Abstract: The present invention relates to a coin-type secondary battery and a manufacturing method therefor and, specifically, can provide: a coin-type secondary battery, wherein a solid electrolyte is applied to an anode part, an ion-containing solution comprising sodium, lithium, magnesium and a combination thereof is applied to a cathode part, and the ion-containing solution flows in from the outside of the cathode part; and a manufacturing method therefor.

Abstract: An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process.

Abstract: An electroplating apparatus has one or more membrane tube rings which act as electric field shields, to provide advantageous plating characteristics at the perimeter of a work piece. The membrane tube rings may be filled with fluids having different conductivity, to change the shielding effect as desired for electroplating different types of substrates. The membrane tube rings may optionally be provided in or on a diffuser plate in the vessel of the apparatus.

Abstract: The problem addressed by the present invention is to provide a method for facilitating the regenerating a waste plating solution as a plating solution. This method for regenerating an acidic waste plating solution containing, as ions, Fe and at least one plating metal element selected from the group consisting of Cu, Ni, Zn, Co, and Mn by removing Fe therefrom is characterized in having an addition step in which phytic acid is added to the waste plating solution to yield a phytic-acid-containing solution in which Fe ions are precipitated, and a removal step in which the precipitate is removed from the phytic-acid-containing solution to yield a regenerated plating solution.

Abstract: A device is for treating and packaging implants. The device includes a container including a chamber therein. The chamber is closed by a removable seal. The device also includes a carrier sized and shaped to be inserted into the chamber. The carrier includes a carrying structure configured to connect an implant thereto. A portion of the carrier may be formed of an electrically conductive material.

Abstract: Disclosed herein are electroplating systems for electroplating nickel onto a semiconductor substrate having an electroplating cell for holding an electrolyte solution during electroplating which includes a cathode chamber and an anode chamber configured to hold a nickel anode, and having an oxygen removal device arranged to reduce oxygen concentration in the electrolyte solution as it is flowed to the anode chamber during electroplating and during idle times when the system is not electroplating. Also disclosed herein are methods of electroplating nickel onto a substrate in an electroplating cell having anode and cathode chambers, which include reducing the oxygen concentration in an electrolyte solution, flowing the electrolyte solution into the anode chamber and contacting a nickel anode therein, and electroplating nickel from the electrolyte solution onto a substrate in the cathode chamber, wherein the electrolyte solution in the cathode chamber is maintained at a pH of between about 3.5 and 4.5.

Abstract: Processes and systems for electrochemical deposition of a multi-component solder by processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids.

Abstract: A method and system are disclosed for controlling plating bath compositions. Speciation analyzers including HPLC and mass spectrometry are employed to separate, detect, identify, and quantify additives and degradation products. A control unit is linked to a plating bath interface, analyzer interface, and valves to control the flow of plating bath to an analyzer sampler and back to plating bath. For each degradation product, a response output is determined for at least one performance factor in terms of an additive equivalent amount that produces the same effect. A data processing unit receives concentration data for additives and degradation products from speciation analyzers and calculates an amount of each additive needed to replenish a used bath. As a result, the bleed-and-feed ratio for maintaining plating baths can be substantially reduced with significant productivity improvement and cost savings in terms of chemicals, chemical disposal, less down time and improved product quality.

Abstract: [Object] When rare earth magnets are plated, components of the rare earth magnets are dissolved in the plating solution, causing plating defects. Thus, an easy method for removing rare earth impurities has been necessary. [Means for Solution] A nickel-electroplating solution containing rare earth impurities is kept at 60° C. or higher for a predetermined period of time to precipitate rare earth impurities for separation by sedimentation or filtration. Rare earth impurities can be precipitated further efficiently by adding precipitate to the nickel-electroplating solution, or by concentrating the nickel-electroplating solution by heating.

Abstract: The method begins by forming a solution comprising catalyst precursors, electrolyte and a solvent. Electrodes are inserted into the solution comprising an anode electrode and a cathode electrode. Electrochemical deposition then occurs wherein a current is passed between the electrodes. In this method at least one additional step of: i) heating the solution prior to and during the electrochemical deposition; ii) increasing the concentration of the catalyst precursors in the solution to greater than 0.1 millimolar; iii) performing the electrochemical deposition by a pulsed current; and iv) adding chemical promoters to the solution.

Abstract: Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel.

Abstract: A method for removing iron ions from galvanizing flux solution includes adding zinc chloride and ammonium chloride to a solvent in a preparing tank to prepare a first galvanizing flux solution which is transferred to a treatment tank, immersing an iron/steel piece in the first galvanizing flux solution to dissolve part of the surface to form iron ions, adding oxygen-rich gas to the first galvanizing flux solution to oxidize the iron ions to form a second galvanizing flux solution containing iron oxide precipitation, filtering the second galvanizing flux solution by a multilayer filter to form a third galvanizing flux solution without iron oxide or with low content of iron oxide, transferring the third galvanizing flux solution back to the treatment tank, and repeating the above steps by immersing another iron/steel piece in the first galvanizing flux solution so as to continuously remove iron ions generated.

Abstract: The disclosed embodiments relate to methods and apparatus for immersing a substrate in electrolyte in an electroplating cell under sub-atmospheric conditions to reduce or eliminate the formation/trapping of bubbles as the substrate is immersed. Various electrolyte recirculation loops are disclosed to provide electrolyte to the plating cell. The recirculation loops may include pumps, degassers, sensors, valves, etc. The disclosed embodiments allow a substrate to be immersed quickly, greatly reducing the issues related to bubble formation and uneven plating times during electroplating.

Abstract: A method of harvesting Group I metals from waste materials, including agitating Group I metal-containing materials in water to define a Group I metal-rich aqueous solution, removing any solid material from the Group I metal-rich aqueous solution, and filling the cathode portion of an electrochemical cell with the Group I metal-rich aqueous solution. A current collector is introduced into the Group I metal-rich aqueous solution, a steel electrode is operationally connected to the cathode portion, and the cathode portion is operated to deposite Group I metal onto the steel electrode.

Abstract: A method for purifying tin includes exposing an electrolytic solution comprising tin to an ion exchange resin and depositing electrorefined tin from the electrolytic solution. The deposited electrorefined tin has alpha particle emissions of less than about 0.01 counts/hour/cm2 immediately after the deposition step, and an alpha emissivity of less than about 0.01 counts/hour/cm2 at least 90 days after the deposition step.

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract: In order to remove fluorine from a zinc containing solution before zinc electro-refining in lower cost, fluorine is removed by adsorption from a zinc containing solution (leached solution) utilizing the character of the predetermined iron compound or zinc compound which can adsorb fluorine in an acid solution and desorb fluorine in an alkaline solution. The fluorine adsorbent/desorbent having adsorbed fluorine is treated in an alkaline solution, to desorb the fluorine. This makes it possible to regenerate the fluorine adsorbent/desorbent. Further, an electrolytic solution for zinc electro-refining can be prepared in lower cost, thus total zinc refining costs can be reduced.

Abstract: A plating apparatus plates a substrate with Sn alloy to form an Sn alloy film on a surface of the substrate. The apparatus includes: a plating bath for retaining a plating solution therein, the substrate being immersed in the plating solution in a position opposite to an insoluble anode; a plating solution dialysis line for extracting the plating solution from the plating bath and returning the plating solution to the plating bath; a dialysis cell provided in the plating solution dialysis line and configured to remove a free acid from the plating solution by dialysis using an anion exchange membrane; a free acid concentration analyzer; and a controller for controlling a flow rate of the plating solution flowing through the plating solution dialysis line based on the concentration of the free acid measured by the free acid concentration analyzer.

Abstract: Electrowinning methods and apparatus are suitable for producing elemental deposits of high quality, purity, and volume. Respective cathodes are used during electrowinning for bearing the elemental product, segregating impurities, dissolving morphologically undesirable material, and augmenting productivity. Silicon suitable for use in photovoltaic devices may be electrodeposited in solid form from silicon dioxide dissolved in a molten salt.

Abstract: A method for driving a flat panel display is provided. The flat panel display has n scan lines, wherein n is a positive integer. Each of the scan lines is coupled to a plurality of pixels. The driving method according to the invention includes the steps as follows: when pixels coupled to a kth scan line are enabled, pixels coupled to the scan lines from the first to k?1th are disabled and pixels coupled to at least a part of scan lines from k+1th to nth are enabled, thus pre-charging the enabled pixels of scan lines from k+1th to nth is performed thereby, wherein k is a positive integer.

Abstract: A device (1) for the wet-chemical treatment of material to be treated (10), in particular of flat material to be treated (10), comprises a treatment vessel (2) for treating the material to be treated (10) with a treatment liquid (9), a transport device (24) for transporting the material to be treated (10) through the treatment vessel (2), and a feed device (11) for feeding an inert gas (16) into the treatment vessel (2).

Abstract: The preceding invention concerns a galvanic bath as well as a method for depositing a zinc-bearing layer onto a substrate surface. According to the invention, it is provided that the galvanic bath be divided into at least two cell chambers, in which the division occurs by means of a cation-exchange membrane and one cell chamber includes an acidic deposition-electrolyte and the other cell chamber includes a neutral or acidic anolyte. The acidic anolyte here is at least partially removed from the cell chamber containing it and is stripped of the foreign metal ions contained in it by means of a cation-exchange arrangement.

Abstract: The present invention relates to a method of producing an electrodeposited metal oxide coating for a supercapacitor electrode. The present invention relates to the chronoamperometric electrodeposition of the metal oxide over a period from a few seconds, up to about 30 seconds leading to superior performance as a result of an increased surface area of the deposit. According to the present invention, the capacitances achieved are typically greater than 1300 F/g, and in some instances, over 4000 F/g.

Abstract: A method and apparatus involving at least two distinct adsorbent media for adsorptive removal of impurities from a metal deposition composition such as an electroless or electrolytic deposition composition.

Abstract: The invention relates to methods and devices for the decontamination of fluid, particularly the removal of heavy metals and/or arsenic and/or their compounds from water, by means of electrolysis, wherein the water to be purified subjected to electrodes of different polarities. The invention can include means for control of the pH of the fluid. The invention can also include control systems that allow self-cleaning of electrodes, self-cleaning of filters, and automatic monitoring of maintenance conditions.

Abstract: The invention relates to a method for depositing chromium and/or chromium alloys on metals, and particularly on sheet steel, wherein an alloy layer is electrolytically deposited on the metal from a solution containing chromium ions and/or chromium ions and further metal ions such as Zn, Cd, In, Pb, Bi, Mo, Cu, Fe, Ni, Co, Mn, Al, Sb, Ag, Sn, Mg, wherein chromium hydroxide precipitated from a chromium (III) solution is used for regenerating the electrolyte solution using chromium (III) ions.

Abstract: The invention relates to solubilizers for metal ions and poorly soluble metal compounds, containing an oxidation product of starch hydrolysate as a solubilizing agent, to a method for solubilizing metal ions and to the use of said solubilizer.

Abstract: The invention concerns a process which is used to plate functional layers of acidic or alkaline zinc or zinc alloy baths which contain nitrogenous organic additives, a soluble zinc salt and if necessary other metal salts selected from Fe, Ni, Co and Sn salts, where the bath composition for the regeneration is conveyed through an appropriate device having an ion exchanger resin to remove cyanide ions.

Abstract: Method and plating bath apparatus for setting the ionic strength of a plating composition using Donnan dialysis by flowing the plating composition along a first surface of a membrane while simultaneously flowing a deposition metal ion exchange composition along a second surface of the membrane such that the deposition metal ion crosses the membrane from the deposition metal ion exchange composition to the plating composition while an exchange cation different from the deposition metal ion crosses the membrane from the plating composition to the deposition metal ion exchange composition.

Abstract: Systems and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, a system includes (a) a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece, (b) an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode, (c) a barrier between the processing unit and the electrode unit to separate the first and second processing fluids, and (d) a water balance unit for maintaining the concentration of water in the first processing fluid within a desired range.

Abstract: Disclosed herein is a method of qualitatively analyzing high-molecular additives in a metal plating solution, including: removing sulfate ions and metal ions from a metal plating solution; and qualitatively analyzing the metal plating solution, from which sulfate ions and metal ions are removed, using Matrix-Assisted Laser Desorption/Ionization Time-Of-Flight Mass Spectroscopy (MALDI-TOF MS). The method is advantageous in that the structure and molecular weight of high-molecular additives present in very small amounts in a plating solution can be accurately measured while maintaining the specific structure and molecular weight thereof without degrading the high-molecular additives.

Abstract: An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; and one or more surface coatings comprising one or more of the following metals titanium, niobium, tantalum, ruthenium, rhodium, iridium, palladium, or gold, or an alloy of two or more metals, or a combination of two or more alloys or metal layers thereof having an increase in the surface area of 5 times to 500 times of the corresponding surface area resulting from the basic geometric shape.

Abstract: The invention relates to methods and devices for the decontamination of fluid, particularly the removal of heavy metals and/or arsenic and/or their compounds from water, by means of electrolysis, wherein the water to be purified subjected to electrodes of different polarities. The invention can include means for control of the pH of the fluid. The invention can also include control systems that allow self-cleaning of electrodes, self-cleaning of filters, and automatic monitoring of maintenance conditions.

Abstract: This invention relates to a method for removing thallium from a zinc-containing solution. In particular, the method relates to the purification with metallic zinc powder of a solution going to the electrolytic production of zinc. In this method, thallium is removed by means of a lead compound in the solution purification stage, either during the final purification stage or in a purification stage in which cadmium is precipitated.

Abstract: The present invention is directed to methods and apparatuses for removing bubbles from a process liquid. The process liquid can comprise a plating solution used in a plating tool. The process liquid is supplied to a tank. A plurality of streams of the process liquid are directed towards a surface of the process liquid from below. This can be done by feeding the process liquid to a flow distributor comprising a plurality of openings providing flow communication between an inner volume of the flow distributor and a main volume of the tank. Before leaving the tank through an outlet, the process liquid flows through a flow barrier.

Abstract: A method for producing high-purity nickel, which involves using a hydrochloric acid solution system to electro-deposit high-purity nickel, characterized in that, it includes the following steps sequentially: 3N-grade-grade electrolytic nickel was used as anode and the electro-deposition was carried out in a hydrochloric acid system, the solution obtained from the electro-deposition was extracted by a three-level countercurrent extraction using anion extraction solvents, and then back-extracted and degreased. After that, the solution was passed through the anion exchange resin to be further purified by ion exchange, and finally put into the electrolytic cell to deposit nickel.

Abstract: There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.

Abstract: A plating solution recovery apparatus for electroplating, the apparatus comprises a circulation tank; a sludge removing device; a concentrating device; an iron compound crystallizing device; an iron compound separating device; an iron compound redissolving device; an iron ion removing device; pipelines sequentially connecting the circulation tank, the sludge removing device, the concentrating device, the iron compound crystallizing device, the iron compound separating device, the iron compound redissolving device, and then the iron ion removing device in a downstream direction from a base point coincident with the circulation tank; a pipeline connecting from the iron ion removing device to the circulation tank; a pipeline connecting from the iron compound separating device to the circulation tank; and a flow path changing device connecting to the circulation tank and provided in at least one portion selected from a group of portions, respectively, between the sludge removing device and the concentrating devic

Abstract: The present invention provides an apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed deposition solution, and a degassed cleaning solution. The technique includes degassing the process solution before delivering the degassed process solution to a processing unit or degassing the process solution in situ, within the processing unit.

Abstract: A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode and a reference electrode and can reduce the molar ratio [Fe+3]/[Fe+2] to 1 ppm without depositing Fe or other metals on the working electrode or causing hydrogen evolution. The process is applicable to electroplating soft magnetic films such as NiFe, FeCo, and CoNiFe and can be performed during plating or during cell idling. The process is cost effective by reducing the amount of hazardous waste and tool down time due to routine solution swap. Other benefits are improved uniformity in composition and thickness of plated films because issues associated with decomposed reducing agents are avoided.

Abstract: An object of the present invention is to provide a face-down type jet plating device in which deterioration in plating quality due to minute solid foreign matters derived from a black film etc. is prevented without impairing operativity. The plating device is designed such that a partition (7) is provided between a semiconductor wafer (1) and an anode (5) so that the anode (5) and the semiconductor wafer (7) are separated from each other and a plating tank (100) is divided into a substrate-to-be-plated chamber and an anode chamber.

Abstract: A method for treating the surface of an object to be treated includes introducing a surface treatment fluid into a reaction vessel (4) capable of receiving an object, introducing-the surface treatment fluid into a separation vessel (14) after the object is subjected to surface treatment, and circulating the surface treatment fluid, from which a contaminant has already been removed, to the reaction vessel (4). At the time of treatment on the surface of the object, a circulation passage for the surface treatment fluid including the reaction vessel (4) is communicated and the surface treatment fluid is constantly circulated through the circulation passage.

Abstract: The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition solution, and a degassed cleaning solution. The technique includes degassing the process solution before delivering the degassed process solution to a processing unit or degassing the process solution in-situ, within the processing unit.

Abstract: Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a plating tank, means for supplying a plating solution into the plating tank, a plating solution outlet port which is formed in the plating tank, a cavity portion into which the plating solution which has flown out of the outlet port flows, a plating solution discharge port within the cavity portion, and a collection tank for the plating solution discharged from the discharge port, which subjects the object to be plated to plating treatment while supplying the plating solution into the plating tank, the shape and/or opening area of the discharge port formed on the downstream side of the cavity portion can be changed.

Abstract: A system and method for reducing ferric ion content in a plating solution by exposing hydrogen to an electrode in a plating solution for reducing a ferric ion content in the plating solution.

Abstract: A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container for containing a plating solution and a hold container for containing a plating solution delivered from the mix container. A precision delivery arrangement delivers a precise predetermined quantum of a predetermined constituent of the plating solution to multiple mix containers and the hold containers. Transfer of plating solution between the mix and hold containers is effected by a transfer pump. Nitrogen gas that has been humidified with deionized water protects the plating solution from either acquiring water or becoming dehydrated, the humidified nitrogen gas being humidified to a predetermined relative humidity with respect to the temperature of the plating solution in the mix container. This is achieved by urging the nitrogen gas through a column that is at the same temperature as the plating solution.

Abstract: The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass. Residual organics, if desired and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment. Inorganic contaminants are removed from the electroplating bath by selective ion exchange resins or electrodialysis, while particulate and suspended colloidal particles are removed by filtration before the treated plating bath is recycled.

Abstract: In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and the present invention can recycle a foemer plating solution to prepare a new plating solution, for example, in the following order: a process for preparing a Sn—Bi alloy plating solution (S1); a process for an active carbon treatment to remove the completing agent (S2); a process for removing Bi (S3); a process for a sedimenting treatment (S4); and a process for analyzing and correcting Sn plating solution. The recycling of plating solutions eliminates their effluent treatment and reduces environmental loads, effluent costs, and costs for purchasing new solutions. In the administration of the plating solution compositions, the conventional data can be utilized to facilitate the administrating operation.

Abstract: A system for use with a plating cell configured to plate objects in a plating process. At least one byproduct is created in a plating substance used in the plating cell. The system includes a purification system configured to remove at least a portion of the at least one byproduct from the plating substance. The purification system comprises at least a first processing vessel, a second processing vessel, and a flow path providing flow from the first processing vessel to the second processing vessel. The flow path may be configured such that the flow from the first vessel to the second vessel is caused by gravity. A method is also provided for removing at least a portion of at least one byproduct from a plating substance used in a plating cell.

Abstract: A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient to promote dissolution of the hydrogen peroxide and generation of hydroxyl radicals; and adding an amount of an iron-containing compound so as to increase the rate of dissolution of the hydrogen peroxide to hydroxyl radicals so as to oxidize the organic compounds; whereby the total amount of organic carbon compounds in the solution is reduced. The apparatus comprises a treatment vessel, a pump for transferring a portion of the solution from the vessel to a mixing tank and for transferring a second portion of the solution to a heat exchanger for heating or cooling the second portion of the solution and a pump for transferring hydrogen peroxide to the vessel.