Abstract: The method of manufacturing a nozzle plate which includes a nozzle having a tapered section and a linear section includes the steps of: forming an etching stopper layer for stopping dry etching of a silicon substrate, on a first surface of the silicon substrate; forming a mask layer on a second surface of the silicon substrate reverse to the first surface; performing a first patterning process with respect to the mask layer so that an opening section is formed in the mask layer; carrying out the dry etching of the silicon substrate through the opening section in the mask layer so that the tapered section of the nozzle is formed in the silicon substrate; carrying out dry etching of the etching stopper layer through the opening section in the mask layer so that at least a part of the linear section of the nozzle is formed in the etching stopper layer; and removing the mask layer.

Abstract: Disclosed are a nano patterning method for fabricating a surface plasmon color filter having a transmissive pattern which selectively transmits light of specific wavelengths, and methods for fabricating a surface plasmon color filter and a liquid crystal display (LCD) device using the same. Used are a stamp which provides a partial electrification region, and a template, thiol-terminated nanospheres which can be self-assembled, thereby fabricating nano holes having a two-dimensional period and arranged in a hexagonal lattice. This may be applied onto a large area of a substrate, and may implement simplified processes and reduced fabrication costs.

Abstract: A method of manufacturing a liquid ejection head includes the steps of (1) forming a recess in a second surface of a substrate to form a common supply port, (2) forming an etching mask, which specifies opening positions of independent supply ports, on a bottom surface of the common supply port, and (3) performing ion etching using plasma with the etching mask employed as a mask, thereby forming the independent supply ports. The etching mask has an opening pattern formed therein such that respective distances from an ejection energy generation element to openings of two independent supply ports adjacent to the ejection energy generation element on the first surface side of the substrate are equal to each other.

Abstract: According to one feature of the present invention, a method of manufacturing a porous catcher includes providing a catcher face material layer; forming pores in the catcher face material layer using a first etching process that is controlled by a first photolithographic mask; providing a reinforcing structure material layer that is in mechanical contact with the porous catcher face; forming openings in the reinforcing structure material layer using a second etching process that is controlled by a second photolithographic mask; and fluidically connecting the openings in the reinforcing structure and the pores of the catcher face using a material removal process.

Abstract: A method of hydrophobizing a frontside surface of an integrated circuit. The method includes the steps of: (a) depositing a hydrophobic polymeric layer onto the frontside surface; (b) depositing a protective metal film onto the hydrophobic polymeric layer; (c) depositing a sacrificial material onto the metal film; (d) patterning the sacrificial material; (e) etching through the metal film, the hydrophobic polymeric layer and the frontside surface; (f) performing MEMS processing steps on a backside of the integrated circuit; (g) subjecting the integrated circuit to an oxidizing plasma, wherein the metal film protects the hydrophobic polymeric layer from the oxidizing plasma; and (h) removing the protective metal film to provide an integrated circuit having a relatively hydrophobic patterned frontside surface.

Abstract: Provided is a nozzle plate and methods of manufacturing the nozzle plate. The nozzle plate may include a substrate having a nozzle. The nozzle plate may also include a permittivity reducing area in an upper portion of the substrate around the nozzle, wherein the permittivity reducing area includes a plurality of porosities and a plurality of walls between the plurality of porosities. Additionally, the nozzle plate may include a protection layer on the substrate, wherein the protection layer covers the plurality of porosities and the plurality of walls.

Abstract: Provided is a processing method for an ink jet head substrate, including: forming a barrier layer on a substrate and forming a seed layer on the barrier layer; forming a resist film on the seed layer and patterning the resist film so that the patterned resist film corresponds to a pad portion for electrically connecting an ink jet head to an outside of the ink jet head; forming the pad portion in an opening of the patterned resist film; removing the resist film; subjecting the substrate to anisotropic etching to form an ink supply port; removing the barrier layer and the seed layer; and performing laser processing from a surface of the substrate.

Abstract: A nozzle plate manufacturing method that offers excellent protection against discharge liquid and that enables a nozzle plate having high nozzle-hole accuracy to be manufactured with good yield. The invention also provides a nozzle plate, a droplet discharge head manufacturing method, and a droplet discharge head.

Abstract: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing a dielectric fill layer over the diaphragm and the plurality of piezoelectric elements to encapsulate the piezoelectric elements, curing the dielectric fill layer to form an interstitial layer, then removing the interstitial layer from an upper surface of the plurality of piezoelectric elements using a plasma etch.

Abstract: A method for manufacturing an ink jet recording head is employed which has a metal mask formation process for forming a metal mask having a predetermined shape containing a silicide film formed by silicidation of the surface of a flow path forming substrate wafer containing a silicon substrate and a liquid flow path formation process for forming a liquid flow path by anisotropically etching the flow path forming substrate wafer using the metal mask as a mask.

Abstract: A liquid ejection head substrate is manufactured by forming a wiring pattern on one surface of a substrate, forming an etching mask layer on the other surface of the substrate, forming a positioning reference mark on the etching mask layer by means of a laser, forming an opening pattern groove running through the etching mask layer and having a bottom in the inside of the silicon substrate, using the positioning reference mark, and forming a liquid supply port running through the silicon substrate by etching the silicon substrate from the opening pattern groove to the one surface by means of crystal anisotropic etching.

Abstract: A nozzle plate manufacturing method that offers excellent protection against discharge liquid, and that enables a nozzle plate having high nozzle-hole accuracy to be manufactured with good yield. The invention also provides a nozzle plate, a droplet discharge head manufacturing method, and a droplet discharge head.

Abstract: A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.

Abstract: Methods for fabrication of microfluidic systems on printed circuit boards (PCB) are described. The PCB contains layers of insulating material and a layer or layers of metal buried within layers of insulating material. The metal layers are etched away, leaving fully enclosed microfluidic channels buried within the layers of insulating material.

Abstract: A checker array print head is able to output an image with possible white or black stripes made unnoticeable even when the conveyance direction of a print medium with respect to the ink jet print head is skewed. A first chip located on an upstream side in a conveyance direction (X direction) and a second chip located on a downstream side in the conveyance direction are arranged such that a dot printed via the first chip and a dot printed via the second chip are printed at intervals shorter than a print resolution in an ejection port arrangement direction (Y direction). Thus, even if the conveyance direction of the print medium is skewed by meandering thereof or the like, possible white stripes, which are particularly noticeable, can be inhibited.

Abstract: A heater stuck includes first strata having a planar configuration supporting and forming a fluid heater element responsive to repetitive electrical activation and deactivation to produce repetitive cycles of fluid ejection from an ejection chamber above the heater element and second strata having a planar configuration coating the heater element of the first strata and being contiguous with the ejection chamber to protect the heater element. The first strata include a substrate and heater strata disposed on it and forming a cavity above the substrate and encompassed on three sides by the heater substrata. The heater substrata includes a pair of conductive layer portions constituting terminal leads disposed on the substrate at opposite sides of the cavity and a resistive layer disposed on the conductive layer portions and defining the fluid heater element that spans the top of the cavity.

Abstract: A method of fabricating a microfluidic device, the method includes etching a plurality of frame-shaped grooves into a first side of a substrate, each frame-shaped groove surrounding a non-etched portion of the substrate; dispensing a sacrificial photoresist on the first side of the substrate; spinning the wafer to obtain a substantially planar surface of the sacrificial photoresist; patterning the sacrificial photoresist to form openings defining walls for a plurality of chambers and fluid passageways; laminating a polymer film over the patterned sacrificial photoresist; etching a portion of the substrate from a second side of the substrate until the etched portion meets the frame-shaped grooves; removing the sacrificial resist to provide a plurality of chambers, each chamber being adjacent to at least one of the plurality of walls; and removing the non-etched portions of the substrate surrounded by the frame-shaped grooves to form a plurality of feed holes.

Abstract: A production process for a structure includes preparing a substrate on which a first layer and a second layer are provided in this order; forming a second mold, which is a part of a mold member serving as a mold for forming the structure, from the second layer; etching the first layer using the second mold as a mask and thereby forming a first mold, which is another part of the mold member from the first layer; providing a coating layer which serves as the structure to cover the first mold and the second mold; and removing the first mold and the second mold and thereby forming the structure.

Abstract: A through-hole forming method includes steps of forming a first impurity region (102a) around a region where a through-hole is to be formed in the first surface of a silicon substrate (101), the first impurity region (102) being higher in impurity concentration than the silicon substrate (101), forming a second impurity region (102b) at a position adjacent to the first impurity region (102a) in the depth direction of the silicon substrate (101), the second impurity region (102b) being higher in impurity concentration than the first impurity region (102a), forming an etch stop layer (103) on the first surface, forming an etch mask layer (104) having an opening on the second surface of the silicon substrate (101) opposite to the first surface, and etching the silicon substrate (101) until at least the etch stop layer (103) is exposed via the opening.

Abstract: Processes for making a membrane having a curved feature are disclosed. A profile-transferring substrate surface having a curved feature is created by vacuum bonding a membrane to a top surface of a substrate, where the top surface has a cavity formed therein. The surface of the membrane is exposed to a fluid pressure such that the membrane deforms and the undersurface of the membrane touches the bottom of the cavity. The curved feature formed in the deformed membrane can be made permanent by annealing the bonding areas between membrane and substrate. A uniform layer of material deposited over the exposed surface of the membrane will include a curved feature at the location where the membrane has bent into the cavity. After at least one layer of material has been uniformed deposited on the membrane, the cavity can be etched open from the bottom to remove the membrane from the underside.

Abstract: Provided is a liquid recording head in which a protective layer having resistance to liquid and an adhesiveness improving film are disposed on a second surface opposite to a first surface of a silicon substrate. The first surface and the second surface have a plane direction. The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates to a liquid introduction port on a side of the second surface of the silicon substrate.

Abstract: A Method for manufacturing a liquid discharge head having a flow path forming member for forming a liquid flow path which communicates with a discharge port discharging liquid, comprises; preparing a layer containing a compound having a structure represented by Formula (1) and a structure represented by Formula (2) as a main chain on a substrate, providing a solution in which a resin is dissolved in a compound represented by Formula (3) or (4) on the layer, forming a mold having the shape as the flow path from the resin, providing a layer which will become the flow path forming member so as to cover the mold, and removing the mold to form the flow path.

Abstract: A method of manufacturing an inkjet head includes: forming an inlet and a pressure chamber in an upper substrate, the inlet penetrating the upper substrate and providing a passage for an inflow of ink, and the pressure chamber formed as a recess in one side of the upper substrate; forming a manifold and an ink channel in a middle substrate, the manifold configured to be connected with the inlet, and the ink channel penetrating the middle substrate and configured to be connected with the pressure chamber; forming a straight portion and a nozzle in a plate substrate, the straight portion configured to be connected with the ink channel, and the nozzle connected with the straight portion; forming a hydrophobic layer on one side of the plate substrate, the hydrophobic layer having a window formed therein, and the window opening the nozzle by a circumference greater than a circumference of an end of the nozzle; and stacking in order and attaching the upper substrate, the middle substrate, and the plate substrate.

Abstract: An ink discharge head includes a coating resin layer having a plurality of discharge ports for discharging ink, and ink flow passages which communicate with the plurality of discharge ports, respectively; and a substrate having energy generation elements which generate the energy for discharging ink and provided with the coating resin layer. A crack inducing portion for relieving the stress produced at the interface between the coating resin layer and the substrate is formed at lateral faces of the outer peripheral edge of the coating resin layer.

Abstract: Various embodiments provide materials and methods for a superoleophobic device, which can include a conformal oleophobic coating disposed on glass pillars and/or stripe-shaped glass structures on a glass substrate to provide the device with a textured superoleophobic surface.

Abstract: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.

Abstract: Provided is a manufacturing method for a thermal head, including: bonding a flat upper substrate in a stacked state onto a flat supporting substrate including a heat-insulating concave portion open to one surface thereof so that the heat-insulating concave portion is closed (bonding step (SA2)); thinning the upper substrate bonded onto the supporting substrate by the bonding step (SA2) (plate thinning step (SA3)); measuring a thickness of the upper substrate thinned by the plate thinning step (SA3) (measurement step (SA4)); deciding a target resistance value of heating resistors based on the thickness of the upper substrate, which is measured by the measurement step (SA4) (decision step (SA5)); and forming, at positions of a surface of the upper substrate thinned by the plate thinning step (SA3), the heating resistors having the target resistance value determined by the decision step (SA5), the positions being opposed to the heat-insulating concave portion (resistor forming step (SA6)).

Abstract: Thermal inkjet print head, comprising a fluid feed channel for delivering fluid, fluid chambers arranged near the fluid feed channel for receiving fluid from the fluid feed channel, resistors for actuating the fluid in the chambers, arranged in a staggered pattern with respect to a fluid feed channel wall, and a cantilever extending over the fluid feed channel wall, having a staggered edge that follows the staggered pattern of the resistors.

Abstract: A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.

Abstract: A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from a first surface to a rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a <100> direction of the Si substrate; and forming a plurality of the liquid supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: An ink feedhole of an inkjet printhead and a method of forming the same includes an ink feedhole that penetrates a substrate and has a width that narrows in an upper direction of the substrate, wherein at least one internal wall of the ink feedhole has a plurality of steps and inclines with respect to a surface of the substrate.

Abstract: A printing device (10) including a substrate (22) having an aperture (20) extending therethrough, wherein the aperture includes a side wall and defines a liquid ink flow path, an ink firing chamber (24) fluidically connected to the aperture, and a coating positioned on the side wall of the aperture, the coating being impervious to etching by liquid ink, and wherein the coating is chosen from one of silicon dioxide, aluminum oxide, hafnium oxide and silicon nitride.

Abstract: The present invention provides a method for producing a liquid discharge head including a silicon substrate having, on a first surface, energy generating elements, and a supply port penetrating the substrate from the first surface to a second surface, which is a rear surface of the first surface of the substrate. The method includes the steps of: preparing the silicon substrate having a sacrifice layer at a portion on the first surface where the ink supply port is to be formed and an etching mask layer having a plurality of openings on the second surface, the volume of a portion of the sacrifice layer at a position corresponding to a portion between two adjacent said openings being smaller than the volume of a portion of the sacrifice layer at a position corresponding to the opening; etching the silicon substrate from the plurality of openings and etching the sacrifice layer.

Abstract: A method for manufacturing a liquid discharge head including a flow path forming member to form a flow path communicating with a discharge port for discharging liquids includes forming an organic material layer on a substrate, applying a soluble resin on the organic material layer to form a resin layer, patterning the resin layer to form a pattern with a shape of the flow path, forming a cover layer as the flow path forming member on the pattern, forming the discharge port to expose a part of the pattern from the cover layer, eluting the pattern from the discharge port to form the flow path, irradiating a substance sticking to a surface of the flow path forming member on which the discharge port is formed with ultraviolet light, wherein the substance contains at least the organic material, and removing the sticking substance.

Abstract: An assembly for selectively etching an inkjet printhead includes a substrate and printhead layers formed on the substrate. A bonding region can provide a location on the printhead layers for an electrical bond. An ink channeling region can be defined at least in part by the printhead layers. A mask layer can partially cover the printhead layers and include a first opening positioned over the bonding region and a second opening positioned over the ink channeling region. The assembly can also include a via at the first opening and a trench at the second opening having greater depth than the via.

Abstract: A process for preparing a flexible device having a superoleophobic surface comprising providing a flexible substrate; disposing a silicon layer on the flexible substrate; using photolithography to create a textured pattern in the silicon layer on the substrate wherein the textured pattern comprises a groove structure; and chemically modifying the textured surface by disposing a conformal oleophobic coating thereon; to provide a flexible device having a superoleophobic surface.

Abstract: A method of manufacturing an inkjet printhead, in which a solvent included in a positive photoresist composition or in a non-photosensitive soluble polymer composition which is used to form a sacrificial layer has a different polarity from that of a solvent included in a negative photoresist composition that is used to form at least one of a channel forming layer and a nozzle layer.

Abstract: A method of processing a substrate includes the steps of providing a silicon substrate that has an etching mask layer with an opening portion at a first surface thereof and has plane orientation of {100} with the surface of the silicon being exposed from the opening portion; preparing a recessed portion that faces from the first surface to a second surface, opposite to the first surface, in the opening portion of the silicon substrate; and forming a penetration port that passes through the first surface and the second surface of the silicon substrate by executing crystalline anisotropic etching in the silicon substrate using an etching liquid in which an etching rate for etching a (100) surface of silicon is higher than an etching rate for etching a (110) surface of silicon, from the recessed portion of the silicon substrate toward the second surface.

Abstract: In a thermal head manufacturing method, at least one concave portion is formed on a surface of a first substrate, and a second substrate comprised of a first layer and a second layer that is denser and harder than the first layer is provided. The first and second substrates are bonded to one another so that the second layer of the second substrate covers the concave portion of the first substrate. The first layer of the second substrate is then etched until a surface of the second layer of the second substrate is exposed. At least one heating resistor is formed on the exposed surface of the second layer of the second substrate after the etching step so that the heating resistor is disposed over the concave portion of the first substrate.

Abstract: Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

Abstract: A method for producing an inkjet recording head includes preparing the substrate having a through hole to be formed into a supply port, the through hole having openings on the first surface and the second surface, the substrate having a first protective layer disposed on the second surface, the first protective layer having an overhang extending into the region of the opening on the second surface. The method also includes forming a second protective layer so as to continuously cover at least the overhang of the first protective layer and the inner wall of the through hole, and removing a portion of the second protective layer corresponding to the opening on the first surface.

Abstract: An inkjet head includes a recording element substrate for discharging ink, a supply port penetrating the recording element substrate and serving as an ink flow path, a protrusion formed at a position surrounding the supply port, projecting from one surface of the recording element substrate, and having a first metal layer at a distal end, and a supporting member having a second metal layer welded with the first metal layer and supporting the recording element substrate.

Abstract: Provided is a method of producing a liquid ejection head substrate, the method including, in sequence; grinding a second surface of a silicon substrate, which is an opposite surface of a first surface on which a function element is formed, polishing the ground second surface, etching the polished second surface by reactive ion etching using ion incident energy, forming an etching mask on the second surface after the reactive ion etching, and forming a liquid supply port by subjecting the silicon substrate to wet etching using the etching mask.

Abstract: A process for manufacturing an inkjet print head comprising the steps of providing a print head wafer comprising a plurality of print head dice coated with a barrier layer, each print head die comprising a plurality of actuators and interconnections, the barrier layer comprising a plurality of openings in correspondence with the plurality of actuators and interconnections, providing a debondable SOI wafer comprising a handle layer, a buried layer, and a device layer, forming a protective layer on the surface of the device layer, bonding the device layer to the barrier layer, debonding the handle layer from the SOI wafer, etching the device layer so as to realize a plurality of openings in correspondence with the plurality of actuators and interconnections, and removing the protective layer in correspondence of the plurality of openings.

Abstract: A liquid ejecting head has a nozzle substrate made of crystalline material, in which a nozzle through which liquid is ejected is provided by an etching process. The nozzle includes a plurality of continuous nozzle sections having different diameters arranged coaxially in the direction of the thickness of the crystalline material. The nozzle sections include a first nozzle section that is located at the ejection-side end and that has a first diameter, and a second nozzle section that is continuous with the first nozzle section and that has a second diameter larger than the first diameter. The difference between the first diameter and the second diameter is not less than 0.1 and not greater than 0.4 relative to the first diameter.

Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.

Abstract: A method of manufacturing an ink-jet head is disclosed. The method in accordance with an embodiment of the present invention includes: forming a dividing groove such that one surface of a piezoelectric element is divided corresponding to the position of the chamber; filling the dividing groove with a filler; bonding one surface of the piezoelectric element to one surface of the ink-jet head in which the chamber is formed; and polishing the other surface of the piezoelectric element such that the filler is exposed.

Abstract: A method for manufacturing a liquid discharge head provided with a substrate which has a layer made of silicon nitride and with a discharge port forming member which is disposed above the layer made of silicon nitride and has a discharge port for discharging liquid. The method includes providing a photosensitive layer that is to be the discharge port forming member above the layer made of silicon nitride, and forming the discharge port by exposing the photosensitive layer to i-line. The layer made of silicon nitride has a refractive index of 2.05 or more to light of a wavelength of 633 nm and irradiation with the i-line is performed in the exposure.

Abstract: A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a second recess provided therein so as to penetrate from the one side face into the inner part through the passive film, wherein the recesses satisfy a relation of a ×tan 54.7 degrees?d, where a is defined as a distance between the first recess and the second recess, and d is defined as a depth of the second recess, and forming the supply port by anisotropically etching the crystal from the one side face.