Utilizing Magnet Or Magnetic Field During Coating Patents (Class 205/89)
  • Patent number: 11060494
    Abstract: A valve is provided, in particular an injection valve, having a valve seat and a valve needle which extends along a closing direction for the most part, the valve seat having a valve-seat surface, and a valve-closing element is mounted on an end of the valve needle facing the valve seat, the valve-closing element being able to be moved between an open position and a closed position, and the valve-closing element together with the valve-seat surface forming a sealing seat in the closed position, the valve-closing element having a greater core hardness and/or surface hardness than the valve-seat surface.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: July 13, 2021
    Assignee: Robert Bosch GmbH
    Inventor: Fatima Mutlu
  • Patent number: 10604660
    Abstract: A wear coating is disclosed that includes a layer treated by a trifunctional organosilane. An article is also disclosed, the article having a surface to which the wear coating is applied. A method of applying the wear coating is also disclosed. In some embodiments, the organosilane is trimethylsilane and the wear coating is applied by chemical vapor deposition, followed by heat treating the wear coating in the presence of the trimethylsilane.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: March 31, 2020
    Assignee: SILCOTEK CORP.
    Inventors: David A. Smith, James B. Mattzela, Paul H. Silvis, Gary A. Barone, Martin E. Higgins
  • Patent number: 10526719
    Abstract: Among other things, one or more systems and techniques for promoting metal plating profile uniformity are provided. A magnetic structure is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. In an embodiment, the magnetic structure applies a force that decreases an edge plating current by moving metal ions away from a wafer edge of the semiconductor wafer. In an embodiment, the magnetic structure applies a force that increases a center plating current by moving metal ions towards a center portion of the semiconductor wafer. In this way, the edge plating current has a current value that is similar to a current value of the center plating current. The similarity between the center plating current and the edge plating current promotes metal plating uniformity.
    Type: Grant
    Filed: August 21, 2013
    Date of Patent: January 7, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Ming-Chin Tsai, Chung-En Kao, Victor Y. Lu
  • Patent number: 10415526
    Abstract: A valve is provided, in particular an injection valve, having a valve seat and a valve needle which extends along a closing direction for the most part, the valve seat having a valve-seat surface, and a valve-closing element is mounted on an end of the valve needle facing the valve seat, the valve-closing element being able to be moved between an open position and a closed position, and the valve-closing element together with the valve-seat surface forming a sealing seat in the closed position, the valve-closing element having a greater core hardness and/or surface hardness than the valve-seat surface.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: September 17, 2019
    Assignee: Robert Bosch GmbH
    Inventor: Fatima Mutlu
  • Patent number: 10082543
    Abstract: In view of drivers cannot equip their vehicles with conventional intelligent battery monitoring system by themselves because the wire connections of the intelligent battery monitoring system are complex, the present invention particularly discloses a non-contact intelligent battery sensing system showing the advantages of simple circuit framework and low manufacturing cost. Since the non-contact intelligent battery sensing system only comprises a magnetic field sensor and a sensor controlling module, it is very easy for the drivers to equip their vehicles with this non-contact intelligent battery sensing system by themselves. To apply the non-contact intelligent battery sensing system, the driver just needs to firstly dispose the magnetic field sensor at one position near to a power line of a battery to be sensed, and then install a sensor controlling application program in his smart phones. Apparently, the non-contact intelligent battery sensing system further shows the advantage of easy to be installed.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: September 25, 2018
    Assignee: Prolific Technology Inc.
    Inventors: Yun-Kuo Lee, Chia-Chang Hsu, Ren-Yuan Yu, Ching-Te Chen, Ke-Ciang Shen
  • Patent number: 9617654
    Abstract: Provided are low friction coatings with improved abrasion, wear resistance and methods of making such coatings. In one form, the coating includes: i) an under layer selected from the group consisting of CrN, TiN, TiAlN, TiAlVN, TiAlVCN, TiSiN, TiSiCN, TiAlSiN and combinations thereof, wherein the under layer ranges in thickness from 0.1 to 100 ?m, ii) an adhesion promoting layer selected from the group consisting of Cr, Ti, Si, W, CrC, TiC, SiC, WC, and combinations thereof, wherein the adhesion promoting layer ranges in thickness from 0.1 to 50 ?m and is contiguous with a surface of the under layer, and iii) a functional layer selected from the group consisting of a fullerene based composite, a diamond based material, diamond-like-carbon and combinations thereof, wherein the functional layer ranges from 0.1 to 50 ?m and is contiguous with a surface of the adhesion promoting layer.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: April 11, 2017
    Assignee: EXXONMOBIL RESEARCH AND ENGINEERING COMPANY
    Inventors: Srinivasan Rajagopalan, Tabassumul Haque, Mehmet Deniz Ertas, Adnan Ozekcin, HyunWoo Jin, Bo Zhao
  • Patent number: 9306147
    Abstract: The present invention relates to a method of producing a substrate, including the steps of preparing a substrate having a nickel layer formed on a copper layer through plating, subjecting the nickel layer to thermal treatment at 800-1000° C., and epitaxial-growing an intermediate layer on the nickel layer, after the step of subjecting the nickel layer to thermal treatment. According to the present invention, there can be provided a substrate that allows the orientation and flatness at the surface of a nickel layer to be improved, and a method of producing the substrate.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: April 5, 2016
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., TOYO KOHAN CO., LTD.
    Inventors: Hajime Ota, Masaya Konishi, Takashi Yamaguchi
  • Publication number: 20150068131
    Abstract: A process for manufacturing an abrasive wire formed by abrasive particles held on a central core by a binder comprises depositing abrasive particles on the central core, each particle comprising a magnetic material that has a relative permeability greater than 50 and that represents at least 1% of the volume of the abrasive particle, and depositing binder on the central core to keep the abrasive particles attached to it. The core has south poles and north poles alternating along either its circumference or its length.
    Type: Application
    Filed: March 29, 2013
    Publication date: March 12, 2015
    Applicants: Commissarial a renergie atomique et aux energies alternatives, Thermocompact, CEntre NAtional de la Recherche Scientique
    Inventors: Gérald Sanchez, Michel Ly, Sophie Rivoirard, Arnaud Grifford
  • Publication number: 20150053563
    Abstract: Among other things, one or more systems and techniques for promoting metal plating profile uniformity are provided. A magnetic structure is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. In an embodiment, the magnetic structure applies a force that decreases an edge plating current by moving metal ions away from a wafer edge of the semiconductor wafer. In an embodiment, the magnetic structure applies a force that increases a center plating current by moving metal ions towards a center portion of the semiconductor wafer. In this way, the edge plating current has a current value that is similar to a current value of the center plating current. The similarity between the center plating current and the edge plating current promotes metal plating uniformity.
    Type: Application
    Filed: August 21, 2013
    Publication date: February 26, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Ming-Chin Tsai, Chung-En Kao, Victor Y. Lu
  • Patent number: 8877030
    Abstract: A magnetic film plating apparatus employs a dip method that allows relatively good escape of bubbles and does not require a wide footprint and, even when a ferromagnetic material is used for an anode, can form a magnetic film on a substrate surface while minimizing the influence of the anode on the uniformity of magnetic anisotropy in the magnetic film. The magnetic film plating apparatus includes a plating tank for holding a plating solution, an anode vertically disposed in the plating tank at a position to be immersed in the plating solution, a substrate holder for holding a substrate W and positioning the substrate W opposite the anode, and a magnetic field generator, disposed outside the plating tank, for generating a magnetic field around the substrate W held by the substrate holder and positioned opposite the anode.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: November 4, 2014
    Assignee: Ebara Corporation
    Inventors: Yasuhiko Endo, Fumio Kuriyama, Masaaki Kimura
  • Publication number: 20140262796
    Abstract: A metal plating apparatus includes a chemical bath chamber, an anode disposed at a bottom portion of the chemical bath chamber, and a cathode disposed at a top portion of the chemical bath chamber. A solenoid coil is disposed within the chemical bath chamber between the anode and the cathode. The solenoid coil is arranged to apply a magnetic field during a metal plating process in a direction from the anode to the cathode.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
  • Publication number: 20140240074
    Abstract: A radially anisotropic toroidal magnetic core is fabricated by a method including providing apparatus having a first magnet for providing a radial magnetic field extending across a cavity from an axial spindle to a surrounding second magnetic element, placing a substrate in the cavity, the substrate having a hole fitting around the head of the spindle; and sputter-depositing a film of ferromagnetic material onto the substrate. An alternative fabrication uses a similar fixture to impose magnetic anisotropy by annealing a previously-formed toroidal core. A particular fixture adapted for deposition by electroplating or for applying anisotropy by annealing pre-formed cores applies magnetic fields symmetrically from above and below the cores. Also described are the radially anisotropic core produced by the method, and an inductor having a coil wound on the radially anisotropic core.
    Type: Application
    Filed: September 24, 2012
    Publication date: August 28, 2014
    Applicant: The Trutees of Dart,outh College
    Inventors: Jizheng Qui, Charles R. Sullivan
  • Publication number: 20140186654
    Abstract: A surface treatment method for stainless steel as a colorful and smooth housing includes the steps of: a base layer including titanium is deposited on the stainless steel substrate by multi-arc ion plating. An aluminum transition layer is deposited on the titanium base layer by multi-arc ion plating, and an outermost layer including aluminum is deposited on the transition layer by magnetron sputtering. The transition layer and the outermost layer are anodized to form an anodic aluminum oxide film; and the anodic aluminum oxide film is sealed after being dyed. An article manufactured by the method is also provided.
    Type: Application
    Filed: July 8, 2013
    Publication date: July 3, 2014
    Inventor: CHUN-JIE ZHANG
  • Patent number: 8753412
    Abstract: An outer blade cutting wheel comprising an annular thin disc base of cemented carbide and a blade section is manufactured by disposing permanent magnet pieces on the side surfaces and inward of the outer periphery of the base to produce a magnetic field, providing magnetic coated diamond and/or CBN abrasive grains such that the magnetic field may act on the grains, causing the grains to be magnetically attracted to the base outer periphery, and electroplating or electroless plating whereby the abrasive grains are bound to the base outer periphery to form the blade section.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: June 17, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masaki Kasashima, Yuhito Doi, Harukazu Maegawa, Takehisa Minowa
  • Publication number: 20130202915
    Abstract: A method is disclosed for defining discrete magnetic and non-magnetic regions on the magnetic film layer of a storage media substrate. The method applies anodic oxidation of a cobalt-containing magnetic film layer to remove cobalt, followed by controlled deposition of a non-magnetic matrix into the regions where the cobalt has been removed. Deposition may either be electrodeposition, collimated vacuum deposition, or other methods depending upon the composition of the non-magnetic matrix being deposited. The method may be performed in a single electrochemical cell.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 8, 2013
    Applicant: SEAGATE TECHNOLOGY, LLC
    Inventor: Seagate Technology, LLC
  • Publication number: 20130153431
    Abstract: Methods and apparatus for forming devices using nanotubes. In one embodiment, an apparatus for depositing nanotubes onto a workpiece comprises a vessel configured to contain a deposition fluid having a plurality of nanotubes including first nanotubes having a first characteristic and second nanotubes having a second characteristic. The apparatus further includes a sorting unit in the vessel configured to selectively isolate or otherwise sort the first nanotubes from the second nanotubes, and a field unit in the vessel configured to attach the first nanotubes to the workpiece. For example, the field unit can attach the first nanotubes to the workpiece such that the first nanotubes are at least generally parallel to each other and in a desired orientation relative to the workpiece.
    Type: Application
    Filed: February 19, 2013
    Publication date: June 20, 2013
    Applicant: MICRON TECHNOLOGY, INC.
    Inventor: Micron Technology, Inc.
  • Publication number: 20130043062
    Abstract: The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.
    Type: Application
    Filed: August 16, 2012
    Publication date: February 21, 2013
    Applicant: EARTHONE CIRCUIT TECHNOLOGIES CORPORATION
    Inventor: William Wismann
  • Patent number: 8192608
    Abstract: An anode and cathode for an electrolytic cell configured as a low inductance transmission line to enable control of an interphase at an electrode surface. The anode and cathode are coupled to a switched current source by a low inductance path that includes a parallel plate transmission line, a coaxial transmission line, or both. The switched current source provides fast switching between current sources to provide fast charging and discharging of the double-layer capacitance associated with the electrode surface so that an isotope may be selectively transported to the electrode surface for oxidation or reduction. A photon source may be used to create a population of isotope containing species within the electrolyte. An additional static magnetic field and/or an alternating current magnetic excitation source may be used to modify the composition of the population of species containing the isotope to be separated.
    Type: Grant
    Filed: December 11, 2010
    Date of Patent: June 5, 2012
    Inventor: Mehlin Dean Matthews
  • Publication number: 20120042993
    Abstract: Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.
    Type: Application
    Filed: August 23, 2011
    Publication date: February 23, 2012
    Applicant: BABCOCK & WILCOX TECHNICAL SERVICES Y-12, LLC
    Inventors: Edward B. Ripley, Russell L. Hallman
  • Patent number: 7964081
    Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: June 21, 2011
    Assignee: International Business Machines Corporation
    Inventors: Matteo Flotta, Lubomyr Taras Romankiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
  • Publication number: 20110042223
    Abstract: The present disclosure generally relates to techniques for magnetic electroplating or electro-deposition. Example methods may include utilizing a magnet during electro-deposition to modify kinetics of deposition of plating material on a substrate.
    Type: Application
    Filed: August 24, 2009
    Publication date: February 24, 2011
    Inventor: Ezekiel Kruglick
  • Publication number: 20100275522
    Abstract: An outer blade cutting wheel comprising an annular thin disc base of cemented carbide and a blade section is manufactured by disposing permanent magnet pieces on the side surfaces and inward of the outer periphery of the base to produce a magnetic field, providing magnetic coated diamond and/or CBN abrasive grains such that the magnetic field may act on the grains, causing the grains to be magnetically attracted to the base outer periphery, and electroplating or electroless plating whereby the abrasive grains are bound to the base outer periphery to form the blade section.
    Type: Application
    Filed: April 29, 2010
    Publication date: November 4, 2010
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masaki Kasashima, Yuhito Doi, Harukazu Maegawa, Takehisa Minowa
  • Patent number: 7802357
    Abstract: A method of forming a plating film capable of improving magnetic properties is provided. A photoresist pattern, having a first opening with an aspect ratio greater than 1 and a second opening with an aspect ratio smaller than that of the first opening, is formed on a surface of a substrate. A seed film is formed to cover an exposed surface of the substrate in the openings and an inner wall of the photoresist pattern in the openings. On the seed film in the openings, the plating film of magnetic material is deposited such that the first opening is filled under application of a magnetic field in the direction intersecting the surface of the substrate, and the second opening is filled under application of the magnetic field in the direction along the surface of the substrate.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: September 28, 2010
    Assignee: TDK Corporation
    Inventor: Akifumi Kamijima
  • Publication number: 20100038252
    Abstract: A plating method for forming a uniform magnetic film in conducting a plating treatment on a wafer with a magnetic film of, for instance, a Fe—Co-based alloy. Specifically, the method comprises the steps of supplying a plating solution through a plating-solution-supply section of a plating tank to a wafer, which placed on an opening of the plating tank, and conducting a plating treatment on the wafer while the plating solution is kept in contact with a plating target surface of the wafer, wherein the plating solution employed is one forming a magnetic film, and the plating treatment is done while a magnetic field is applied to the plating solution in contact with the plating target surface of the wafer.
    Type: Application
    Filed: August 12, 2008
    Publication date: February 18, 2010
    Inventor: YUTAKA KASUYA
  • Publication number: 20100006444
    Abstract: A magnetic film plating apparatus employs a dip method that allows relatively good escape of bubbles and does not require a wide footprint and, even when a ferromagnetic material is used for an anode, can form a magnetic film on a substrate surface while minimizing the influence of the anode on the uniformity of magnetic anisotropy in the magnetic film. The magnetic film plating apparatus includes a plating tank for holding a plating solution; an anode vertically disposed in the plating tank at a position to be immersed in the plating solution; a substrate holder for holding a substrate W and positioning the substrate W opposite the anode; and a magnetic field generator, disposed outside the plating tank, for generating a magnetic field around the substrate W held by the substrate holder and positioned opposite the anode.
    Type: Application
    Filed: July 7, 2009
    Publication date: January 14, 2010
    Inventors: Yasuhiko Endo, Fumio Kuriyama, Masaaki Kimura
  • Publication number: 20090258188
    Abstract: Disclosed herein is a composition for forming an inorganic pattern, comprising an inorganic precursor, at least one stabilizer selected from ?-diketone and ?-ketoester, and a solvent. Use of the composition enables efficient and inexpensive formation of an inorganic micropattern.
    Type: Application
    Filed: August 28, 2008
    Publication date: October 15, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Nam CHA, Dae Joon KANG, Byong Gwon SONG
  • Patent number: 7544282
    Abstract: Disclosed are a method and a device for filling material separations on the surface. In methods known in prior art, which are used for filling material separations, the substrate is often influenced in a negative manner by high processing temperatures and dissimilar additives. The inventive method overcomes said disadvantage, taking place at low temperatures and allowing the material separation to be completely filled without using dissimilar substances.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: June 9, 2009
    Assignee: Siemens Aktiengesellschaft
    Inventors: Marc De Vogelaere, Ursus Krüger, Daniel Körtvelyessy, Ralph Reiche
  • Publication number: 20090065363
    Abstract: An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process.
    Type: Application
    Filed: September 10, 2007
    Publication date: March 12, 2009
    Inventors: Trifon M. Liakopoulos, Robert W. Filas, Amrit Panda
  • Publication number: 20090050486
    Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.
    Type: Application
    Filed: August 24, 2007
    Publication date: February 26, 2009
    Applicant: International Business Machines Corporation
    Inventors: Matteo Flotta, Lubomyr Taras Romankiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
  • Patent number: 7445696
    Abstract: For an electrolytic cell, an apparatus and method are described that use one or more sensors to measure magnetic field strength about a conductor carrying electrical current. A processor is in electrical communication with the sensors and determines a compensated magnetic field strength based on the magnetic fields of other conductors that also carry electrical current to or from the electrolytic cell. The processor uses this compensated magnetic field strength to determine the cathode electrical current carried by the conductor and to identify open and short circuits between the anodes and cathodes of the cell. The described apparatus and method account for interactions between the magnetic fields of the neighboring cathodes.
    Type: Grant
    Filed: March 17, 2005
    Date of Patent: November 4, 2008
    Assignee: Kennecott Utah Copper Corporation
    Inventors: Eugene Yanjun You, Antonio Berges-Dreyfous, David B. George, Daniel Kim, Keming Zhou
  • Publication number: 20080202922
    Abstract: A hybrid electro-deposition process for soft magnetic cobalt alloy films comprises providing a plating bath that includes cobalt and a reducing agent, providing a cobalt-containing anode in the plating bath coupled to a power supply, providing a substrate in the plating bath coupled to the power supply, wherein the substrate functions as a cathode, applying a magnetic field across the plating bath, and applying an electrical current to the plating bath by way of the power supply to cause the cobalt to deposit onto the substrate and form a soft magnetic film.
    Type: Application
    Filed: February 22, 2007
    Publication date: August 28, 2008
    Inventors: Ting Zhong, Arnel M. Fajardo, Chang-Min Park
  • Publication number: 20080083624
    Abstract: An electroplating apparatus and method are provided. The electrolysis plating apparatus includes an electrolytic cell, and copper electrode, a wafer electrode, and a magnetic field generator.
    Type: Application
    Filed: September 28, 2007
    Publication date: April 10, 2008
    Inventor: SANG CHUL KIM
  • Patent number: 7062840
    Abstract: A process for forming magnetic targets for position and speed sensors, and magnetic targets formed according to the process. The targets are formed on a conductor-clad substrate by first applying a layer of photoresist material and then patterning and etching the photoresist to form trenches defining the shape and dimensions of the targets. Magnetic material is formed in the trenches and magnetized to form the targets.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: June 20, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Thaddeus Schroeder, Shih-Chia Chang, Lorenzo Guadalupe Rodriguez
  • Patent number: 7048840
    Abstract: The invention relates to a method for metal coating the surface of high temperature superconductors with a copper-oxygen base structure. The aim of the invention is to achieve a method as above, which requires a low production complexity, serves for the production of contacts with a low electrical and/or thermal transfer resistance and which increases the stability of the metallization. Said aim is achieved whereby copper is applied to give low-ohmic contacts, and the linked achievement of a stable metallization between the HTS and the electrical and/or thermal coupling. Further advantageous effects are achieved with the method whereby the copper is applied in the form of copper alloys, in particular as copper-nickel or copper-zinc alloys. On applying the method it is furthermore of advantage for the creation of fine grained surface coatings to overlay the galvanic cell with a permanent and/or alternating magnetic field.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: May 23, 2006
    Assignee: Adelwitz Technologiezentrum GmbH
    Inventors: Frank Werfel, Uta Flögel-Delor, Rolf Rothfeld, Dieter Wippich
  • Patent number: 6919007
    Abstract: Disclosed is a method of mounting chips, including the steps of: dipping a mounting board in a solvent in which chips are dispersed; and mounting the chips on the mounting board by forming electric field gradients on the mounting board in correspondence with positions where the chips are to be mounted. With this configuration, fine chips such as fine semiconductor chips can be mounted at desired positions on a mounting board with a high efficiency and a high yield.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: July 19, 2005
    Assignee: Sony Corporation
    Inventors: Yumi Sanaka, Isamu Nakao, Tadashi Ishibashi, Katsuya Shirai
  • Patent number: 6890412
    Abstract: A method and apparatus for microencapsulating or electrodeposited coating of ferromagnetic and soft-magnetic sub-micron or nano sized powderized material comprising use of a rotary flow-through device assisted by an electromagnet within the electrode ring to alternately position the powder at the face of the cathode ring and electroplate the powder and reorient it prior to another repositioning. The invention is also of a process and apparatus for forming a strip, mesh, or film from magnetic powderized material in an organized bipolar arrangement, which is particularly useful for electroforming foils with the magnetic particles positioned in a monolayer within a multilayer metallic foil.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: May 10, 2005
    Assignee: Surfect Technologies, Inc.
    Inventors: Thomas P. Griego, John W. Eichman, III, Geronimo Velasquez
  • Patent number: 6855239
    Abstract: A plating method and apparatus using contactless electrode is described. In one embodiment an inductive element is placed proximally to a substrate and a moving electromagnetic field generates an emf in the substrate to plate the surface. In another embodiment, a conductive plate is used, so that the conductive plate and the wafer, separated by a dielectric material, operate as two plates of a capacitor when voltage is applied to the conductive plate. The resulting electrostatic field impresses a charge potential on the substrate to plate the surface of the substrate.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: February 15, 2005
    Inventor: Rahul Jairath
  • Patent number: 6776891
    Abstract: A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co100−a−bFeaMb, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: August 17, 2004
    Assignee: Headway Technologies, Inc.
    Inventors: Chaopeng Chen, Kevin Lin, Jei Wei Chang
  • Patent number: 6716331
    Abstract: An electrolytic method is disclosed by which occlusion of hydrogen or sticking of atoms or molecules in plating and so forth is not disturbed by electronic magnetic force produced by main electric current and ion current flowing from the positive electrode to the negative electrode through electrolyte. An electric circuit separate from a positive electrode and a negative electrode is provided between the positive electrode and the negative electrode, and electric current of a direction opposite to that of main electric current and ion current flowing in the electrolyte from the positive electrode to the negative electrode is supplied to the electric circuit to produce an opposite magnetic field which cancels a magnetic field produced by the main electric current and the ion current flowing in the electrolyte.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: April 6, 2004
    Inventor: Toichi Chikuma
  • Publication number: 20030132118
    Abstract: An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate support disposed therein and adapted to rotate a substrate. One or more electrical contact elements are disposed on the substrate support. A drive system is disposed proximate the housing. The drive system is magnetically coupled to and adapted to rotate the substrate support. In another embodiment, a method of plating a substrate includes the steps of covering a substrate supported within a housing with electrolyte, and displacing a portion of the electrolyte from the housing prior to electrically biasing the substrate, and electrically biasing the substrate.
    Type: Application
    Filed: January 14, 2002
    Publication date: July 17, 2003
    Applicant: Applied Materials, Inc.
    Inventor: Nicolay Kovarsky
  • Patent number: 6576110
    Abstract: An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated with an inert material that is impervious to the electrolyte solution. In one embodiment, the anode is formed as a perforated anode. In one aspect, the electric field generating portion is formed contiguous with the electrolyte solution chemical reaction portion. In another aspects, the planar electric field generating portion is formed as a distinct member from the electrolyte solution chemical reaction portion.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: June 10, 2003
    Assignee: Applied Materials, Inc.
    Inventor: Dan Maydan
  • Publication number: 20030044303
    Abstract: A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co100-a-bFeaMb, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.
    Type: Application
    Filed: May 18, 2001
    Publication date: March 6, 2003
    Applicant: Headway Technologies, Inc.
    Inventors: Chaopeng Chen, Kevin Lin, Jei Wei Chang
  • Publication number: 20030038034
    Abstract: A method and apparatus for microencapsulating or electrodeposited coating of ferromagnetic and soft-magnetic sub-micron or nano sized powderized material comprising use of a rotary flow-through device assisted by an electromagnet within the electrode ring to alternately position the powder at the face of the cathode ring and electroplate the powder and reorient it prior to another repositioning. The invention is also of a process and apparatus for forming a strip, mesh, or film from magnetic powderized material in an organized bipolar arrangement, which is particularly useful for electroforming foils with the magnetic particles positioned in a monolayer within a multilayer metallic foil.
    Type: Application
    Filed: August 27, 2002
    Publication date: February 27, 2003
    Inventors: Thomas P. Griego, John W. Eichman, Geronimo Velasquez
  • Patent number: 6451195
    Abstract: An electrolytic plating system includes a coil for generating a magnetic field in the direction perpendicular to the subject surface of a wafer on which a Cu film is to be formed. The current components perpendicular to the magnetic field stirs the electrolytic solution without using a stirrer, thereby achieving a uniform thickness for the Cu film without a void therein.
    Type: Grant
    Filed: July 6, 2000
    Date of Patent: September 17, 2002
    Assignee: NEC Corporation
    Inventor: Masahito Watanabe
  • Patent number: 6346181
    Abstract: Disclosed is an Ni-plated layer of biaxial texture, which is formed by electroplating. In the Ni-plated layer,peaks measured on a &thgr;-rocking curve have a FWHM of 7° or less in terms of the misorientation on the c-axis; and peaks measured on &phgr;-scan have a FWHM of 21° or less in terms of the misorientation on the plane formed by the a-axis and the b-axis. Also, a process of electroplating a Ni layer are disclosed. The process comprises forming a Ni-plated layer of biaxial texture under a magnetic field by electroplating and subjecting the Ni-plated layer to thermal treatment to develop the biaxial texture. This electroplating process is expected to give a significant contribution to the development of the electroplating technology and to replace the vacuum deposition used for the preparation of thin film magnetic materials or thin film piezoelectric materials.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: February 12, 2002
    Assignee: Korea Institute of Machinery and Materials
    Inventors: Kyu Hwan Lee, Hyung-Sik Chung, Sang Ro Lee, Doyon Chang, Yongsoo Jeong, Jaimoo Yoo, Jae-Woong Ko, Hai-Doo Kim
  • Patent number: 6346182
    Abstract: This invention relates to a bipolar electrochemical process for toposelective electrodeposition of a catalytic substance on an electrically conductive particulate substrate to produce a catalyst, as well as to the catalyst so produced.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: February 12, 2002
    Assignee: Drexel University
    Inventor: Jean-Claude Bradley
  • Publication number: 20020005358
    Abstract: An electrolytic method is disclosed by which occlusion of hydrogen or sticking of atoms or molecules in plating and so forth is not disturbed by electronic magnetic force produced by main electric current and ion current flowing from the positive electrode to the negative electrode through electrolyte. An electric circuit separate from a positive electrode and a negative electrode is provided between the positive electrode and the negative electrode, and electric current of a direction opposite to that of main electric current and ion current flowing in the electrolyte from the positive electrode to the negative electrode is supplied to the electric circuit to produce an opposite magnetic field which cancels a magnetic field produced by the main electric current and the ion current flowing in the electrolyte.
    Type: Application
    Filed: July 12, 2001
    Publication date: January 17, 2002
    Applicant: TOICHI CHIKUMA
    Inventor: Toichi Chikuma
  • Patent number: 6284127
    Abstract: A process for dewaxing waxy hydrocarbonaceous materials, such as hydrocarbon fuel and lubricating oil fractions to reduce their cloud and pour points comprises reacting the material with hydrogen in the presence of a dewaxing catalyst comprising at least one metal catalytic component and ferrierite in which at least a portion of its cation exchange positions are occupied by one or more trivalent rare earth metal cations. The rare earth ion exchanged ferrierite catalyst has good selectivity for lubricating oil production, particularly when dewaxing a Fischer-Tropsch wax hydroisomerate. Preferably at least 10% and more preferably at least 15% of the ferreirite cation exchange capacity is occupied by one or more trivalent rare earth metal cations.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: September 4, 2001
    Assignee: Exxon Research and Engineering Company
    Inventors: Bruce R. Cook, Jack W. Johnson, Guang Cao, Rich A. McEvoy, Richard H. Ernst
  • Patent number: 6274022
    Abstract: A method for producing electro- or electroless-deposited-film, in which the crystal orientation of the film is controlled to provide improved product properties. A paramagnetic material or diamagnetic material in its electrolytic-state is deposited on a substrate by an electro- or electroless-deposition process. A magnetic field having an intensity at least on the order of 7 T is applied in a predetermined direction, so as to perform the deposition in environment added with the magnetic field. A porous plate is preferably arranged adjacent to the substrate, for suppressing flow of an electrolytic liquid that may occur during the application of the magnetic field.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: August 14, 2001
    Assignee: Nagoya University
    Inventors: Shigeo Asai, Kensuke Sassa, Takahisa Taniguchi
  • Patent number: 6251250
    Abstract: A novel method and apparatus of wet processing workpieces, such as electroplating semiconductor wafers and the like, that incorporates reciprocating processing fluid agitation to control fluid flow at the workpiece, and where electric fields are involved as in such electroplating, controlling the electric field distribution.
    Type: Grant
    Filed: September 3, 1999
    Date of Patent: June 26, 2001
    Inventor: Arthur Keigler