with a voltage being applied between the workpiece and the cathode, to decompose water molecules in the ultrapure water into hydrogen ions and hydroxide ions, and supply the resulting hydroxide ions to a surface of the workpiece, thereby performing removal processing of or oxide film formation on the workpiece through a chemical dissolution reaction or an oxidation reaction mediated by the hydroxide ions. Thus, clean processing can be performed by use of hydroxide ions in ultrapure water, with no impurities left behind on the processed surface of the workpiece.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: April 9, 2002
    Assignees: Ebara Corporation
    Inventors: Yuzo Mori, Mitsuhiko Shirakashi, Takayuki Saito, Yasushi Toma, Akira Fukunaga, Itsuki Kobata
  • Patent number: 6325913
    Abstract: This invention relates to an improved apparatus and method for electrolytic descaling of steel strips. The apparatus comprises electrodes integrated with nozzles having jet openings for dispensing electrolyte onto the surface of the steel strips. By jetting the electrolyte to the steel strip in the air and applying a voltage to the electrode, the scale on the surface of the steel strip is removed. This jetting of electrolyte reduces the size requirement of the electrolyte tank storing the electrolyte because the required quantity of electrolyte decreases. The present invention does not require immersion of the electrodes in the electrolyte and thus avoids the problem of short-circuiting that occurs with submerged electrodes. This results in a significant improvement in electric power efficiency.
    Type: Grant
    Filed: August 23, 1999
    Date of Patent: December 4, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Katsumi Mabuchi, Tomoko Kikuchi, Yasunobu Kani, Tsuneo Nakamura, Shinichi Yokosuka
  • Patent number: 6290461
    Abstract: An electrochemical machine is disclosed for use in an electrochemical machining process to simultaneously generate different levels of metal removal. The electrochemical machine comprises at least two electrodes, each including an electrically conductive cylinder having an external surface partially coated with an insulated coating. The insulating coating is in a pattern defining raised areas to be formed on an internal surface of a predrilled hole in a workpiece wherein at least one of the electrodes has a varied pattern of insulating coating.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: September 18, 2001
    Assignee: General Electric Company
    Inventors: Bin Wei, Hsin-Pang Wang
  • Patent number: 6287449
    Abstract: An electrolytic liquid slurry containing pure water, abrading particles and nitric acid, boric acid, alkanol amine, sodium sulfite, sodium chloride, ammonium chloride, sodium phosphate, potassium phosphate, sodium silicate, aluminum phosphate, ammonium phosphate, diethanolamide borate, amine borate, sodium metaborate, propylene glycol or their liquid mixture is supplied to the surface of a magnetic hard disk substrate or the surface of a tape. The tape is pressed against the surface of the disk substrate and a voltage difference is applied between an electrode disposed in contact with the electrolytic liquid slurry and the disk substrate which serves as another electrode. Since texturing and electrolytic processes are thus carried out simultaneously, the stock removal can be increased and the throughput can be improved.
    Type: Grant
    Filed: November 16, 1999
    Date of Patent: September 11, 2001
    Assignee: Nihon Micro Coating Co., Ltd.
    Inventors: Yuji Horie, Jun Watanabe
  • Patent number: 6267868
    Abstract: An electrode for use in an electrochemical machining process comprising an outer metal skin of corrosion resistant material, an inner core of conductive material, and an insulating coating disposed on an external surface of the outer metal skin. The external surface is partially coated with the insulating coating so as to define a pattern of raised areas to be formed on an internal surface of a predrilled hole in a workpiece.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: July 31, 2001
    Assignee: General Electric Company
    Inventors: Bin Wei, Bruce Alan Knudsen, William Thomas Carter, Jr., Hsin-Pang Wang
  • Patent number: 6264822
    Abstract: An electrode used as a tool in an electrochemical machining process to generate raised areas or ridges in the walls of a predrilled hole in an electrically conductive workpiece has an electrically conductive cylinder partially coated with an electrically insulating material in a pattern defining the raised areas to be formed. The pattern may comprise a plurality of spaced apart rings. An electrochemical machining method of drilling bulbs in the walls of a predrilled hole uses the electrode of the invention to greatly increase process efficiency.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: July 24, 2001
    Assignee: General Electric Company
    Inventors: Bin Wei, Hsin-Pang Wang, John Peter Fura
  • Patent number: 6258248
    Abstract: A process for removing zinc from galvanized steel. The galvanized steel is immersed in an electrolyte containing at least about 15% by weight of sodium or potassium hydroxide and having a temperature of at least about 75° C. and the zinc is galvanically corroded from the surface of the galvanized steel. The material serving as the cathode is principally a material having a standard electrode potential which is intermediate of the standard electrode potentials of zinc and cadmium in the electrochemical series. The steel scrap is carried through the electrolyte by a conveyor which is electrically isolated from ground and which comprises a cathodic material which has a standard electrode potential which is intermediate of the standard electrode potentials of zinc and cadmium in the electrochemical series.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: July 10, 2001
    Assignee: Metals Investment Trust Limited
    Inventor: William A. Morgan
  • Patent number: 6234752
    Abstract: An electrochemical machining process is disclosed for forming multiple raised areas having multiple heights in a wall of predrilled holes within a workpiece. Positioned within each hole is an electrode coated with an insulating material in a pattern defining the raised areas to be formed in the wall of each respective hole. An electric current is applied from a power supply to each of the electrodes. A resistor is positioned between the power supply and at least one of the electrodes to vary the voltage passing through the electrode to vary the amount of material removed within that respective hole.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: May 22, 2001
    Assignee: General Electric Company
    Inventors: Bin Wei, Hsin-Ping Wang
  • Patent number: 6221235
    Abstract: A sacrificial cores in castings of metallic or non-metallic materials is made from a metal that can be electrolytically dissolved, and is removed from the casting by electrochemical machining. The sacrificial core may be a hollow shell incorporating an integral electrode within the shell and electrically insulated from the shell.
    Type: Grant
    Filed: November 30, 1998
    Date of Patent: April 24, 2001
    Assignee: Faraday Technology Marketing Group LLC
    Inventor: Lawrence E. Gebhart
  • Patent number: 6203689
    Abstract: An electropolishing apparatus for polishing an inner face of a deep hole of an article comprises a support for holding an article so that the article is maintained to erect in an electrolytic bath, and an electrode to be inserted into a deep hole of the article. The electrode is a hollow member having a through hole formed longitudinally. Electrolyte is supplied into the through hole of the electrode from upside. The electrolyte flows through the through hole of the electrode, a gap between the lower end of the electrode and the bottom of the hole, and another gap to be between an outer face of the electrode and an inner face of the hole. A plurality of removers consisting of nonwoven fabric may be fixed around the electrode. The support and the article rotate, while the electrode moves up and down. Furthermore, a plurality of magnets may be arranged around the article so that a magnetic field is formed in a zone including the article.
    Type: Grant
    Filed: September 23, 1998
    Date of Patent: March 20, 2001
    Assignee: Korea Advanced Institute Science and Technology
    Inventors: Jeong Du Kim, Min Seog Choi
  • Patent number: 6176998
    Abstract: Method of manufacturing a bearing ring (1) for a bearing such as a ball bearing or cylindrical roller bearing, wherein the bearing ring (1) is rotated around an axis (6) and the amount of material removed is controlled by the choice of the cross section of an electrode (3) parallel to the surface of the raceway under the electrode (3). Thus the radius of the groove (2) is kept constant. An electrode with a suitably adapted convex cross section allows for the manufacture of bearing rings within a very narrow specification range. Thus the invention also relates to a bearing comprising an electrochemically machined bearing ring (1) according to the invention having excellent operational life and characteristics.
    Type: Grant
    Filed: July 6, 1999
    Date of Patent: January 23, 2001
    Assignee: SKF Engineering and Research Centre B.V.
    Inventors: Frank Peter Wardle, Herve Girardin
  • Patent number: 6162348
    Abstract: A semi-conductive grindstone (10) comprising grains and a semi-conductive binder to fix the grains is prepared, a voltage is applied between the grindstone and the conductive workpiece (1), an conductive grinding fluid is supplied between them, the grindstone is contacted to the workpiece, the binder of the grindstone is subjected to electrolytic dressing in the contact point, and the workpiece is simultaneously ground by using the grindstone. A semi-conductive binder is preferably composed of metal powder and an insulating resin. Consequently, application is possible to peculiar grindstones such as ball-nose grindstone, grinding of the workpiece is simultaneously possible with dressing of the working surface of the grindstone by electrolytic dressing, and thus, grinding of long duration is also possible maintaining high efficiency and high preciseness.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: December 19, 2000
    Assignee: The Institute of Physical and Chemical Research
    Inventor: Hitoshi Ohmori
  • Patent number: 6143158
    Abstract: A method for producing an aluminum support for a lithographic printing plate comprising the steps of (a) electrolytic polishing an aluminum plate in an alkaline aqueous solution; and (b) electrochemically surface roughening the aluminum plate using direct or alternating current in an acidic aqueous solution in this order, and also a method for producing an aluminum support for a lithographic printing plate comprising an electrolytic polishing step of treating an aluminum plate used as an anode in an alkaline aqueous solution at a current density of 5 A/dm.sup.2 to 200 A/dm.sup.2 while allowing the alkaline aqueous solution to flow between the aluminum plate and an electrode at an average flow rate of 10 cm/second to 400 cm/second.
    Type: Grant
    Filed: April 24, 1998
    Date of Patent: November 7, 2000
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Akio Uesugi
  • Patent number: 6110351
    Abstract: A method of machining metal-matrix composite materials using electrochemical machining is provided. The method comprises the steps of: providing a metal matrix composite material in an electrochemical machine, and electrochemically machining the metal-matrix composite material in a nitrate or chloride containing electrolyte at a current density of equal to or greater than approximately 1 A/cm.sup.2. Preferably the metal-matrix composite is comprised of an aluminum alloy or pure Al matrix with ceramic particles, such as silicon carbide.
    Type: Grant
    Filed: October 15, 1998
    Date of Patent: August 29, 2000
    Assignee: University of Hawaii
    Inventors: Lloyd Hiromi Hihara, Philip Panquites, IV
  • Patent number: 6106690
    Abstract: An electroplaning technique achieves superior flatness of the face of a wafer. A chuck holds the wafer so the face of the wafer is oriented downwards and lowers it to an electroplaner stage. The electroplaner includes an elongated, horizontally extending cup, an elongated horizontally extending nozzle within it. Electrolyte flows non-turbulently from an upper side of the nozzle to create a meniscus of electrolyte that contacts the wafer. The electroplaner moves transversely while the chuck is held steady so that said meniscus sweeps across the face of said wafer. A rinser of similar construction likewise has a meniscus or rinse that sweeps across the wafer. The nozzle can have a row of openings along its upper side, or may be formed at least in part of a microporous material. The wafer is electrically configured as cathode.
    Type: Grant
    Filed: December 7, 1998
    Date of Patent: August 22, 2000
    Assignee: Reynolds Tech Fabricators, Inc.
    Inventor: H. Vincent Reynolds
  • Patent number: 6099715
    Abstract: During continuous electrochemical polishing of a metallic workpiece an electrolyte flows through a cathodic part of a tool into a working gap formed between the cathodic part and the workpiece and leaves it through a discharge channel between the cathodic part and a wall of the tool. Between the tool's wall and the workpiece a clearance is formed bordering the working gap. To avoid flow of the electrolyte from the working gap into the clearance and to discharge fluid from the gap, a chamber is provided which contains an external fluid held under a pre-adjusted pressure, which can be above or below atmospheric pressure in relation to the pressure of the electrolyte in the working gap. The fluid's pressure is adjusted so, that at the beginning of the clearance a barrier against the penetration of electrolyte liquid is formed. At this barrier the electrolyte is separated from the surface of the workpiece alongside a distinctive breakaway edge.
    Type: Grant
    Filed: October 5, 1998
    Date of Patent: August 8, 2000
    Inventor: Fritz-Herbert Frembgen
  • Patent number: 5935411
    Abstract: A continuous process for electropolishing surgical needles. Surgical needles are mounted to an electrically conductive carrier strip. The carrier strip and needles are then moved continuously through an electropolishing bath and the needles are maintained in the bath for a sufficient period of time to effectively polish the needles.
    Type: Grant
    Filed: May 16, 1997
    Date of Patent: August 10, 1999
    Assignee: Ethicon, Inc.
    Inventors: Robert Brown, Gordon Stuart, Geoffrey DeYoung, Andrew John Schuessler, George Schob, Mufutau G. Olatunji, Eugene Reynolds
  • Patent number: 5865984
    Abstract: Disclosed is an electrochemical etching apparatus including a fixture for holding a workpiece; a nozzle, positioned opposite the fixture and facing the workpiece, for impinging an etchant onto the workpiece; and an electrode for applying a voltage between the electrode and the workpiece; wherein, in operation, one of the fixture and nozzle are rotated and the nozzle is moved radially outwardly so that the workpiece is spirally etched. Also disclosed is a method of spirally etching a workpiece.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: February 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: William E. Corbin, Jr., Madhav Datta, Thomas E. Dinan, Frederick W. Kern
  • Patent number: 5820744
    Abstract: Electrochemical machining (ECM) techniques utilizing real-time parameter monitoring, alarms and feedback control for improved machining of a workpiece are disclosed. The ECM device utilizes one or more cathodes, an electrolyte and a positively charged workpiece to achieve electrolytic action. A number of controlling variables, such as cathode feed rate, electrolyte flow rate and voltage, are balanced in response to measured system parameters. The following parameters are preferably monitored in order to adjust the controlling variables: the drive parameters of feed rate and cathode depth; the pump parameters of flow rate and pressure; and the power components of voltage and current. The flow rate in each of the cathodes, or a corresponding Reynolds number, is preferably utilized to provide an alarm to the operator if a statistically significant change in flow is detected.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: October 13, 1998
    Assignee: Doncasters, Turbo Products Division
    Inventors: Clifton Vedantus Edwards, Frank P. Simkowski
  • Patent number: 5779878
    Abstract: A process for removing zinc from galvanized steel. The galvanized steel is immersed in an electrolyte containing at least about 15% by weight of sodium or potassium hydroxide and having a temperature of at least about 75.degree. C. and the zinc is galvanically corroded from the surface of the galvanized steel. The material serving as the cathode is principally a material having a standard electrode potential which is intermediate of the standard electrode potentials of zinc and cadmium in the electrochemical series.
    Type: Grant
    Filed: July 17, 1996
    Date of Patent: July 14, 1998
    Assignee: Metal Recovery Industries (US) Inc.
    Inventors: William A. Morgan, Frederick J. Dudek, Edward J. Daniels
  • Patent number: 5728286
    Abstract: A method of manufacturing an extrusion die for extruding a honeycomb structural body is disclosed. The extrusion die has a plurality of forming channels which have a shape in a traverse cross section corresponding to that of the honeycomb structural body and have a predetermined depth from a front side of the extrusion die toward a back side, and a plurality of opening holes for feeding raw materials which have a cylindrical shape extending independently from the back side toward the front side and are arranged at a cross portion and/or a straight portion of the forming channels in such a manner that each opening hole is opened and connected to the cross portion and/or straight portion of the forming channels.
    Type: Grant
    Filed: August 8, 1996
    Date of Patent: March 17, 1998
    Assignees: NGK Insulators, Ltd., Institute of Technology Precision Electrical Discharge Works
    Inventors: Kazuo Suzuki, Shoji Futamura
  • Patent number: 5688392
    Abstract: A method of machining the surface of an electrically conductive workpiece by application of a voltage to an electrically conductive tool spaced apart from the workpiece and moving the tool to shape or pattern the workpiece wherein variable flow of fluid is provided in the space between the tool and the workpiece. The fluid contains suspended insoluble interactive particles that are electrically conductive or are ionically conductive, but electronically insulating. The suspended particles came intermittent electrical short circuiting between the tool and the workpiece to prevent catastrophic and uncontrolled sparking or arcing during machining.
    Type: Grant
    Filed: September 7, 1995
    Date of Patent: November 18, 1997
    Assignee: Eltron Research, Inc.
    Inventor: James H. White
  • Patent number: 5685971
    Abstract: A method and apparatus for forming a passage with a variable diameter along its length in a conductive workpiece are disclosed. The workpiece is mounted in a fixture and an externally insulated hollow electrode is positioned proximate to a surface location of the workpiece into which the passage is to be formed. A first selected voltage is connected between the electrode and the workplace with the voltage being connected to cause the electrode to act as a cathode and the workpiece to act as an anode. A pump causes an acidic electrolyte to flow through the electrode at a chosen pressure and onto the workpiece surface. The electrode is moved toward the workpiece at a first selected feed rate by a CNC controller to cause a portion of the passage to be formed at a first predetermined diameter.
    Type: Grant
    Filed: September 30, 1991
    Date of Patent: November 11, 1997
    Assignee: General Electric Company
    Inventors: Lawrence Joseph Schroder, Lathan Merriman Wayman, Oleg Edelman
  • Patent number: 5681448
    Abstract: An electrochemical etching process carried out in an etching system including an electrolysis vessel which is provided thereinside with facing wall surfaces defining therebetween an etching solution flow region. A semiconductor substrate to be etched and a counter electrode are mounted respectively on the facing wall surfaces. A flow stream generating section for the etching solution is formed separate from the etching solution flow region and includes a device for generating the flow stream of the etching solution. The flow stream generating section is connected to the etching solution flow region in such a manner that the etching solution flow in a direction generally parallel with the facing wall surfaces inside the electrolysis vessel. An electric potential is applied between the semiconductor substrate and the counter electrode to accomplish an electrochemical etching on the semiconductor substrate.
    Type: Grant
    Filed: December 27, 1995
    Date of Patent: October 28, 1997
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Makoto Uchiyama, Hidetoshi Nojiri, Yasukazu Iwasaki
  • Patent number: 5641391
    Abstract: Embodiments of the present invention provide a new method for producing a three dimensional object, particularly suited to microfabrication applications. The method includes the steps of providing a substrate with a conducting interface, an electrode having a feature or features that are small relative to the substrate, and a solution. The solution has a reactant that will either etch the substrate or deposit a selected material in an electrochemical reaction. The electrode feature is placed close to but spaced from the interface. A current is passed between the electrode and the interface, through the solution, inducing a localized electrochemical reaction at the interface, resulting in either the deposition of material or the etching of the substrate. Relatively moving the electrode and the substrate along a selected trajectory, including motion normal to the interface, enables the fabrication of a three dimensional object.
    Type: Grant
    Filed: May 15, 1995
    Date of Patent: June 24, 1997
    Inventors: Ian W. Hunter, Serge R. Lafontaine, John D. Madden
  • Patent number: 5614076
    Abstract: An electroetching tool using scanned localized application of flowing electrolyte against a workpiece such as a large area mask having high density features for the fabrication of microelectronic components. A masked molybdenum plate is suspended in a vertical direction within a tank which functions as a reservoir for a recirculating electrobyte. The electrolyte in the reservoir is filtered and pumped to a pair of travelling cathode assemblies from which the flowing electrolyte is simultaneously applied through respective charged orifices to both sides of the workpiece. The workpiece is masked on its opposite sides with mirror imaged mask apertures having corresponding opposite-sided features in registration with each other.Each orifice through which the electrolyte is applied comprises an open groove in the surface of a block of polyvinal chloride material which groove extends in a vertical direction relative to the tank. The bottom of the groove is adjacent to a conductive plate.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: March 25, 1997
    Assignee: International Business Machines Corporation
    Inventors: Denis J. Brophy, Madhav Datta, Derek B. Harris, Frank S. Ryan, Frank A. Spera
  • Patent number: 5595640
    Abstract: Nozzle body acting as an insoluble anode for the galvanic or chemical treent of rod-shaped or pipe-shaped objects continuously moved through the nozzle body and acting as cathode. The nozzle body is arranged in a hollow body serving as a pressure vessel, the electrolyte flowing through the hollow body. The hollow body has a plurality of radial bore holes acting as nozzles, these bore holes being arranged in a plurality of cross-sectional regions lying at a distance from one another and being inclined at angles (.alpha.) and (.beta.) relative to the longitudinal axis of the nozzle body and relative to the respective cross-sectional region. Diaphragms are associated with the nozzle body which is coated on all sides with a layer of metal from the platinum group. The diaphragms are arranged in the through-opening of the nozzle body, surround the body to be treated, and are situated in planes between the outlet openings of the bore holes.
    Type: Grant
    Filed: August 28, 1995
    Date of Patent: January 21, 1997
    Assignee: Metallglanz Gesellschaft fuer Entgratung und Oberflaechentechnik mbH
    Inventor: Timm von Hoffmann
  • Patent number: 5567300
    Abstract: A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendous cost advantages over previously employed micromilling techniques for planarization.
    Type: Grant
    Filed: September 2, 1994
    Date of Patent: October 22, 1996
    Assignee: IBM Corporation
    Inventors: Madhav Datta, Terrence R. O'Toole
  • Patent number: 5543032
    Abstract: A tool and process for electroetching metal films or layers on a substrate employs a linear electrode and a linear jet of electrolyte squirted from the electrode. The electrode is slowly scanned over the film by a drive mechanism. The current is preferably intermittent. In one embodiment a single wafer surface (substrate) is inverted and the jet is scanned underneath. In another embodiment wafers are held vertically on opposite sides of a holder and two linear electrodes, oriented horizontally and on opposite sides of the holder, are scanned vertically upward at a rate such that the metal layers are completely removed in one pass. The process is especially adapted for fabricating C4 solder balls with triple seed layers of Ti--W (titanium-tungsten alloy) on a substrate, phased Cr--Cu consisting of 50% chromium (Cr) and 50% copper (Cu), and substantially pure Cu. Solder alloys are through-mask electrodeposited on the Cu layer. The seed layers conduct the plating current.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: August 6, 1996
    Assignee: IBM Corporation
    Inventors: Madhav Datta, Ravindra V. Shenoy
  • Patent number: 5536388
    Abstract: A nozzle is provided for use in electroetching a vertically oriented workpiece, comprising a housing having a top, sides, and bottom for creating a flow of etching solution on the workpiece, and means for shaping the flow of etching solution into a moving channel to improve etch uniformity of the workpiece.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: July 16, 1996
    Assignee: International Business Machines Corporation
    Inventors: Thomas E. Dinan, Kirk G. Berridge, Madhav Datta, Thomas S. Kanarsky, Michael B. Pike, Ravindra V. Shenoy