Utilizing Electromagnetic Wave Energy During Coating (e.g., Visible Light, Etc.) Patents (Class 205/91)
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Patent number: 11769851Abstract: The present disclosure provides a method for treating a surface portion of a TCO material in a semiconductor device that comprises a structure arranged to facilitate current flow in one direction. To perform the method the surface portion of the TCO is exposed to an electrolyte and a current is induced in the device. The current allows reducing the TCO material in a manner such that the adhesion of a metallic material to the exposed surface portion is improved over the adhesion of the metallic material to a non-exposed surface portion.Type: GrantFiled: February 24, 2017Date of Patent: September 26, 2023Assignee: NewSouth Innovations Pty LimitedInventors: Alison Joan Lennon, Vincent Akira Allen
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Patent number: 11629073Abstract: The present invention relates to a hybrid system for water treatment, desalination, and chemical production. The hybrid system of the present invention includes a photoanode, an anode chamber, an anion exchange membrane, a middle chamber, a cation exchange membrane, a cathode chamber, and a cathode. In the middle chamber, saltwater or seawater is desalinated by photoelectrochemical electrodialysis. Chloride ions are generated during the desalination, transferred to the anode chamber, and activated by the photoanode. In the anode chamber, wastewater is treated by the activated chloride ions. In the cathode chamber, at least one chemical species selected from the group consisting of water, oxygen, and carbon dioxide is reduced by electrons supplied from the photoanode.Type: GrantFiled: May 11, 2018Date of Patent: April 18, 2023Assignee: KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Hyun Woong Park, Seong Hun Kim
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Patent number: 11460424Abstract: An evaluation method is for evaluating a charging connector in coolability by connecting an evaluation jig to the charging connector, the charging connector including a pair of male terminals and a bottom wall, the evaluation jig including a pair of female terminals, the pair of female terminals being connected to the pair of male terminals in evaluating the charging connector in coolability. The method comprises: connecting the pair of female terminals to the pair of male terminals; and adjusting a connection state of the terminals so that contact resistance between the terminals falls within a prescribed range. In the step of adjusting, a resistance between a point of 4.5 mm of the male terminal from a surface of the bottom wall and a point of 43 mm of the female terminal from the surface of the bottom wall is measured as the contact resistance.Type: GrantFiled: December 10, 2020Date of Patent: October 4, 2022Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hisato Kawahara, Hiroaki Yuasa, Hidetoshi Kusumi
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Patent number: 11402406Abstract: An evaluation method is a method for evaluating a charging connector in coolability by connecting an evaluation jig to the charging connector, the charging connector including a pair of male terminals coolable with a coolant, the evaluation jig including a pair of female terminals, the pair of female terminals being connected to the pair of male terminals in evaluating the charging connector in coolability. The method comprises: connecting the pair of female terminals to the pair of male terminals; adjusting a connection state between the male terminal and the female terminal such that contact resistance between the terminals is 0.06 m? or more and 0.15 m? or less; and after the adjusting, evaluating the coolability depending on whether the male and female terminals have a temperature of 90° C. or lower when a charging current of 400 A is supplied to the terminals for 30 minutes.Type: GrantFiled: December 9, 2020Date of Patent: August 2, 2022Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hisato Kawahara, Hiroaki Yuasa, Hidetoshi Kusumi
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Patent number: 10950742Abstract: A method for preparing a film of a CIS semiconductor compound overcoated by a color layer includes preparing an electrolyte solution by mixing precursors of film constituents including Cu, In, and Se with a solvent; configuring an electrodeposition circuit by connecting an electrochemical cell comprising the electrolyte solution, a working electrode, and a counter electrode to a voltage or current supply device; disposing a photomask having the predetermined pattern on the working electrode; producing the film through the photomask on a surface of the working electrode by applying a reduction voltage or current; disposing a light source to emit light toward the photomask; and photoelectrically depositing the film on the surface of the working electrode at least in the predetermined pattern while illuminating light through the photomask; and forming a color layer of CuSe at least in the predetermined pattern on the film employed as a working electrode using photo-electrodeposition.Type: GrantFiled: November 1, 2017Date of Patent: March 16, 2021Assignee: Korea Institute of Science and TechnologyInventors: Doh Kwon Lee, In Ho Kim, Hee Sun Yun, Jang Mi Lee
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Patent number: 10537520Abstract: The present invention relates to stable, liquid parenteral formulations of Melphalan or pharmaceutically acceptable salts thereof. Further this invention also describes process of preparing such formulations.Type: GrantFiled: June 29, 2016Date of Patent: January 21, 2020Assignee: LEIUTIS PHARMACEUTICALS PVT. LTD.Inventors: Kocherlakota Chandrashekhar, Banda Nagaraju
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Patent number: 9450136Abstract: A structure and method of making a thin-film solar cell is provided. A thin-film solar cell includes a substrate, absorber layer and a buffer layer. The absorber layer is deposited by a single-step bulk electrochemical process, or a multi-layer electrochemical process. The buffer layer is deposited by an electrochemical deposition process such as a multi-layer deposition or an atomic layer deposition. The absorber and buffer layers are non-toxic materials which can include sulfur incorporated during the deposition process or incorporated after deposition by an anneal step.Type: GrantFiled: April 29, 2015Date of Patent: September 20, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Lian Guo, Raman Vaidyanathan
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Patent number: 9447514Abstract: A structure and method of making a thin-film solar cell is provided. A thin-film solar cell includes a substrate, absorber layer and a buffer layer. The absorber layer is deposited by a single-step bulk electrochemical process, or a multi-layer electrochemical process. The buffer layer is deposited by an electrochemical deposition process such as a multi-layer deposition or an atomic layer deposition. The absorber and buffer layers are non-toxic materials which can include sulfur incorporated during the deposition process or incorporated after deposition by an anneal step.Type: GrantFiled: April 29, 2015Date of Patent: September 20, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Lian Guo, Raman Vaidyanathan
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Patent number: 9403293Abstract: An anodized layer formation method of an embodiment of the present invention includes the steps of: (a) providing an aluminum base which has a surface that is made of aluminum; (b) anodizing the surface to form a barrier-type alumina layer; and (c) after step (b), further anodizing the surface to form a porous alumina layer which has a plurality of minute recessed portions. According to an embodiment of the present invention, a method is provided that enables formation of a porous alumina layer which has an interpore distance of a desired magnitude with the use of an aluminum base which has a surface that is made of aluminum, irrespective of the surface form.Type: GrantFiled: August 31, 2010Date of Patent: August 2, 2016Assignee: SHARP KABUSHIKI KAISHAInventors: Akinobu Isurugi, Kiyoshi Minoura, Takao Imaoku
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Publication number: 20150144495Abstract: A method of depositing aluminum onto a substrate is disclosed. In this method, the substrate is disposed as cathode in an electrochemical cell with an anode and a liquid electrodeposition composition comprising an ionic liquid and a source of aluminum, and aluminum is electroplated onto the substrate. Residual water content in the electroplating bath is controlled by exposure to light in the presence of a photo-oxidation catalyst to decompose the water or species associated with water.Type: ApplicationFiled: November 22, 2013Publication date: May 28, 2015Applicant: Sikorsky Aircraft CorporationInventors: Lei Chen, Xiaomei Yu, William P. Fallon
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Patent number: 8926805Abstract: An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.Type: GrantFiled: July 30, 2012Date of Patent: January 6, 2015Assignee: International Business Machines CorporationInventors: Veeraraghavan S. Basker, Eduard Cartier, Hariklia Deligianni, Rajarao Jammy, Vamsi K. Paruchuri
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Patent number: 8840768Abstract: A preparation method for molecular recognition sensor by electrodeposition is provided. The preparation method is as following: forming molecularly imprinted polymeric micelles by self-assembly of ionic type photosensitive copolymers; forming a film on the surface of an electrode by electrodepositing the molecularly imprinted polymeric micelles at a constant potential; crosslinking the electrodeposited micellar film via ultraviolet light irradiation; extracting the template molecules from the crosslinked film to obtain electrode modified by the molecularly imprinted polymeric micellar film; and connecting the modified electrode with a sensor device and a computer to construct a molecular recognition sensing system capable of specifically detecting the template molecules.Type: GrantFiled: July 31, 2012Date of Patent: September 23, 2014Assignee: Jiangnan UniversityInventors: Xiaoya Liu, Yiqun Yang, Chenglin Yi, Jing Luo, Haiqiang Wu, Sisi Jiang, Baoqing Wang, Jinqiang Jiang, Ren Liu, Shengwen Zhang, Jing Xu
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Publication number: 20140261613Abstract: Various technologies described herein pertain to assembling electronic devices into a microsystem. The electronic devices are disposed in a solution. Light can be applied to the electronic devices in the solution. The electronic devices can generate currents responsive to the light applied to the electronic devices in the solution, and the currents can cause electrochemical reactions that functionalize regions on surfaces of the electronic devices. Additionally or alternatively, the light applied to the electronic devices in the solution can cause the electronic devices to generate electric fields, which can orient the electronic devices and/or induce movement of the electronic devices with respect to a receiving substrate. Further, electrodes on a receiving substrate can be biased to attract and form connections with the electronic devices having the functionalized regions on the surfaces. The microsystem can include the receiving substrate and the electronic devices connected to the receiving substrate.Type: ApplicationFiled: October 23, 2013Publication date: September 18, 2014Applicant: Sandia CorporationInventors: Gregory N. Nielson, Murat Okandan
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Patent number: 8795503Abstract: The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: a container (10) intended to contain an electrolyte (E), a support (20) arranged in the container, said support being adapted for attachment of the semiconductor substrate (S) on said support (20), a counter-electrode (30) arranged in the container (10), illumination means (50) comprising a source (51) emitting light rays and means (52) to homogenize the light rays on all of said surface of the semiconductor substrate (S), so as to activate the surface of the semiconductor substrate (S), and an electric supply (40) comprising connection means for connection to the semiconductor substrate and to the counter-electrode in order to polarize said surface of said semiconductor substrate (S) at an electric potential permitting the electrochemical reaction.Type: GrantFiled: March 25, 2010Date of Patent: August 5, 2014Assignee: AlchimerInventors: Said Zahraoui, Francis Descours, Frederic Raynal
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Patent number: 8795502Abstract: A method of forming patterned metallization by electrodeposition under illumination without external voltage supply on a photovoltaic structure or on n-type region of a transistor/junction.Type: GrantFiled: May 12, 2010Date of Patent: August 5, 2014Assignee: International Business Machines CorporationInventors: John M. Cotte, Harold J. Hovel, Devendra K. Sadana, Xiaoyan Shao, Steven Erik Steen
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Publication number: 20140209471Abstract: A method and apparatus for electrochemically forming an oxide layer on a flat conductive surface which involves positioning a working electrode bearing the flat conductive surface in opposed parallel spaced apart relation to a flat conductive surface of a counter electrode such that the flat conductive surface of the working electrode and the flat conductive surface of the counter electrode are generally opposed, horizontally oriented, and define a space therebetween.Type: ApplicationFiled: September 8, 2011Publication date: July 31, 2014Applicant: CLEAR METALS, INC.Inventors: Leonid Borisovich Rubin, Alexander Sergeyevich Osipov, Elena Borisovna Neburchilova
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Publication number: 20140174936Abstract: Monovalent copper plating baths are used to metallize current tracks of the front side or emitter side of semiconductor wafers. Copper is selectively deposited on the current tracks by electrolytic plating or LIP. Additional metallization of the current tracks may be done using conventional metal plating baths. The metalized semiconductors may be used in the manufacture of photovoltaic devices.Type: ApplicationFiled: April 19, 2012Publication date: June 26, 2014Applicant: Rohm and Haas Electronic Materials LLCInventors: Gary Hamm, Jason A. Reese, Lingyun Wei
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Publication number: 20140110264Abstract: A simple and fast light induced nickel plating method for p-type silicon wafer and n/p silicon solar cell material is revealed. When a n/p solar cell or p-Si semiconductor substrate, which is subjected to metallization with metal contact on the rear side, is immersed in a plating bath, metal ions are reduced on the front surface of semiconductor as soon as illumination starts on the front. The mechanism of nickel plating in this invention is nickel electroplating under the reduction reaction with the use of interfacial potential between the nickel plating bath and the metal surface. It does not need any surface catalytic processing and extra voltage. Instead, it can carry out the nickel deposition on the specific surface with a high nickel plating rate, a simple process and a low production cost.Type: ApplicationFiled: October 24, 2012Publication date: April 24, 2014Applicant: Atomic Energy Council-Institute of Nuclear ResearchInventors: Yu-Han Su, Wei-Yang Ma, Tsun-Neng Yang
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Publication number: 20140103538Abstract: One embodiment is a method for void-free metallic electrofilling inside openings, said method includes: providing a substrate with at least one opening, the substrate includes an electrically conductive surface, including inside the at least one opening; immersing the substrate in an electrolyte contained in an ECD cell, the ECD cell includes at least one anode and a cathode, the cathode includes at least a portion of the conductive surface, the electrolyte includes plating metallic ions and at least one inhibitor additive, said metallic ions and at least one inhibitor additive having concentrations; providing electrolyte agitation across the substrate surface; and applying electroplating current density to the substrate; wherein the agitation, the concentrations, and the electroplating current density are such to produce void-free metallic electrofilling of the at least one opening, and wherein a height of electrodeposited surface bumps, or transition steps or humps, or transition spikes, is less than 140 nmType: ApplicationFiled: November 30, 2012Publication date: April 17, 2014Inventor: Uri Cohen
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Publication number: 20140008234Abstract: A metal underlayer is selectively plated on semiconductor wafers immediately followed by plating copper on the metal underlayer using a low internal stress copper plating bath. Additional metallization may be done to build up the metal layers using conventional metal plating baths and methods to form current tracks. Formation of metal silicides is avoided. Good adhesion of the metals to the semiconductors is achieved. The metalized semiconductors may be used in the manufacture of photovoltaic devices.Type: ApplicationFiled: July 9, 2012Publication date: January 9, 2014Applicant: Rohm and Haas Electronic Materials LLCInventors: Lingyun WEI, Gary HAMM, Narsmoul KARAYA, JR.
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Publication number: 20130327649Abstract: A method of manufacturing a biosensor having a microbeam linked to a support, at least one electrode a biological molecule A grafted onto the microbeam in a different zone from the zone where the electrode is embedded, and a mechanoelectrical transducer for converting variations of the mechanical properties of the microbeam into an electrical signal, when the biological molecule A is placed in contact with a biological molecule B to be detected and/or quantified. The method includes: formation of an electrode on fluoropolymer material sheet, passivation of the electrode(s), creation of the form of the biosensor in the sheet of polymer material and separation of this form from the sheet, functionalization either of a prefunctionalized zone or of a zone of the microbeam, this zone being different from the zone wherein the electrode is embedded, and grafting of a biological molecule A onto the functionalized zone.Type: ApplicationFiled: February 14, 2012Publication date: December 12, 2013Applicant: Commissariat A L'Energie Atomique Et Aux Energies AlternativesInventors: Jérôme Polesel Maris, Thomas Berthelot
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Patent number: 8603314Abstract: Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.Type: GrantFiled: December 13, 2011Date of Patent: December 10, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Gary Hamm, Jason A. Reese, George R. Allardyce
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Patent number: 8594417Abstract: Systems and methods for inspecting anodes, and smelting management based thereon are provided. In one embodiment, a system includes an imaging device configured to obtain images of at least one anode assembly, an image processor configured to producing imaging data based on the images, and a data analyzer configured to produce anode characteristic data based on the imaging data. In one embodiment, a method includes the steps of obtaining at least one image of at least a portion of an anode assembly, producing imaging data based on the at least one image, and deriving anode characteristic data based, at least in part, on the imaging data.Type: GrantFiled: November 27, 2007Date of Patent: November 26, 2013Assignee: ALCOA Inc.Inventors: Jean-Pierre Gagné, Gilles Dufour
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Patent number: 8551313Abstract: An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.Type: GrantFiled: November 15, 2007Date of Patent: October 8, 2013Assignee: International Business Machines CorporationInventors: Veeraraghavan S. Basker, Eduard Cartier, Hariklia Deligianni, Rajarao Jammy, Vamsi K. Paruchuri
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Publication number: 20130240364Abstract: The provided method includes photoelectrodeposition of an electrocatalyst onto a semiconductor to form a photoanode. The method yields composite photoanodes showing enhancement of photocurrent (water splitting rate) when incorporated into a photoelectrochemical cell for water electrolysis.Type: ApplicationFiled: September 7, 2012Publication date: September 19, 2013Applicant: UNIVERSITY OF WASHINGTONInventors: Daniel R. Gamelin, Diane K. Zhong
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Publication number: 20130233718Abstract: A material surface treatment protocol (e.g., FIG. 13) uses concurrent electronic and photonic stimulation to generate an exothermic reaction and coat the surface (e.g., FIGS. 8 and 9) of a material, such as palladium. This protocol is performed at or near the boiling point of water within a sealed vessel that prevents the escape of steam and that is lined with silica or a similar glass to increase the silica available to the reaction. The great majority of the applied energy is heat used to elevate the temperature to near the boiling point, while concurrent stimulations provide only about 100 mW of additional energy for the surface treatment.Type: ApplicationFiled: April 30, 2013Publication date: September 12, 2013Inventors: Brian P. Roarty, Carol J. Walker
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Publication number: 20130199830Abstract: By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.Type: ApplicationFiled: August 5, 2011Publication date: August 8, 2013Applicant: Hitachi Chemical Company LtdInventors: Masaki Morita, Konatsu Nakamura, Shin Takanezawa
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Publication number: 20130183534Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.Type: ApplicationFiled: September 30, 2011Publication date: July 18, 2013Applicants: Kunio Mori, Meiko Electronics Co., Ltd., Sulfur Chemical Institute IncorporatedInventors: Kunio Mori, Yusuke Matsuno, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
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Publication number: 20130161614Abstract: Nanostructured films including a plurality of nanowells, the nanowells having a pore at the top surface of the film, the pore defining a channel that extends downwardly towards the bottom surface of the film are provided. Also provided are methods including exposing a growth substrate to an anodizing bath, applying ultrasonic vibrations to the anodizing bath, and generating a current through the anodizing bath to form the nanostructured film. The nanostructured films may be formed from TiO2 and may be used to provide solid state dye sensitized solar cells having high conversion efficiencies.Type: ApplicationFiled: July 29, 2011Publication date: June 27, 2013Inventors: Ashutosh Tiwari, Michael Snure, Makarand Karmarkar
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Publication number: 20120318673Abstract: An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.Type: ApplicationFiled: August 28, 2012Publication date: December 20, 2012Applicant: International Business Machines CorporationInventors: Veeraraghavan S. Basker, John M. Cotte, Hariklia Deligianni, Matteo Flotta
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Publication number: 20120292192Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.Type: ApplicationFiled: April 30, 2012Publication date: November 22, 2012Inventors: Manish RANJAN, Shantinath GHONGADI, Frederick Dean WILMOT, Douglas HILL, Bryan L. BUCKALEW
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Publication number: 20120285833Abstract: A preparation method for molecular recognition sensor by electrodeposition is provided. The preparation method is as following: forming molecularly imprinted polymeric micelles by self-assembly of ionic type photosensitive copolymers; forming a film on the surface of an electrode by electrodepositing the molecularly imprinted polymeric micelles at a constant potential; crosslinking the electrodeposited micellar film via ultraviolet light irradiation; extracting the template molecules from the crosslinked film to obtain electrode modified by the molecularly imprinted polymeric micellar film; and connecting the modified electrode with a sensor device and a computer to construct a molecular recognition sensing system capable of specifically detecting the template molecules.Type: ApplicationFiled: July 31, 2012Publication date: November 15, 2012Inventors: Xiaoya LIU, Yiqun Yang, Chenglin Yi, Jing Luo, Haiqiang Wu, Sisi Jiang, Baoqing Wang, Jinqiang Jiang, Ren Liu, Shengwen Zhang, Jing Xu
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Patent number: 8303791Abstract: An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.Type: GrantFiled: August 26, 2008Date of Patent: November 6, 2012Assignee: International Business Machines CorporationInventors: Veeraraghavan S. Basker, John M. Cotte, Hariklia Deligianni, Matteo Flotta
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Publication number: 20120048378Abstract: A structure and method of making a thin-film solar cell. A thin-film solar cell includes a substrate, absorber layer and a buffer layer. The absorber layer is deposited by a single-step bulk electrochemical process, or a multi-layer electrochemical process. The buffer layer is deposited by an electrochemical deposition process such as a multi-layer deposition or an atomic layer deposition. The absorber and buffer layers are non-toxic materials which can include sulfur incorporated during the deposition process or incorporated after deposition by an anneal step.Type: ApplicationFiled: August 31, 2011Publication date: March 1, 2012Applicant: International Business Machines CorporationInventors: Hariklia Deligianni, Lian Guo, Raman Vaidyanathan
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Publication number: 20120000785Abstract: The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: a container (10) intended to contain an electrolyte (E), a support (20) arranged in the container, said support being adapted for attachment of the semiconductor substrate (S) on said support (20), a counter-electrode (30) arranged in the container (10), illumination means (50) comprising a source (51) emitting light rays and means (52) to homogenize the light rays on all of said surface of the semiconductor substrate (S), so as to activate the surface of the semiconductor substrate (S), and an electric supply (40) comprising connection means for connection to the semiconductor substrate and to the counter-electrode in order to polarize said surface of said semiconductor substrate (S) at an electric potential permitting the electrochemical reaction.Type: ApplicationFiled: March 25, 2010Publication date: January 5, 2012Applicant: ALCHIMERInventors: Said Zahraoui, Francis Descours, Frederic Raynal
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Publication number: 20110278172Abstract: A method of forming patterned metallization by electrodeposition under illumination without external voltage supply on a photovoltaic structure or on n-type region of a transistor/junction.Type: ApplicationFiled: May 12, 2010Publication date: November 17, 2011Applicant: International Business Machines CorporationInventors: John M. Cotte, Harold J. Hovel, Devendra K. Sadana, Xiaoyan Shao, Steven E. Steen
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Publication number: 20110253545Abstract: The present disclosure provides a method of electrodeposition of a metal or metal alloy on at least one surface of a semiconductor material. The method of the present invention provides full coverage of an electrodeposited metallic film on the at least one surface of the semiconductor material. The method of the present disclosure includes providing a semiconductor material. A metallic film is applied to at least one surface of the semiconductor material by an electrodeposition process. The electrodeposition process employed uses current waveforms that apply a low current density initially, and after a predetermined period of time, the current density is changed to a high current density.Type: ApplicationFiled: April 19, 2010Publication date: October 20, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Laura L. Kosbar, Xiaoyan Shao
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Publication number: 20110212344Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula AMxByOz, in which A is one or more elements selected from groups 10 and 11 of the Element Periodic Table; M is one or more metal elements in three plus selected from the group consisting of Fe, Co, Mn, Al, Ga, In, Tl, and rare earth elements; and O is oxygen; and x=0-2, y=0.01-2; z=1-4; and the accelerators further have a formula A?M?mOn, in which A? is one or more elements selected from groups 9, 10, and 11 of the periodic table; M is one or more elements selected from the group consisting of Cr, Mo, W, Se, Te, and Po; and O is oxygen; and m=0.01-2; n=2-4. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator.Type: ApplicationFiled: November 19, 2010Publication date: September 1, 2011Inventors: Qing Gong, Liang Zhou, Weifeng Miao, Xiong Zhang
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Publication number: 20110171600Abstract: A bio-implant having a screw body selectively formed with nanoporous channels structure in a spiral groove and the method of making the same are disclosed. Nanoporous channels structure formed into the spiral groove of the bio-implant is carried out by the heat treatment in vacuum firstly and anodic treatment secondly. Thereafter, bioactive material is filled into the nanoporous and deposited on the implant surface by an electro-deposition process so as to increase the bioactivity and biocompatibility of the bio-implant.Type: ApplicationFiled: May 11, 2010Publication date: July 14, 2011Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventors: Chung-Kuang Yang, Sea-Fue Wang, Sheng-Yang Lee, Jen-Chang Yang, I-lin Ho
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Publication number: 20110132764Abstract: A process for producing a photovoltaic structure that includes a thin coating film, generally made of a transparent conductive oxide, deposited on top of a sublayer having photovoltaic properties. The coating film is deposited electrochemically in an electrolysis bath and at least partly assisted by illumination coming from a light source.Type: ApplicationFiled: July 28, 2009Publication date: June 9, 2011Applicants: ELECTRICITE DE FRANCE, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE- CNRSInventors: Daniel Lincot, Jean Rousset
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Publication number: 20110062028Abstract: An apparatus for electroplating one or more surfaces (2,3) on one or more substrates (1), especially solar cells (1a), is described. The apparatus includes an electrochemical coating bath (13), which has a coating tank (12) filled with an electrochemical coating liquid (14). The apparatus also includes a conveying device (15) for transporting the substrate through the coating bath (13), a light source circuit (60) with light sources (64) for irradiating the substrate (1) and an electrolytic cell rectifier circuit (50) for the substrate with anodes (54). The apparatus is characterized by a device for generating synchronous current pulses and light pulses, so that during a time interval between the current pulses the irradiating of the substrate or substrates is interrupted. A process for electrochemical plating of the surface of the substrate or substrates is also described.Type: ApplicationFiled: September 16, 2010Publication date: March 17, 2011Inventors: Lothar Lippert, Stefan Dauwe
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Publication number: 20110011745Abstract: A method for electrochemically depositing a metal electrode of a solar cell, comprising the steps of: making the surface of the solar cell having a cathode contact with an electrolyte solution, connecting an anode of the solar cell and a solid metal, illuminating the main light-receiving surface of the solar cell, wherein metal ions in the electrolyte solution accept electrons formed on the cathode surface of the solar cell so that a metal is formed and deposited on the cathode surface of the solar cell, meanwhile, the solid metal provides electrons to the anode of the solar cell so that the metal ions are formed and dissolved in the electrolyte solution.Type: ApplicationFiled: January 29, 2008Publication date: January 20, 2011Applicant: WUXI SUNTECH POWER CO., LTD.Inventors: Jingjia Ji, Stuart Wenham, Liping Chen, Zhengrong Shi
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Patent number: 7804046Abstract: In order that an object can be warmed through the use of thermoacoustic effect, the acoustic heating apparatus includes a first stack 3a sandwiched between a high-temperature-side heat exchanger 4 and a low-temperature input-side heat exchanger 5 in a first tube portion 2a and a second stack 3b sandwiched between a low-temperature-side heat exchanger 6 and a high-temperature output-side heat exchanger 7 in a second tube portion 2b. A standing wave and a traveling wave are generated through self excitation in the first tube portion 2a by cooling the low-temperature input-side heat exchanger 5 to minus 20° C. to 60° C. A temperature gradient is generated in the second stack 3b by propagating the resulting standing wave and the traveling wave to the second tube portion 2b, and high-temperature heat is output due to this temperature gradient from the high-temperature output-side heat exchanger 7 disposed on the second stack 3b side.Type: GrantFiled: March 23, 2005Date of Patent: September 28, 2010Assignee: The DoshishaInventors: Yoshiaki Watanabe, Shinichi Sakamoto
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Publication number: 20100224498Abstract: A method for producing a wear and corrosion resistant WC based material coated with one or more metals selected from group IVB, VB and VIB metals (according to CAS system) and Al is disclosed. The method comprises treating of said coated structure with electrochemical boriding treatment in an electrolyte which is substantially free of halogenated compounds wherein the electrolyte comprises alkali carbonates and boron sources and said electrolyte being heated during electrolysis under an induction heating regime having electromagnetic frequency ranging from 50 to 300 kHz during electrolysis.Type: ApplicationFiled: November 6, 2008Publication date: September 9, 2010Inventors: Mustafa K. Ürgen, Servet I. Timur, Kürsat M. Kazmanli, Güldem Kartal
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Publication number: 20100200408Abstract: A metal and oxygen material such as a transparent electrically conductive oxide material is electro deposited onto a substrate in a solution deposition process. Process parameters are controlled so as to result in the deposition of a high quality layer of material which is suitable for use in a back reflector structure of a high efficiency photovoltaic device. The deposition may be carried out in conjunction with a masking member which operates to restrict the deposition of the metal and oxygen material to specific portions of the substrate. In particular instances the deposition may be implemented in a continuous, roll-to-roll process. Further disclosed are semiconductor devices and components of semiconductor devices made by the present process, as well as apparatus for carrying out the process.Type: ApplicationFiled: February 11, 2009Publication date: August 12, 2010Applicant: United Solar Ovonic LLCInventors: Shengzhong Liu, Chaolan Hu, Yanhua Zhou, Kais Younan, Bud Dotter, II, Vincent Cannella, Arindam Banerjee, Jeffrey Yang, Subhendu Guha
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Publication number: 20100108525Abstract: An apparatus for the light-supported precipitation of an electrolyte on a semiconductor component comprises a plating bath with an electrolyte, a first electrode arranged in the plating bath and a second electrode arranged outside the plating bath, a holding device for the semiconductor component and an irradiation device for irradiating the semiconductor component with electromagnetic radiation, the irradiation device being arranged outside the plating bath.Type: ApplicationFiled: November 5, 2009Publication date: May 6, 2010Inventors: Andreas Krause, Bernd Bitnar, Claudia Lengsfeld, Holger Neuhaus
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Publication number: 20100108524Abstract: The invention relates to a method for manufacturing an article comprising a barrier layer, the method comprising—providing an metallic or metalloid layer to a surface of a substrate by electro-deposition, using a plating liquid comprising an ionic liquid and metal ions or metalloid ions, which metal ions or metalloid ions are reduced and deposited to form the metallic or metalloid layer during the electro-deposition; and—preferably at least partially oxidising the metallic or metalloid layer.Type: ApplicationFiled: April 17, 2008Publication date: May 6, 2010Applicant: Nederlandse Organisatie voor toegepast-natuurweten schappelijk onderzoek TNOInventors: Antonius Maria Bernardus van Mol, Harmannus Franciscus Maria Schoo, Petrus Marinus Martinus Cornelus Bressers, Joost van Erkel, Marinus Marc Koetse
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Publication number: 20100087916Abstract: A method for manufacturing a degradation-inhibiting first layer on the surface of an implant body, in particular an intraluminal endoprosthesis, whereby the body has at least one metallic material, which is at least largely biodegradable, comprising the following steps: preparing the body of the implant, and applying the first layer to at least a portion of the body surface, whereby the first layer contains magnesium stearate. An implant obtainable by such a method.Type: ApplicationFiled: September 24, 2009Publication date: April 8, 2010Applicant: BIOTRONIK VI PATENT AGInventors: Ullrich Bayer, Baerbel Becher, Bernd Block
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Publication number: 20100072070Abstract: A plurality of pixels, each including first and second electrodes and an electrolytic solution, are arranged. When a voltage between the first and the second electrodes increases into a precipitation critical value or more, the precipitation of electroplating starts. When the voltage decreases into a value smaller than the deposition overvoltage value, the precipitation ends. A control unit controlling the voltage between the first and second electrodes repeats a subfield operation including a first operation of selectively supplying any of first, a second voltage and third voltages to the plurality of pixels, and a second operation of collectively supplying the second voltage value to the plurality of pixels after the first operation, at least two times or more, to control the gradation of each pixel based on a timing of supplying the third voltage.Type: ApplicationFiled: September 3, 2009Publication date: March 25, 2010Applicant: CANON KABUSHIKI KAISHAInventor: Hajime Ikeda
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Publication number: 20100021650Abstract: Disclosed herein are a method of producing microstructure and a method of producing mold, the methods permitting production of much smaller pores than before in an atmosphere where impurities are negligible and also permitting production of microstructures having a smaller size and a higher crystallinity than before with the help of the pores. The method of producing microstructure comprises a step of making pores (4) in a substrate (1) to become a mold (5) by irradiation with a focused energy beam (3) and a step of growing a microstructure (8) in the thus made pores (4). The method of producing a mold includes a step of making pores (4) by irradiating a substrate (1) to become a mold (5) with a focused energy beam (3).Type: ApplicationFiled: May 26, 2009Publication date: January 28, 2010Applicant: Sony CorporationInventors: Koji Kadono, Yosuke Murakami