Abstract: In an embodiment, a fluid ejection device includes a die substrate having first and second fluid slots along opposite substrate sides and separated by a substrate central region. First and second internal columns of closed chambers are associated with the first and second slots, respectively, and the internal columns are separated by the central region. Fluidic channels extending across the central region fluidically couple closed chambers from the first internal column with closed chambers from the second internal column. Pump actuators in each closed chamber pump fluid through the channels from slot to slot.

Abstract: A production process for an optically shaped product, including applying a photosensitive resin composition in a form of a dry film on to a substrate in which a hole opening to a surface thereof is formed so as to cover the hole and performing patterning to form an optically shaped product, wherein the photosensitive resin composition contains a resin comprising a tri- or higher functional epoxy resin and a bifunctional epoxy resin, the bifunctional epoxy resin has a weight-average molecular weight (Mw) of 5,500 to 60,000, the resin has a weight-average molecular weight (Mw) ranging from 4,500 to 11,000, and the mixing ratio by mass between the tri- or higher functional epoxy resin and the bifunctional epoxy resin satisfies (b)/(a)?1.5, where (a) is the mass of the tri- or higher functional epoxy resin, and (b) is the mass of the bifunctional epoxy resin.

Abstract: A composite of metal and resin is provided. The composite of metal and resin includes a metal piece and a resin piece, and the surface of the metal piece includes a number of micropores. Each micropore includes a first inclining hole and a second inclining hole, and the first inclining hole and the second inclining hole are disposed inclined with the surface of the metal piece. The first inclining hole and the second inclining hole are disposed symmetrical around an axis perpendicular to the surface of the metal piece, and communicate with each other on the surface of the metal piece. The resin piece is embedded to the micropores to combine with the metal piece. The bonding strength of the composite of metal and resin is increased. A method of manufacturing the composite of metal and resin is also provided.

Abstract: Provided are a manufacturing method of an inkjet print head, the inkjet print head and a drawing apparatus equipped with the inkjet print head. The manufacturing method includes: forming a separation assisting layer on a substrate; forming heating resistors, thin-film transistors and nozzles for ejecting liquid, on the separation assisting layer; separating the separation assisting layer from the substrate; forming a first heat-conductive layer on the opposite surface of the separation assisting layer from the nozzles; and forming an ink supply port for supplying ink to the nozzles from a first heat-conductive layer side of the inkjet print head.

Abstract: A piezoelectric device includes a deformation portion, a non-deformation portion which hinders deformation of the elastic layer, and a piezoelectric element. The deformation portion includes a first area in which the piezoelectric element is disposed, a third area adjacent to the non-deformation portion, and a second area disposed between the first area and the third area. In the first area, the elastic layer, an insulation layer, the lower electrode layer, the piezoelectric layer, and the upper electrode layer are sequentially stacked. In the second area, the elastic layer, the insulation layer, the piezoelectric layer, and the upper electrode layer are sequentially stacked. In the third area, the elastic layer and the upper electrode layer are sequentially stacked. The elastic layer is silicon oxide, and impurities are added to the upper electrode layer in the silicon oxide in the third area.

Abstract: An object of the present invention is to provide a processing method of a silicon substrate, capable of suppressing breakage of thin silicon or a thin film structure of an intermediate layer in etching first and second silicon substrates. According to the present invention, a first silicon substrate and a second silicon substrate are bonded to each other while holding an intermediate layer having an opening between both of the silicon substrates in a bonding step. A closed space defined by at least one of the first and second silicon substrates and the opening at least partly embedded with a filler in a filling step. Furthermore, a liquid supply port is formed in such a manner as to penetrate the filler in the opening and the second silicon substrate from the first silicon substrate in an etching step.

Abstract: The present invention provides methods utilizing current nano-technological processes for fabricating a range of micro-devices with significantly expanded capabilities, unique functionalities at microscopic levels, enhanced degree of flexibilities, reduced costs and improved performance in the fields of bioscience and medicine. Such fabricated micro-devices have significant improvements in many areas over the existing, conventional methods, which include, but are not limited to reduced overall costs, early disease detection, targeted drug delivery, targeted disease treatment and reduced degree of invasiveness in treatment. Compared with existing, conventional approaches, the said inventive approach disclosed in this patent application is much more microscopic, sensitive, accurate, precise, flexible and effective.

Abstract: In an embodiment, a fluid ejection device includes a die substrate having first and second fluid slots along opposite substrate sides and separated by a substrate central region. First and second internal columns of closed chambers are associated with the first and second slots, respectively, and the internal columns are separated by the central region. Fluidic channels extending across the central region fluidically couple closed chambers from the first internal column with closed chambers from the second internal column. Pump actuators in each closed chamber pump fluid through the channels from slot to slot.

Abstract: A method of manufacturing a liquid ejection head includes forming a hole in an SOI substrate including a first silicon layer, a second silicon layer, and a silicon oxide layer interposed between the first and second silicon layers such that the hole extends through the first silicon layer and the silicon oxide layer to the second silicon layer, forming a first protective film on the first silicon layer and an inner wall of the hole, forming a water-repellent film on the first protective film, attaching a support substrate to part of the water-repellent film facing away from the first silicon layer, removing the second silicon layer to remove a bottom of the hole, removing part of the water-repellent film disposed on the inner wall of the hole, and releasing the support substrate from the water-repellent film.

Abstract: Examples of fluid ejection apparatuses and methods for making fluid ejection apparatuses are described. An example method may include forming a fluid feed slot in a bulk layer of a substrate, forming a plurality of ink feed channels in at least an epitaxial layer of the substrate, each of the ink feed channels fluidically coupled to the fluid feed slot, and forming a plurality of drop generators over the substrate such that the epitaxial layer of the substrate is between the plurality of drop generators and the bulk layer and such that the each of the drop generators is fluidically coupled to the fluid feed slot by at least one of the ink feed channels.

Abstract: A manufacturing method for a liquid ejection head including: a substrate; an ejection orifice forming member having an ejection orifice on the substrate; and a surface layer having a recess that has a bottom portion communicating with the ejection orifice and an opening held in contact with an outside and having a width larger than a width of the ejection orifice, the surface layer being formed on the forming member, the method including: forming a first resin layer serving as the forming member by applying a negative photosensitive resin composition A onto the substrate; forming a second resin layer as the surface layer by applying a negative photosensitive resin composition B having sensitivity lower than sensitivity of the composition A onto the first resin layer; subjecting the first and the second resin layers to pattern exposure collectively; and subjecting the first and the second resin layers to development collectively.

Abstract: The invention provides a process for producing a liquid ejection head having an ejection orifice forming member in which an ejection orifice for ejecting a liquid has been formed, and a substrate having an energy-generating element for generating energy for ejecting a liquid from the ejection orifice on the side of a front surface thereof, the process includes the steps of providing a film having a support, a first layer and a second layer in this order, arranging the film on the substrate in such a manner that the second layer faces the front surface, detaching the support from the film arranged, forming the ejection orifice in the second layer, and removing at least a part of the first layer from the second layer.

Abstract: A recording head having a substrate and a channel forming member configured to form a flow channel, a supply port formed at the substrate so as to penetrate through the substrate, the flow channel communicates with the supply port, and a member formed of an organic material and configured to connect two surfaces forming the supply port and opposing each other with the supply port interposed therebetween.

Abstract: A liquid ejecting head includes a nozzle opening that is formed on one face of a silicon substrate, and ejects liquid, a first concave portion that is provided on the other face of the silicon substrate, and configures a pressure generating chamber which communicates with the nozzle opening, and a second concave portion that is provided on one face of the silicon substrate, and configures a flow path which communicates with the first concave portion and supplies the liquid, in which the first concave portion and the second concave portion overlap each other in an in-plane direction when seen in a direction which is orthogonal to the face of the silicon substrate.

Abstract: Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane.

Abstract: A piezoelectric element includes a support body having a displacing part capable of undergoing displacement, a lower electrode layer having a lower main electrode body and a lower electrode wire part with the lower main electrode body being formed on the support body and provided within the displacing part in a plan view and the lower electrode wire part being connected to the lower main electrode body and provided across an interior and an exterior of the displacing part, a first piezoelectric layer provided on the lower main electrode body, an upper electrode layer provided across the interior and exterior of the displacing part with at least a part of the upper electrode layer being layered on the first piezoelectric layer and insulated from the lower electrode layer, and a second piezoelectric layer provided on the support body to cover at least a part of the lower electrode wire part.

Abstract: A method of making inkjet print heads may include forming recesses in a first surface of a first wafer to define inkjet chambers. The method may also include forming openings extending from a second surface of the first wafer through to respective ones of the inkjet chambers to define inkjet orifices. The method may further include forming a second wafer including ink heaters, and joining the first and second wafers together so that the ink heaters are aligned within respective inkjet chambers to thereby define the inkjet print heads.

Abstract: A method for forming a feature in a device layer, including forming a first layer of a liftoff material and a second layer of photoresist over the liftoff material, exposing the photoresist and developing the photoresist and the liftoff layer. The photoresist develops at a slower rate than the liftoff layer. The development results in a first opening in the lift off layer and a second opening in the photoresist layer wherein the first opening is smaller than the second opening because of the different developing rates. The device layer is then dry etched or ion milled through the opening. Subsequent removal of the first layer and second layer leaves a clean surface of the patterned device layer, without the fences that can be formed using other methods.

Abstract: Provided is a liquid discharge head comprising a discharge port-forming member having discharge ports for discharging a liquid and having a surface provided with a liquid-repellent film. The liquid-repellent film includes a layer containing a resin composition containing at least one of polyurethane and polyrotaxane disposed on the discharge port-forming member and a layer containing a fluorine compound and having a thickness of 10 nm or less disposed on the resin composition-containing layer. When a scratch-forming tool, a diamond tip having a tip diameter of 15 ?m, is pressed onto the liquid-repellent film with a load of 0.098 N (10 gf) and is reciprocated ten times, the depth of a scratch formed on the surface of the liquid-repellent film is smaller than the thickness of the fluorine compound-containing layer.

Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.

Abstract: An inkjet nozzle device configured for venting a gas bubble during droplet ejection. The inkjet nozzle device includes: a firing chamber for containing ink, the firing chamber having a floor and a roof defining a nozzle aperture having a perimeter; and a heater element bonded to the floor of the firing chamber. The device is configured to satisfy the relationships A=swept volume/area of heater element=8 to 14 microns; and B=firing chamber volume/swept volume=2 to 6. The swept volume is defined as the volume of a shape defined by a projection from the perimeter of the nozzle aperture to the floor of the firing chamber, and includes a volume contained within the nozzle aperture.

Abstract: An electromechanical transducer element includes a substrate; a first electrode formed on the substrate as a common electrode; an electromechanical transducer membrane formed on the first electrode; a second electrode formed on the electromechanical transducer membrane as an individual electrode; a first insulation protection membrane formed on the first and the second electrode; a third electrode electrically connected to the first electrode; a fourth electrode electrically connected to the second electrode; a second insulation protection membrane including a common electrode pad formed on the third electrode and plural individual electrode pads formed on the fourth electrode; and a fifth electrode formed so as to surround a vicinity of at least one of the individual electrode pads disposed at end parts. Further, the fifth electrode is formed on the first insulation protection membrane and is electrically connected to the first electrode.

Abstract: A liquid ejection head body includes a substrate and a channel forming member arranged on the substrate. The channel forming member has a liquid ejection port for ejecting liquid and a liquid channel communicating with the liquid ejection port, while the substrate has an ejection energy generating element for generating energy for ejecting liquid at a first surface side and a liquid supply port for supplying liquid to the liquid channel in the inside. A conductive layer for electrically connecting the first surface side and a second surface side disposed opposite to the first surface side is arranged along the lateral surface of the liquid supply port.

Abstract: The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.

Abstract: A method for producing a liquid-ejection head includes the steps of: forming molds on or above a substrate, the molds being used as molding members for forming liquid chambers; forming a flow-passage-forming member by depositing an inorganic material on or above the substrate and the molds by chemical vapor deposition, the flow-passage-forming member having depressed portions each formed in an area between an adjacent pair of liquid-chamber side walls in which the molds are not formed; forming a photosensitive resin layer by depositing a photosensitive resin on the flow-passage-forming member and in the depressed portions; forming filling members in the depressed portions by grinding the photosensitive resin layer until the upper surface of an orifice plate is exposed; after grinding the photosensitive resin layer, forming ejection ports in the flow-passage-forming member; and, after forming the ejection ports, removing the molds.

Abstract: The invention relates to the field of LCDs, and more particularly to a PCB for an LCD device and an LCD device. The PCB includes a front face and a back face; the front face of the PCB is a face for densely arranging components, and the back face is a face without densely arranged components; the back face of the PCB is provided with a jumper wire for dissipating heat, and the jumper wire is connected with a terminal of the component. The heat of the component is transmitted to the jumper wire by the terminal, and the jumper wire is used for auxiliarily strengthening heat dissipation. Thus, the heat is rapidly transmitted, and the heat dissipating effect is significantly improved.

Abstract: A liquid ejection head includes a substrate, an energy-generating element provided on a front surface side of the substrate, the energy-generating element generating energy for ejecting liquid, sidewall members of a liquid flow path, and an ejection port forming member that defines an ejection port from which the liquid is ejected. In the liquid ejection head, sidewalls of the liquid flow path are formed of the sidewall members and a top wall of the liquid flow path is formed of the ejection port forming member, the sidewall members are each formed of a core member that extends from a front surface of the substrate and a covering member that covers the surface of the core member, the covering member covers the front surface of the substrate, and the ejection port forming member is formed of an inorganic material.

Abstract: Methods are provided for obtaining hollow nano-structures which include the steps of providing a suspended film starting layer on a support substrate, depositing on the starting layer a sacrificial layer, performing, in progressive sequence, a complete erosion phase of said support substrate and starting layer and performing an at least partial erosion phase of the sacrificial layer previously deposited on the starting layer so as to obtain holes passing through the starting layer and passing or non passing through the sacrificial layer, depositing, on the side of the support substrate opposite to that where the starting layer is put, at least one covering layer arranged to internally cover the holes created by the progressive erosion. Hollow nano-structures formed by such methods are also provided.

Abstract: A driving substrate includes: a protective layer including an etching surface; and a film layer including one or more convex portions on a surface thereof. The film layer is in contact with a rear surface of the protective layer. The one or more convex portions each have a surface being flush with the etching surface.

Abstract: A method for processing a silicon wafer is provided. The method includes allowing an etchant to flow along a surface of the silicon wafer to form a line in which a plurality of apertures are arranged in a flow direction of the etchant from an upstream side to a downstream side. The apertures arranged in the line include a first aperture formed on the most upstream side and a second aperture formed downstream of the first aperture in the flow direction of the etchant. The first aperture and the second aperture are subjected to different processes after being formed.

Abstract: There is provided a method for manufacturing a liquid discharge head including a substrate in which a liquid supply port is formed, a channel forming member that forms a liquid channel communicating with the liquid supply port on the substrate. The method includes preparing a substrate on which a hole serving as the liquid supply port is open, attaching a dry film on the substrate to cover an opening of the hole with the dry film, curing a cover part of the dry film that covers the hole, patterning the dry film to form a mold for the liquid channel, of a region of the dry film that includes the cover part, forming the channel forming member such that it covers the mold, and removing the mold to form the liquid channel.

Abstract: A method and system for integrated circuit fabrication is disclosed. In an example, the method includes determining a first process parameter of a wafer and a second process parameter of the wafer, the first process parameter and the second process parameter corresponding to different wafer characteristics; determining a variation of a device parameter of the wafer based on the first process parameter and the second process parameter; constructing a model for the device parameter as a function of the first process parameter and the second process parameter based on the determined variation of the device parameter of the wafer; and performing a fabrication process based on the model.

Abstract: A liquid ejection head including a substrate having an ejection-energy-generating element for generating energy for ejecting a liquid; an orifice plate including at least an ejection-orifice-forming wall that constitutes an ejection orifice for ejecting the liquid and an upper wall of a liquid chamber communicating with the ejection orifice, and a liquid chamber side wall that constitutes a side wall of the liquid chamber. The orifice plate is formed of an inorganic material. The liquid ejection head includes a plurality of liquid chambers; and an elastic member filled into a depressed portion formed between the liquid chamber side wall of one liquid chamber of the liquid chambers adjacent to each other and the liquid chamber side wall of the other liquid chamber. The upper end of the elastic member is arranged in a position higher than an upper face of the ejection-orifice-forming wall.

Abstract: Forming memristors on imaging devices can include forming a printhead body comprising a first conductive material, forming a memory on the printhead body by performing an oxidation process to form a switching oxide material on the first conductive material, and forming a second conductive material on the switching oxide material.

Abstract: A method for manufacturing a liquid discharge head includes a step of preparing a first substrate having an energy generating element at a front surface side thereof; a step of forming a wall member, which is to become a wall for a liquid flow passage, at the front surface side of the first substrate; a step of forming a mask having an opening on the wall member and forming a second substrate, which is composed of silicon and is to become an orifice plate, on the mask; and a step of forming a liquid supply port in the first substrate and a liquid discharge port in the second substrate by supplying an etchant from a back surface side of the first substrate, the back surface being a surface opposite the front surface.

Abstract: An ink jet head includes: a pressure chamber to be filled with ink formed in a pressure chamber structure, the pressure chamber in which an etching limiter made of a material different from a material of the pressure chamber structure is formed on an inner wall surface of the pressure chamber; a nozzle plate comprising a nozzle that leading to the pressure chamber and a movable range fitted to the etching limiter; and a flat driver comprising a piezoelectric body to operate the movable range and arranged on the nozzle plate.

Abstract: A liquid ejection head includes a substrate having an ejection energy generating element formed at a first surface side thereof, a common liquid chamber formed at a second surface of the substrate, and a liquid supply port extending from the bottom of the common liquid chamber to the first surface. The liquid ejection head is manufactured by preparing a substrate having the common liquid chamber formed at the second surface side, then arranging a material to be filled in the common liquid chamber, subsequently forming an aperture in the filled material as corresponding to the liquid supply port to be formed, and thereafter forming the liquid supply port by reactive ion etching, using at least the filled material as a mask.

Abstract: The invention provides a liquid ejection head including a substrate and a flow path forming member on the substrate, the flow path forming member forming an ejection orifice from which a liquid is ejected and a liquid flow path. The flow path forming member is formed of an inorganic material, contains at least a flow path side wall portion forming a side of the liquid flow path and has a member covering a substrate side end part of an inner wall of the flow path side wall portion.

Abstract: A process for producing a liquid ejection head including a silicon substrate having a supply port to supply a liquid to a flow path, and an ejection-orifice-forming member forming the flow path between the ejection-orifice-forming member and the silicon substrate and having an ejection orifice to eject the liquid in the flow path. The process includes forming an etching protection film so as to cover the ejection-orifice-forming member; forming the supply port passing through the silicon substrate by anisotropic etching using an alkaline aqueous solution; and removing the etching protection film. The etching protection film includes an organic polymer material having a storage modulus at 80° C. of 1.0×106 Pa or higher.

Abstract: Provided is a liquid discharge head comprising a discharge port-forming member having discharge ports for discharging a liquid and having a surface provided with a liquid-repellent film. The liquid-repellent film includes a layer containing a resin composition containing at least one of polyurethane and polyrotaxane disposed on the discharge port-forming member and a layer containing a fluorine compound and having a thickness of 10 nm or less disposed on the resin composition-containing layer. When a scratch-forming tool, a diamond tip having a tip diameter of 15 ?m, is pressed onto the liquid-repellent film with a load of 0.098 N (10 gf) and is reciprocated ten times, the depth of a scratch formed on the surface of the liquid-repellent film is smaller than the thickness of the fluorine compound-containing layer.

Abstract: A method of manufacturing an ejection orifice member includes: preparing a substrate including a first layer, a second layer, and a third layer, the first layer protruding in a first direction crossing a principal surface of the substrate, the second and third layers being formed on the first direction side of the first layer, the preparing a substrate including forming the second layer to follow a contour of a first direction side surface of the first layer, and then forming the third layer on a surface of the second layer which protrudes on the first direction side; performing plating using the second layer as a seed to form a fourth layer on the first direction side of the second layer; removing the third layer from the fourth layer to form a hole as the ejection orifice in the fourth layer; and thinning the fourth layer at least around the hole.

Abstract: A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.

Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening.

Abstract: In an embodiment, a method of fabricating an integrated orifice plate and cap structure includes forming an orifice bore on the front side of a product wafer, coating side walls of the orifice bore with a protective material, grinding the product wafer from its back side to a final thickness, forming a first hardmask for subsequent cavity formation, forming a second hardmask over the first hardmask for subsequent descender formation, forming a softmask over the second hardmask for subsequent convergent bore formation, etching a latent convergent bore using the softmask as an etch delineation feature, etching a descender using the second hardmask as an etch delineation feature, and anisotropic etching of convergent bore walls and cavities using the first hardmask as an etch delineation feature.

Abstract: Provided are a method of forming a through hole, which can inhibit misalignment between central axes of holes in both surfaces of a substrate, which is free from metal contamination, and which inhibits notching so as to improve the dimensional accuracy, the method including: preparing a silicon substrate; preparing a supporting substrate for supporting the silicon substrate; fixing the silicon substrate and the supporting substrate to form a composite substrate; and carrying out dry etching to the composite substrate from a silicon substrate side of the composite substrate toward a supporting substrate side of the composite substrate to form a through hole in the silicon substrate, in which the supporting substrate in the preparing a supporting substrate has a hole formed at a region corresponding to a region of the through hole to be formed in the silicon substrate, on a surface of the supporting substrate facing the silicon substrate.

Abstract: A nozzle plate manufacturing method that offers excellent protection against discharge liquid and that enables a nozzle plate having high nozzle-hole accuracy to be manufactured with good yield. The invention also provides a nozzle plate, a droplet discharge head manufacturing method, and a droplet discharge head.

Abstract: A manufacturing method of nozzle plate for liquid ejection head includes, providing a substrate having a first base material of Si and a second base material, of which the etching rate in Si anisotropic dry etching is lower then that of Si, provided on one side of the first base material, forming a film as a second etching mask on the surface of the second base material, forming a second etching mask pattern having a small-diameter opening shape in the second etching mask film, etching until the etching part is extended through the second base material, forming a film as a first etching mask film on the surface of the first base material, forming a first etching mask pattern having a large-diameter opening shape in the first etching mask film, and Si anisotropic dry etching until the etched part is extended through the first base material.

Abstract: A method of manufacturing a plurality of spacers in a film stack includes forming at least one electrically-conductive element having sidewalls on a substrate, depositing a plurality of passivation layers proximate to the substrate, and performing etching on one of the plurality of passivation layers to form a plurality of spacers substantially across from the sidewalls of the at least one electrically-conductive element.

Abstract: A method for producing a liquid-ejection head includes forming molds on or above the substrate, the molds being used as mold members for forming the plurality of liquid chambers; forming the flow-passage-forming member by depositing an inorganic material on or above the substrate and the molds by chemical vapor deposition, the flow-passage-forming member having depressed portions each formed in an area between an adjacent pair of the liquid-chamber side walls in which the molds are not formed; forming a water-repellent layer on the orifice plate; forming filling members in the depressed portions by applying a filling material to the flow-passage-forming member having the water-repellent layer formed thereon to fill the depressed portions with the filling material; forming the ejection ports in the flow-passage-forming member; and removing the molds after forming the ejection ports.

Abstract: The invention provides a process for producing a substrate with a piercing aperture, the piercing aperture being formed by conducting dry etching from the side of a second surface opposite to a first surface of a substrate to the first surface, the process comprising, in the following order, the steps of (a) forming a groove around a region where the piercing aperture is formed in the first surface of the substrate, (b) forming an etch-stop layer in the region where the piercing aperture is formed in the first surface of the substrate and in the interior of the groove, and (c) forming the piercing aperture by conducting the dry etching from the side of the second surface.