Treating Process Fluid By Means Other Than Agitation Or Heating Or Cooling Patents (Class 205/98)
  • Patent number: 11230781
    Abstract: It is an object of the present disclosure to provide a method that allows uniformly forming a silver film by a solid electrolyte deposition. One aspect of this embodiment is a method for forming a silver film. The method includes disposing an anode, a substrate as a cathode, and a separator such that the separator is positioned between the anode and the substrate and the separator is in contact with a surface of the substrate, the separator including an electrolytic solution that contains silver ions, and applying a voltage between the anode and the substrate to form a silver film on the substrate. The separator is a porous membrane without ion exchange functional group. The electrolytic solution contains organic sulfonic acid ions. The substrate contains a crystalline metal, and a silver film is formed on the crystalline metal.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: January 25, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Hirofumi Iisaka
  • Patent number: 10604861
    Abstract: Device for vertical galvanic metal deposition on a substrate comprising a first and a second device, arranged vertically parallel to each other; the first device comprising a first anode having a plurality of through-going conduits and a first carrier having a plurality of through-going conduits; wherein said first anode and said first carrier are connected to each other; wherein the second device comprises a first substrate holder adapted to receive a first substrate to be treated, wherein said first substrate holder at least partially surrounds the first substrate along its outer frame, wherein the first device further comprises a plurality of plugs, each plug comprising a through-going channel, each plug arranged such that it runs from the backside of the first carrier through a through-going conduit of the first carrier and further through the conduit of the first anode element, and the plugs are detachably connected to the first device.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: March 31, 2020
    Assignee: Atotech Deutschland GmbH
    Inventor: Ray Weinhold
  • Patent number: 10233556
    Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. Also typically present is an edge flow element configured to direct electrolyte into a corner formed between the substrate and substrate holder. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: March 19, 2019
    Assignee: Lam Research Corporation
    Inventors: Gabriel Hay Graham, Jacob Lee Hiester, Lee Peng Chua, Bryan L. Buckalew
  • Patent number: 10183292
    Abstract: A method, circuit and apparatus for detecting capacitance on a droplet actuator, inter alia, for determining the presence, partial presence or absence of a droplet at an electrode on a droplet actuator by: (a) providing a droplet actuator comprising: (i) a substrate comprising electrodes arranged on the substrate for conducting droplet operations on a surface of the substrate; (ii) a capacitance detection circuit for detecting capacitance at the droplet operations surface at one or more of the electrodes; (b) detecting capacitance at the droplet operations surface at one or more of the electrodes; and (c) determining from the capacitance the presence, partial presence or absence of a droplet at the droplet operations surface at the electrode.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: January 22, 2019
    Assignee: ADVANCED LIQUID LOGIC, INC.
    Inventors: Ryan A. Sturmer, Michael G. Pollack, Vamsee K. Pamula, Vijay Srinivasan, Philip Y. Paik
  • Patent number: 10137435
    Abstract: The present invention concerns a method for the preparation of a catalyst onto a solid support of a (semi-)conductive material consisting in depositing said catalyst onto said support from a near-neutral aqueous solution containing at least one nickel or cobalt organic complex and at least one basic oxoanion, by a method selected in the group consisting of reductive electrodeposition, photochemical electrodeposition and photoelectrochemical deposition. The present invention also concerns said catalyst and uses thereof.
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: November 27, 2018
    Assignees: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, UNIVERSITE JOSEPH FOURIER
    Inventors: Vincent Artero, Marc Fontecave, Saioa Cobo, Pierre-Andre Jacques, Holger Dau, Jonathan Heidkamp
  • Patent number: 9708723
    Abstract: An electroplating cell includes: (i) an anode chamber in which an anode chamber solution is stored; and (ii) a separator that includes a base material and an organic plating additive contained in the base material, separates the anode chamber and a cathode from each other, and selectively allows permeation of metal ions contained in the anode chamber solution.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: July 18, 2017
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Fusayoshi Miura, Atsushi Murase, Naoki Hasegawa, Motoki Hiraoka, Yuki Sato
  • Patent number: 9662651
    Abstract: An active matrix electrowetting on dielectric (AM-EWOD) device includes a plurality of array elements configured to manipulate one or more droplets of fluid on an array, each of the array elements including a corresponding array element circuit. Each array element circuit includes a top substrate electrode and a drive electrode between which the one or more droplets may be positioned, with an insulator layer being interposed between the one or more droplets and the drive electrode; and write circuitry configured to write data to the array element. At least some of the array element circuits include measure circuitry configured to detect a pinhole defect in the insulator layer.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: May 30, 2017
    Assignee: Sharp Microfluidic Solutions Limited
    Inventor: Benjamin James Hadwen
  • Patent number: 9511369
    Abstract: The invention provides a droplet actuator. The droplet actuator may include a base substrate and a top substrate separated to form a gap. The base substrate may include electrodes configured for conducting droplet operations in the gap; and the top substrate may include a glass substrate portion coupled to a non-glass portion, where the non-glass portion may include one or more openings establishing a fluid path extending from an exterior of the droplet actuator and into the gap. The invention also provides related methods of manufacturing the droplet actuator, methods of using the droplet actuator, and methods of loading the droplet actuator.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: December 6, 2016
    Assignee: Advanced Liquid Logic, Inc.
    Inventors: Vijay Srinivasan, Michael G. Pollack, Alexander Shenderov, Zhishan Hua, Arjun Sudarsan
  • Patent number: 9464361
    Abstract: Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for plating highly uniform metal layers. In specific embodiments, the apparatus includes a flow-shaping element made of an ionically resistive material and having a plurality of channels made through the flow shaping element. The channels allow for transport of the electrolyte through the flow shaping element during electroplating. The channel openings are arranged in a spiral-like pattern on the substrate-facing surface of the flow shaping element such that the center of the spiral-like pattern is offset from the center of the flow shaping element.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: October 11, 2016
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, David W. Porter
  • Patent number: 9453310
    Abstract: Road markers, highway delineators and other products are manufactured from a compounded mixture of polymers and pulverized or micronized rubber powder, using a multi-layer plastic extrusion process on industry standard plastic extrusion equipment. The compound retains shape and includes a mixture of natural and synthetic rubbers, carbon black, fillers and oils; a propylene-based elastomer; a mixture of light color aliphatic hydrocarbon resins, and linear low density polyethylene.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: September 27, 2016
    Assignee: K. Jabat Inc.
    Inventors: David Kulkaski, Thomas D. Simmering
  • Patent number: 9151520
    Abstract: A heat pump including at least two devices for displacement of droplets of liquid by electro-wetting, where one includes a control unit such that it forms a compressor of the pneumatic fluid confined between the droplets of liquid, where the other includes a control unit such that it forms an expander to expand the pneumatic fluid confined between the droplets of liquid, where the high-pressure end of the compressor is connected to the high-pressure end of the expander through a thermal exchanger of a hot source, and where the low-pressure end of the expander is connected to the low-pressure end of the compressor through a thermal exchanger with a cold source, and where the unit formed by the compressor, the expander, and the thermal exchangers forms a single channel.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: October 6, 2015
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: Ghislain Despesse
  • Publication number: 20150136609
    Abstract: An Sn alloy plating apparatus is disclosed which can relatively easily perform control of an Sn alloy plating solution, including control of the Sn ion concentration and the acid concentration of the plating solution.
    Type: Application
    Filed: October 28, 2014
    Publication date: May 21, 2015
    Inventors: Masashi SHIMOYAMA, Masamichi TAMURA, Yuji ARAKI
  • Patent number: 8961771
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: February 24, 2015
    Assignee: APPLIED Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
  • Patent number: 8852417
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: October 7, 2014
    Assignee: APPLIED Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
  • Patent number: 8808521
    Abstract: A method and system are disclosed for controlling plating bath compositions. Speciation analyzers including HPLC and mass spectrometry are employed to separate, detect, identify, and quantify additives and degradation products. A control unit is linked to a plating bath interface, analyzer interface, and valves to control the flow of plating bath to an analyzer sampler and back to plating bath. For each degradation product, a response output is determined for at least one performance factor in terms of an additive equivalent amount that produces the same effect. A data processing unit receives concentration data for additives and degradation products from speciation analyzers and calculates an amount of each additive needed to replenish a used bath. As a result, the bleed-and-feed ratio for maintaining plating baths can be substantially reduced with significant productivity improvement and cost savings in terms of chemicals, chemical disposal, less down time and improved product quality.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: August 19, 2014
    Inventor: Boli Zhou
  • Publication number: 20140209472
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Application
    Filed: February 10, 2014
    Publication date: July 31, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
  • Publication number: 20140076798
    Abstract: The invention relates to a method for producing a noble metal/metal layer, which has particularly advantageous tribological properties, comprising the following steps: providing a bath for the currentless deposition of a metal layer, which additionally contains at least one type of noble metal ions; introducing a substrate into the bath; and applying a voltage.
    Type: Application
    Filed: June 30, 2011
    Publication date: March 20, 2014
    Applicant: Schauenburg Ruhrkunststoff GmbH
    Inventor: Stefan Koppe
  • Patent number: 8609254
    Abstract: Methods of preparing metal and metal alloys with partially microcrystalline anodic coatings are disclosed. Associated article therefrom are correspondingly disclosed. The partially microcrystalline anodic coatings exhibit steam, superheated steam, alkaline and acidic resistance. Partially microcrystalline anodic coating can be prepared by impregnation of micropores of a metal or metal substrate with metal precursor species, conversion of the metal precursor species into metal hydroxides, thermal treatment to dry out moisture and to promote phase transformation of the metal hydroxide product into metal oxides solids and bonding with metastable metal oxide substance in the pore structure of the metal or metal alloy substrate, and hydrothermal sealing to create sealed partially microcrystalline anodic coating.
    Type: Grant
    Filed: May 19, 2010
    Date of Patent: December 17, 2013
    Assignee: Sanford Process Corporation
    Inventors: Timothy P. Cabot, John J. Tetrault, Dong-Jin Sung
  • Patent number: 8603305
    Abstract: An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: December 10, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Robert Rash, Richard Abraham, David W. Porter, Steven T. Mayer
  • Publication number: 20130292255
    Abstract: The purpose of the present invention is to provide an electrical Al plating bath that poses little danger of exploding or igniting as a result of contacting air or water, and contains no benzene, toluene, xylene, naphthalene, or 1,3,5-trimethylbenzene, which have detrimental effects to humans. The present invention provides an electrical aluminum or aluminum alloy fused salt plating bath that is obtained by heat treatment of an electrical aluminum or aluminum alloy fused salt plating bath containing (A) a halogenated aluminum as the primary component and (B) at least one other type of halide after adding (C) one, two or more reducible compounds selected from the group consisting of hydrides of elements in Group 1 Periods 2 through 6 of the Periodic Table of Elements and/or hydrides of Group 13 Periods 2 through 6 of the Periodic Table of Elements and amine borane compounds.
    Type: Application
    Filed: January 4, 2012
    Publication date: November 7, 2013
    Applicant: DIPSOL CHEMICALS CO., LTD
    Inventors: Manabu Inoue, Akira Hashimoto, Tadahiro Onuma, Toshiki Inomata, Keisuke Nonomura, Naruaki Konno
  • Publication number: 20130284602
    Abstract: A device for metalizing wafers, in particular microchip wafers, in an electrolyte, contains a plurality of holder arrangements. Each holder arrangement has a chamber for the electrolyte which is separate from the electrolyte-receiving chambers in other holder devices, a ring acting as cathode, and an anode system as the anode being associated with each wafer.
    Type: Application
    Filed: December 12, 2011
    Publication date: October 31, 2013
    Inventor: Markus Hacksteiner
  • Patent number: 8524065
    Abstract: Embodiments of systems and methods for electrocoating a part are presented herein. According to one embodiment, an electrocoating system comprises a tank, a pump in fluid communication with the tank, and an external anode positioned outside of the tank. The external anode is a substantially membrane-free metal pipe configured to provide an electric charge to a fluid for electrocoating a part. The system may further comprise one or more internal nozzles positioned inside of the tank to direct an electrically charged fluid from the pump into the tank for electrocoating a part. In addition, the system may further comprise one or more external nozzles positionable outside of the tank to direct an electrically charged fluid from the pump to one or more selected areas of a part positioned for electrocoating outside of the tank.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: September 3, 2013
    Assignee: Metokote Corporation
    Inventors: Brent Allen Schwartz, Brian Todd Young
  • Patent number: 8475643
    Abstract: To provide an anodic oxidation method, a titanium oxide film manufacturing method and a catalyst carrying method which is suitable, for example, for anodic oxidation of aluminum, titanium and catalyst carrying on the surface of alumite (registered trademark), capable of generating an oxide film at a low cost and rapidly by eliminating the use of a strongly acid or strongly basic electrolytic solution and using a carbonated water as an electrolytic solution, capable of controlling the sealing treatment of oxide film through a simple method, capable of effecting the oxide film dyeing and catalyst carrying rationally and easily, and capable of effecting the catalyst carrying safely and surely without eroding a base material. An object (3) to be treated is electrolyzed in an electrolytic solution received in a treatment vessel (1) serving the object (3) as an anodic electrode. It is an anodic oxidation method in which an oxide film is generated on the surface of the object (3).
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: July 2, 2013
    Inventors: Hideo Yoshida, Kentaro Abe, Kiyohito Sakon
  • Publication number: 20130153431
    Abstract: Methods and apparatus for forming devices using nanotubes. In one embodiment, an apparatus for depositing nanotubes onto a workpiece comprises a vessel configured to contain a deposition fluid having a plurality of nanotubes including first nanotubes having a first characteristic and second nanotubes having a second characteristic. The apparatus further includes a sorting unit in the vessel configured to selectively isolate or otherwise sort the first nanotubes from the second nanotubes, and a field unit in the vessel configured to attach the first nanotubes to the workpiece. For example, the field unit can attach the first nanotubes to the workpiece such that the first nanotubes are at least generally parallel to each other and in a desired orientation relative to the workpiece.
    Type: Application
    Filed: February 19, 2013
    Publication date: June 20, 2013
    Applicant: MICRON TECHNOLOGY, INC.
    Inventor: Micron Technology, Inc.
  • Patent number: 8372658
    Abstract: A chemical analytic apparatus of the present invention is the one which proposes that a miniaturization, a making low-cost and portability are possible and also the operation of each process of separation, concentration and dilution of specimen is possible, and, which includes: an introduction means (S1) that introduces a droplet to which magnetic ultrafine particles are mixed into another liquid that differs from the droplet while maintaining a single droplet; a conveyance means by which the droplet that includes the magnetic particles is conveyed in another liquid of the introduction means by applying magnetic field externally to the magnetic ultrafine particles; and processing means (S2 to S6) by which operations for processing of chemical analysis are performed one by one in the process in which the droplet to which the magnetic ultrafine particles are mixed is conveyed by the conveyance means.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: February 12, 2013
    Assignee: Japan Science and Technology Agency
    Inventors: Mitsuhiro Shikida, Kazuo Sato, Hiroyuki Honda, Kohta Inouchi
  • Publication number: 20130032484
    Abstract: A system for electroplating a rotogravure cylinder out of a plating solution having a concentration of copper ions wherein the cylinder is connectable to a current source is provided. The system includes a plating apparatus configured to copper plate the cylinder comprising a non-dissolvable anode, a plating tank configured to receive the cylinder, a controller configured to control operation of the apparatus, and a tube for delivering a mixture of a hardener and the plating solution to the plating tank.
    Type: Application
    Filed: October 12, 2012
    Publication date: February 7, 2013
    Applicant: Chema Technology, Inc.
    Inventor: Chema Technology, Inc.
  • Publication number: 20120325668
    Abstract: Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.
    Type: Application
    Filed: September 5, 2012
    Publication date: December 27, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shafaat Ahmed, Hariklia Deligianni
  • Publication number: 20120298515
    Abstract: A device (1) for the wet-chemical treatment of material to be treated (10), in particular of flat material to be treated (10), comprises a treatment vessel (2) for treating the material to be treated (10) with a treatment liquid (9), a transport device (24) for transporting the material to be treated (10) through the treatment vessel (2), and a feed device (11) for feeding an inert gas (16) into the treatment vessel (2).
    Type: Application
    Filed: December 28, 2010
    Publication date: November 29, 2012
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Andreas Skupin, Helmut Bruckner, Christian Lowinski
  • Patent number: 8298395
    Abstract: An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the plating solution. The apparatus also includes a non-dissolvable anode at least partially disposed within the plating solution. A current source is electrically connected to the non-dissolvable anode and to the cylinder. An ultrasonic system may be provided to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulation pump, a mixing system and heating and cooling elements for the plating solution may be provided.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: October 30, 2012
    Assignee: Chema Technology, Inc.
    Inventor: Hubert F. Metzger
  • Patent number: 8282806
    Abstract: The preceding invention concerns a galvanic bath as well as a method for depositing a zinc-bearing layer onto a substrate surface. According to the invention, it is provided that the galvanic bath be divided into at least two cell chambers, in which the division occurs by means of a cation-exchange membrane and one cell chamber includes an acidic deposition-electrolyte and the other cell chamber includes a neutral or acidic anolyte. The acidic anolyte here is at least partially removed from the cell chamber containing it and is stripped of the foreign metal ions contained in it by means of a cation-exchange arrangement.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: October 9, 2012
    Assignee: Enthone Inc.
    Inventor: Axel Fuhrmann
  • Patent number: 8236159
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: August 7, 2012
    Assignee: Applied Materials Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
  • Publication number: 20120175263
    Abstract: Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.
    Type: Application
    Filed: December 13, 2011
    Publication date: July 12, 2012
    Inventors: Kousik GANESAN, Tighe SPURLIN, Jonathan D. REID, Shantinath GHONGADI, Andrew McKERROW, James E. DUNCAN
  • Publication number: 20120152751
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Application
    Filed: February 27, 2012
    Publication date: June 21, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Tom L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
  • Publication number: 20120088118
    Abstract: Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings.
    Type: Application
    Filed: December 8, 2011
    Publication date: April 12, 2012
    Applicant: Modumetal LLC
    Inventor: Christina LOMASNEY
  • Patent number: 8123926
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: February 28, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W Batz, Jr., Bioh Kim, Tom L Ritzdorf, John L Klocke, Kyle M Hanson
  • Publication number: 20110284381
    Abstract: Methods of preparing metal and metal alloys with partially microcrystalline anodic coatings are disclosed. Associated article therefrom are correspondingly disclosed. The partially microcrystalline anodic coatings exhibit steam, superheated steam, alkaline and acidic resistance. Partially microcrystalline anodic coating can be prepared by impregnation of micropores of a metal or metal substrate with metal precursor species, conversion of the metal precursor species into metal hydroxides, thermal treatment to dry out moisture and to promote phase transformation of the metal hydroxide product into metal oxides solids and bonding with metastable metal oxide substance in the pore structure of the metal or metal alloy substrate, and hydrothermal sealing to create sealed partially microcrystalline anodic coating.
    Type: Application
    Filed: May 19, 2010
    Publication date: November 24, 2011
    Applicant: DURALECTRA-CHN, LLC
    Inventors: Timothy P. Cabot, John J. Tetrault, Dong-Jin Sung
  • Patent number: 7846316
    Abstract: Method and plating bath apparatus for setting the ionic strength of a plating composition using Donnan dialysis by flowing the plating composition along a first surface of a membrane while simultaneously flowing a deposition metal ion exchange composition along a second surface of the membrane such that the deposition metal ion crosses the membrane from the deposition metal ion exchange composition to the plating composition while an exchange cation different from the deposition metal ion crosses the membrane from the plating composition to the deposition metal ion exchange composition.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: December 7, 2010
    Assignee: Enthone Inc.
    Inventors: Axel Koenig, Andreas Möbius, Franz-Josef Stark
  • Publication number: 20100294082
    Abstract: Proposed is a method for collecting valuable metal from an ITO scrap including a step of collecting tin by subjecting the ITO scrap to electrolysis. Further proposed is a method for collecting valuable metal from an ITO scrap including the steps of providing an ITO electrolytic bath and a tin collecting bath, dissolving the ITO scrap in the electrolytic bath, and thereafter collecting tin in the tin collecting bath. Additionally proposed is a method for collecting valuable metal from an ITO scrap including the steps of dissolving the ITO scrap by subjecting it to electrolysis as an anode in electrolyte, precipitating only tin contained in the solution as tin itself or a substance containing tin, extracting the precipitate, placing it in a collecting bath, re-dissolving this to obtain a solution of tin hydroxide, and performing electrolysis or neutralization thereto in order to collect tin.
    Type: Application
    Filed: June 27, 2007
    Publication date: November 25, 2010
    Applicant: NIPPON MINING & METALS CO., LTD.
    Inventors: Yuichiro Shindo, Kouichi Takemoto
  • Patent number: 7833404
    Abstract: A method of forming a film composed of a phosphate compound and a metal on the surface of an article to be treated by performing electrolytic treatment on a metal article to be treated in a phosphate chemical treatment bath. The method includes contacting the metal article having electrical conductivity with the phosphate chemical treatment bath containing phosphate ions and phosphoric acid, nitrate ions, metal ions that form a complex with phosphate ions in the phosphate chemical treatment bath, and metal ions for which the dissolution-precipitation equilibrium potential at which ions dissolved in the phosphate chemical treatment bath are reduced and precipitate as metal is equal to or greater than ?830 mV. The (oxidation-reduction potential) of the phosphate chemical treatment bath is maintained at equal to or greater than 700 mV.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: November 16, 2010
    Assignee: Denso Corporation
    Inventors: Shigeki Matsuda, Shin Nishiya
  • Publication number: 20100140099
    Abstract: A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a plating bath. Further defect reduction and improved bottom up plating of vias is achieved by applying a static charge on the wafer before it is immersed in the bath, in order to enhance bath accelerators used to control the plating rate. The static charge is applied to the wafer using a supplemental electrode disposed outside the plating bath.
    Type: Application
    Filed: February 15, 2010
    Publication date: June 10, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Liang Chang, Shau-Lin Shue
  • Publication number: 20100122909
    Abstract: A chromium plating bath containing trivalent chromium ions and hexavalent chromium ions is prepared by a method including the steps of: (A) mixing chromic acid and an organic acid in an aqueous solution containing these acids and reducing chromic acid by the organic acid so as to prepare an aqueous solution not containing hexavalent chromium ions; (B) adding a pH adjustor to the aqueous solution not containing hexavalent chromium ions so as to adjust pH to a value of 1 to 4; and (C) further adding chromic acid to the aqueous solution not containing hexavalent chromium ions and having undergone the pH adjustment so as to prepare an aqueous solution containing trivalent chromium ions and hexavalent chromium ions. The chromium plating bath containing both trivalent chromium ions and hexavalent chromium ions can be prepared while easily and assuredly adjusting the contents (content ratio) of trivalent chromium ions and hexavalent chromium ions to predetermined values (a predetermined value).
    Type: Application
    Filed: November 17, 2009
    Publication date: May 20, 2010
    Inventors: Toru Murakami, Suhaimi Hamid, Ryo Maeda
  • Publication number: 20100116673
    Abstract: The present invention relates to a cationic electrodeposition coating composition, which provides an uncured electrodeposited film having storage elasticity modulus (G?) at 140° C. within a range of from 80 to 500 dyn/cm2 and loss elasticity modulus (G?) at 80° C. within a range of from 10 to 150 dyn/cm2, and which is superior in smoothness and edge coatability; and a method for establishing both of smoothness and edge coatability therewith; as well as; a cationic electrodeposition coating composition comprising crosslinked resin particles having an average particle size within a range of from 1.0 to 3.0 ?m and thermal softening temperature within a range of from 120 to 180° C.
    Type: Application
    Filed: October 24, 2007
    Publication date: May 13, 2010
    Inventor: Teruzo Toi
  • Publication number: 20100072071
    Abstract: Embodiments of systems and methods for electrocoating a part are presented herein. According to one embodiment, an electrocoating system comprises a tank, a pump in fluid communication with the tank, and an external anode positioned outside of the tank. The external anode is a substantially membrane-free metal pipe configured to provide an electric charge to a fluid for electrocoating a part. The system may further comprise one or more internal nozzles positioned inside of the tank to direct an electrically charged fluid from the pump into the tank for electrocoating a part. In addition, the system may further comprise one or more external nozzles positionable outside of the tank to direct an electrically charged fluid from the pump to one or more selected areas of a part positioned for electrocoating outside of the tank.
    Type: Application
    Filed: September 19, 2008
    Publication date: March 25, 2010
    Applicant: METOKOTE CORPORATION
    Inventors: Brent Allen Schwartz, Brian Todd Young
  • Publication number: 20100000872
    Abstract: The surface of a metal base is electroplated by utilizing an induction codeposition phenomenon using at least one of carbon dioxide and inert gas, an electroplating liquid containing a metal powder dispersed therein, and a surfactant in a supercritical state or a subcritical state. The concentration of the metal in the electroplating liquid is in a saturated or supersaturated state. Accordingly, the dissolution speed of the metal base can be suppressed, and, at the same time, a plating layer having a smooth surface can be formed in a short time by utilizing an induction codeposition phenomenon. The electroplating method can be applied even when the metal base is formed of a metallic thin film provided on a surface of an insulating film provided on the substrate, or even when the metal is copper, zinc, iron, nickel, or cobalt.
    Type: Application
    Filed: April 2, 2007
    Publication date: January 7, 2010
    Applicants: S.E.S. CO., LTD.
    Inventors: Tetsuya Shimizu, Hisayoshi Tajima, Seizo Miyata, Masato Sone
  • Publication number: 20090272466
    Abstract: Provided is ultrahigh purity copper having a hardness of 40 Hv or less, and a purity of 8N or higher (provided that this excludes the gas components of O, C, N, H, S and P). With this ultrahigh purity copper, the respective elements of O, S and P as gas components are 1 wtppm or less. Also provided is a manufacturing method of ultrahigh purity copper based on two-step electrolysis using an electrolytic solution comprised of copper nitrate solution, including the procedures of adding hydrochloric acid in an electrolytic solution comprised of copper nitrate solution; circulating the electrolytic solution; and performing two-step electrolysis while eliminating impurities with a filter upon temporarily setting the circulating electrolytic solution to a temperature of 10° C. or less. The present invention provides a copper material that is compatible with the thinning (wire drawing) of the above, and is capable of efficiently manufacturing ultrahigh purity copper having a purity of 8N (99.
    Type: Application
    Filed: April 24, 2006
    Publication date: November 5, 2009
    Applicant: NIPPON MINING & METALS CO., LTD.
    Inventors: Yuichiro Shindo, Kouichi Takemoto
  • Publication number: 20090205965
    Abstract: Disclosed are a method and an apparatus for forming an oxide coating film with excellent corrosion resistance and adhesiveness on a cathode made of a metal plate by a simple process at low cost. A direct current voltage is applied between an anode (12) and a cathode (13) in an electrolyte solution which cathode (13) is made of a metal plate to be coated with oxide and arranged opposite to the anode (12), while supplying oxygen or a gas containing oxygen into the electrolyte solution, so that the metal plate cathode (13) is coated with oxide, thereby being formed into a oxide-coated metal plate.
    Type: Application
    Filed: November 9, 2004
    Publication date: August 20, 2009
    Applicants: Toyo Seikan Kaisha, LTD., Toyo Kohan CO., LTD.
    Inventors: Wataru Kurokawa, Hiroshi Matsubayashi, Mitsuhide Aihara, Masanobu Matsubara, Masatoki Ishida, Norimasa Maida
  • Patent number: 7575664
    Abstract: A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plating solution is supplied by causing an impregnated member containing the plating solution to face the conductive layer. Since the plating solution stays in the depression, a larger amount of plating solution is supplied than on the upper surface of the substrate, and the plating rate of the plating film in the depression increases. Consequently, the plating film can be preferentially formed in the depression such as a groove or hole.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: August 18, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tetsuo Matsuda, Hisashi Kaneko, Katsuya Okumura
  • Publication number: 20090192628
    Abstract: The object of the present invention is to provide a bone substitute material, medical material containing the bone substitute material and process for producing the bone substitute material wherein the bone material has excellent mechanical strength, biological affinity and biological activity. The present invention provides a bone substitute material comprising a titanium or a titanium alloy and an anodic oxide film of the titanium or titanium alloy, wherein the anodic oxide film is formed on a surface of the titanium or titanium alloy, wherein inorganic compound microparticles are firmly fixed to a surface and/or inside of the anodic oxide film, and wherein the inorganic compound contains at least phosphorus and calcium. The present invention further provides a medical material comprising the bone substitute material and a method for manufacturing the bone substitute material.
    Type: Application
    Filed: August 31, 2006
    Publication date: July 30, 2009
    Inventors: Seishiro Ito, Mitsunobu Iwasaki
  • Publication number: 20090173632
    Abstract: In a nonaqueous electrolyte cell-oriented electrode (10), an electrode active material layer (12) formed on a collector (1) has a density gradient developed with a gradient of a varied concentration of a solid along a thickness from a surface of the electrode active material layer (12) toward the collector (1), and in a gel electrolyte cell-oriented electrode (30), an electrode active material layer (32) formed on a collector (1) has a density gradient developed with (a) gradient(s) of (a) varied concentration(s) of one or both of an electrolyte salt and a film forming material along a thickness from a surface of the electrode active material layer (32) toward the collector (1).
    Type: Application
    Filed: March 9, 2009
    Publication date: July 9, 2009
    Inventors: Mori Nagayama, Takamistu Saito, Osamu Shimamura
  • Publication number: 20090117351
    Abstract: Medical devices, particularly stents, suitable for drug delivery and including a porous structure and/or colors are disclosed.
    Type: Application
    Filed: January 2, 2009
    Publication date: May 7, 2009
    Applicant: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: Barry O'Brien, Brian Brown, Robert Nolan