Abstract: An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.

Abstract: The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: a container (10) intended to contain an electrolyte (E), a support (20) arranged in the container, said support being adapted for attachment of the semiconductor substrate (S) on said support (20), a counter-electrode (30) arranged in the container (10), illumination means (50) comprising a source (51) emitting light rays and means (52) to homogenize the light rays on all of said surface of the semiconductor substrate (S), so as to activate the surface of the semiconductor substrate (S), and an electric supply (40) comprising connection means for connection to the semiconductor substrate and to the counter-electrode in order to polarize said surface of said semiconductor substrate (S) at an electric potential permitting the electrochemical reaction.

Abstract: Methods of dispensing a small amount of liquid onto a work piece includes in some embodiments known providing a microscopic channel for the liquid to flow from the nanodispenser. In some embodiments, dispensing the liquid includes dispensing the liquid using a nanodispenser have at least one slit extending to the tip. Some methods include controlling the rate of evaporation or the rate of liquid flow to establish an equilibrium producing a bubble of a desired size.

Abstract: A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device comprises a plating tank, a laser oscillator for emitting a laser beam, a conveying device for conveying a member to be plated, a photoelectronic sensor for detecting the position of a positioning hole of the member to be plated, and a galvanometer scanner having a galvanometer mirror capable of scanning the laser beam. The plated member is applied with fine spot plating by the laser plating device.

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula AMxByOz, in which A is one or more elements selected from groups 10 and 11 of the Element Periodic Table; M is one or more metal elements in three plus selected from the group consisting of Fe, Co, Mn, Al, Ga, In, Tl, and rare earth elements; and O is oxygen; and x=0-2, y=0.01-2; z=1-4; and the accelerators further have a formula A?M?mOn, in which A? is one or more elements selected from groups 9, 10, and 11 of the periodic table; M is one or more elements selected from the group consisting of Cr, Mo, W, Se, Te, and Po; and O is oxygen; and m=0.01-2; n=2-4. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator.

Abstract: A first preferred method for increasing the solderability of a substrate comprising: preparing the substrate for nickel plating by cleaning and removal of surface contaminants; plating a first nickel film of the desired thickness directly onto the substrate; preparing the nickel film comprising thoroughly cleaning the surface; depositing a substantially pure nickel film directly on the first nickel film using a suitable PVD technique; and applying solder to the substantially pure nickel film. Another preferred method for increasing the solderability of a substrate comprising plating a first nickel layer directly onto the substrate by using an electrolytic or electroless nickel plating process; depositing a substantially pure nickel film directly on the first nickel film using physical vapor deposition; and applying solder to the substantially pure nickel film.

Abstract: The invention relates to a method for precision processing of substrates in which a liquid jet which is directed towards a substrate surface and contains a processing reagent is guided over the regions of the substrate to be processed, a laser beam being coupled into the liquid jet. Likewise, a device which is suitable for implementation of the method is described. The method is used for different process steps in the production of solar cells.

Abstract: A method for arranging particles according to one aspect of the present invention comprises the steps of: forming a thin film on a surface of a substrate, the thin film being obtained by dispersing first particles made of metal in a material, a surface of the material is to be charged to a first polarity in a predetermined solution; dispersing second particles in the solution, the second particles being charged to a second polarity opposite to the first polarity; immersing the thin film in the solution; and irradiating the thin film with light having a wavelength which causes plasmon resonance with surface plasmons of the metal particles.

Abstract: A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device comprises a plating tank, a laser oscillator for emitting a laser beam, a conveying device for conveying a member to be plated, a photoelectronic sensor for detecting the position of a positioning hole of the member to be plated, and a galvanometer scanner having a galvanometer mirror capable of scanning the laser beam. The plated member is applied with fine spot plating by the laser plating.

Abstract: The invention relates to a photovoltaic cell comprising a photovoltaically active semiconductor material, wherein the photovoltaically active semiconductor material is a p- or n-doped semiconductor material comprising mixed compounds of the formula (I): (Zn1?xMnxTe)1?y(SiaTeb)y ??(I) where x is from 0.01 to 0.99, y is from 0.01 to 0.2, a is from 1 to 2 and b is from 1 to 3.

Abstract: A method for fabricating a disc stamper is provided. First, a substrate is provided. Next, a layer of a coatable inorganic material is coated on the substrate, wherein the coatable inorganic material is an oxide, in which the chemical element constitution is more than one element selected from the group consisting of Te, Al, Zr, and Ti. Next, a laser beam is utilized to perform direct write on the layer of the coatable inorganic material to form a relief pattern. Thereafter, a metal layer is electroplated on the relief pattern. Next, the metal layer is separated from the relief pattern. The layer of the coatable inorganic material is utilized to form the relief pattern, so that it is more compatibility to equipment apparatus and lower cost in contrast with sputtered PTM process.

Abstract: Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. The systems and methods involve in situ removal of coating materials from the surfaces of the metal substrates while the substrates are either submerged in plating or etching solutions, or are positioned in a proximate enclosure just prior to submersion in the plating or etching solutions. Further, the substrates can be in contact with a suitable patterning mask to obtain patterned oxide-free regions for plating or etching. This in situ removal of coating layers may be achieved by pulse heating or photoablation of the substrate and the inhibiting coating layers. Electrical energy or laser light energy may be used for this purpose. Additionally or alternatively, the coating materials may be removed by mechanical means.

Abstract: A method for arranging particles according to one aspect of the present invention comprises the steps of: forming a thin film on a surface of a substrate, the thin film being obtained by dispersing first particles made of metal in a material, a surface of the material is to be charged to a first polarity in a predetermined solution; dispersing second particles in the solution, the second particles being charged to a second polarity opposite to the first polarity; immersing the thin film in the solution; and irradiating the thin film with light having a wavelength which causes plasmon resonance with surface plasmons of the metal particles.

Abstract: An anodic oxidation apparatus and an anodic oxidation method are provided that enable uniform photoirradiation of a treatment part of a target substrate, thereby realizing enhancement in uniformity of anodic oxidation in the surface of the target substrate. The anodic oxidation apparatus includes: a lamp that emits light; a target substrate holder provided at a position reached by the emitted light and capable of holding the target substrate; a cathode electrode that is provided on the way of the emitted light to reach the target substrate and that has an opening portion to allow light to pass therethrough and has a conductor section not transmitting light; and a vibrating mechanism to periodically vibrate a spatial position of one of the cathode electrode, the lamp, and the target substrate holder.

Abstract: A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippable coating and to activate an underlying region of the substrate surface exposed by the ablation of the strippable coating; contacting the substrate surface with a seeding solution containing polymer-stabilised catalytic seeding particles, so that the seeding particles adhere preferentially to the activated region of the substrate; and electrolessly plating the substrate surface, whereby the seeded areas of the substrate surface are selectively plated.

Abstract: An electrode fabrication method, electrolytic cell and laser stimulation system for producing heat and elevated electrode power densities in a water-based liquid electrolyte. The electrode fabrication process involves using a Hydrogen absorbing metal that will form a hydride, cold working said metal, etching said metal, polishing said metal, ultrasonically cleaning said metal and annealing said metal. The electrolytic cell of the system has a pair of external magnets adjacent to the cell providing a magnetic field across the face of the cathode. The electrolytic cell also has a secondary anode of Gold capable of providing Gold ions to plate over to the cathode during the course of electrolysis. The system also has a laser under computer control capable of tuning the laser to specific wavelengths capable of triggering heat evolution and elevated electrode power densities.

Abstract: Method for selectively metallizing dielectric materials, the method includes: adhesively covering dielectric materials with an activating layer comprising a conductive material, which layer is subsequently structured by way of laser ablation; and using a subsequent laser treatment to structure the activating layer in such a way that discrete conductive structures are formed, which are subsequently metallized.

Abstract: A method permitting less energy consumption and efficient formation of high quality electrodes is provided. An electrode is formed as an electrodeposited film by irradiating the surface of an object to be treated, the surface at least permitting generation of charged particles when irradiated with a laser beam, with a fentosecond laser beam and metal-plating the surface of a substrate using hot electrons generated by this laser irradiation.

Abstract: In a process for manufacturing an electrode (1) on a substrate (2) using a conventional structuring process, an electrically conducting surface structure is created which has at least one tip (3) or edge (4). In the area of the tip (3) or edge (4), an electrode layer (5) is galvanized onto the substrate (2) and/or applied by electrostatic powder coating. Then, a surface area of the substrate (2), which surrounds the electrode layer (5) located on the tip (3) or edge (4), is converted into an insulating layer (8) by a chemical reaction. The electrode layer (5) can also be applied in a manner where, in the area of the tip (3) or edge (4), a chemical is released, which upon irradiation by electromagnetic and/or particle radiation, precipitates an electrically conducting material. This chemical is then impinged in the area of the tip (3) or edge (4) with optical radiation.

Abstract: A method permitting less energy consumption and efficient formation of high quality electrodes is provided. An electrode is formed as an electrodeposited film by irradiating the surface of an object to be treated, the surface at least permitting generation of charged particles when irradiated with a laser beam, with a femtosecond laser beam and metal-plating the surface of a substrate using hot electrons generated by this laser irradiation.

Abstract: To provide a process for recording an image using a photoelectrodeposition method having high general-purpose properties that require no restriction on the selection of a material used as a substrate, a process for recording an image having (A) arranging a substrate 10 comprising a support 11, a conductive film 12 and a photosemiconductor thin film 13 laminated in this order, in such a manner that at least the photosemiconductor thin film 13 comes in contact with an electrodeposition solution 20; (B) applying an electric current or a voltage to the conductive film 12, and simultaneously irradiating the substrate 10 with light from the side of the photosemiconductor thin film 13 through the electrodeposition solution 20, and (C) generating a photoelectromotive force on a light irradiated part, so as to form an electrodeposition film 21 on the light irradiated part.

Abstract: A method for manufacturing a color filter having a high resolution and excellent controllability, in few steps without using a photolithographic process is disclosed.

Abstract: A bio-molecule analyzer includes an array of addressable light sources, a photoconductive layer of material having a layer of electrically conductive material on a surface thereof mounted on the array of addressable light sources, and a plurality of test sites on an opposing surface of the photoconductive layer of material defined by the plurality of light sources. A solution containing a plurality of bio-molecules is positioned in electrical contact with the plurality of test sites. An electrical potential is connected between the solution and the layer of electrically conductive material, whereby the array of addressable light sources emit beams of light through a plurality of portions of the photoconductive layer of material to define the test sites and complete electrical circuits between the layer of electrically conductive material and the solution.

Abstract: Creating relatively pure and consistent crystals of high performance minerals, such as diamond, has long been pursued. Unfortunately, synthesizing crystals that exhibit deep bonding generally requires high temperatures and high pressures for the formation of large crystals. Alternatively, high pressure and explosive shock waves can also be utilized, as demonstrated by closed-bomb diamond synthesis. Diamond crystal formation at lower temperatures and pressures have been demonstrated, but the formations have been thin and inconsistent. A method of forming diamond and the synthesis of other high performance crystals that are consistent, and can be grown to larger sizes has not existed, nor has a means of providing uniform and consistent thin layers of diamond and other such crystals been demonstrated.

Abstract: A method of photoelectro-manipulation of target molecules including providing a photoconductive layer of material having a first and a second electrically conductive contact on a first surface thereof and a probe on an opposed second surface. A solution containing target molecules is positioned in electrical contact with the probe. A positive potential is connected between the solution and the first electrically conductive contact and a negative potential is connected between the solution and the second electrically conductive contact. A beam of light is directed through a portion of the photoconductive layer of material to complete an electrical circuit between one of the first and the second electrically conductive contacts and the solution, whereby target molecules in the solution are attracted to or repelled from the probe which is coupled into the electrical circuit by the beam of light.

Abstract: A method of photoelectro-synthesizing probe arrays including the steps of providing a photoconductive layer of material having a layer of electrically conductive material on a first surface thereof and a solution of a plurality of a first oligonucleotide modified monomer positioned in electrical contact with an opposing second surface thereof such that a potential is connected therebetween. A beam of light is directed through a portion of the photoconductive layer of material to complete an electrical circuit between the layer of electrically conductive material and the solution through the portion of the photoconductive layer, whereby the monomers in the solution are electropolymerized on a surface area which is coupled into the electrical circuit by the beam of light.

Abstract: A photoelectrochemical method and apparatus are disclosed for fabricating electronic circuits. An electroplating solution is applied to the surface of a reverse biased p-type semiconductor material, such as NiO. The solution-covered NiO surface is illuminated with a light beam directed by computer aided design data to photoelectrochemically deposit a seed layer of metal in an electronic circuit pattern. The seed layer may be thickened by further deposition in a plating bath to form metallic circuit traces on the NiO. If desired, the metallic circuitry may be transferred from the NiO to an alternate substrate having a low dielectric constant. The porosity of the NiO surface can be adjusted to optimize the metallic circuit adhesion for image retention or ease of transfer. The metallic traces may also be treated to reduce adhesion of subsequently deposited metal that can be transferred readily.

Abstract: The invention provides a method for forming deposits of superconducting ceramics by sequentially electrodepositing layers of metals, of a type and in proportion suitable for forming a superconducting ceramic, to form a precursor metal deposit, followed by oxidizing the precursor deposit to form a superconducting ceramic deposit. Optionally, the electroplating steps are conducted in such a manner that a patterned precursor deposit results, to obtain a patterned superconducting deposit after oxidation.