Abstract: A valve is provided, in particular an injection valve, having a valve seat and a valve needle which extends along a closing direction for the most part, the valve seat having a valve-seat surface, and a valve-closing element is mounted on an end of the valve needle facing the valve seat, the valve-closing element being able to be moved between an open position and a closed position, and the valve-closing element together with the valve-seat surface forming a sealing seat in the closed position, the valve-closing element having a greater core hardness and/or surface hardness than the valve-seat surface.

Abstract: A wear coating is disclosed that includes a layer treated by a trifunctional organosilane. An article is also disclosed, the article having a surface to which the wear coating is applied. A method of applying the wear coating is also disclosed. In some embodiments, the organosilane is trimethylsilane and the wear coating is applied by chemical vapor deposition, followed by heat treating the wear coating in the presence of the trimethylsilane.

Abstract: Among other things, one or more systems and techniques for promoting metal plating profile uniformity are provided. A magnetic structure is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. In an embodiment, the magnetic structure applies a force that decreases an edge plating current by moving metal ions away from a wafer edge of the semiconductor wafer. In an embodiment, the magnetic structure applies a force that increases a center plating current by moving metal ions towards a center portion of the semiconductor wafer. In this way, the edge plating current has a current value that is similar to a current value of the center plating current. The similarity between the center plating current and the edge plating current promotes metal plating uniformity.

Abstract: A valve is provided, in particular an injection valve, having a valve seat and a valve needle which extends along a closing direction for the most part, the valve seat having a valve-seat surface, and a valve-closing element is mounted on an end of the valve needle facing the valve seat, the valve-closing element being able to be moved between an open position and a closed position, and the valve-closing element together with the valve-seat surface forming a sealing seat in the closed position, the valve-closing element having a greater core hardness and/or surface hardness than the valve-seat surface.

Abstract: In view of drivers cannot equip their vehicles with conventional intelligent battery monitoring system by themselves because the wire connections of the intelligent battery monitoring system are complex, the present invention particularly discloses a non-contact intelligent battery sensing system showing the advantages of simple circuit framework and low manufacturing cost. Since the non-contact intelligent battery sensing system only comprises a magnetic field sensor and a sensor controlling module, it is very easy for the drivers to equip their vehicles with this non-contact intelligent battery sensing system by themselves. To apply the non-contact intelligent battery sensing system, the driver just needs to firstly dispose the magnetic field sensor at one position near to a power line of a battery to be sensed, and then install a sensor controlling application program in his smart phones. Apparently, the non-contact intelligent battery sensing system further shows the advantage of easy to be installed.

Abstract: Provided are low friction coatings with improved abrasion, wear resistance and methods of making such coatings. In one form, the coating includes: i) an under layer selected from the group consisting of CrN, TiN, TiAlN, TiAlVN, TiAlVCN, TiSiN, TiSiCN, TiAlSiN and combinations thereof, wherein the under layer ranges in thickness from 0.1 to 100 ?m, ii) an adhesion promoting layer selected from the group consisting of Cr, Ti, Si, W, CrC, TiC, SiC, WC, and combinations thereof, wherein the adhesion promoting layer ranges in thickness from 0.1 to 50 ?m and is contiguous with a surface of the under layer, and iii) a functional layer selected from the group consisting of a fullerene based composite, a diamond based material, diamond-like-carbon and combinations thereof, wherein the functional layer ranges from 0.1 to 50 ?m and is contiguous with a surface of the adhesion promoting layer.

Abstract: The present invention relates to a method of producing a substrate, including the steps of preparing a substrate having a nickel layer formed on a copper layer through plating, subjecting the nickel layer to thermal treatment at 800-1000° C., and epitaxial-growing an intermediate layer on the nickel layer, after the step of subjecting the nickel layer to thermal treatment. According to the present invention, there can be provided a substrate that allows the orientation and flatness at the surface of a nickel layer to be improved, and a method of producing the substrate.

Abstract: A process for manufacturing an abrasive wire formed by abrasive particles held on a central core by a binder comprises depositing abrasive particles on the central core, each particle comprising a magnetic material that has a relative permeability greater than 50 and that represents at least 1% of the volume of the abrasive particle, and depositing binder on the central core to keep the abrasive particles attached to it. The core has south poles and north poles alternating along either its circumference or its length.

Abstract: Among other things, one or more systems and techniques for promoting metal plating profile uniformity are provided. A magnetic structure is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. In an embodiment, the magnetic structure applies a force that decreases an edge plating current by moving metal ions away from a wafer edge of the semiconductor wafer. In an embodiment, the magnetic structure applies a force that increases a center plating current by moving metal ions towards a center portion of the semiconductor wafer. In this way, the edge plating current has a current value that is similar to a current value of the center plating current. The similarity between the center plating current and the edge plating current promotes metal plating uniformity.

Abstract: A magnetic film plating apparatus employs a dip method that allows relatively good escape of bubbles and does not require a wide footprint and, even when a ferromagnetic material is used for an anode, can form a magnetic film on a substrate surface while minimizing the influence of the anode on the uniformity of magnetic anisotropy in the magnetic film. The magnetic film plating apparatus includes a plating tank for holding a plating solution, an anode vertically disposed in the plating tank at a position to be immersed in the plating solution, a substrate holder for holding a substrate W and positioning the substrate W opposite the anode, and a magnetic field generator, disposed outside the plating tank, for generating a magnetic field around the substrate W held by the substrate holder and positioned opposite the anode.

Abstract: A metal plating apparatus includes a chemical bath chamber, an anode disposed at a bottom portion of the chemical bath chamber, and a cathode disposed at a top portion of the chemical bath chamber. A solenoid coil is disposed within the chemical bath chamber between the anode and the cathode. The solenoid coil is arranged to apply a magnetic field during a metal plating process in a direction from the anode to the cathode.

Abstract: A radially anisotropic toroidal magnetic core is fabricated by a method including providing apparatus having a first magnet for providing a radial magnetic field extending across a cavity from an axial spindle to a surrounding second magnetic element, placing a substrate in the cavity, the substrate having a hole fitting around the head of the spindle; and sputter-depositing a film of ferromagnetic material onto the substrate. An alternative fabrication uses a similar fixture to impose magnetic anisotropy by annealing a previously-formed toroidal core. A particular fixture adapted for deposition by electroplating or for applying anisotropy by annealing pre-formed cores applies magnetic fields symmetrically from above and below the cores. Also described are the radially anisotropic core produced by the method, and an inductor having a coil wound on the radially anisotropic core.

Abstract: A surface treatment method for stainless steel as a colorful and smooth housing includes the steps of: a base layer including titanium is deposited on the stainless steel substrate by multi-arc ion plating. An aluminum transition layer is deposited on the titanium base layer by multi-arc ion plating, and an outermost layer including aluminum is deposited on the transition layer by magnetron sputtering. The transition layer and the outermost layer are anodized to form an anodic aluminum oxide film; and the anodic aluminum oxide film is sealed after being dyed. An article manufactured by the method is also provided.

Abstract: An outer blade cutting wheel comprising an annular thin disc base of cemented carbide and a blade section is manufactured by disposing permanent magnet pieces on the side surfaces and inward of the outer periphery of the base to produce a magnetic field, providing magnetic coated diamond and/or CBN abrasive grains such that the magnetic field may act on the grains, causing the grains to be magnetically attracted to the base outer periphery, and electroplating or electroless plating whereby the abrasive grains are bound to the base outer periphery to form the blade section.

Abstract: A method is disclosed for defining discrete magnetic and non-magnetic regions on the magnetic film layer of a storage media substrate. The method applies anodic oxidation of a cobalt-containing magnetic film layer to remove cobalt, followed by controlled deposition of a non-magnetic matrix into the regions where the cobalt has been removed. Deposition may either be electrodeposition, collimated vacuum deposition, or other methods depending upon the composition of the non-magnetic matrix being deposited. The method may be performed in a single electrochemical cell.

Abstract: Methods and apparatus for forming devices using nanotubes. In one embodiment, an apparatus for depositing nanotubes onto a workpiece comprises a vessel configured to contain a deposition fluid having a plurality of nanotubes including first nanotubes having a first characteristic and second nanotubes having a second characteristic. The apparatus further includes a sorting unit in the vessel configured to selectively isolate or otherwise sort the first nanotubes from the second nanotubes, and a field unit in the vessel configured to attach the first nanotubes to the workpiece. For example, the field unit can attach the first nanotubes to the workpiece such that the first nanotubes are at least generally parallel to each other and in a desired orientation relative to the workpiece.

Abstract: The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.

Abstract: An anode and cathode for an electrolytic cell configured as a low inductance transmission line to enable control of an interphase at an electrode surface. The anode and cathode are coupled to a switched current source by a low inductance path that includes a parallel plate transmission line, a coaxial transmission line, or both. The switched current source provides fast switching between current sources to provide fast charging and discharging of the double-layer capacitance associated with the electrode surface so that an isotope may be selectively transported to the electrode surface for oxidation or reduction. A photon source may be used to create a population of isotope containing species within the electrolyte. An additional static magnetic field and/or an alternating current magnetic excitation source may be used to modify the composition of the population of species containing the isotope to be separated.

Abstract: Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.

Abstract: The present disclosure generally relates to techniques for magnetic electroplating or electro-deposition. Example methods may include utilizing a magnet during electro-deposition to modify kinetics of deposition of plating material on a substrate.

Abstract: An outer blade cutting wheel comprising an annular thin disc base of cemented carbide and a blade section is manufactured by disposing permanent magnet pieces on the side surfaces and inward of the outer periphery of the base to produce a magnetic field, providing magnetic coated diamond and/or CBN abrasive grains such that the magnetic field may act on the grains, causing the grains to be magnetically attracted to the base outer periphery, and electroplating or electroless plating whereby the abrasive grains are bound to the base outer periphery to form the blade section.

Abstract: A method of forming a plating film capable of improving magnetic properties is provided. A photoresist pattern, having a first opening with an aspect ratio greater than 1 and a second opening with an aspect ratio smaller than that of the first opening, is formed on a surface of a substrate. A seed film is formed to cover an exposed surface of the substrate in the openings and an inner wall of the photoresist pattern in the openings. On the seed film in the openings, the plating film of magnetic material is deposited such that the first opening is filled under application of a magnetic field in the direction intersecting the surface of the substrate, and the second opening is filled under application of the magnetic field in the direction along the surface of the substrate.

Abstract: A plating method for forming a uniform magnetic film in conducting a plating treatment on a wafer with a magnetic film of, for instance, a Fe—Co-based alloy. Specifically, the method comprises the steps of supplying a plating solution through a plating-solution-supply section of a plating tank to a wafer, which placed on an opening of the plating tank, and conducting a plating treatment on the wafer while the plating solution is kept in contact with a plating target surface of the wafer, wherein the plating solution employed is one forming a magnetic film, and the plating treatment is done while a magnetic field is applied to the plating solution in contact with the plating target surface of the wafer.

Abstract: A magnetic film plating apparatus employs a dip method that allows relatively good escape of bubbles and does not require a wide footprint and, even when a ferromagnetic material is used for an anode, can form a magnetic film on a substrate surface while minimizing the influence of the anode on the uniformity of magnetic anisotropy in the magnetic film. The magnetic film plating apparatus includes a plating tank for holding a plating solution; an anode vertically disposed in the plating tank at a position to be immersed in the plating solution; a substrate holder for holding a substrate W and positioning the substrate W opposite the anode; and a magnetic field generator, disposed outside the plating tank, for generating a magnetic field around the substrate W held by the substrate holder and positioned opposite the anode.

Abstract: Disclosed herein is a composition for forming an inorganic pattern, comprising an inorganic precursor, at least one stabilizer selected from ?-diketone and ?-ketoester, and a solvent. Use of the composition enables efficient and inexpensive formation of an inorganic micropattern.

Abstract: Disclosed are a method and a device for filling material separations on the surface. In methods known in prior art, which are used for filling material separations, the substrate is often influenced in a negative manner by high processing temperatures and dissimilar additives. The inventive method overcomes said disadvantage, taking place at low temperatures and allowing the material separation to be completely filled without using dissimilar substances.

Abstract: An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process.

Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.

Abstract: For an electrolytic cell, an apparatus and method are described that use one or more sensors to measure magnetic field strength about a conductor carrying electrical current. A processor is in electrical communication with the sensors and determines a compensated magnetic field strength based on the magnetic fields of other conductors that also carry electrical current to or from the electrolytic cell. The processor uses this compensated magnetic field strength to determine the cathode electrical current carried by the conductor and to identify open and short circuits between the anodes and cathodes of the cell. The described apparatus and method account for interactions between the magnetic fields of the neighboring cathodes.

Abstract: A hybrid electro-deposition process for soft magnetic cobalt alloy films comprises providing a plating bath that includes cobalt and a reducing agent, providing a cobalt-containing anode in the plating bath coupled to a power supply, providing a substrate in the plating bath coupled to the power supply, wherein the substrate functions as a cathode, applying a magnetic field across the plating bath, and applying an electrical current to the plating bath by way of the power supply to cause the cobalt to deposit onto the substrate and form a soft magnetic film.

Abstract: An electroplating apparatus and method are provided. The electrolysis plating apparatus includes an electrolytic cell, and copper electrode, a wafer electrode, and a magnetic field generator.

Abstract: A process for forming magnetic targets for position and speed sensors, and magnetic targets formed according to the process. The targets are formed on a conductor-clad substrate by first applying a layer of photoresist material and then patterning and etching the photoresist to form trenches defining the shape and dimensions of the targets. Magnetic material is formed in the trenches and magnetized to form the targets.

Abstract: The invention relates to a method for metal coating the surface of high temperature superconductors with a copper-oxygen base structure. The aim of the invention is to achieve a method as above, which requires a low production complexity, serves for the production of contacts with a low electrical and/or thermal transfer resistance and which increases the stability of the metallization. Said aim is achieved whereby copper is applied to give low-ohmic contacts, and the linked achievement of a stable metallization between the HTS and the electrical and/or thermal coupling. Further advantageous effects are achieved with the method whereby the copper is applied in the form of copper alloys, in particular as copper-nickel or copper-zinc alloys. On applying the method it is furthermore of advantage for the creation of fine grained surface coatings to overlay the galvanic cell with a permanent and/or alternating magnetic field.

Abstract: Disclosed is a method of mounting chips, including the steps of: dipping a mounting board in a solvent in which chips are dispersed; and mounting the chips on the mounting board by forming electric field gradients on the mounting board in correspondence with positions where the chips are to be mounted. With this configuration, fine chips such as fine semiconductor chips can be mounted at desired positions on a mounting board with a high efficiency and a high yield.

Abstract: A method and apparatus for microencapsulating or electrodeposited coating of ferromagnetic and soft-magnetic sub-micron or nano sized powderized material comprising use of a rotary flow-through device assisted by an electromagnet within the electrode ring to alternately position the powder at the face of the cathode ring and electroplate the powder and reorient it prior to another repositioning. The invention is also of a process and apparatus for forming a strip, mesh, or film from magnetic powderized material in an organized bipolar arrangement, which is particularly useful for electroforming foils with the magnetic particles positioned in a monolayer within a multilayer metallic foil.

Abstract: A plating method and apparatus using contactless electrode is described. In one embodiment an inductive element is placed proximally to a substrate and a moving electromagnetic field generates an emf in the substrate to plate the surface. In another embodiment, a conductive plate is used, so that the conductive plate and the wafer, separated by a dielectric material, operate as two plates of a capacitor when voltage is applied to the conductive plate. The resulting electrostatic field impresses a charge potential on the substrate to plate the surface of the substrate.

Abstract: A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co100−a−bFeaMb, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.

Abstract: An electrolytic method is disclosed by which occlusion of hydrogen or sticking of atoms or molecules in plating and so forth is not disturbed by electronic magnetic force produced by main electric current and ion current flowing from the positive electrode to the negative electrode through electrolyte. An electric circuit separate from a positive electrode and a negative electrode is provided between the positive electrode and the negative electrode, and electric current of a direction opposite to that of main electric current and ion current flowing in the electrolyte from the positive electrode to the negative electrode is supplied to the electric circuit to produce an opposite magnetic field which cancels a magnetic field produced by the main electric current and the ion current flowing in the electrolyte.

Abstract: An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate support disposed therein and adapted to rotate a substrate. One or more electrical contact elements are disposed on the substrate support. A drive system is disposed proximate the housing. The drive system is magnetically coupled to and adapted to rotate the substrate support. In another embodiment, a method of plating a substrate includes the steps of covering a substrate supported within a housing with electrolyte, and displacing a portion of the electrolyte from the housing prior to electrically biasing the substrate, and electrically biasing the substrate.

Abstract: An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated with an inert material that is impervious to the electrolyte solution. In one embodiment, the anode is formed as a perforated anode. In one aspect, the electric field generating portion is formed contiguous with the electrolyte solution chemical reaction portion. In another aspects, the planar electric field generating portion is formed as a distinct member from the electrolyte solution chemical reaction portion.

Abstract: A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co100-a-bFeaMb, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.

Abstract: A method and apparatus for microencapsulating or electrodeposited coating of ferromagnetic and soft-magnetic sub-micron or nano sized powderized material comprising use of a rotary flow-through device assisted by an electromagnet within the electrode ring to alternately position the powder at the face of the cathode ring and electroplate the powder and reorient it prior to another repositioning. The invention is also of a process and apparatus for forming a strip, mesh, or film from magnetic powderized material in an organized bipolar arrangement, which is particularly useful for electroforming foils with the magnetic particles positioned in a monolayer within a multilayer metallic foil.

Abstract: An electrolytic plating system includes a coil for generating a magnetic field in the direction perpendicular to the subject surface of a wafer on which a Cu film is to be formed. The current components perpendicular to the magnetic field stirs the electrolytic solution without using a stirrer, thereby achieving a uniform thickness for the Cu film without a void therein.

Abstract: This invention relates to a bipolar electrochemical process for toposelective electrodeposition of a catalytic substance on an electrically conductive particulate substrate to produce a catalyst, as well as to the catalyst so produced.

Abstract: Disclosed is an Ni-plated layer of biaxial texture, which is formed by electroplating. In the Ni-plated layer,peaks measured on a &thgr;-rocking curve have a FWHM of 7° or less in terms of the misorientation on the c-axis; and peaks measured on &phgr;-scan have a FWHM of 21° or less in terms of the misorientation on the plane formed by the a-axis and the b-axis. Also, a process of electroplating a Ni layer are disclosed. The process comprises forming a Ni-plated layer of biaxial texture under a magnetic field by electroplating and subjecting the Ni-plated layer to thermal treatment to develop the biaxial texture. This electroplating process is expected to give a significant contribution to the development of the electroplating technology and to replace the vacuum deposition used for the preparation of thin film magnetic materials or thin film piezoelectric materials.

Abstract: An electrolytic method is disclosed by which occlusion of hydrogen or sticking of atoms or molecules in plating and so forth is not disturbed by electronic magnetic force produced by main electric current and ion current flowing from the positive electrode to the negative electrode through electrolyte. An electric circuit separate from a positive electrode and a negative electrode is provided between the positive electrode and the negative electrode, and electric current of a direction opposite to that of main electric current and ion current flowing in the electrolyte from the positive electrode to the negative electrode is supplied to the electric circuit to produce an opposite magnetic field which cancels a magnetic field produced by the main electric current and the ion current flowing in the electrolyte.

Abstract: A process for dewaxing waxy hydrocarbonaceous materials, such as hydrocarbon fuel and lubricating oil fractions to reduce their cloud and pour points comprises reacting the material with hydrogen in the presence of a dewaxing catalyst comprising at least one metal catalytic component and ferrierite in which at least a portion of its cation exchange positions are occupied by one or more trivalent rare earth metal cations. The rare earth ion exchanged ferrierite catalyst has good selectivity for lubricating oil production, particularly when dewaxing a Fischer-Tropsch wax hydroisomerate. Preferably at least 10% and more preferably at least 15% of the ferreirite cation exchange capacity is occupied by one or more trivalent rare earth metal cations.

Abstract: A method for producing electro- or electroless-deposited-film, in which the crystal orientation of the film is controlled to provide improved product properties. A paramagnetic material or diamagnetic material in its electrolytic-state is deposited on a substrate by an electro- or electroless-deposition process. A magnetic field having an intensity at least on the order of 7 T is applied in a predetermined direction, so as to perform the deposition in environment added with the magnetic field. A porous plate is preferably arranged adjacent to the substrate, for suppressing flow of an electrolytic liquid that may occur during the application of the magnetic field.

Abstract: A novel method and apparatus of wet processing workpieces, such as electroplating semiconductor wafers and the like, that incorporates reciprocating processing fluid agitation to control fluid flow at the workpiece, and where electric fields are involved as in such electroplating, controlling the electric field distribution.