Abstract: The present disclosure provides an encapsulation structure and an encapsulation method for a flexible OLED device. The encapsulation structure for the flexible OLED device comprises an organic matter protective layer, one or more continuous organic flat layers, one or more inorganic barrier layers, and one or more organic layers sequentially disposed on the OLED device. An outermost surface of each organic layer is treated with plasma to become a surface hardened layer, which forms an organic barrier layer with an unhardened portion of the organic layer. The surface hardened layer can prevent moisture invasion and erosion, thereby extending a service life of the OLED device. The unhardened portion of the organic barrier layer can completely release tensile stress of an inorganic layer. The encapsulation structure for the flexible OLED device improves moisture and oxygen blocking performance and reduces a risk of degradation of a thin-film encapsulation structure during bending.

Abstract: A display article is described herein that includes: a substrate comprising a thickness and a primary surface; and the primary surface having defined thereon a diffractive surface region. The diffractive surface region comprises a plurality of structural features that comprises a plurality of different heights in a multimodal distribution. Further, the substrate exhibits a sparkle of less than 4%, as measured by pixel power deviation (PPD140) at an incident angle of 0° from normal, a distinctness of image (DOI) of less than 80% at an incident angle of 20° from normal, and a transmittance haze of less than 20% from an incident angle of 0° from normal.

Abstract: In an example, an integrated optical circuit (IOC) includes a first substrate formed of a first material and a first waveguide formed of a second material and positioned on the first substrate. The first waveguide includes a plurality of branches and is configured to polarize light beams that propagate through the first waveguide. The IOC further includes a second substrate formed of a third material, the second substrate coupled to or positioned on the first substrate. The IOC further includes a plurality of straight waveguides formed in the second substrate, each of the plurality of straight waveguides optically coupled to a respective branch of the plurality of branches of the first waveguide. The IOC further includes a plurality of electrodes positioned proximate to the plurality of straight waveguides, the plurality of electrodes configured to modulate the phase of light beams that propagate through the plurality of straight waveguides.

Abstract: A semiconductor device manufacturing method, wherein the etching apparatus used includes a sample loading chamber (15), a vacuum transition chamber (14), a reactive ion plasma etching chamber (10), an ion beam etching chamber (11), a film coating chamber (12), and a vacuum transport chamber (13). Without interrupting the vacuum, reactive ion etching is first adopted to etch to an isolation layer (102); then, ion beam etching is performed to etch into a fixed layer (101) and stopped near a bottom electrode metal layer (100), leaving only a small amount of the fixed layer (101); subsequently, reactive ion etching is adopted to etch to the bottom electrode metal layer (100); and finally, ion beam cleaning is performed to remove metal residues and sample surface treatment, and coating protection is performed.

Abstract: A testing device and probe elements thereof are provided. The testing device includes a circuit substrate, a plurality of probe elements, a first housing and a second housing. The plurality of probe elements are independent of each other and arranged at fixed intervals. Each probe element comprises a body, a first contact section and a second contact section. The body is provided with a plurality of strip-shaped perforations, and the body includes a first lateral side and a second lateral side opposite to each other. The first contact section is connected to the first lateral side, and the second contact section is connected to the second lateral side. The extension direction of the first contact section relative to the body and the extension direction of the second contact section relative to the body are distinct from each other.

Abstract: Probe cards for probing highly-scaled integrated circuits are provided. A probe card includes a backplane and an array of probes extending from the backplane. Each of the probes includes a cantilever member and a probe tip. A first end of the cantilever member is coupled to the backplane, such that the cantilever member extends from the backplane. The probe tip extends from a second end of the cantilever member. The probes are fabricated from semiconductor materials. Each probe is configured to transmit electrical signals between the backplane and a device under test (DUT), via corresponding electrodes of the DUT. The probes are highly-scaled such that the feature size and pitch of the probes matches the highly-scaled feature size and pitch of the DUT's electrodes. The probes comprise atomic force microscopy (AFM) probes that are enhanced for increased electrical conductivity, elasticity, lifetime, and reliability.

Abstract: A method for microstructuring a plate-shaped glass substrate by laser radiation includes: introducing one-sided recesses into the glass substrate, in which a focus of the laser radiation forms a spatial beam along a beam axis and in which the laser radiation creates modifications in the glass substrate along the beam axis so that an action of an etching medium subsequently creates the recesses in the glass substrate through anisotropic removal of material in a respective region of the modifications. A chemical composition of the glass substrate is partially changed and thus at least one region of changed properties is created before the action of the etching medium.

Abstract: A mask material for plasma dicing, which is used in a plasma step, whose surface roughness Rz at the surface side that does not touch with an adherend is from 0.1 ?m to 1.5 ?m; a mask-integrated surface protective tape; and a method of producing a semiconductor chip.

Abstract: An electrode, in particular for micro-batteries, produced in a plurality of layers with intermediate steps of masking a first layer leaving some parts of the latter exposed in order next to produce a removal of material eliminating defects. After removal of the masking layer, the second layer can be formed. Other layers can then follow in the same way.

Abstract: A vessel for transporting a material that is solid or semi-solid at ambient temperature, includes a body having an interior surface comprising textured metal, and a superoleophobic coating on the interior surface for inhibiting the material from adhering to the interior surface, the superoleophobic coating including a nanotextured coating disposed on the textured metal and functionalized with a fluorinated compound. The superoleophobic coating facilitates flow of the material along the interior surface.

Abstract: In an example, an integrated optical circuit (IOC) includes a first substrate formed of a first material and a first waveguide formed of a second material and positioned on the first substrate. The first waveguide includes a plurality of branches and is configured to polarize light beams that propagate through the first waveguide. The IOC further includes a second substrate formed of a third material, the second substrate coupled to or positioned on the first substrate. The IOC further includes a plurality of straight waveguides formed in the second substrate, each of the plurality of straight waveguides optically coupled to a respective branch of the plurality of branches of the first waveguide. The IOC further includes a plurality of electrodes positioned proximate to the plurality of straight waveguides, the plurality of electrodes configured to modulate the phase of light beams that propagate through the plurality of straight waveguides.

Abstract: A transfer method of transferring an object to a target substrate by using a deformable film is provided. The method includes: a first process of forming an object on a source substrate, a second process of placing a deformable film on the source substrate on which the object is formed, a third process of embedding the object into the deformable film, a fourth process of separating an object, which is to be transferred, from the source substrate, integrating the transfer object in or on a surface of the deformable film, and separating deformable film, in which the transfer object is integrated, from the source substrate, and a fifth process of transferring the object integrated into the deformable film to a target substrate.

Abstract: In an assembly between a MEMS and/or NEMS electromechanical component and a casing, the electromechanical component includes at least one suspended and movable structure which is provided with at least one fixing zone, on which a region for receiving the casing is fixed, the suspended structure being at least partially formed in a cover for protecting the component or in a layer which is different from the one in which a sensitive element of the component is formed.

Abstract: Provided herein are devices and methods for topically and controllably delivering cargo across or into biological tissues, particularly the skin. These devices permit delivery of cargo to deeper cell layers of a tissue. These devices include microstructure arrays comprising nanochannels. Also disclosed is a device comprising a one or more microstructure arrays encased in a frame.

Abstract: Sub-lithographic structures configured for selective placement of carbon nanotubes and methods of fabricating the same generally includes alternating conformal first and second layers provided on a topographical pattern formed in a dielectric layer. The conformal layers can be deposited by atomic layer deposition or chemical vapor deposition at thicknesses less than 5 nanometers. A planarized surface of the alternating conformal first and second layers provides an alternating pattern of exposed surfaces corresponding to the first and second layer, wherein a width of at least a portion of the exposed surfaces is substantially equal to the thickness of the corresponding first and second layers. The first layer is configured to provide an affinity for carbon nanotubes and the second layer does not have an affinity such that the carbon nanotubes can be selectively placed onto the exposed surfaces of the alternating pattern corresponding to the first layer.

Abstract: The present disclosure provides an electron source, including one or more tips, wherein at least one of the tips comprises one or more fixed emission sites, wherein at least one of the tips includes one or more fixed emission sites, wherein the emission sites includes a reaction product of metal atoms on a surface of the tip with gas molecules.

Abstract: A device for controlling electron flow is provided. The device comprises a cathode, an elongate electrical conductor embedded in a diamond substrate, an anode, and a control electrode provided on the substrate surface for modifying the electric field in the region of the end of the conductor. A method of manufacturing the device is also provided.

Abstract: Provided are a method of producing a nano composite structure and a nano composite structure produced by using the same. The method comprises producing a substrate; placing a metal net structure above the substrate; and plasma treating the substrate above which the metal net structure is placed. The nano composite structure includes a substrate having a plurality of first protrusions constituting a nano pattern on its surface; and an inorganic particle disposed on an end of at least a portion of the first protrusions.

Abstract: A device for controlling electron flow is provided. The device comprises a cathode, an elongate electrical conductor embedded in a diamond substrate, an anode, and a control electrode provided on the substrate surface for modifying the electric field in the region of the end of the conductor. A method of manufacturing the device is also provided.

Abstract: Example embodiments relate to methods for producing a probe suitable for scanning probe microscopy. One embodiment includes a method for producing a probe tip suitable for scanning probe microscopy. The method includes producing a probe tip body that includes at least an outer layer of a probe material. The method also includes, during the production of the probe tip body or after the production, forming a mask layer on the outer layer of probe material. Further, the method includes subjecting the probe tip body to a plasma etch procedure. The mask layer acts as an etch mask for the plasma etch procedure. The plasma etch procedure and the etch mask are configured to produce one or more tip portions formed of the probe material. The one or more tip portions are smaller and more pointed than the probe tip body prior to the plasma etch procedure.

Abstract: The present invention provides a drug-holding microneedle array in which a drug is applied and held only on a tip portion of microneedles for quantitatively holding the drug and for preventing the drug from falling away during insertion of the microneedles. The drug-holding microneedle array comprises: a microneedle array having a microneedle substrate 4 and microneedles, the microneedles being positioned in plural on the microneedle substrate 4 and a tip portion 1 of the microneedles projecting via steps 2 and a drug held on the tip portion of the microneedles and the steps 2.

Abstract: A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.

Abstract: Micro- or nano-pores are produced in a membrane for various applications including filtration and sorting functions. Pores with at least one cross-sectional dimension in or near the nano-scale are provided. Device designs and processing allow for the use of thin film disposition and nano-imprinting or nano-molding to produce arrays of nano-pores in membrane materials functioning in applications such as filtration membranes, drug application/control structures, body fluid sampling structures, and sorting membranes. The nano-imprinting or nano-molding approach is utilized to create nano-elements in an organic or inorganic mold material with at least one nano-element cross-sectional dimension in or close to the nano-scale. These nano-elements can be in various shapes including slits, cones, columns, domes, and hemispheres.

Abstract: A method of fabricating a magnetoresistive bit from a magnetoresistive stack includes (a) etching through at least a portion of a thickness of the surface region to create a first set of exposed areas in the form of multiple strips extending in a first direction, and (b) etching through at least a portion of a thickness of the surface region to create a second set of exposed areas in the form of multiple strips extending in a second direction. The first set of exposed areas and the second set of exposed areas may have multiple areas that overlap. The method may also include, (c) after the etching in (a) and (b), etching through at least a portion of the thickness of the magnetoresistive stack through the first set and second set of exposed areas.

Abstract: Exemplary etching methods may include flowing a hydrogen-containing precursor into a substrate processing region of a semiconductor processing chamber. The methods may include flowing a fluorine-containing precursor into the substrate processing region. The methods may include contacting a substrate housed in the substrate processing region with the hydrogen-containing precursor and the fluorine-containing precursor. The substrate may define a trench. A spacer may be formed along a sidewall of the trench, and the spacer may include a plurality of layers including a first layer of a carbon-containing material, a second layer of an oxygen-containing material, and a third layer of a carbon-containing material. The second layer of the spacer may be disposed between the first layer and third layer of the spacer. The methods may also include removing the oxygen-containing material.

Abstract: A direct current application device includes a direct current source or an appliance configured to be linked to a direct current source. A first electrode is configured to be connected to the direct current source. The first electrode comprises a plurality of needles comprising 3-12 needles which are configured to comprise an electrically conductive connection with each other. A second electrode is configured to be connected to the direct current source. The second electrode comprises a flat electrode, a needle, or a plurality of needles which are configured to comprise an electrically conductive connection with each other. A current device is configured to maintain a current at a constant level during an application of the direct current, or a battery as the direct current source.

Abstract: A method for forming a chemical guiding structure intended for self-assembly of a block copolymer by chemoepitaxy, where the method includes forming on a substrate a functionalisation layer made of a first polymer material having a first chemical affinity with respect to the block copolymer; forming on the substrate guiding patterns made of a second polymer material having a second chemical affinity with respect to the block copolymer, different from the first chemical affinity, and wherein the guiding to patterns have a critical dimension of less than 12.5 nm and are formed by means of a mask comprising spacers.

Abstract: A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it.

Abstract: Disclosed is a method of manufacturing an emitter in which the tip of the emitter can be formed into a desired shape even when various materials are used for the emitter. The method includes performing an electrolytic polishing process of polishing a front end of a conductive emitter material so that a diameter of the front end is gradually reduced toward a tip; performing a first etching process by irradiating a processing portion of the emitter material processed by the electrolytic polishing process with a charged particle beam; performing a sputtering process by irradiating the pointed portion formed by the first etching process with a focused ion beam; and performing a secondary etching process of further sharpening the tip by an electric field induced gas etching processing while observing a crystal structure of the tip of the pointed portion processed by the sputtering process using a field ion microscope.

Abstract: A method for manufacturing a fine hollow protruding article (1) according to the invention involves: a protrusion forming step of bringing a projecting mold part (11) that includes a heating means into contact from one surface (2D) side of a base sheet (2) including a thermoplastic resin, and, while softening, with heat, a contact section (TP) in the base sheet (2) where the projecting mold part (11) contacts the base sheet (2), inserting the projecting mold part (11) into the base sheet (2), to form a protrusion (3) that protrudes from the other surface (2U) side of the base sheet (2); a cooling step of cooling the protrusion (3) in a state where the projecting mold part (11) is inserted in an interior of the protrusion (3); and a release step of withdrawing the projecting mold part (11) from the interior of the protrusion (3) after the cooling step, to form the fine hollow protruding article (1).

Abstract: Three-dimensional microstructure devices having substantially perfect alignment and leveling of a three-dimensional microstructure with respect to a substrate having a plurality of discrete electrodes and relating fabricating methods are disclosed. Seed layers are deposited onto the discrete electrodes of the substrate, and the three-dimensional microstructure is bonded adjacent to the seed layers. A substantially uniform sacrificial layer is deposited onto exposed surfaces of the three-dimensional microstructure. A plurality of first gaps exists between the seed layers and corresponding regions of the sacrificial layer. Conductive layers are deposited to fill the first gaps. The sacrificial layer is dissolved to create a second plurality of gaps between the conductive layers and the corresponding regions of the three-dimensional microstructure. The second gaps are substantially uniform.

Abstract: An optoelectronic device including three-dimensional semiconductor elements predominantly made of a first compound selected from among the group consisting of Compounds III-V, Compounds II-VI, and Compounds IV. Each semiconductor element defines, optionally with insulating portions partially covering said semiconductor element, at least one first surface including contiguous facets angled relative to each other. The optoelectronic device includes quantum dots at least some of the seams between the facets. The quantum dots are predominantly made of a mixture of the first compound and an additional element and are suitable for emitting or receiving a first electromagnetic radiation at a first wavelength.

Abstract: Described is a device for use in scanning probe microscopy and to a method for manufacturing same. The metallic device has a single body with two parts, wherein the second part has a submicrometric point that defines a nanoscale apex. Also provided is a method for manufacturing a high optical efficiency probe for scanning probe microscopy.

Abstract: A mask assembly includes a mask including an opening forming a pattern, an intermediate layer disposed on at least a portion of the mask, and a self-assembled monolayer (SAM) disposed on at least a portion of the intermediate layer.

Abstract: A scanning probe inspector comprises: a probe that includes a cantilever and a tip whose length corresponds to a depth of a trench that is formed in a wafer; a trench detector that acquires location information of the trench using the probe, where the location information includes depth information of the trench; a controller that inserts the tip into a first point where there exists a trench based on the location information of the trench, and moves the tip through the trench using the location information of the trench; and a defect detector that detects a presence of a defect in a sidewall of the trench as the tip is moved through the trench.

Abstract: A method of manufacturing a primary mold for the forming of a retroreflective screen, the method including the steps of: a) forming, on the front surface of such a substrate, a layer of a material such that the first substrate is selectively etchable over said layer; and b) forming microrecesses from the rear surface of the first substrate by selective etching of the first substrate over said layer, each microrecess emerging on the rear surface of said layer and having a back parallel to the front surface of the first substrate and first and second lateral walls orthogonal to each other and orthogonal to the back the first and second lateral walls and the back of the microrecess joining at a same point and forming a trihedron.

Abstract: The present invention generally relates to nanoantenna arrays and fabrication methods of said nanoantenna arrays. In particular, one aspect relates to nanoantenna arrays including nanostructures of predefined shapes in predefined patterns, which results in collective excitement of surface plasmons. The nanoantenna arrays can be used for spectroscopy and nanospectroscopy. Another aspects of the present invention relate to a method of high-throughput fabrication of nanoantenna arrays includes fabricating a reusable nanostencil for nanostensil lithography (NSL) which provides a mask to deposit materials onto virtually any support, such as flexible and thin-film stretchable supports. The nanostencil lithography methods enable high quality, high-throughput fabrication of nanostructures on conducting, non-conducting and magnetic supports. The nanostencil can be prepared by etching nanoapertures of predefined patterns into a waffer or ceramic membrane.

Abstract: In one embodiment, a surface treatment apparatus for a semiconductor substrate includes a holding unit, a first supply unit, a second supply unit, a third supply unit, a drying treatment unit, and a removal unit. The holding unit holds a semiconductor substrate with a surface having a convex pattern formed thereon. The first supply unit supplies a chemical solution to the surface of the semiconductor substrate, to perform cleaning and oxidation. The second supply unit supplies pure water to the surface of the semiconductor substrate, to rinse the semiconductor substrate. The third supply unit supplies a water repelling agent to the surface of the semiconductor substrate, to form a water repellent protective film on the surface of the convex pattern. The drying treatment unit dries the semiconductor substrate. The removal unit removes the water repellent protective film while making the convex pattern remain.

Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

Abstract: A three dimensional biomedical probe device is provided that includes a planar substrate. A probe structure is supported on the planar substrate. The probe structure has a base and a portion essentially perpendicular to the base extending along a length to a tip and has a linear dimension at the tip of said probe structure of between 5 nanometers (nm) and 5 microns thereby defining an AC, DC, or transient current, charge, or voltage sensing probe. In one variation, this probe is the electrical contact to the biomedical medium. In another variation, this probe is also the gate electrode of a field effect transistor (FET). An array of selectively electrically addressable such devices is also provided giving the ability to sample the physiological activity at many positions within cells, fluids and intercellular regions without the need for mechanical motion and inducing cellular lysis.

Abstract: A method of making nanoscale devices, the method including: depositing a metal film on a surface of a first substrate; annealing the metal film to form a plurality of metal island structures on the surface of the first substrate; laying metal nanospheres on the surface of the first substrate; baking the first composite structure to make the metal nanospheres become a plurality of metal crystalline balls; forming a photoresist layer on the first surface of the second composite structure; placing a release agent layer on a second substrate, applying an external force to press the photoresist layer on the release agent layer under an inert atmosphere; heating the second composite structure, the photoresist layer, the release agent layer, and the second substrate are and applying voltages in three stages.

Abstract: The present invention relates to a reflective optical objective (1) comprising: —a first reflecting element (3) including a front surface (3a) and a hack surface (3b), the front surface (3a) including a convex reflecting surface (11); and —a second reflecting element (5) including a concave reflecting surface (13) facing the convex reflecting surface (11) of the first reflecting element (3), the second reflecting element (5) including a transmissive section (7) permitting electromagnetic radiation to pass through the concave reflecting surface (13) of the second reflecting element (5) to the first reflecting element (3). The reflective optical objective (1) is characterized in that the reflective optical objective (1) includes a carrier material (9) embedding at least the front surface (3a) of the first reflecting element (3) and defining the distance (d) between the first (3) and second (5) reflecting elements.

Abstract: A probe card includes a substrate module having an installation hole and a first stair-shaped structure provided on two stairs thereof with a first connection surface and a first transmission surface having a first contact pad, a probe module having a probe and a second stair-shaped structure provided on two stairs thereof with a second connection surface and a second transmission surface having a second contact pad electrically connected with the probe, and a pressing member. The probe module is disposed in the installation hole so that the first and second connection surfaces are connected and the first and second transmission surfaces are opposite. The pressing member is detachably pressed on the probe module to press the second connection surface against the first connection surface and make the first and second contact pads electrically connected.

Abstract: The present disclosure relates generally to microneedle devices and methods for fabricating microneedles from a biocompatible polymer using photolithography. More particularly, aspects of the present disclosure are directed to the fabrication of microneedle devices using a biocompatible polymer (biopolymer) by way of biocompatible, essentially biocompatible, or substantially biocompatible fabrication techniques.

Abstract: A method, and corresponding apparatus, of fabricating a structure by chemical wet etching starting from a material rod of millimetric or sub-millemetric size, the method comprising: dipping an end portion (170) of the material rod (128,129) into a vessel (105) containing an etchant liquid (110) and a protective overlayer (175) floating on top of the etchant liquid, imparting a relative rotational movement of the etchant liquid with respect to the end portion (170) of the material rod immersed therein, wherein said imparting a relative rotational movement comprises imparting to the etchant liquid a rotational movement component with respect to a static reference system.

Abstract: The present application relates to a touch sensor and a method for preparing the same, and the touch sensor according to the present application includes: a substrate; and a driving electrode part, a sensing electrode part, and a wiring electrode part, which are provided on the same surface of the substrate, in which the driving electrode part, the sensing electrode part, and the wiring electrode part each include a conductive pattern including a shielding part and an opening.

Abstract: A method for applying a masked overgrowth layer onto a seed layer for producing semiconductor components, characterized in that a mask for masking the overgrowth layer is imprinted onto the seed layer.

Abstract: An organic light emitting display (OLED) device includes a substrate comprising a display region and a peripheral region. The OLED device further includes a conductive layer disposed in the peripheral region on the substrate and including an opening portion exposing at least a portion of the substrate, the conductive layer having an undercut shape. The OLED device additionally includes an insulation layer disposed on the conductive layer, the insulation layer including an opening that exposes the opening portion. The OLED device further includes a common layer disposed in both the display region and the peripheral region on the insulation layer and on the substrate exposed by the opening portion. The common layer disposed on the substrate exposed by the opening portion is spaced apart from the common layer disposed on the insulation layer.

Abstract: The purpose of the present invention is to provide a charged particle beam device that exhibits high performance due to the use of vanadium glass coatings, and to provide a method of manufacturing a component for a charged particle beam device. Specifically provided is a charged particle beam device using a vacuum component characterized by comprising a metal container, the interior space of which is evacuated to form a high vacuum, and coating layers formed on the surface on the interior space-side of the metal container, wherein the coating layers are vanadium-containing glass, which is to say an amorphous substance.

Abstract: A method for fabricating a trench isolation structure is provided. The method includes providing a substrate and forming a patterned mask layer on the substrate. A first etching step is performed on the substrate by using the patterned mask layer to form a trench in the substrate. A dielectric material is formed in the trench and on the patterned mask layer, wherein the dielectric material on the patterned mask layer has a first height. An etch back step is performed to decrease the dielectric material on the patterned mask layer to a second height. A planarization process is performed to remove the dielectric material on the patterned mask layer, where a polishing pad is used, and a first pressure and a second pressure are respectively applied on a central portion and a peripheral portion of the polishing pad, wherein the second pressure is greater than the first pressure.