Abstract: A method of forming a nozzle plate component for a printhead comprising the steps of: providing a laminar body having a polymeric upper layer defining a top surface and a metal lower layer defining a bottom surface; removing material by ablation or photolithography from the polymeric layer to selectively expose the metal layer; and applying etchant from the top surface that selectively etches the exposed areas of the metal layer, thereby undercutting said upper layer to form a recess area in the metal layer and forming an opening through said body.

Abstract: An inkjet printhead and a method of manufacturing the inkjet printhead. In the inkjet printhead, an anti reflective layer is formed of a material absorbing light on a chamber layer, and a nozzle layer including a plurality of nozzles is formed on the anti reflective layer.

Abstract: A process for manufacturing an inkjet print head comprising the steps of providing a print head wafer comprising a plurality of print head dice coated with a barrier layer, each print head die comprising a plurality of actuators and interconnections, the barrier layer comprising a plurality of openings in correspondence with the plurality of actuators and interconnections, providing a debondable SOI wafer comprising a handle layer, a buried layer, and a device layer, forming a protective layer on the surface of the device layer, bonding the device layer to the barrier layer, debonding the handle layer from the SOI wafer, etching the device layer so as to realize a plurality of openings in correspondence with the plurality of actuators and interconnections, and removing the protective layer in correspondence of the plurality of openings.

Abstract: A manufacturing method of a nozzle for an inkjet head. With the nozzle for an inkjet head, including a first board in which a nozzle hole is perforated, a middle layer stacked on the first board and perforated in an area corresponding to the nozzle hole, and a second board stacked on the middle layer and perforated in an area corresponding to the nozzle hole, where a hydrophobic layer is joined onto the inner perimeter of the nozzle hole and onto the first board around the nozzle hole, the uniformity and reproduction quality may be improved of nozzles treated for hydrophobicity, as the depth of the hydrophobic layer may be controlled to be uniform and the deposition of the hydrophobic layer may be prevented at the back surface of the nozzles.

Abstract: Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes: a substrate having an ink feed hole extending therethrough; a chamber layer including a plurality of ink chambers above the substrate; a nozzle layer including a plurality of nozzles above the chamber layer; and at least one support beam formed in the substrate to connect inner walls of the ink feed hole.

Abstract: A printhead and a method of manufacturing a printhead are provided. The printhead includes a polymeric substrate including a surface. Portions of the polymeric substrate define a liquid chamber. A material layer is disposed on the surface of the polymeric substrate. Portions of the material layer define a nozzle bore. The nozzle bore is in fluid communication with the liquid chamber.

Abstract: A nozzle plate, comprising: a nozzle discharging a liquid as droplets; a liquid-repellent film preventing attachment of the liquid on one surface of the nozzle plate; and a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate. In the nozzle plate, the liquid-repellant film and the first bonding film are plasma polymerized films having a Si skeleton, the Si skeleton including a siloxane (Si—O) bond and having a random atomic structure, and an alkyl group bonded with the Si skeleton. Further, the alkyl group existing around a surface of the first bonding film is eliminated from the Si skeleton by an application of energy, which is applied to a region of at least a part of the first bonding film, so as to develop adhesiveness with respect to the substrate in the region of the surface of the first bonding film.

Abstract: The method manufactures a nozzle plate, and comprises: a patterned resist formation step of forming a patterned resist on a flat surface of a matrix substrate, the patterned resist having a shape corresponding to a diameter of nozzle holes in a nozzle plate to be formed, the patterned resist having a thickness corresponding to a length of the nozzle holes; a nozzle length regulating member placement step of placing the nozzle length regulating member having a flat surface onto the patterned resist in such a manner that the flat surface of the nozzle length regulating member faces the flat surface of the matrix substrate across the patterned resist; and a nozzle plate formation step of forming the nozzle plate by plating with the patterned resist between the flat surface of the matrix substrate and the flat surface of the nozzle length regulating member.

Abstract: A method, which is capable of manufacturing an ink jet recording head with a high degree of accuracy even though the density of an ink passage pattern is increased, includes the steps of forming an ink passage pattern on a substrate formed therein with an ink discharge pressure generating element from dissoluble resin; depositing an organic material on the substrate formed thereon with the ink passage pattern from the dissoluble resin by a vapor growth process at a temperature at which the dissolubility of the dissoluble resin is not lost, so as to form a coated resin layer; forming an ink discharge port in the coated resin layer in parts located above the ink discharge pressure generating element; and eluting the dissoluble resin.

Abstract: A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole.

Abstract: A method for manufacturing a liquid ejection head including a substrate and a member, disposed above the substrate, having passages communicatively connected to discharge ports through which a liquid is ejected includes providing first solid layers made of a positive photosensitive resin above the substrate such that outer side surfaces of the first solid layers form an obtuse angle with the substrate; providing a second solid layer above the substrate such that the second solid layer abuts the outer side surfaces of the first solid layers, the second solid layer being processed into at least one portion of a mold for the passages; exposing portions of the outer side surfaces of the first solid layers through the second solid layer; removing the exposed portions from the first solid layers; and providing a cover layer over the second solid layer, the cover layer being processed into the member.

Abstract: A producing method for a liquid discharge head having a pressure generation chamber communicating with a discharge port for discharging a liquid, a piezoelectric element provided corresponding to the pressure generation chamber, and a vibration plate provided between the pressure generation chamber and the piezoelectric element, the method including: a preparation step of preparing a flat plate-shaped substrate having a recess on a main surface thereof, a piezoelectric element forming step of forming the piezoelectric element in the recess, a vibration plate forming step of forming the flat vibration plate on the main surface of the substrate and the piezoelectric element, a pressure generation chamber forming step of forming the pressure generation chamber on the vibration plate, and a removing step of removing the substrate in at least a peripheral portion of the piezoelectric element.

Abstract: A heater of a thermal inkjet printhead. The heater is formed of tantalum aluminum oxynitride (Ta—Al—ON), wherein the tantalum aluminum oxynitride is formed of about 30 to about 60 atomic % tantalum, about 10 to about 30 atomic % aluminum, about 5 to about 30 atomic % oxygen, and about 5 to about 30 atomic % nitrogen.

Abstract: A first substrate 10 having a channel 12 which passes through the inside thereof and an opening 14a or 14b of the channel which is formed on at least one side thereof, and a second substrate 20 for forming a nozzle hole communicating with the channel are prepared. The second substrate is bonded to the one side of the first substrate where the channel opening 14b is formed so that the opening is blocked by the second substrate. The second substrate is etched with a mixed etching fluid, which contains a high-pressure fluid and an etching solution, fed thereto via the channel of the first substrate, thereby forming the nozzle hole 22 communicating with the channel.

Abstract: A method of forming an ink supply channel for an inkjet printhead comprises the steps of: (i) providing a wafer having a frontside and a backside; (ii) etching a plurality of frontside trenches into the frontside; (iii) filling each of the trenches with a photoresist plug; (iv) forming nozzle structures on the frontside using MEMS fabrication processes; (v) etching a backside trench from the backside, the backside trench meeting with one or more of the plugs; (vi) removing a portion of each photoresist plug via the backside trench by subjecting the backside to a biased oxygen plasma etch, thereby exposing sidewall features in the backside trench; (vii) modifying the exposed sidewall features; and (viii) removing the photoresist plugs to form the ink supply channel. The ink supply channel connects the backside to the frontside.

Abstract: A printhead and method of forming the printhead are provided. The method includes forming an ink feed passage through a print head substrate by providing a metallic substrate having a first surface and a second surface; providing an ink ejector structure on a first surface of the metallic substrate; providing a mask over the second surface of the metallic substrate to define the ink feed passage; and forming the ink feed passage from the second surface of the metallic substrate using a liquid etchant.

Abstract: The chambers (42) and each corresponding ink feeding duct (56), made in a structural layer of photosensitive resin (38), are delimited by a flat bottom wall (36) made of a protective layer (34, 36) of tantalum and gold and an upper wall (44), consisting of a substantially concave surface, including at least one ejection nozzle (46) and joined to the bottom wall along a continuous perimetral line (52), in which the inner shape of each of the chambers (42) and of each of the feeding ducts (56) represents the complementary impression of the outer form of a sacrificial layer (57), obtained from a controlled and non-contained growth of a metal, deposited starting from the dimensions of the layer of gold (36), laid on top of the layer of tantalum (34).

Abstract: A method for manufacturing an ink jet recording head including a reservoir to which ink is supplied from outside, a pressure generating chamber leading to the reservoir, and a nozzle orifice leading to the pressure generating chamber, includes: a) forming a flow channel forming film on a first face side of a substrate having an integrated circuit; b) forming a groove in the flow channel forming film; c) filling the groove with a sacrificial film; d) forming a vibrating film on the sacrificial film and the flow channel forming film; e) forming a piezoelectric element on the vibrating film; f) forming the reservoir by etching the substrate from a second face side of the substrate to an extent where the sacrificial film is exposed; g) removing the sacrificial film through the reservoir; and h) forming the nozzle orifice in the flow channel forming film.

Abstract: A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon is formed on a silicon body by bonding a silicon-on-insulator substrate to a silicon substrate. The handle and insulator layers of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane.

Abstract: A process for facilitating modification of an etched trench is provided. The process comprises: (a) providing a wafer comprising an etched trench, the trench having a photoresist plug at its base; and (b) removing a portion of the photoresist by subjecting the wafer to a biased oxygen plasma etch. The process is particularly suitable for preparing a trench for subsequent argon ion milling. Printhead integrated circuits fabricated by a process according to the invention have improved ink channel surface profiles and/or surface properties.

Abstract: The method comprises the following steps: preparing a sheet having thickness of 5 ?m to a few tens of micrometers, suitable for being etched by a lithographic operation; making a mask on a face of the sheet, the mask presenting etching selectivity S of at least 5; depositing a layer of photosensitive resin on the mask; making through holes in the layer of resin by photolithography; etching through the mask via the pores in the layer of resin; and anisotropically etching through the sheet from the pores in the mask in order to make pores in the sheet having an aspect ratio greater than 5. The invention is applicable to fabricating micron and sub-micron filters.

Abstract: A liquid discharge head includes, on a same substrate, pressure generating chambers, nozzle apertures communicating with the pressure generating chambers through nozzle communicating pans, and a reservoir, wherein a cross-section area of the nozzle communicating part is larger, along a direction parallel to a nozzle aperture face of the substrate, than a cross-section area of the nozzle aperture, and the cross-section area of the nozzle aperture in such direction remains constant over the entire length of the nozzle aperture.

Abstract: A liquid ejection head includes a substrate, having a front surface and a back surface, provided on the front surface with an energy generating element for generating energy used for ejecting liquid; a supply port, provided so as to penetrate between the front surface and the back surface of the substrate, for supplying the liquid to the energy generating element; a first film provided on the front surface of the substrate; and a second film provided so as to coat a wall of the substrate defining the supply port. The first film and the second film surface-contact each other with respect to two directions substantially perpendicular to each other.

Abstract: A loss in the rigidity of a substrate for a liquid discharge head having nozzles at a high density can be suppressed. A liquid discharge head includes plural pressure generating chambers respectively provided with pressure generating elements, plural nozzle apertures respectively communicating with the plural pressure generating chambers and adapted to discharge a liquid, and a reservoir with which the plural pressure generating chambers commonly communicate respectively through communicating parts. The pressure generating chambers and the reservoir respectively have recessed portions formed respectively on one and the other of two principal planes of the same substrate, and the reservoir contains a portion shallower than a portion within the reservoir that communicates with the pressure generating chambers.

Abstract: Included are the steps of: forming piezoelectric elements on a surface of a passage-forming substrate with a vibration plate in between, and forming a penetrating portion by removing an area in the vibration plate, which area will serve as a communicating portion; forming lead electrodes and sealing up the penetrating portion with an interconnect layer; joining a reservoir forming plate to a surface of a passage-forming substrate; forming liquid passages by wet-etching; forming protection films on inner surfaces of the liquid passages; detaching and removing a protection film on an interconnect layer; and causing a reservoir portion and a communicating portion to communicate with each other by removing a corresponding part of the interconnect layer, and in accordance with the manufacturing method, while the liquid passages are being formed, the communicating portion is formed in a way that an edge of an opening of the vibration plate is located outside an edge of an opening which is close to the penetrating p

Abstract: A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.

Abstract: A manufacturing method of nozzle plate for liquid ejection head includes, providing a substrate having a first base material of Si and a second base material, of which the etching rate in Si anisotropic dry etching is lower then that of Si, provided on one side of the first base material, forming a film as a second etching mask on the surface of the second base material, forming a second etching mask pattern having a small-diameter opening shape in the second etching mask film, etching until the etching part is extended through the second base material, forming a film as a first etching mask film on the surface of the first base material, forming a first etching mask pattern having a large-diameter opening shape in the first etching mask film, and Si anisotropic dry etching until the etched part is extended through the first base material.

Abstract: An orifice array plate and a charge plate for a continuous ink jet printer print head are integrally fabricated by providing an electrically non-conductive substrate; forming, on one side of the substrate, an orifice plate with an array of orifices; forming, on the other side of the substrate, a charge plate comprising a plurality of charge leads aligned with respective ones of the orifices; and removing at least that portion of the substrate that is between the orifices and the charge leads. The final produce includes an electrically non-conductive substrate; an orifice plate, including an array of orifices, on one side of the substrate; a charge plate, including a plurality of charge leads, on the other side of the substrate such that the charge leads are aligned with respective ones of the orifices; and a plurality of passages through the substrate, said passages extending between the orifices and the charge leads.

Abstract: The present invention relates to a droplet jetting apparatus using electrostatic force, a manufacturing method thereof and an ink providing method thereof. The droplet jetting apparatus using electrostatic force includes a lower electrode unit in which a nozzle and a lower electrode positioned in the nozzle equipped in the upper part of a first substrate, and an ink inflow channel equipped in the lower part of the first substrate are integrally formed; an upper electrode unit having an upper electrode formed on the top surface of a second substrate and an ink discharge hole formed by being penetrated to the upper electrode from the bottom surface of the second substrate; and a bonding layer for bonding the lower electrode unit and the upper electrode unit with each other so that the nozzle is vertically aligned with the ink discharge hole.

Abstract: A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon is formed on a silicon body by bonding a silicon-on-insulator substrate to a silicon substrate. The handle and insulator layers of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane.

Abstract: A manufacturing method for manufacturing a liquid ejection element including a liquid flow path which is open at an ejection outlet for ejecting liquid, and an energy generating member for generating energy usable for ejecting the liquid from liquid flow path through the ejection outlet, the manufacturing method, includes a step of forming the energy generating member on a front side of a substrate; a step of forming a top plate member on the side having the energy generating member formed by the energy generating member forming step, wherein the top plate member is a member in which the liquid flow path and the ejection outlet are formed; and a step of thinning the substrate, having the top plate member formed thereon by the top plate member forming step, from a back side thereof.

Abstract: A method of manufacturing an inkjet printhead, in which a solvent included in a positive photoresist composition or in a non-photosensitive soluble polymer composition which is used to form a sacrificial layer has a different polarity from that of a solvent included in a negative photoresist composition that is used to form at least one of a channel forming layer and a nozzle layer.

Abstract: Methods of forming a fluid channel in a semiconductor substrate may include providing a semiconductor substrate having a backside and a device side, wherein the device side is configured to secure ink ejecting devices thereon and applying a material layer to the backside of the semiconductor substrate. The method may further include providing a gray scale mask configured with a pattern corresponding to a fluid channel having a plurality of slots, exposing the material layer to sufficient light radiation energy through the gray scale mask and etching the exposed material layer and the semiconductor substrate through to the device side of the semiconductor substrate.

Abstract: According to the present invention, there are provided an ink jet recording head capable of performing high-precision printing and recording and having a high reliability, and a method of manufacturing the head. The ink jet recording head of the present invention has: an element substrate on whose surface an ink discharge energy generating element is formed and which is made of silicon; and a thin and flat inorganic substrate in which an ink discharge port is formed in a portion disposed vertically above the ink discharge energy generating element. Furthermore, the head includes a photosensitive material layer which bonds the element substrate to the inorganic substrate and which is to constitute a wall forming an ink flow path which communicates with the ink discharge port. The inorganic substrate is laminated on the element substrate provided with the photosensitive material layer, and is thereafter provided with the ink discharge port.

Abstract: A method of substantially simultaneously forming at least two fluid supply slots through a thickness of semiconductor substrate from a first surface to a second surface thereof. The method includes the steps of applying a photoresist layer to the first surface of the semiconductor substrate. The photoresist layer is patterned and developed using a gray scale mask for a first fluid supply slot. The semiconductor substrate is then reactive ion etched, to form the at least two fluid supply slots through the thickness of the substrate. The first fluid supply slot is substantially wider than the second fluid supply slot, and the first and second fluid supply slots are etched through the substrate at substantially the same rate.

Abstract: An integrated orifice array plate and a charge plate is fabricated for a continuous ink jet print head by providing an electrically non-conductive orifice plate substrate having first and second opposed sides and an array of predetermined spaced-apart orifice positions. A plating seed layer is applied to the first of the opposed sides of the substrate, and an array of orifices is formed through the orifice plate substrate at the predetermined orifice positions. The orifices extend between the opposed sides. The plating seed layer is etched, leaving a portion of the plating seed layer adjacent to each of the predetermined orifice positions. A charge electrode is plated onto each of the portions of the plating seed layer.

Abstract: An inkjet head having an electrostatic actuator and a manufacturing method of the same are disclosed. The inkjet head having an electrostatic actuator, comprising a stator, on which is formed a plurality of comb pattern shaped first protrusion parts and second protrusion parts in both directions, and a rotor consisting of a first component and a second component, the ends of which join with the diaphragm, wherein a third protrusion part is formed on the first component, facing the first protrusion parts and meshing with the first protrusion parts without contact; and a fourth protrusion part is formed on the second component, facing the second protrusion parts and meshing with the second protrusion parts without contact, may decrease the size of the head composition and may increase the electrostatic force so that a large displacement may be obtained with little voltage to increase the ink discharge pressure.

Abstract: The method for manufacturing a liquid ejection head comprising a diaphragm which serves as portions of pressure chambers connected to nozzles through which liquid is ejected, and piezoelectric bodies which deform the diaphragm, the method comprises: an electrical wire forming step of removing at least a part of a silicon substrate, and forming electrical wires for supplying drive signals to drive the piezoelectric bodies, in sections where the silicon substrate has been removed; a piezoelectric body forming step of forming the piezoelectric bodies on sections where the silicon substrate has not been removed at least in the electrical wire forming step; and a diaphragm forming step of forming the diaphragm on a side of the piezoelectric bodies opposite to the silicon substrate.

Abstract: The described embodiments relate to slotted substrates and methods of making the slotted substrates. One exemplary method patterns a first set of dummy features in a first layer positioned over a first surface of a substrate and patterns a second set of dummy features in a second layer positioned over the first layer. After the method patterns the first set of dummy features and the second set of dummy features, the method further forms a slot in the substrate, at least in part, by allowing an etchant to pass through the first and second sets of dummy features to the first surface.

Abstract: A method of bonding two semiconductor substrates to form a printhead includes aligning a top surface of a first substrate with a second substrate, wherein the first substrate has a fluid channel in the top surface, heating the first and second substrates to a first temperature in a partial vacuum, and placing the top surface of the first substrate in contact with the second substrate to form a bond.

Abstract: Surfaces of second substrates of head members at the sides opposite to adhesion surfaces with first substrates face each other, the pair of head members is fixed to each other with a sealed space interposed between the surfaces of the second substrates at the sides opposite to the adhesion surfaces with the first substrates, and a solution treatment is performed with respect to the pair of head members fixed

Abstract: A method for manufacturing a liquid ejecting head includes performing a dry cleaning process of cleaning the surface of a wire side of a second substrate by dry etching of a plasma etching mode, and performing a liquid cleaning process of cleaning the surface of a pressure generation chamber side of a first substrate.

Abstract: A liquid ejecting head includes a substrate, a nozzle forming member for forming on a principal surface of the substrate a nozzle comprising a flow passage of liquid and an orifice for ejecting the liquid, and a dummy pattern. The dummy pattern has substantially the same dimension as at least a part of the nozzle and is formed so that a cross section of the dummy pattern is exposed at an end surface of the nozzle forming member.

Abstract: Provided are a nozzle plate of an inkjet printhead and a method of manufacturing the same. The nozzle plate includes: a substrate including a plurality of nozzles; and a plurality of first grooves formed on the surface of a substrate around the nozzles. In this structure, ink remaining on the surface of the nozzle plate can be efficiently removed.

Abstract: A method of fabricating a printhead having a hydrophobic ink ejection face, the method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a nozzle plate having relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face of the printhead; (b) depositing a hydrophobic polymeric layer onto the nozzle surface; (c) depositing a protective metal film onto at least the polymeric layer; (d) depositing a sacrificial material onto the polymeric layer; (e) patterning the sacrificial material to define a plurality of nozzle opening regions; (f) defining a plurality of nozzle openings through the metal film, the polymeric layer and the nozzle plate; (g) subjecting the printhead to an oxidizing plasma; and (h) removing the protective metal film, thereby providing a printhead having a relatively hydrophobic ink ejection face.

Abstract: Methods and apparatus for determining the extent of etching in material by locating a detector element adjacent to a portion of the material that is to be etched. The width of the element varies. The resistance of the element is measured upon etching the portion.

Abstract: A process for manufacturing a monolithic thermal ink jet printhead (40) comprising a plurality of chambers (74) and of nozzles (56), comprises steps of (206) depositing a plurality of sacrificial layers (31), of obtaining, by means of exposure and development operations, a plurality of casts (156), of (215) applying a structural layer (107), and subsequently steps of (225) removing the casts (156) and of (226) removing the sacrificial layers (31), in order to produce a plurality of chambers (74) and nozzles (56).

Abstract: A method of fabricating a printhead ejection nozzle is provided which includes depositing sacrificial material on a planar substrate form a scaffold of the sacrificial material on the substrate, defining openings in the sacrificial material to the plane of the substrate at positions for sidewalls of a nozzle chamber and a filter structure for the nozzle chamber, depositing roof material over, and into the openings of, the sacrificial material so as to form the sidewalls of the nozzle chamber on the substrate, a roof of the nozzle chamber bridging the sidewalls, and the filter structure, etching the roof material to the sacrificial material to form a nozzle aperture through the roof of the nozzle chamber, and removing the sacrificial material.

Abstract: The present disclosure provides a method of cleaning a semiconductor substrate after a DRIE etch process, wherein residue from the DRIE process is removed without damaging the substrate. The process may include contacting the micro-fluid ejection head with an aqueous solution of TMAH, stripping a photoresist etch mask from the micro-fluid ejection head, and dissolving a passivating coating from the substrate. Then the substrate may be contacted with an acidic solution. The method may further include rinsing and drying the substrate.

Abstract: A method for manufacturing a microstructure comprises the steps of forming positive type resist layer (PMMA) on a base plate having heater formed thereon; forming positive type resist layer (PMIPK) on the aforesaid positive type resist layer; exposing the positive type resist layer on the upper layer to ionizing radiation of the wavelength region that gives decomposition reaction to the positive type resist layer (PMIPK) for the formation of a designated pattern by development; exposing the positive type resist layer on the lower layer to ionizing radiation of the wavelength region that givens decomposition reaction to the positive type resist layer (PMMA) for the formation of a designated pattern by development; and coating photosensitive resin film having adhesive property on the resist pattern formed by the positive type resist layer (PMMA) and positive type resist layer (PMIPK); and then, dissolving the resist pattern to be removed after the resin film having adhesive property is hardened.