Abstract: A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.

Abstract: A method of manufacturing an inkjet print head that includes an improved process of forming an ink feed hole, thereby enabling an increase in productivity and a favorable ink supply via the ink feed hole. The method includes preparing a substrate on which a heater to heat an ink is formed on the front side thereof, forming a flow passage formation layer on the front side of the substrate such that the flow passage formation layer defines an ink flow passage, forming a nozzle layer provided with a nozzle on the flow passage formation layer, forming a first protective layer such that the first protective layer covers the flow passage formation layer and the nozzle layer, applying a mask material used to etch the substrate to the rear side of the substrate, applying a second protective layer to the lateral side of the substrate to protect the lateral side of the substrate, and forming an ink feed hole on the substrate by wet etching. Tantalum (Ta) is used as the mask material.

Abstract: An inkjet head includes a channel unit and actuator units. Inside the channel unit, individual ink channels are formed so that ink supplied from ink inlets is ejected from nozzles via pressure chambers. The actuator units are bonded to the upper surface of the channel unit. The actuator units have a configuration of four piezoelectric sheets laminated to one another. On the upper surface of the piezoelectric sheet, individual electrodes are disposed in positions opposed to the pressure chambers respectively. A FPC for supplying driving signals to the actuator units is connected to the individual electrodes.

Abstract: Provided is a manufacturing method for a thermal head, including: bonding a flat upper substrate in a stacked state onto a flat supporting substrate including a heat-insulating concave portion open to one surface thereof so that the heat-insulating concave portion is closed (bonding step (SA2)); thinning the upper substrate bonded onto the supporting substrate by the bonding step (SA2) (plate thinning step (SA3)); measuring a thickness of the upper substrate thinned by the plate thinning step (SA3) (measurement step (SA4)); deciding a target resistance value of heating resistors based on the thickness of the upper substrate, which is measured by the measurement step (SA4) (decision step (SA5)); and forming, at positions of a surface of the upper substrate thinned by the plate thinning step (SA3), the heating resistors having the target resistance value determined by the decision step (SA5), the positions being opposed to the heat-insulating concave portion (resistor forming step (SA6)).

Abstract: An inkjet head according to an aspect of the invention may include: a manifold storing ink being injected from the outside; ink chambers receiving the ink from the manifold to eject the ink to the outside through nozzles; and a restrictor connecting the manifold and the ink chambers to each other and providing a plurality of interconnection paths.

Abstract: An inkjet head according to an aspect of the invention may include: a flow path plate having a plurality of ink chambers therein; a nozzle plate having a plurality of nozzles connected to the ink chambers in order to eject ink in the ink chambers to the outside; and air traps provided inside the flow path plate and the nozzle plate to prevent crosstalk in which vibrations for driving the ink chambers affect another adjacent ink chamber.

Abstract: A method of etching backside ink supply channels for an inkjet printhead. The method includes the steps of: (a) attaching a frontside of the printhead to a handle wafer; (b) etching the backside of the printhead using an anisotropic DRIE process to form a plurality of ink supply channels, the DRIE process including alternating etching and passivation steps, the passivation steps depositing a polymeric coating on sidewalls of the ink supply channels; and (c) removing the polymeric coating by etching the backside of the printhead in a biased plasma etching chamber using an O2 plasma. The chamber temperature is in the range of 90 to 180° C.

Abstract: There are provided a method of manufacturing a thermal head having a hollow portion at a position opposing a heating resistor, the manufacturing method assuring a sufficient strength to an upper plate substrate of the thermal head. The manufacturing method includes: processing a top surface of the upper plate substrate bonded to a support substrate to thin the upper plate substrate to a thickness T; wherein the processing comprises processing the top surface of the upper plate substrate so that a roughness Ra of the top surface of the upper plate substrate satisfies the following expression:: Ra?loge(T2)/(3×106)+6.5×10?6.

Abstract: A method of manufacturing a liquid ejection head in which a pressure chamber for storing an ejection liquid is connected with an ink supply channel through a restrictor, includes the steps of: forming first spaces for the liquid supply channel and the pressure chamber in a silicon substrate by performing anisotropic etching on a surface of the silicon substrate, the surface of the silicon substrate being parallel to a Si(110) plane, each of the first spaces being defined by two vertical walls and two inclined walls, each of the two vertical walls being parallel to a Si(111) plane that is perpendicular to the surface of the silicon substrate, each of the two inclined walls being parallel to a Si(111) plane that is inclined with respect to the surface of the silicon substrate; then forming an etching protection film on the silicon substrate, the etching protection film protecting the silicon substrate from being etched; then forming an opening corresponding to a second space for the restrictor in the etching pr

Abstract: An ink-jet recording head has a plate-shaped member including a first layer with a partition wall formed by a first etching process and defining a pressure chamber, an ink inlet passage and a common ink storage chamber, a second layer with a land formed by a second etching process so as to correspond to the pressure chamber, and an intermediate layer sandwiched between the first and the second layers. The recording head also has a pressure producing device disposed with its extremity in contact with the land, and a nozzle plate with a nozzle hole bonded to the front surface of the plate-shaped member. An ink particle is jetted through the nozzle hole when the pressure in the pressure chamber is changed by the pressure producing device.

Abstract: A process for producing a multiplicity of microfluidic arrangements from a plate-shaped composite structure and an atomiser which is provided with such nozzle arrangements is proposed. Each arrangement has a groove structure which forms flow channels and the dimensions of which are in the micrometer range. The lines for optional subsequent mechanical separation of bridging groove structures are joined to each other and are partly or completely filled with a filling medium before mechanical machining. The medium is selected so that it is not removed from the groove structures either by the mechanical machining or by aids used during mechanical machining. Afterwards, however, the filling medium is removed from the groove structures by suitable measures. The groove structures are thereby prevented from becoming blocked due to mechanical contaminants.

Abstract: A method of fabricating an inkjet nozzle assembly having a seal member bridging between a moving portion and a stationary portion. The method includes the steps of: (a) providing a partially-fabricated printhead comprising a nozzle chamber sealed with a roof, (b) etching a via through the roof to define the moving portion on a first side of the via and the stationary portion on a second side of the via; (c) plugging the via with a plug of sacrificial material; (d) depositing a layer of flexible material over the plug; and (e) removing the plug to provide the inkjet nozzle assembly. The resultant seal member is comprised of the flexible material.

Abstract: A method of manufacturing an inkjet print head simplifies a manufacturing process and uniformly forms an ink channel and includes forming a chamber layer using a low-speed optical hardening material on a substrate, hardening regions of the chamber layer for the wall of an ink channel by selectively exposing the chamber layer to light, forming a nozzle layer using a high-speed optical hardening material, having a higher optical reaction speed than that of the low-speed optical hardening material, on the chamber layer, hardening regions of the nozzle layer other than nozzles by selectively exposing the nozzle layer to light, and forming the ink channel and the nozzles by developing the chamber layer and the non-exposed regions of the nozzle layer.

Abstract: A method of fabricating an inkjet printhead. The method includes the steps of: (a) forming a plurality of MEMS ink ejection assemblies on an ink-ejection surface of a silicon substrate, each ink ejection assembly being sealed with roof material spanning across the ink ejection assemblies to define a nozzle plate; (b) etching partially into the roof material to form simultaneously a respective nozzle rim for each ink ejection assembly and a plurality of projections patterned across the nozzle plate between nozzle rims; and (c) etching through the roof material to form a respective nozzle aperture for each ink ejection assembly. The projections patterned across the nozzle plate between nozzle rims are useful for reducing stiction between particulates and the nozzle plate.

Abstract: A method of making a printhead comprises forming a resistor strip in a heating region of the printhead. In a first portion of the heating region, a resistive layer is formed including a central resistor region interposed between two spaced apart conductive elements. In the method, a conductive layer is removed from a bus region of the printhead while protecting the first portion of the heating region.

Abstract: A method of forming an ink supply channel for an inkjet printhead comprises the steps of: (i) providing a wafer having a frontside and a backside; (ii) etching a plurality of frontside trenches into the frontside; (iii) filling each of the trenches with a photoresist plug; (iv) forming nozzle structures on the frontside using MEMS fabrication processes; (v) etching a backside trench from the backside, the backside trench meeting with one or more of the plugs; (vi) removing a portion of each photoresist plug via the backside trench by subjecting the backside to a biased oxygen plasma etch, thereby exposing sidewall features in the backside trench; (vii) modifying the exposed sidewall features; and (viii) removing the photoresist plugs to form the ink supply channel. The ink supply channel connects the backside to the frontside.

Abstract: The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.

Abstract: An ink jet recording head includes a substrate having a plurality of energy-generating elements that generate energy for discharging ink droplets and an ink supply port extending in a direction in which the energy-generating elements are arranged, a plurality of discharge ports that are provided correspondingly to the energy-generating elements, a discharge-port-forming member provided on the substrate and including a plurality of ink passages that include the energy-generating elements and connect the supply port and each of the discharge ports, and a rib provided on a surface of the discharge-port-forming member opposite the supply port and extending in a direction in which the energy-generating elements are arranged. A surface of the rib opposite the supply port has a protective layer.

Abstract: A manufacturing method for a substrate for an ink jet head, including formation of an ink supply port in a silicon substrate, the method includes a step of forming, on one side of the substrate, an etching mask layer having an opening at a position corresponding ink supply port; a step of forming unpenetrated holes through the opening of the etching mask layer in at least two rows in a longitudinal direction of the opening; and a step of forming the ink supply port by crystal anisotropic etching of the substrate in the opening.

Abstract: An ink solution comprises (a) a solvent having (i) a boiling point between about 50° C. and about 100° C., (ii) a relative polarity of less than about 0.4, and (iii) a poly(dimethylsiloxane) swelling ratio of less than about 1.25; and (b) one or more dissolved organosulfur compounds, wherein each organosulfur compound has 10 or more carbon atoms. The one or more organosulfur compounds are present in a total concentration of at least about 3 mM, and the ink solution contains essentially no solid particles of the organosulfur compounds or solid particles derived from the organosulfur compounds.

Abstract: A method for producing an ink jet recording head having high durability and high ink resistance can enable high-quality image recording by employing a material capable of reducing the internal stress and having satisfactory patterning characteristics. Such an ink jet recording head can be produced with high precision. A cationically photopolymerizable resin composition containing a condensate of a hydrolysable organosilane compound, employed as a material for forming a flow path forming member, enables a reduction of internal stress and a highly precise pattern in the flow path forming member, thereby providing an ink jet recording head having a high durability and a high ink resistance and capable of high-quality printing over a prolonged time.

Abstract: A liquid droplet ejection head includes: a nozzle plate that has a plurality of nozzles ejecting a liquid droplet; a flow path member that includes: pressure generating chambers that communicate with the nozzles; and liquid supply paths through which liquid is supplied to the pressure generating chambers; and a damper portion that is disposed in at least one part of a region, the region being on the nozzle plate, corresponding to the liquid supply paths, the damper portion reducing a fluctuation of an ejection amount of the liquid droplets to enable stable ejection.

Abstract: A method for manufacturing a nozzle plate includes: forming on a first surface of a silicon substrate a film to be a dry etching mask used to form a depression that becomes a first nozzle portion on a droplet discharge side of the silicon substrate, and dry etching the silicon substrate using the film to form the depression to be the first nozzle portion; sequentially forming a first liquid-resistant protective film having liquid resistance and etching resistance and a liquid repellent layer having liquid repellency over the whole of the first surface of the silicon substrate after removing the film used as the dry etching mask, the whole of the first surface including an inner wall of the depression; bonding a support substrate to the first surface of the silicon substrate, and reducing the silicon substrate to a desired thickness from a second surface side opposite from the support substrate; dry etching the silicon substrate from the second surface side until a bottom of the depression to be the first nozz

Abstract: A microfluidic architecture is disclosed. The microfluidic architecture includes a substrate having an edge and a thin film stack established on at least a portion of the substrate adjacent the edge. The thin film stack includes a non-conducting layer and a seed layer, where the seed layer is positioned such that a portion of the non-conducting layer is exposed. A chamber layer is established on at least a portion of the seed layer. The non-conducting layer, the seed layer, and the chamber layer define a microfluidic chamber. A layer having a predetermined surface property is electroplated on the chamber layer and on at least one of another portion of the seed layer and the exposed portion of the non-conducting layer.

Abstract: A method of fabricating a printhead having a hydrophobic ink ejection face is provided. The method comprises the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face; (b) depositing a layer of relatively hydrophobic polymeric material onto the nozzle surface, the polymeric material being resistant to removal by ashing; and (c) defining a plurality of nozzle openings in the nozzle surface, thereby providing a printhead having a relatively hydrophobic ink ejection face. Steps (b) and (c) may be performed in any order.

Abstract: An ink-jet head and a method for manufacturing the ink-jet head are disclosed. The ink-jet head can include: a chamber, which may house a type of ink; a membrane, which may be formed on one side of the chamber, and in a surface of which a holding cavity may be formed; a lower electrode, formed on an inner surface of the holding cavity; and a piezoelectric component, held in the holding cavity. According to certain embodiments of the invention, the ink-jet head can be formed with thin-film type actuators, and the electrical properties of the ink-jet head can be improved.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is covalently bound to a substantially planar support material, and a method of making the same.

Abstract: A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.

Abstract: A method is for forming three-dimensional micro- and nanostructures, based on the structuring of a body of material by a mould having an impression area which reproduces the three-dimensional structure in negative form. This method includes providing a mould having a substrate of a material which can undergo isotropic chemical etching, in which the impression area is to be formed. An etching pattern is defined on (in) the substrate, having etching areas having zero-, uni- or bidimensional extension, which can be reached by an etching agent. A process of isotropic chemical etching of the substrate from the etching areas is carried out for a corresponding predetermined time, so as to produce cavities which in combination make up the impression area. The method is advantageously used in the fabrication of sets of microlenses with a convex three-dimensional structure, of the refractive or hybrid refractive/diffractive type, for forming images on different focal planes.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: A method for manufacturing an inkjet head includes providing a piezoelectric substrate having a porous structure, a diaphragm on the porous structure, and a piezoelectric substance layer on the diaphragm, and forming a cavity by etching out the porous structure from the piezoelectric substrate.

Abstract: An ink jet head includes a Si substrate with a surface having a {100} orientation; a passage holding ink on the Si substrate; an ink discharge port which is communicatively connected to the passage and through which ink is ejected; and a supply port which extends through the Si substrate, which is communicatively connected to the passage, and which supplies ink to the passage. The supply port has walls having two {111} planes facing each other.

Abstract: An ink-jet recording head includes a plurality of recording element substrates each having an ejection pressure generating element configured to generate pressure for ejecting ink from an ink discharge port. The plurality of recording element substrates each include a first surface on which the corresponding ejection pressure generating element is disposed and a second surface, serving as an end surface intersecting with the first surface, being at least partially formed by etching.

Abstract: The present invention provides a method for producing a liquid discharge head including a silicon substrate having, on a first surface, energy generating elements, and a supply port penetrating the substrate from the first surface to a second surface, which is a rear surface of the first surface of the substrate. The method includes the steps of: preparing the silicon substrate having a sacrifice layer at a portion on the first surface where the ink supply port is to be formed and an etching mask layer having a plurality of openings on the second surface, the volume of a portion of the sacrifice layer at a position corresponding to a portion between two adjacent said openings being smaller than the volume of a portion of the sacrifice layer at a position corresponding to the opening; etching the silicon substrate from the plurality of openings and etching the sacrifice layer.

Abstract: To keep printing quality uniform and to improve productivity, while maintaining a heating efficiency and a strength against an external load, provided is a thermal head manufacturing method including: a concave portion forming step of forming a concave portion on one face of a supporting substrate; an upper substrate forming step of forming an upper substrate in which an etching layer and a non-etching layer are arranged in layers in a substrate thickness direction, the etching layer being etched at a predetermined etching rate, the non-etching layer being lower in etching rate than the etching layer; a bonding step of bonding the one face of the supporting substrate in which the concave portion has been formed in the concave portion forming step to a surface on a side of the non-etching layer of the upper substrate; a thinning step of etching the etching layer of the upper substrate which has been bonded to the supporting substrate in the bonding step; and a heating resistor forming step of forming a heating

Abstract: A method of forming a nozzle chamber of a printhead includes steps of forming a first laminate of sacrificial layers on a substrate, the first laminate of sacrificial layers being formed as a ring on the substrate; photoimaging the first laminate of sacrificial layers to cause edges thereof to angle inwards, forming an approximate trapezoidal cross-section; depositing a TiN layer over the first laminate of sacrificial layer and the substrate, the TiN layer being inclined at portions deposited over the inwardly angled edges; etching the TiN layer to form a paddle and a nozzle chamber rim, the paddle incorporating an inner inclined portion and the nozzle chamber rim incorporating a complementary outer inclined portion, the paddle and nozzle rim defining an aperture therebetween; and removing the one or more sacrificial layers.

Abstract: The present invention provides a method for manufacturing an integrated circuit. In one embodiment, the method includes etching one or more openings within a substrate using an etch tool, and subjecting the one or more openings to a post-etch clean, wherein a delay time exists between removing the substrate from the etch tool and the subjecting the one or more opening to the post-etch clean. This method may further include exposing the substrate having been subjected to the post-etch clean to a rinsing agent, wherein a resistivity of the rinsing agent is selected based upon the delay time.

Abstract: A liquid drop discharge head includes a chip 21 that is formed by separation of a silicon wafer 20. The silicon wafer 20 has a first direction and a second direction which are mutually intersected. The chip 21 is separated from the silicon wafer 20 by etching the wafer along a separation line 22 parallel to the first direction of the wafer and by dicing the wafer 20 along a separation line 23 parallel to the second direction of the wafer.

Abstract: Provided is a method for manufacturing a nozzle plate which has a through hole having an ejection port. In the method, the through hole, which has one opening as an ejection port for ejecting the liquid, is arranged on a Si substrate by an anisotropic etching method wherein etching and side wall protection film formation are alternately repeated to the Si substrate and the following steps are performed in the following order; forming a film to be an etching mask on a surface of the Si substrate whereupon the ejection port is to be formed, forming the etching mask pattern having an opening for forming the thorough hole by performing photolithography and etching to a film to be the etching mask, and performing the etching by the anisotropic etching method by satisfying the conditional expression.

Abstract: The present invention provides a manufacturing method of a substrate for an ink jet head including forming an ink supply opening to a silicon substrate, including (a) forming, at the back surface of the silicon substrate, an etching mask layer, which has an opening that is asymmetric with a center line, extending in the longitudinal direction, of an area on the surface of the silicon substrate where the ink supply opening is to be formed; (b) forming a non-through hole on the silicon substrate via the opening on the etching mask layer; and (c) forming the ink supply opening by performing a crystal anisotropic etching to the silicon substrate from the opening.

Abstract: Provided are a nozzle plate and a method of fabricating the nozzle plate. In accordance with an example embodiment of the present invention, a nozzle plate may include a body and at least one nozzle protruding from the body, wherein the at least one nozzle includes a wall having a thickness that increases the farther the wall gets away from an exit of the at least one nozzle.

Abstract: A method of fabricating an inkjet nozzle assembly having a seal member bridging between a moving portion and a stationary portion. The method includes the steps of: (a) providing a partially-fabricated printhead comprising a nozzle chamber sealed with a roof, (b) etching a via through the roof to define the moving portion on a first side of the via and the stationary portion on a second side of the via; (c) plugging the via with a plug of sacrificial material; (d) depositing a layer of flexible material over the plug; and (e) removing the plug to provide the inkjet nozzle assembly. The resultant seal member is comprised of the flexible material.

Abstract: A method of manufacturing an ink-jet head is disclosed. The method in accordance with an embodiment of the present invention includes: forming a dividing groove such that one surface of a piezoelectric element is divided corresponding to the position of the chamber; filling the dividing groove with a filler; bonding one surface of the piezoelectric element to one surface of the ink-jet head in which the chamber is formed; and polishing the other surface of the piezoelectric element such that the filler is exposed.

Abstract: The method of manufacturing a nozzle plate comprises the steps of: applying a protective sheet to a first surface of a nozzle plate in which nozzles are to be formed; forming holes which pass through the nozzle plate and have bottoms inside the protective sheet, from a side of a second surface of the nozzle plate reverse to the first surface; filling a filling material into the holes, from the side of the second surface; peeling away the protective sheet after the filling step; forming a liquid-repelling film on the first surface of the nozzle plate after the peeling step; and removing the filling material after the liquid-repelling film forming step.

Abstract: A method for forming a self-aligned hole through a substrate to form a fluid feed passage is provided by initially forming an insulating layer on a first side of a substrate having two opposing sides; and forming a feature on the insulating layer. Next, etch an opening through the insulating layer, such that the opening is physically aligned with the feature on the insulating layer; and coat the feature with a layer of protective material. Patterning the layer of protective material will expose the opening through the insulating layer. Dry etching from the first side of the substrate forms a blind feed hole in the substrate corresponding to the location of the opening in the insulating layer, the blind feed hole including a bottom. Subsequently, grind a second side of the substrate and blanket etch it to form a hole through the entire substrate.

Abstract: Provided is a liquid jet head, a method of manufacturing the same, and a liquid jet apparatus, in which liquid ejecting characteristics can be kept constant for a long period and in which nozzle blockage is prevented. In a liquid jet head including a passage-forming substrate (10) which is made of a single crystal silicon substrate and in which pressure generating chambers (12) communicating with nozzle orifices are formed, and pressure generating elements (300) for causing pressure changes in the pressure generating chambers (12), a protective film (100) which is made of tantalum oxide and has resistance to liquid, is provided at least on the inner wall surfaces of the pressure generating chambers (12).

Abstract: Provided is a method of fabricating a printhead integrated circuit (IC). The method includes the step of depositing metal layers interspersed with interlayer dielectric (ILD) layers onto a silicon wafer substrate. A passivation layer is deposited onto an outermost metal layer and at least a portion of the passivation layer is masked with a photoresist. A pit is etched into the silicon wafer substrate, said pit having a base and sidewalls. Etching is carried out along an edge of the substrate to expose the last metal layer to define bonding pads for operatively connecting a microprocessor. A step of etching portions adjacent the pit to expose the outermost metal layer to define electrode portions. The electrode portions are for supporting a heater element to be suspended in the pit.

Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.

Abstract: For forming a group or rows of nozzles in a substrate of an ink-jet head, firstly, a laser irradiation source and a masking material in which a plurality of holes arranged in two rows are formed, are arranged on an upper side of a position at which one group of rows of nozzles of the substrate is formed. Next, an ultraviolet laser is irradiated from an upper side of the masking material, and a laser which has passed through the masking material is irradiated on the substrate. Two rows of nozzles are formed in a portion of the substrate at which the ultraviolet laser is irradiated. Accordingly, by irradiation of the laser once, it is possible to form a plurality of nozzles arranged in a row.