Mold, Mask, Or Masterform Patents (Class 205/70)
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Publication number: 20120255863Abstract: A system and method to form beam tunnels in interaction circuits. Forms, such as fibers or sheets can be located and secured above a substrate at a desired size and desired shape to form the final shape of the beam tunnels. Fiber holders can be utilized to position the forms above the substrate. A photoresist can then be applied over the substrate embedding the forms. A single exposure LIGA process can be performed on the photoresist, including the steps of ultraviolet photolithography, molding, and electroforming. After the process, the forms can be removed to leave the beam tunnels in the interaction circuits.Type: ApplicationFiled: March 15, 2012Publication date: October 11, 2012Inventor: Colin D. Joye
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Publication number: 20120247964Abstract: Disclosed is a microfluidic control device which may electrochemically and simply measure the value of glycosylated hemoglobin in blood on a chip, a method for manufacturing the same, and a method for operating the same.Type: ApplicationFiled: March 30, 2012Publication date: October 4, 2012Applicant: Electronics and Telecommunications Research InstituteInventors: Dae Sik LEE, Moon Youn Jung, Seung Hwan Kim
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Publication number: 20120219759Abstract: A micro structure which is preferred as an original plate of an antireflection, a mold of nano imprint or injection molding is obtained by a single particle film etching mask on which each particle is precisely aligned and closest packed in two dimensions. A single particle film etching mask is produced by a drip step wherein a dispersed liquid in which particles dispersed in a solvent are dripped onto a liquid surface of a water tank, a single particle film formation step in which a single particle film which consists of the particles by volatizing a solvent is formed, and a transfer step in which the single particle film is transferred to a substrate. The single particle film etching mask on which particles are closest packed in two dimensions, has a misalignment D(%) of an array of the particles that is defined by D(%)=|B?A|×100/A being less than or equal to 10%. However, A is the average diameter of the particles, and B is the average pitch between the particles in the single particle film.Type: ApplicationFiled: May 9, 2012Publication date: August 30, 2012Applicant: OLI PAPER CO., LTD.Inventor: Kei Shinotsuka
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Patent number: 8241479Abstract: A variety of deep structured decorative patterns originate with mechanical relief or etching. The present method incorporates a deeply patterned or textured etching or relief into a thin film embossing shim to simulate the look of the deep pattern or texture when used to emboss thin film or material. A transparent mold of the relief surface (such as brushed metal, engine-turned patterns, and textured glass) is formed using UV curable liquid and a transparent substrate. The relief copy in the transparent mold or overlay is mapped onto a photoresist surface or plate by shining or expanding one or more laser lights or laser beams through the transparent mold. The different heights of the relief copy of the transparent mold will cause the light to diffract/refract to form a corresponding patterned etching in the photoresist plate. The resulting photoresist plate is then metalized and electroplated to form a thin film embossing shim.Type: GrantFiled: June 29, 2009Date of Patent: August 14, 2012Assignee: Illinois Tool Works Inc.Inventors: Louis M. Spoto, Dean J. Randazzo, Matt Deschner
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Publication number: 20120126038Abstract: Nozzle and a method of making the same are disclosed.Type: ApplicationFiled: July 29, 2010Publication date: May 24, 2012Inventors: Barry S. Carpenter, Jaime B. Willoughby, Jennifer J. Sahlin
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Publication number: 20120024709Abstract: Disclosed are a porous electroformed shell for forming a grain pattern and a manufacturing method thereof. The method includes the step of causing an epoxy mandrel to be conductive by formation of a conductive thin film thereon; transferring a non-conductive masking pattern on the conductive thin film by using a masking film; generating and growing a fine pore at the position of the non-conductive masking pattern through electroforming; and demolding an electrodeposited layer having the fine pore from the epoxy mandrel, Through the disclosed method, precise control, both as a whole or in part, on a diameter, a formation position, and a density of a fine pore can be simply, economically, and efficiently can be carried out according to various curved shapes of the electroformed shell.Type: ApplicationFiled: July 28, 2010Publication date: February 2, 2012Inventors: Kie-Moon Sung, Man-Jae Weon, Kyung-Ho Lee, Young-Min Park
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Publication number: 20110318533Abstract: Provided is a method of duplicating a nano-pattern texture of the surface of an object through electroforming using an imprint mold, including selecting the object having the surface texture to be duplicated; disposing the selected object and pre-treating the surface thereof; nano-imprinting the surface of the pretreated object, thus duplicating it on a plastic mold; metalizing the surface of the plastic mold through vapor deposition, and performing electroforming, thus manufacturing metal module master molds; trimming the edges of the metal module master molds, performing micro-processing, connecting the metal module master molds, and then performing electroforming, thus manufacturing a large-area metal unit master mold; and electroforming the metal unit master mold, thus producing a duplicate having the surface texture, thus exhibiting an effect in which the skin of a selected natural object can be duplicated on metal having a uniform thickness.Type: ApplicationFiled: September 7, 2011Publication date: December 29, 2011Applicant: EMOT CO., LTD.Inventors: Kyung Wook LEE, Kyung Yul LEE, Jun Sang JEONG, Soo Han KIM
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Publication number: 20110290760Abstract: A method for producing plastic shell includes following steps. Provide a male mold and a female mold, then chemically etching a first texture on a surface of the female mold. Form a second texture on the surface of the female mold. Produce a plastic shell with various types of textures using the male mold and the female mold.Type: ApplicationFiled: October 21, 2010Publication date: December 1, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: YUN-LUNG CHEN
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Patent number: 8038863Abstract: A stamper having a patterned layer composed of a hard material and a compressible material back plane layer. The back plane layer may be composed of an elastomer. The stamper may be used to imprint an embossable layer disposed above a substrate for the production of a magnetic recording disk.Type: GrantFiled: October 9, 2009Date of Patent: October 18, 2011Assignee: WD Media, Inc.Inventor: Andrew M. Homola
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Publication number: 20110233063Abstract: A mold is fabricated with a cavity formed in an insulating layer formed so as to be placed on an upper surface of a conductive base material. This mold is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity to electroform a metal-formed product in the cavity. In this electrodepositing process, when the width of the cavity is taken as W and a vertical height of a head space between an upper opening of the cavity and an upper surface of a metal layer is taken as H, the growth of the metal layer is stopped so that the height H of the head space left above the metal layer satisfies: H?W/2.85 where 300 ?m?W; H?W/3.75 where 200 ?m?W<300 ?m; H?W/4 where 100 ?m?W<200 ?m; and H?W/10 where W<100 ?m.Type: ApplicationFiled: September 11, 2009Publication date: September 29, 2011Applicant: OMRON CorporationInventors: Kazumasa Seki, Akihiko Hatamura, Hitoshi Yoshida, Toshio Yamashita, Yasuhiro Miura
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Patent number: 8025782Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.Type: GrantFiled: March 14, 2007Date of Patent: September 27, 2011Assignee: Doniar SAInventor: Clément Saucy
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Publication number: 20110226625Abstract: Disclosed is a method of manufacturing a master mold having an uneven pattern which includes wide and narrow concave portions using a reactive ion etching process. The method is capable of manufacturing a master mold improved in the uniformity of concave portions of the uneven pattern by performing a main etching step in which etching is performed, using an original plate which includes a processing target layer and a foundation layer, on the processing target layer using the foundation layer as an etch stop layer and an extra etching step in which etching is performed on the original plate degraded by the main etching step in the uniformity of concave portions in order to improve the uniformity using an etching gas which includes a first gas capable of etching the foundation layer and producing a deposit with a bias power of not greater than 15 W.Type: ApplicationFiled: March 18, 2011Publication date: September 22, 2011Applicant: FUJIFILM CORPORATIONInventor: Katsuhiro NISHIMAKI
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Patent number: 8016995Abstract: An electrochemical deposition method includes disposing a mold into an electrolytic bath for forming a first metal layer on a surface of the mold, bonding a first surface of a conductive component to the first metal layer, and disposing the mold bonded to the conductive component into an electrolytic bath for forming a second metal layer on a second surface of the conductive component.Type: GrantFiled: April 3, 2008Date of Patent: September 13, 2011Assignee: Lite-On Technology CorporationInventor: Kai-Chung Hou
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Publication number: 20110217409Abstract: A method of manufacturing a composite stamp (24) for embossing comprises the steps of: (a) taking a master structure (10) having a conductive surface (16) and dielectric features (18) thereon; (b) depositing an opaque material on exposed regions of the conductive surface (16) to form an opaque mask (20); (c) coating the dielectric features (18) and opaque mask (20) with a fluid material (4) which is capable of being transformed to a form-retaining material; (d) causing or permitting the fluid material (4) to be transformed to a form-retaining material which is bonded to the opaque mask (20); and (e) removing the form-retaining material (4) and bonded opaque mask (20) from the master structure (10) to provide the composite stamp (24). Other aspect of the invention provide a composite stamp (24) and a composite structure (22) for making the composite stamp.Type: ApplicationFiled: October 28, 2008Publication date: September 8, 2011Inventors: John Christopher Rudin, Stephen Kitson, Timothy Taphouse, David Alexander Pearson
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Patent number: 8012329Abstract: A method includes placing a conductive mold in a first bath of electroforming solution, the solution including metal and having a selected temperature. A current is provided to the electroforming solution so that metal deposits onto the mold, thereby forming an electroformed element on the mold, the electroformed element and the mold being a composite assembly. The method further includes removing the composite assembly from the electroforming solution and transferring the composite assembly to a second bath having the same selected temperature. Thereafter, the electroformed element is separated from the mold while the composite assembly is in the second bath.Type: GrantFiled: May 9, 2008Date of Patent: September 6, 2011Assignee: 3M Innovative Properties CompanyInventors: Jennifer L. Trice, Charles N. DeVore, James R. Starkey
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Publication number: 20110180410Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.Type: ApplicationFiled: January 20, 2011Publication date: July 28, 2011Inventors: Jeffrey A. Thompson, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley
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Publication number: 20110156295Abstract: A method of manufacturing a brightness enhancement film includes the following: providing a embossing substrate, providing a first embossing assembly including a roller and an embossing layer applied on the roller, which is formed by electroforming and includes protruding micro-structures formed on the outer surface of the embossing layer, rolling the embossing layer onto the embossing substrate, and embossing the recessed micro-structures on a surface of the embossing substrate.Type: ApplicationFiled: April 12, 2010Publication date: June 30, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: HSI-CHANG WU, TAI-CHERNG YU
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Publication number: 20100314253Abstract: According to one embodiment, a three dimensional structure of a stamper is subject to etch by supplying a pulsed electric currentelectric current to the surface of the stamper.Type: ApplicationFiled: June 11, 2010Publication date: December 16, 2010Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Takuya SHIMADA, Shinobu SUGIMURA, Yoshiyuki KAMATA, Masatoshi SAKURAI
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Publication number: 20100236934Abstract: The invention relates to a method (3) of fabricating a mould (39, 39?, 39?) that includes the following steps: a) providing (10) a substrate (9, 9?) that has a top layer (21, 21?) and a bottom layer (23, 23?) made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, intermediate layer (22, 22?); b) etching (11, 12, 14, 2, 4) at least one pattern (26, 26?, 27) in the top layer (21, 21?) as far as the intermediate layer (22, 22?) to form at least one cavity (25, 25?) in said mould; c) coating (6, 16) the top part of said substrate with an electrically insulating coating (30, 30?); d) directionally etching (8, 18) said coating and said intermediate layer to limit the presence thereof exclusively at each vertical wall (31, 31?, 33) formed in said top layer. The invention concerns the field of micromechanical parts, in particular, for timepiece movements.Type: ApplicationFiled: March 12, 2010Publication date: September 23, 2010Applicant: NIVAROX-FAR S.A.Inventors: Pierre Cusin, Clare Golfier, Jean-Philippe Thiebaud
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Publication number: 20100104678Abstract: A method of making a tooling die can include depositing a plurality of layers onto a substrate using a printing process. Selected portions of the plurality of layers can be removed to expose a surface defining a desired shape of the tooling die. An electrically conductive material can be deposited to form a seed layer, and a structural material can be electrodeposited onto the seed layer to form the tooling die. The tooling die can be used to form contact structures on an electronic component.Type: ApplicationFiled: October 28, 2008Publication date: April 29, 2010Inventors: Igor Y. Khandros, Gaetan L. Mathieu
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Publication number: 20100072069Abstract: A method for manufacturing an imprint stamper includes the steps of forming a first electroformed layer on a concavo-convex pattern of an original disk with the pattern, peeling off the first electroformed layer to provide a first stamper, forming a second electroformed layer on a concavo-convex pattern of the first stamper, peeling off the second electroformed layer to provide a second stamper, forming a third electroformed layer on a concavo-convex pattern of the second stamper, and peeling off the third electroformed layer to provide a third stamper. In addition, a conductive film is formed at least on one of a bottom of the concave portion and a top surface of the convex portion of the concavo-convex pattern at least in one of the first stamper and the second stamper.Type: ApplicationFiled: September 24, 2009Publication date: March 25, 2010Inventors: Takuya Shimada, Shinobu Sugimura, Yoshiyuki Kamata
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Publication number: 20100062222Abstract: Disclosed herein is a die manufacturing method including the steps of: forming a pattern on the machining surface of a cylindrical resin original plate by laser machining; and fabricating a cylindrical die by the electroforming method using the resin original plate having the pattern formed.Type: ApplicationFiled: September 2, 2009Publication date: March 11, 2010Applicant: SONY CORPORATIONInventors: Hidehisa Murase, Yoshinari Sasaki, Kosei Aso, Tomohide Jozaki, Setsuo Okino
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Patent number: 7670515Abstract: A method for fabricating a mold for a microlens having a desired radius (R) of curvature by electroplating. In this method, a minimum radius (Rmin) of curvature is utilized to achieve the desired curvature radius.Type: GrantFiled: August 6, 2003Date of Patent: March 2, 2010Assignee: Canon Kabushiki KaishaInventors: Takayuki Yagi, Yasuhiro Shimada, Takayuki Teshima, Takashi Ushijima
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Patent number: 7666579Abstract: Analog data such as text and images are stored in microscopic analog format on a disk surface capable of maintaining the information for 1000 years or more whereby simple optical magnification will result in one being able to read the information formed therein. For a disk read by backlighting, as with microfiche, a photosensitive material is overlayed on hard metal surface which in turn is formed on a transparent glass or quartz material. A laser beam is focused on certain desired portions of the photosensitive material and the exposed material and underlying hard metal layer etched off to form pits down to the transparent layer corresponding to the analog information. The resulting disk can then be used to produce archival copies and distribution copies using hot embossing or other disclosed techniques.Type: GrantFiled: September 16, 2002Date of Patent: February 23, 2010Assignee: Serenity Technologies, Inc.Inventors: Suneeta Neogi, Jayant Neogi
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Publication number: 20100034993Abstract: A variety of deep structured decorative patterns originate with mechanical relief or etching. The present method incorporates a deeply patterned or textured etching or relief into a thin film embossing shim to simulate the look of the deep pattern or texture when used to emboss thin film or material. A transparent mold of the relief surface (such as brushed metal, engine-turned patterns, and textured glass) is formed using UV curable liquid and a transparent substrate. The relief copy in the transparent mold or overlay is mapped onto a photoresist surface or plate by shining or expanding one or more laser lights or laser beams through the transparent mold. The different heights of the relief copy of the transparent mold will cause the light to diffract/refract to form a corresponding patterned etching in the photoresist plate. The resulting photoresist plate is then metalized and electroplated to form a thin film embossing shim.Type: ApplicationFiled: June 29, 2009Publication date: February 11, 2010Applicant: ILLINOIS TOOL WORKS INC.Inventors: Louis M. Spoto, Dean J. Randazzo, Matt Deschner
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Patent number: 7651601Abstract: A heat spreader (10) and a method for manufacturing the heat spreader are disclosed. The heat spreader includes a metal casing (12) and a wick structure (16) lines an inner surface of the metal casing. The metal casing defines therein a chamber (14) and includes an evaporating section (126) and a condensing section (127). The wick structure is in the form of metal foam and occupies a portion of the chamber. In one embodiment, the wick structure has a pore size gradually increasing from the evaporating section towards the condensing section of the metal casing. The heat spreader is manufactured by electrodepositing a layer of metal coating (70) on an outer surface of a metal foam framework (20). The metal coating becomes the metal casing and the metal foam framework becomes the wick structure.Type: GrantFiled: January 9, 2006Date of Patent: January 26, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Ching-Bai Hwang, Jin-Gong Meng
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Publication number: 20090321388Abstract: An imprint stamper for manufacturing a magnetic recording medium with a plurality of recording bits includes a plurality of first concave portions to form the recording bits, a wall portion provided so as to separate the first concave portions from each other, and a second concave portion provided to the wall portion so as to connect one of the first concave portions and the other of the first concave portions adjacent to one of the first concave portions.Type: ApplicationFiled: June 30, 2009Publication date: December 31, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Takeshi Okino, Shinobu Sugimura, Kazuto Kashiwagi, Yoshiyuki Kamata
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Patent number: 7638265Abstract: A method for manufacturing a mold of a light guide plate is disclosed. The method includes following steps: providing a substrate and forming a plurality of microstructures on the substrate; depositing a first metal layer upon the substrate; spreading a photoresist layer on the first metal layer, exposing the photoresist layer to a photomask, and developing a photoresist pattern; removing a part of the first metal layer without cover of the photoresist pattern so as to form a sink pattern; depositing a second metal layer upon the sink pattern; electroforming a metal plate on the second metal layer; and remaining the metal plate and the second metal layer by separating the metal plate from the photoresist layer, the first metal layer, and the substrate so as to generate the mold of the light guide plate.Type: GrantFiled: July 31, 2007Date of Patent: December 29, 2009Assignee: Coretronic CorporationInventors: Ming-Dah Liu, Shi-Chi Hou, Jui-Nien Jao
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Patent number: 7638027Abstract: A method for fabricating a microstructure array, such as a microlens array, and a mold for forming the microlens array, includes the steps of forming an array of microstructures with a curved profile in a discrete form on a substrate, and uniformly forming a continuous layer on the substrate and the discrete microstructures. Optically-unusable regions between the discrete microstructures, such as microlenses, can be readily reduced or eliminated by forming the continuous layer until flat portions between the microstructures disappear.Type: GrantFiled: February 24, 2005Date of Patent: December 29, 2009Assignee: Canon Kabushiki KaishaInventors: Takayuki Teshima, Takayuki Yagi
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Publication number: 20090314648Abstract: According to one embodiment, a method of manufacturing a stamper used for manufacturing a magnetic recording medium having magnetic patterns corresponding to servo areas including a preamble section, an address section and a burst section and data areas including discrete tracks, the method includes forming additional resist patterns such that protrusions and recesses appear alternately in the radial direction in the preamble section and/or address section, in forming resist patterns corresponding to the servo areas including the preamble section, the address section and the burst section and data areas including discrete tracks are formed on a master plate, depositing a conductive film on the entire surface of the master plate and resist patterns, followed by electroforming a metal layer, and peeling off the metal layer from the master plate.Type: ApplicationFiled: June 23, 2009Publication date: December 24, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Ryoichi Takahashi, Masatoshi Sakurai
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Publication number: 20090277795Abstract: A process for fabricating a molding stamp mainly includes the steps of: forming a metal seed film on a substrate; forming a photo resist layer on the metal seed film; exposing the photo resist layer by a direct writing method, and developing the photo resist layer thereby forming a pattern of the photo resist layer, the pattern made of a number of microlens structures and a through hole configured for exposing a portion of the metal seed film therefrom; electroforming a body on the substrate to cover the pattern of the photo resist layer, the body having an extending portion being connected with the metal seed film via the through hole of the photo resist layer; removing the photo resist layer from the substrate; and separating the electroformed body from the substrate.Type: ApplicationFiled: September 30, 2008Publication date: November 12, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: TAI-CHERNG YU
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Publication number: 20090255817Abstract: A system, and corresponding method for use, for providing a mass-producible retroreflective material, or sheeting, featuring full cube corner pins is presented. The full cube corner shaping may be provided with the use of a diamond turning tool. The diamond turning tool may be used to simultaneously manufacture a number of pins. The pins may be used to form a mold featuring a triangular or full cube corner surface formation.Type: ApplicationFiled: April 9, 2008Publication date: October 15, 2009Applicant: Reflexite CorporationInventor: Xiao-Jing Lu
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Publication number: 20090134032Abstract: An electrochemical deposition method includes disposing a mold into an electrolytic bath for forming a first metal layer on a surface of the mold, bonding a first surface of a conductive component to the first metal layer, and disposing the mold bonded to the conductive component into an electrolytic bath for forming a second metal layer on a second surface of the conductive component.Type: ApplicationFiled: April 3, 2008Publication date: May 28, 2009Inventor: Kai-Chung Hou
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Patent number: 7520972Abstract: A process for making a mould piece having a main curved surface bearing an utilitary microstructure which comprises transferring a utilitary microstructure from a master piece main surface to a main surface of a flat cured elastomeric film; pressing the cured elastomeric film and a master article against each other so as to conform the overall shape of said cured elastomeric film to the curved shape of the main surface of the master article and to spread over a curable coating composition between the curved main surface of the master article and the main surface bearing the replica of the said utilitary microstructure of the cured elastomeric film; curing the coating composition; removing the cured elastomeric film and depositing a layer of a metal or a metallic alloy on the exposed main surface of the hard coating of the master article; and recovering said metal or metallic alloy layer to obtain a mould piece having a curved main surface bearing a replica of said transferred utilitary microstructure.Type: GrantFiled: June 30, 2003Date of Patent: April 21, 2009Assignee: Essilor InternationalInventors: Gerhard Keller, Mary Jane New, Kerim Yasan Arda, Philip John Rawlins, Allan Carmichael
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Patent number: 7465383Abstract: A master information carrier for magnetic transfer includes a master substrate made of metal, including an embossed pattern corresponding to information to be transferred. The master substrate is produced by laminating a metal disk with a predetermined thickness on an original disk, on which an embossed pattern is formed, by electroforming, peeling off the metal disk and die-cutting a disk in a desired size. An outer diameter of the metal disk is at least 1.7 times longer than an outer diameter of the die-cut master substrate. When the metal disk is peeled off from the original disk, deformation due to the forces acting from the side of the outer circumference is reduced. The flatness of the metal disk is ensured and the transfer qualities are improved. Further, a step of removing distortion of the metal disk, caused at the time of peeling off the metal disk, may also be provided.Type: GrantFiled: April 12, 2005Date of Patent: December 16, 2008Assignee: FUJIFILM CorporationInventors: Kazuhiro Niitsuma, Masakazu Nishikawa, Tadashi Yasunaga
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Patent number: 7462312Abstract: A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cut 10 into a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.Type: GrantFiled: October 19, 2004Date of Patent: December 9, 2008Assignee: Fujitsu LimitedInventors: Naohisa Matsushita, Toshikazu Furui
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Publication number: 20080299247Abstract: There is provided a fine pattern mold capable of transferring a fine concave/convex pattern accurately without causing deformation of the fine concave/convex pattern itself. The fine patter mold comprises: a roll; a buffer tube whose inner peripheral surface is in contact with an outer peripheral surface of the roll; and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.Type: ApplicationFiled: May 30, 2008Publication date: December 4, 2008Inventors: Masahiko Ogino, Mitsuru Hasegawa, Kenya Ohashi, Akihiro Miyauchi, Hitoshi Suzuki, Toshio Haba, Haruo Akahoshi
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Publication number: 20080254162Abstract: It includes an electroformed shell 6, which has a molding surface 60 and is formed by electroforming processing, a media flow path 2 for circulating a heat medium so as to perform temperature adjustment on the molding surface 60 formed in the electroformed shell 6, a backing member 71 with which the electroformed shell 6 is backed, and media conveying paths 74, respectively provided in an upstream-side end portion 21 and a downstream-side end portion 21, for flowing a heat medium into or out of the media flow path 2. A connecting jig 1 for connecting the media flow path 2 and the media conveying paths 74 is embedded in the electroformed shell 6.Type: ApplicationFiled: March 26, 2008Publication date: October 16, 2008Applicant: TOYODA GOSEI CO., LTD.Inventors: Kimihiro Iimura, Muneo Furutani, Shoji Araki, Nobuyoshi Tanaka
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Publication number: 20080237050Abstract: The present invention provides an electrocasting method by which the shape of the surface opposite to the surface to be electrodeposited on the mold can be controlled. A molded metal article is electrocast by forming an insulating layer on the side wall faces of a cavity and the outer wall face of a conductive mold in which the cavity is formed, placing the mold in an electrolysis tank and applying voltage, electrodepositing metal on the bottom face of the cavity, and growing the metal layer in the cavity so as to leave a space having a height of at least one-third the width of the cavity.Type: ApplicationFiled: March 28, 2008Publication date: October 2, 2008Applicant: OMRON CORPORATIONInventors: Kazumasa Seki, Akihiko Hatamura, Hitoshi Yoshida, Toshio Yamashita
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Publication number: 20080179189Abstract: An electroformed tool has an integrated base with channels contacting the tool with heat exchange fluids flowing through the channels during molding or embossing. A blank base is machined with a network of interconnected open channels on a top surface and end flow through passageways communicating with the channels. The tool is used as an electrode to erode the top surface of the blank base using plunge electro discharge machining by lowering the uneven deposit on the bottom of the electroformed tool down onto the top surface of the blank base in the electro discharge machining environment to form a top contoured surface to mate with the uneven deposit on the non-molding side of the substrate. Thermal management fluid channels are thereby conformal to the mold cavity. The tool and base are sealed together.Type: ApplicationFiled: May 1, 2007Publication date: July 31, 2008Inventor: Robert E. Szokolay
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Patent number: 7347572Abstract: Optical mirror elements for high bandwidth free space optical communication are produced by an electroforming replication technique. Onto the precision surface of a mandrel that is a negative of the required optical surface a layer of metal is deposited forming an exact copy of the mandrel surface and is then separated to form the required optical element. During the production process the mandrel may be coated with a variety of materials that are then separated together with the electroformed optical element during the release step to form a monolithic structure that includes a reflective coating. The mandrel remains unchanged by the process and can then be re-used. The high cost of conventional polishing techniques is therefore limited to the production of the mandrel. The replication process results in the production of low cost optical elements suitable for high bandwidth free space optical data transmission.Type: GrantFiled: May 23, 2000Date of Patent: March 25, 2008Assignee: Media Lario S.R.L.Inventors: Arnoldo Valenzuela, Giuseppe Valsecchi, Robert David Banham, Fabio Marioni
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Patent number: 7338753Abstract: A method of manufacturing a metal microstructure (1) by using a resin mold (13).Type: GrantFiled: August 14, 2006Date of Patent: March 4, 2008Assignee: Sumitomo Electric Industries, Ltd.Inventors: Jun Yorita, Yoshihiro Hirata, Tsuyoshi Haga
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Patent number: 7270732Abstract: A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an integrated body by electroforming; forming a metal thickened layer by metal spraying; forming a second electroformed cover and forming a metal key bond between the electroformed cover and the metal thickened layer. The method of the invention can shorten fabrication time of the electroformed mold insert and improve the mechanical strength and soldering affinity of the metal thickened layer.Type: GrantFiled: October 21, 2004Date of Patent: September 18, 2007Assignee: Chung Shan Institute of Science and TechnologyInventors: Chia-Hua Chang, Jen-Chin Wu
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Patent number: 7267756Abstract: The present invention provides a mold for fine electroforming M having a simple structure. In order to improve the productivity of a metal product, an electrode portion can be arranged with a much higher density, and a metal thin film formed on the electrode portion can easily be peeled off. The present invention provides a manufacturing method for manufacturing the mold M with a higher accuracy and by an easier way. The mold for fine electroforming M has a conductive substrate 1 to function as a cathode during electroforming and insulation layer 2 having an opening 21, which has a shape corresponding to a shape of a plane shape of the metal product P and is through to the conductive substrate 1, and composed of an inorganic insulation material having a thickness T2 of not less than 10 nm and less than one-half the thickness T1 of the metal product P. The surface of the conductive substrate 1 exposed at the opening 21 is adapted to serve as the electrode portion.Type: GrantFiled: February 18, 2003Date of Patent: September 11, 2007Assignee: Sumitomo Electric Industries, Ltd.Inventors: Koji Nitta, Shinji Inazawa, Akihisa Hosoe
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Patent number: 7229542Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 ?m range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.Type: GrantFiled: May 7, 2003Date of Patent: June 12, 2007Assignee: Microfabrica Inc.Inventor: Christopher A. Bang
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Patent number: 7211333Abstract: The present invention is to provide a resin-forming mold having high releasability and permitting a production without increasing production costs. The resin-forming mold can be used to produce a resin-molded product having minute uneven portions on a front face thereof, such as a surface light source device-use light guide for a liquid crystal display, an aspherical micro-lens, micro-Fresnel lens and an optical disk. In the stamper (resin-forming mold) 10 provided with an electroformed layer 11 and a conductive film 12 formed on the electroformed layer 11, the front face layer 12c of the conductive film 12 is formed of aluminum and a back face 12d is formed of nickel as an electroconductive metal. In addition, the constituent composition of the aluminum and the nickel continuously changes from the front face 12c toward the back face 12d. The front face 12c may be formed of aluminum and oxygen. The aluminum may combine with the oxygen to form an oxide of aluminum.Type: GrantFiled: May 13, 2004Date of Patent: May 1, 2007Assignee: Kuraray Co., Ltd.Inventors: Yukihiro Yanagawa, Takumi Yagi, Masaru Karai
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Patent number: 7195862Abstract: Process for producing a tool insert for injection molding a microstructured part fabricated of a synthetic material, a metal or a ceramic material and which comprises an arrangement of microchannels and which further comprises an arrangement of through-going orifices extending in a substantially perpendicular manner with respect to the outer surface of the part.Type: GrantFiled: November 24, 2003Date of Patent: March 27, 2007Assignee: Weidmann Plastics Technology AGInventors: Max Gmür, Thomas Fässler
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Patent number: 7150844Abstract: A method of manufacturing a stamper/imprinter for use in patterning of a recording medium comprises sequential steps of: (a) providing a substrate/workpiece comprising a topographically patterned surface including a plurality of projections and depressions corresponding to a pattern to be formed in a surface of the recording medium; (b) forming a thin release layer in conformal contact with the topographically patterned surface by means of a dry process; (c) forming a thicker layer of a material in conformal contact with the thin passivation layer on the topographically patterned surface; and (d) separating the thicker layer of material from the topographically patterned surface to form therefrom a stamper/imprinter including an imprinting surface having a negative image replica of the topographically patterned surface, separation of the thicker layer of material from the topographically patterned surface being facilitated by the thin release layer formed by the dry process.Type: GrantFiled: October 16, 2003Date of Patent: December 19, 2006Assignee: Seagate Technology LLCInventors: Neil N. Deeman, Hong Ying Wang, Gennady Gauzner, Nobuo Kurataka
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Patent number: 7147201Abstract: A method for annealing a structure formed by electrodeposition is provided, the method comprising providing the electrodeposition structure, the electrodeposition structure comprising an electroformed mold, the electroformed mold having a nominal thickness between and including 0.5 mm to 8.0 mm and having a melting temperature; heating the electrodeposition structure to a temperature between ambient temperature and the melting temperature of the electrodeposition structure; isostatically pressurizing the electrodeposition structure to a pressure above ambient pressure; cooling the electrodeposition structure to ambient temperature; and depressurizing the electrodeposition structure to ambient pressure.Type: GrantFiled: September 29, 2004Date of Patent: December 12, 2006Assignee: Collins & AikmanInventors: Robert Grimmer, Alex Risca, Richard Combs
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Patent number: 7117577Abstract: A method is designed to fasten a mold shell with a mold seat without causing the mold shell to crack. The method involves a first step in which a metal shell is formed on a model by electrocasting. The metal shell is then provided with at least one nut therewith by soldering through electrocasting. The metal shell is separated from the model and is then provided with a metal layer of a thickness by arc spraying, with the metal layer circumventing the nut. The mold seat is provided with at least one through hole. The mold shell is fastened with the mold seat by a bolt which is engaged with the nut via the through hole of the mold seat.Type: GrantFiled: September 29, 2003Date of Patent: October 10, 2006Assignee: Chung-Shan Institute of Science & TechnologyInventors: Jen-Chin Wu, Chia-Hua Chang, Ming-Jen Wang