Purifying Electrolyte Patents (Class 205/99)
  • Patent number: 11088387
    Abstract: The present invention relates to a coin-type secondary battery and a manufacturing method therefor and, specifically, can provide: a coin-type secondary battery, wherein a solid electrolyte is applied to an anode part, an ion-containing solution comprising sodium, lithium, magnesium and a combination thereof is applied to a cathode part, and the ion-containing solution flows in from the outside of the cathode part; and a manufacturing method therefor.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: August 10, 2021
    Inventors: Young Sik Kim, Jin Hyup Han, Soo Min Hwang
  • Patent number: 9611561
    Abstract: An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: April 4, 2017
    Assignee: Enpirion, Inc.
    Inventors: Trifon M. Liakopoulos, Robert W. Filas, Amrit Panda
  • Patent number: 9469911
    Abstract: An electroplating apparatus has one or more membrane tube rings which act as electric field shields, to provide advantageous plating characteristics at the perimeter of a work piece. The membrane tube rings may be filled with fluids having different conductivity, to change the shielding effect as desired for electroplating different types of substrates. The membrane tube rings may optionally be provided in or on a diffuser plate in the vessel of the apparatus.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: October 18, 2016
    Assignee: APPLIED Materials, Inc.
    Inventors: Paul R. McHugh, Gregory J. Wilson, Roey Shaviv
  • Patent number: 9249511
    Abstract: The problem addressed by the present invention is to provide a method for facilitating the regenerating a waste plating solution as a plating solution. This method for regenerating an acidic waste plating solution containing, as ions, Fe and at least one plating metal element selected from the group consisting of Cu, Ni, Zn, Co, and Mn by removing Fe therefrom is characterized in having an addition step in which phytic acid is added to the waste plating solution to yield a phytic-acid-containing solution in which Fe ions are precipitated, and a removal step in which the precipitate is removed from the phytic-acid-containing solution to yield a regenerated plating solution.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: February 2, 2016
    Assignee: FUJI SHOJI CO., LTD.
    Inventors: Nobuhiro Kanazawa, Katsuhiro Goto, Tatsuya Banno
  • Patent number: 9221563
    Abstract: A device is for treating and packaging implants. The device includes a container including a chamber therein. The chamber is closed by a removable seal. The device also includes a carrier sized and shaped to be inserted into the chamber. The carrier includes a carrying structure configured to connect an implant thereto. A portion of the carrier may be formed of an electrically conductive material.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: December 29, 2015
    Inventor: Urs Hulliger
  • Publication number: 20150041327
    Abstract: Disclosed herein are electroplating systems for electroplating nickel onto a semiconductor substrate having an electroplating cell for holding an electrolyte solution during electroplating which includes a cathode chamber and an anode chamber configured to hold a nickel anode, and having an oxygen removal device arranged to reduce oxygen concentration in the electrolyte solution as it is flowed to the anode chamber during electroplating and during idle times when the system is not electroplating. Also disclosed herein are methods of electroplating nickel onto a substrate in an electroplating cell having anode and cathode chambers, which include reducing the oxygen concentration in an electrolyte solution, flowing the electrolyte solution into the anode chamber and contacting a nickel anode therein, and electroplating nickel from the electrolyte solution onto a substrate in the cathode chamber, wherein the electrolyte solution in the cathode chamber is maintained at a pH of between about 3.5 and 4.5.
    Type: Application
    Filed: August 6, 2013
    Publication date: February 12, 2015
    Inventors: Bryan L. Buckalew, Thomas A. Ponnuswamy, Ben Foley, Steven T. Mayer
  • Publication number: 20140246324
    Abstract: Processes and systems for electrochemical deposition of a multi-component solder by processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids.
    Type: Application
    Filed: February 28, 2014
    Publication date: September 4, 2014
    Applicant: APPLIED Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Thomas L. Ritzdorf, John L. Klocke, Kyle M. Hanson, Marvin L. Bernt, Ross Kulzer
  • Patent number: 8808521
    Abstract: A method and system are disclosed for controlling plating bath compositions. Speciation analyzers including HPLC and mass spectrometry are employed to separate, detect, identify, and quantify additives and degradation products. A control unit is linked to a plating bath interface, analyzer interface, and valves to control the flow of plating bath to an analyzer sampler and back to plating bath. For each degradation product, a response output is determined for at least one performance factor in terms of an additive equivalent amount that produces the same effect. A data processing unit receives concentration data for additives and degradation products from speciation analyzers and calculates an amount of each additive needed to replenish a used bath. As a result, the bleed-and-feed ratio for maintaining plating baths can be substantially reduced with significant productivity improvement and cost savings in terms of chemicals, chemical disposal, less down time and improved product quality.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: August 19, 2014
    Inventor: Boli Zhou
  • Publication number: 20140224664
    Abstract: [Object] When rare earth magnets are plated, components of the rare earth magnets are dissolved in the plating solution, causing plating defects. Thus, an easy method for removing rare earth impurities has been necessary. [Means for Solution] A nickel-electroplating solution containing rare earth impurities is kept at 60° C. or higher for a predetermined period of time to precipitate rare earth impurities for separation by sedimentation or filtration. Rare earth impurities can be precipitated further efficiently by adding precipitate to the nickel-electroplating solution, or by concentrating the nickel-electroplating solution by heating.
    Type: Application
    Filed: September 21, 2012
    Publication date: August 14, 2014
    Applicant: HITACHI METALS, LTD.
    Inventor: Masanao Kamachi
  • Publication number: 20140224663
    Abstract: The method begins by forming a solution comprising catalyst precursors, electrolyte and a solvent. Electrodes are inserted into the solution comprising an anode electrode and a cathode electrode. Electrochemical deposition then occurs wherein a current is passed between the electrodes. In this method at least one additional step of: i) heating the solution prior to and during the electrochemical deposition; ii) increasing the concentration of the catalyst precursors in the solution to greater than 0.1 millimolar; iii) performing the electrochemical deposition by a pulsed current; and iv) adding chemical promoters to the solution.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 14, 2014
    Applicant: PHILLIPS 66 COMPANY
    Inventors: Mahaprasad Kar, Neal D. McDaniel, Danielle K. Smith, Dennis G. Schultz, Bruce B. Randolph
  • Patent number: 8801912
    Abstract: Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: August 12, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Naoyuki Omura, Toshihisa Isono, Koji Shimizu, Shinji Tachibana, Tomohiro Kawase, Shunsaku Hoshi
  • Publication number: 20140158544
    Abstract: A method for removing iron ions from galvanizing flux solution includes adding zinc chloride and ammonium chloride to a solvent in a preparing tank to prepare a first galvanizing flux solution which is transferred to a treatment tank, immersing an iron/steel piece in the first galvanizing flux solution to dissolve part of the surface to form iron ions, adding oxygen-rich gas to the first galvanizing flux solution to oxidize the iron ions to form a second galvanizing flux solution containing iron oxide precipitation, filtering the second galvanizing flux solution by a multilayer filter to form a third galvanizing flux solution without iron oxide or with low content of iron oxide, transferring the third galvanizing flux solution back to the treatment tank, and repeating the above steps by immersing another iron/steel piece in the first galvanizing flux solution so as to continuously remove iron ions generated.
    Type: Application
    Filed: September 6, 2011
    Publication date: June 12, 2014
    Inventor: Chien-Tsung Ou
  • Publication number: 20140097088
    Abstract: The disclosed embodiments relate to methods and apparatus for immersing a substrate in electrolyte in an electroplating cell under sub-atmospheric conditions to reduce or eliminate the formation/trapping of bubbles as the substrate is immersed. Various electrolyte recirculation loops are disclosed to provide electrolyte to the plating cell. The recirculation loops may include pumps, degassers, sensors, valves, etc. The disclosed embodiments allow a substrate to be immersed quickly, greatly reducing the issues related to bubble formation and uneven plating times during electroplating.
    Type: Application
    Filed: December 10, 2013
    Publication date: April 10, 2014
    Applicant: Novellus Systems, Inc.
    Inventors: R. Marshall Stowell, Jingbin Feng, David W. Porter
  • Publication number: 20140076730
    Abstract: A method of harvesting Group I metals from waste materials, including agitating Group I metal-containing materials in water to define a Group I metal-rich aqueous solution, removing any solid material from the Group I metal-rich aqueous solution, and filling the cathode portion of an electrochemical cell with the Group I metal-rich aqueous solution. A current collector is introduced into the Group I metal-rich aqueous solution, a steel electrode is operationally connected to the cathode portion, and the cathode portion is operated to deposite Group I metal onto the steel electrode.
    Type: Application
    Filed: March 4, 2013
    Publication date: March 20, 2014
    Inventor: Indiana University Research and Technology Corporation
  • Publication number: 20130341196
    Abstract: A method for purifying tin includes exposing an electrolytic solution comprising tin to an ion exchange resin and depositing electrorefined tin from the electrolytic solution. The deposited electrorefined tin has alpha particle emissions of less than about 0.01 counts/hour/cm2 immediately after the deposition step, and an alpha emissivity of less than about 0.01 counts/hour/cm2 at least 90 days after the deposition step.
    Type: Application
    Filed: March 13, 2013
    Publication date: December 26, 2013
    Applicant: Honeywell International Inc.
    Inventors: Paul P. Silinger, Mark B. Fery, Brett M. Clark, Derek E. Grove
  • Publication number: 20130334052
    Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
    Type: Application
    Filed: May 24, 2013
    Publication date: December 19, 2013
    Inventors: Lee Peng Chua, Steven T. Mayer, David W. Porter, Thomas A. Ponnuswamy
  • Patent number: 8597519
    Abstract: In order to remove fluorine from a zinc containing solution before zinc electro-refining in lower cost, fluorine is removed by adsorption from a zinc containing solution (leached solution) utilizing the character of the predetermined iron compound or zinc compound which can adsorb fluorine in an acid solution and desorb fluorine in an alkaline solution. The fluorine adsorbent/desorbent having adsorbed fluorine is treated in an alkaline solution, to desorb the fluorine. This makes it possible to regenerate the fluorine adsorbent/desorbent. Further, an electrolytic solution for zinc electro-refining can be prepared in lower cost, thus total zinc refining costs can be reduced.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: December 3, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Hiroshi Hata, Kenji Haiki, Kazuhiko Nishina, Masatami Sakata
  • Publication number: 20130306483
    Abstract: A plating apparatus plates a substrate with Sn alloy to form an Sn alloy film on a surface of the substrate. The apparatus includes: a plating bath for retaining a plating solution therein, the substrate being immersed in the plating solution in a position opposite to an insoluble anode; a plating solution dialysis line for extracting the plating solution from the plating bath and returning the plating solution to the plating bath; a dialysis cell provided in the plating solution dialysis line and configured to remove a free acid from the plating solution by dialysis using an anion exchange membrane; a free acid concentration analyzer; and a controller for controlling a flow rate of the plating solution flowing through the plating solution dialysis line based on the concentration of the free acid measured by the free acid concentration analyzer.
    Type: Application
    Filed: May 14, 2013
    Publication date: November 21, 2013
    Inventors: Yuji ARAKI, Masashi SHIMOYAMA
  • Publication number: 20130264212
    Abstract: Electrowinning methods and apparatus are suitable for producing elemental deposits of high quality, purity, and volume. Respective cathodes are used during electrowinning for bearing the elemental product, segregating impurities, dissolving morphologically undesirable material, and augmenting productivity. Silicon suitable for use in photovoltaic devices may be electrodeposited in solid form from silicon dioxide dissolved in a molten salt.
    Type: Application
    Filed: June 10, 2013
    Publication date: October 10, 2013
    Applicant: INFINIUM, INC.
    Inventors: Adam Clayton POWELL, IV, Stephen Joseph DEREZINSKI
  • Patent number: 8390603
    Abstract: A method for driving a flat panel display is provided. The flat panel display has n scan lines, wherein n is a positive integer. Each of the scan lines is coupled to a plurality of pixels. The driving method according to the invention includes the steps as follows: when pixels coupled to a kth scan line are enabled, pixels coupled to the scan lines from the first to k?1th are disabled and pixels coupled to at least a part of scan lines from k+1th to nth are enabled, thus pre-charging the enabled pixels of scan lines from k+1th to nth is performed thereby, wherein k is a positive integer.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: March 5, 2013
    Assignee: AU Optronics Corporation
    Inventor: Chien-Yu Yi
  • Publication number: 20120298515
    Abstract: A device (1) for the wet-chemical treatment of material to be treated (10), in particular of flat material to be treated (10), comprises a treatment vessel (2) for treating the material to be treated (10) with a treatment liquid (9), a transport device (24) for transporting the material to be treated (10) through the treatment vessel (2), and a feed device (11) for feeding an inert gas (16) into the treatment vessel (2).
    Type: Application
    Filed: December 28, 2010
    Publication date: November 29, 2012
    Inventors: Andreas Skupin, Helmut Bruckner, Christian Lowinski
  • Patent number: 8282806
    Abstract: The preceding invention concerns a galvanic bath as well as a method for depositing a zinc-bearing layer onto a substrate surface. According to the invention, it is provided that the galvanic bath be divided into at least two cell chambers, in which the division occurs by means of a cation-exchange membrane and one cell chamber includes an acidic deposition-electrolyte and the other cell chamber includes a neutral or acidic anolyte. The acidic anolyte here is at least partially removed from the cell chamber containing it and is stripped of the foreign metal ions contained in it by means of a cation-exchange arrangement.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: October 9, 2012
    Assignee: Enthone Inc.
    Inventor: Axel Fuhrmann
  • Publication number: 20120200308
    Abstract: The present invention relates to a method of producing an electrodeposited metal oxide coating for a supercapacitor electrode. The present invention relates to the chronoamperometric electrodeposition of the metal oxide over a period from a few seconds, up to about 30 seconds leading to superior performance as a result of an increased surface area of the deposit. According to the present invention, the capacitances achieved are typically greater than 1300 F/g, and in some instances, over 4000 F/g.
    Type: Application
    Filed: September 30, 2010
    Publication date: August 9, 2012
    Inventor: Scott W. Donne
  • Patent number: 8202431
    Abstract: A method and apparatus involving at least two distinct adsorbent media for adsorptive removal of impurities from a metal deposition composition such as an electroless or electrolytic deposition composition.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: June 19, 2012
    Assignee: Enthone Inc.
    Inventors: Christoph Werner, Axel Fuhrmann, Andreas Möbius
  • Patent number: 8097145
    Abstract: The invention relates to methods and devices for the decontamination of fluid, particularly the removal of heavy metals and/or arsenic and/or their compounds from water, by means of electrolysis, wherein the water to be purified subjected to electrodes of different polarities. The invention can include means for control of the pH of the fluid. The invention can also include control systems that allow self-cleaning of electrodes, self-cleaning of filters, and automatic monitoring of maintenance conditions.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: January 17, 2012
    Assignee: ARS USA LLC
    Inventors: Andrew Polnicki, Giselher Klose
  • Publication number: 20110272285
    Abstract: The invention relates to a method for depositing chromium and/or chromium alloys on metals, and particularly on sheet steel, wherein an alloy layer is electrolytically deposited on the metal from a solution containing chromium ions and/or chromium ions and further metal ions such as Zn, Cd, In, Pb, Bi, Mo, Cu, Fe, Ni, Co, Mn, Al, Sb, Ag, Sn, Mg, wherein chromium hydroxide precipitated from a chromium (III) solution is used for regenerating the electrolyte solution using chromium (III) ions.
    Type: Application
    Filed: September 30, 2009
    Publication date: November 10, 2011
    Inventors: Johann Gerdenitsch, Alexander Tomandl
  • Publication number: 20110250534
    Abstract: The invention relates to solubilizers for metal ions and poorly soluble metal compounds, containing an oxidation product of starch hydrolysate as a solubilizing agent, to a method for solubilizing metal ions and to the use of said solubilizer.
    Type: Application
    Filed: October 19, 2009
    Publication date: October 13, 2011
    Applicant: Suedzucker Aktiengesellschaft Mannheim/Ochsenfurt
    Inventors: Alireza Haji Begli, Markwart Kunz, Christine Kroener, Matthias Moser, Bart Levecke
  • Publication number: 20110210006
    Abstract: The invention concerns a process which is used to plate functional layers of acidic or alkaline zinc or zinc alloy baths which contain nitrogenous organic additives, a soluble zinc salt and if necessary other metal salts selected from Fe, Ni, Co and Sn salts, where the bath composition for the regeneration is conveyed through an appropriate device having an ion exchanger resin to remove cyanide ions.
    Type: Application
    Filed: November 17, 2009
    Publication date: September 1, 2011
    Inventor: Serdar Turan Karagöl
  • Patent number: 7846316
    Abstract: Method and plating bath apparatus for setting the ionic strength of a plating composition using Donnan dialysis by flowing the plating composition along a first surface of a membrane while simultaneously flowing a deposition metal ion exchange composition along a second surface of the membrane such that the deposition metal ion crosses the membrane from the deposition metal ion exchange composition to the plating composition while an exchange cation different from the deposition metal ion crosses the membrane from the plating composition to the deposition metal ion exchange composition.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: December 7, 2010
    Assignee: Enthone Inc.
    Inventors: Axel Koenig, Andreas Möbius, Franz-Josef Stark
  • Patent number: 7794573
    Abstract: Systems and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, a system includes (a) a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece, (b) an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode, (c) a barrier between the processing unit and the electrode unit to separate the first and second processing fluids, and (d) a water balance unit for maintaining the concentration of water in the first processing fluid within a desired range.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: September 14, 2010
    Assignee: Semitool, Inc.
    Inventor: John L. Klocke
  • Patent number: 7781731
    Abstract: Disclosed herein is a method of qualitatively analyzing high-molecular additives in a metal plating solution, including: removing sulfate ions and metal ions from a metal plating solution; and qualitatively analyzing the metal plating solution, from which sulfate ions and metal ions are removed, using Matrix-Assisted Laser Desorption/Ionization Time-Of-Flight Mass Spectroscopy (MALDI-TOF MS). The method is advantageous in that the structure and molecular weight of high-molecular additives present in very small amounts in a plating solution can be accurately measured while maintaining the specific structure and molecular weight thereof without degrading the high-molecular additives.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: August 24, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yun Hee Kim, Bae Kyun Kim, Dong Hyun Cho
  • Patent number: 7776197
    Abstract: An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; and one or more surface coatings comprising one or more of the following metals titanium, niobium, tantalum, ruthenium, rhodium, iridium, palladium, or gold, or an alloy of two or more metals, or a combination of two or more alloys or metal layers thereof having an increase in the surface area of 5 times to 500 times of the corresponding surface area resulting from the basic geometric shape.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: August 17, 2010
    Assignee: Second Sight Medical Products, Inc.
    Inventor: Dao Min Zhou
  • Publication number: 20100187118
    Abstract: The invention relates to methods and devices for the decontamination of fluid, particularly the removal of heavy metals and/or arsenic and/or their compounds from water, by means of electrolysis, wherein the water to be purified subjected to electrodes of different polarities. The invention can include means for control of the pH of the fluid. The invention can also include control systems that allow self-cleaning of electrodes, self-cleaning of filters, and automatic monitoring of maintenance conditions.
    Type: Application
    Filed: March 31, 2010
    Publication date: July 29, 2010
    Inventors: Andrew Polnicki, Giselher Klose
  • Patent number: 7645372
    Abstract: This invention relates to a method for removing thallium from a zinc-containing solution. In particular, the method relates to the purification with metallic zinc powder of a solution going to the electrolytic production of zinc. In this method, thallium is removed by means of a lead compound in the solution purification stage, either during the final purification stage or in a purification stage in which cadmium is precipitated.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: January 12, 2010
    Assignee: Outotec Oyj
    Inventor: Aimo Järvinen
  • Patent number: 7615103
    Abstract: The present invention is directed to methods and apparatuses for removing bubbles from a process liquid. The process liquid can comprise a plating solution used in a plating tool. The process liquid is supplied to a tank. A plurality of streams of the process liquid are directed towards a surface of the process liquid from below. This can be done by feeding the process liquid to a flow distributor comprising a plurality of openings providing flow communication between an inner volume of the flow distributor and a main volume of the tank. Before leaving the tank through an outlet, the process liquid flows through a flow barrier.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: November 10, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Helge Hartz, Markus Nopper, Axel Preusse
  • Publication number: 20090272651
    Abstract: A method for producing high-purity nickel, which involves using a hydrochloric acid solution system to electro-deposit high-purity nickel, characterized in that, it includes the following steps sequentially: 3N-grade-grade electrolytic nickel was used as anode and the electro-deposition was carried out in a hydrochloric acid system, the solution obtained from the electro-deposition was extracted by a three-level countercurrent extraction using anion extraction solvents, and then back-extracted and degreased. After that, the solution was passed through the anion exchange resin to be further purified by ion exchange, and finally put into the electrolytic cell to deposit nickel.
    Type: Application
    Filed: April 13, 2005
    Publication date: November 5, 2009
    Applicant: JINCHUAN GROUP LTD.
    Inventors: Yongjun Li, Jun Wu, Wengang Zheng, Zhenhua Chen, Zhongqiang Yan, Yongfeng Ma, Shiqing Qi, Wenying Cao
  • Publication number: 20090107845
    Abstract: There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.
    Type: Application
    Filed: April 26, 2006
    Publication date: April 30, 2009
    Inventors: Karlheinz Arzt, Jens-Eric Geissler
  • Publication number: 20090078577
    Abstract: A plating solution recovery apparatus for electroplating, the apparatus comprises a circulation tank; a sludge removing device; a concentrating device; an iron compound crystallizing device; an iron compound separating device; an iron compound redissolving device; an iron ion removing device; pipelines sequentially connecting the circulation tank, the sludge removing device, the concentrating device, the iron compound crystallizing device, the iron compound separating device, the iron compound redissolving device, and then the iron ion removing device in a downstream direction from a base point coincident with the circulation tank; a pipeline connecting from the iron ion removing device to the circulation tank; a pipeline connecting from the iron compound separating device to the circulation tank; and a flow path changing device connecting to the circulation tank and provided in at least one portion selected from a group of portions, respectively, between the sludge removing device and the concentrating devic
    Type: Application
    Filed: August 17, 2007
    Publication date: March 26, 2009
    Inventors: Kentaro Suzuki, Kei Yuki, Fumio Aoki
  • Patent number: 7503830
    Abstract: The present invention provides an apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed deposition solution, and a degassed cleaning solution. The technique includes degassing the process solution before delivering the degassed process solution to a processing unit or degassing the process solution in situ, within the processing unit.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: March 17, 2009
    Assignee: Novellus Systems, Inc.
    Inventors: Bulent M. Basol, Cyprian E. Uzoh
  • Patent number: 7431815
    Abstract: A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode and a reference electrode and can reduce the molar ratio [Fe+3]/[Fe+2] to 1 ppm without depositing Fe or other metals on the working electrode or causing hydrogen evolution. The process is applicable to electroplating soft magnetic films such as NiFe, FeCo, and CoNiFe and can be performed during plating or during cell idling. The process is cost effective by reducing the amount of hazardous waste and tool down time due to routine solution swap. Other benefits are improved uniformity in composition and thickness of plated films because issues associated with decomposed reducing agents are avoided.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: October 7, 2008
    Assignee: Headway Technologies, Inc.
    Inventors: Chao-Peng Chen, Jas Chudasama, Situan Lam
  • Publication number: 20080105555
    Abstract: An object of the present invention is to provide a face-down type jet plating device in which deterioration in plating quality due to minute solid foreign matters derived from a black film etc. is prevented without impairing operativity. The plating device is designed such that a partition (7) is provided between a semiconductor wafer (1) and an anode (5) so that the anode (5) and the semiconductor wafer (7) are separated from each other and a plating tank (100) is divided into a substrate-to-be-plated chamber and an anode chamber.
    Type: Application
    Filed: December 8, 2005
    Publication date: May 8, 2008
    Inventor: Yoshihide Iwazaki
  • Patent number: 7323096
    Abstract: A method for treating the surface of an object to be treated includes introducing a surface treatment fluid into a reaction vessel (4) capable of receiving an object, introducing-the surface treatment fluid into a separation vessel (14) after the object is subjected to surface treatment, and circulating the surface treatment fluid, from which a contaminant has already been removed, to the reaction vessel (4). At the time of treatment on the surface of the object, a circulation passage for the surface treatment fluid including the reaction vessel (4) is communicated and the surface treatment fluid is constantly circulated through the circulation passage.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: January 29, 2008
    Assignees: Asahi Engineering Co., Ltd.
    Inventors: Hideo Yoshida, Seizo Miyata, Masato Sone, Nobuyoshi Sato
  • Patent number: 7189146
    Abstract: The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition solution, and a degassed cleaning solution. The technique includes degassing the process solution before delivering the degassed process solution to a processing unit or degassing the process solution in-situ, within the processing unit.
    Type: Grant
    Filed: April 29, 2003
    Date of Patent: March 13, 2007
    Assignee: ASM Nutool, Inc.
    Inventors: Bulent M. Basol, Cyprian E. Uzoh
  • Patent number: 7179359
    Abstract: Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a plating tank, means for supplying a plating solution into the plating tank, a plating solution outlet port which is formed in the plating tank, a cavity portion into which the plating solution which has flown out of the outlet port flows, a plating solution discharge port within the cavity portion, and a collection tank for the plating solution discharged from the discharge port, which subjects the object to be plated to plating treatment while supplying the plating solution into the plating tank, the shape and/or opening area of the discharge port formed on the downstream side of the cavity portion can be changed.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: February 20, 2007
    Assignee: Electroplating Engineers of Japan, Ltd
    Inventor: Hirofumi Ishida
  • Patent number: 7156972
    Abstract: A system and method for reducing ferric ion content in a plating solution by exposing hydrogen to an electrode in a plating solution for reducing a ferric ion content in the plating solution.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: January 2, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Wolfgang Diel, Richard M. Peekema, Murali Ramasubramanian
  • Patent number: 7147827
    Abstract: A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container for containing a plating solution and a hold container for containing a plating solution delivered from the mix container. A precision delivery arrangement delivers a precise predetermined quantum of a predetermined constituent of the plating solution to multiple mix containers and the hold containers. Transfer of plating solution between the mix and hold containers is effected by a transfer pump. Nitrogen gas that has been humidified with deionized water protects the plating solution from either acquiring water or becoming dehydrated, the humidified nitrogen gas being humidified to a predetermined relative humidity with respect to the temperature of the plating solution in the mix container. This is achieved by urging the nitrogen gas through a column that is at the same temperature as the plating solution.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: December 12, 2006
    Assignee: Applied Materials, Inc.
    Inventor: Todd Alan Balisky
  • Patent number: 6942779
    Abstract: The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass. Residual organics, if desired and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment. Inorganic contaminants are removed from the electroplating bath by selective ion exchange resins or electrodialysis, while particulate and suspended colloidal particles are removed by filtration before the treated plating bath is recycled.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: September 13, 2005
    Assignee: Mykrolis Corporation
    Inventors: Brett Matthew Belongia, Zhen Wu Lin, John E. Pillion, Jieh-Hwa Shyu
  • Patent number: 6899802
    Abstract: In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and the present invention can recycle a foemer plating solution to prepare a new plating solution, for example, in the following order: a process for preparing a Sn—Bi alloy plating solution (S1); a process for an active carbon treatment to remove the completing agent (S2); a process for removing Bi (S3); a process for a sedimenting treatment (S4); and a process for analyzing and correcting Sn plating solution. The recycling of plating solutions eliminates their effluent treatment and reduces environmental loads, effluent costs, and costs for purchasing new solutions. In the administration of the plating solution compositions, the conventional data can be utilized to facilitate the administrating operation.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: May 31, 2005
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Koujiro Kameyama
  • Patent number: 6890414
    Abstract: A system for use with a plating cell configured to plate objects in a plating process. At least one byproduct is created in a plating substance used in the plating cell. The system includes a purification system configured to remove at least a portion of the at least one byproduct from the plating substance. The purification system comprises at least a first processing vessel, a second processing vessel, and a flow path providing flow from the first processing vessel to the second processing vessel. The flow path may be configured such that the flow from the first vessel to the second vessel is caused by gravity. A method is also provided for removing at least a portion of at least one byproduct from a plating substance used in a plating cell.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: May 10, 2005
    Assignee: The BOC Group, Inc.
    Inventors: Colin John Dickinson, Ray Carnahan
  • Patent number: 6884332
    Abstract: A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient to promote dissolution of the hydrogen peroxide and generation of hydroxyl radicals; and adding an amount of an iron-containing compound so as to increase the rate of dissolution of the hydrogen peroxide to hydroxyl radicals so as to oxidize the organic compounds; whereby the total amount of organic carbon compounds in the solution is reduced. The apparatus comprises a treatment vessel, a pump for transferring a portion of the solution from the vessel to a mixing tank and for transferring a second portion of the solution to a heat exchanger for heating or cooling the second portion of the solution and a pump for transferring hydrogen peroxide to the vessel.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: April 26, 2005
    Assignee: Kuntz Electroplating Inc.
    Inventors: Peter Forth, Art Vibert, Madeline Busch, Sarah Stevenson, Hussain Al-Ekabi