Abstract: A copper foil, intended for use as a current collector in a lithium-containing electrode for a lithium-based electrochemical cell, is subjected to a series of chemical oxidation and reduction processing steps to form a field of integral copper wires extending outwardly from the surfaces of the current collector (and from the copper content of the foil) to be coated with a resin-bonded porous layer of particles of active electrode material. The copper wires serve to anchor thicker layers of porous electrode material and enhance liquid electrolyte contact with the electrode particles and the current collector to improve the energy output of the cell and its useful life.

Abstract: A method in which a digital picture of the tip of a dental scaler tool and other uniquely identifying characteristics is used to measure the extent of wear on the tool. Unique characteristics of the dental scaler tool, such as color and shape of the grip, narrow a set of reference images to a subset of likely matching tip reference images. A digital contour of the worn tip is isolated. Characteristics of the physical shape of each available tips have been stored in a digital library of reference images. The same tip shape characteristics are developed for the tip contour that were stored for each reference image. The digital profile of the worn tip and a matching, selected reference image of the tip from a library of digitally overlaid. An accurate measurement of the extent of wear of the insert tip is made and displayed.

Abstract: An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure include a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil.

Abstract: An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After each coupon is shaped or components mounted to the coupon, the coupons are bonded together. The adhesive is dissolved to remove the device from the backing or backings to which it is attached.

Abstract: The object of the present invention is to strongly join an aluminum alloy part with an FRP prepreg. An object obtained by subjecting an aluminum alloy to a suitable liquid treatment so as to form a surface having large, micron-order irregularities and also fine irregularities with a period of several tens of nanometers, eliminating the presence of sodium ions from the surface and additionally forming a surface film of aluminum oxide, which is thicker than a natural oxide layer, has been found to have a powerful adhesive strength with epoxy-based adhesives. By simultaneously curing an FRP prepreg which uses the same epoxy-based adhesive in the matrix, an integral composite or structure in which FRP and aluminum alloy have been united at a joining strength of unprecedented magnitude is produced.

Abstract: Provided is a circuit substrate, including a glass film (10) forming a rough layer (11) after surface roughness processing, a resin adhesion (20) located the rough layer (11) on either side of the glass film (10), and a metal foil (30) located on the outside of resin adhesion layer (20). The glass film (10), the resin adhesion layer (20) and the metal foil (30) are joined together through suppressing. The circuit substrate employs the glass film (10) which forms a rough layer (11) after surface roughness processing as a carrier material, so that the resin adhesion layer (20) and the surface of the glass film (10) have a good binding force, and the dielectric constant of the circuit substrate has slight difference in the directions of X, Y and Z. Also provided is manufacturing method for a circuit substrate.

Abstract: There is provided a technique to strongly integrate a galvanized steel sheet and a resin molded article. A hot-dip galvanized steel sheet is immersed in an aqueous solution for aluminum degreasing to form a specific roughness on the surface. The surface is covered with convex protrusions having a diameter of about 100 nm, and a chromate treatment layer appears in the surface. A resin composition comprising 70 to 97 wt % of polyphenylene sulfide and 3 to 30 wt % of a polyolefin resin is injected onto the surface. The resin composition penetrates into ultra-fine irregularities and is cured in that state, and thereby a composite in which the galvanized steel sheet and the resin molded article are strongly integrated can be obtained. The shear rupture strength of the composite is extremely high.

Abstract: The object of the present invention is to strongly join an aluminum alloy part with an FRP prepreg. An object obtained by subjecting an aluminum alloy to a suitable liquid treatment so as to form a surface having large, micron-order irregularities and also fine irregularities with a period of several tens of nanometers, eliminating the presence of sodium ions from the surface and additionally forming a surface film of aluminum oxide, which is thicker than a natural oxide layer, has been found to have a powerful adhesive strength with epoxy-based adhesives. By simultaneously curing an FRP prepreg which uses the same epoxy-based adhesive in the matrix, an integral composite or structure in which FRP and aluminum alloy have been united at a joining strength of unprecedented magnitude is produced.

Abstract: In an embodiment of the disclosure, there is provided a molybdenum composite hybrid laminate. The laminate has a plurality of composite material layers. The laminate further has a plurality of surface treated molybdenum foil layers interweaved between the composite material layers. The laminate further has a plurality of adhesive layers disposed between and bonding adjacent layers of the composite material layers and the molybdenum foil layers.

Abstract: In the composite, an aluminum-plated steel sheet and a resin are securely and integrally joined together. Through chemical etching, the aluminum-plated steel sheet is caused to have a surface configuration, in which three-dimensional protrusions having shapes with a minor diameter of at least 0.3 ?m and a major diameter of at least 3 ?m are scattered over a plain part and a portion covered with shallow fine recesses with a diameter of 20 to 50 nm in a state of being distributed adjacent to each other on the plain part accounts for 30 to 50% of the surface area of the plain part. The surface of the three-dimensional protrusions is mainly ceramic containing silicon and the plain part is mainly ceramic containing aluminum. The resin is joined through injection molding with the aluminum-plated steel sheet having been inserted into a metallic mold.

Abstract: An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure include a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil.

Abstract: The disclosure provides in one embodiment a method of promoting adhesion on a composite surface. The method comprises providing a composite structure having at least one composite surface to be bonded. The method further comprises preparing the at least one composite surface. The method further comprises providing a chemical derivatization compound containing active functional groups that promote adhesion. The method further comprises depositing the chemical derivatization compound on the prepared composite surface to form a functional group-adhesive promoter derivatized layer. The method further comprises applying an adhesive layer to the derivatized layer. The method further comprises heat curing the adhesive layer to result in a bond with another structure made of a composite, a metal, or a combination thereof.

Abstract: Disclosed is a mobile terminal case, a mobile terminal having the same, and a method of manufacturing a mobile terminal case, and the mobile terminal may include a case forming an external shape with a curved surface, and a film member mounted on the case, wherein the film member may include a base film combined with the case and made of a synthetic resin material, and a metal film mounted on a surface of the base film and at least part of which is formed to correspond to the curved surface.

Abstract: The invention relates to a composite material made up of at least one ceramic layer or at least one ceramic substrate and at least one metallization formed by a metallic layer on a surface side of the at least one ceramic substrate.

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract: An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure includes a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil.

Abstract: The presently disclosed invention provides for the fabrication of porous anodic alumina (PAA) films on a wide variety of substrates. The substrate comprises a wafer layer and may further include an adhesion layer deposited on the wafer layer. An anodic alumina template is formed on the substrate. When a rigid substrate such as Si is used, the resulting anodic alumina film is more tractable, easily grown on extensive areas in a uniform manner, and manipulated without danger of cracking. The substrate can be manipulated to obtain free-standing alumina templates of high optical quality and substantially flat surfaces. PAA films can also be grown this way on patterned and non-planar surfaces. Furthermore, under certain conditions, the resulting PAA is missing the barrier layer (partially or completely) and the bottom of the pores can be readily accessed electrically.

Abstract: The invention is a technique for strongly integrating a galvanized steel sheet and a resin molded article. A hot-dip galvanized steel sheet “Z18” is immersed in an aqueous solution for aluminum degreasing at 75° C. for 7 minutes, to form roughness having an RSm of 0.8 to 2.3 ?m and an Rz of 0.3 to 1.0 ?m on the surface. The surface is covered with convex protrusions having a diameter of about 100 nm, and a chromate treatment layer appears in the surface. In other words, three conditions suitable for bonding are satisfied thereby. A resin composition comprising 70 to 97 wt % of polyphenylene sulfide and 3 to 30 wt % of a polyolefin resin is injected onto the surface. The resin composition penetrates into ultra-fine irregularities and is cured in that state, whereby a composite in which the galvanized steel sheet and the resin molded article are strongly integrated is obtained. The shear rupture strength of the composite is extremely high, in excess of 20 MPa.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: A method for forming a micromachined device is disclosed that includes providing a first silicon layer and a second silicon layer. A coating is provided on a first portion of the first layer. The first layer and the second layer are bonded to each other to form a micromachined device, the coating being effective to prevent the coated first portion of the first layer from bonding to the second layer.

Abstract: To manufacture a layer of semiconductor material, a first wafer of semiconductor material is subjected to implantation to form a defect layer at a distance from a first face; the first wafer is bonded to a second wafer, by putting an insulating layer present on the second wafer in contact with the first face of the first wafer. Then, hydrogen atoms are introduced into the first wafer through a second face at an energy such as to avoid defects to be generated in the first wafer and at a temperature lower than 600° C. Thereby, the first wafer splits into a usable layer, bonded to the second wafer, and a remaining layer disposed between the defect layer and the second face of the first wafer. Prior to bonding, the first wafer is subjected to processing steps for obtaining integrated components.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path.

Abstract: Under the condition that the height is fixed at a target height by turning off a feedback control system of a Z piezoelectric actuator of a cantilever of an atomic force microscope having a probe, which is harder than a processed material, flexure and twisting of the cantilever when carrying out mechanical processing while selectively repeating scanning only on the processed area (in the case of detecting flexure, parallel with the cantilever and in the case of detecting twisting, vertical with the cantilever) is monitored by a quadrant photodiode position sensing detector and the processing is repeated till a flexure amount or a twisting amount, namely, till an elastic deformation amount of the cantilever becomes not more than a determined threshold. It is not necessary to carry out scanning of the observation in obtaining the height information for detection of an end point, so that it is possible to improve a throughput of processing.

Abstract: A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good copper to laminate adhesion. The remainder of the circuit line surfaces are smooth. Thus, those areas for propagation of the signal on signal lines have the circuit lines smooth to maximize the signal propagation effect, while those areas where the signal propagation is not critical are rough, which improves the adhesion of one layer to another. On the voltage planes, the surface in those regions opposite the smooth surfaces of the signal planes is smooth. Thus, these areas of the voltage planes can be maintained smooth while the other areas of the surface of the voltage planes can be roughened, providing good adhesion to the adjoining dielectric material.

Abstract: A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding any acids is used for etching and removing an undesired portion of the metal layer 12 to form a metal circuit 12 on the at least one side of the ceramic substrate 10.

Abstract: Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of applying adhesion promoter to a clean surface of the substrate, and curing the adhesion promoter. SPIE varnish is applied over the cured adhesion promoter, and is itself cured. A further layer of adhesion promoter is applied over the cured SPIE varnish, and is cured. The polyimide dielectric material is then laminated to the adhesion promoter. Cleaning of the copper-containing substrate portions is performed by etching with etchant including cupric chloride, cleaning of the titanium-containing substrate portions is performed with etchant including HF, and cleaning of copper- and titanium-containing portions is performed by HF etching followed by cupric chloride etching. Aluminum-containing portions of the substrate are not etched.

Abstract: In accordance with the objectives of the invention a new method is provided for improving adhesion strength that is deposited over the surface of a layer of copper. Conventional etch stop layers of for instance dichlorosilane (SiCl2H2) or SiOC have poor adhesion with an underlying layer of copper due to poor molecular binding between the interfacing layers. The surface of the deposited layer of copper can be provided with a special enhanced interface layer by using a method provided by the invention. That is pre-heat of the copper layer followed by a pre-cleaning treatment with ammonia (NH3) and N2, followed by forming an adhesive enhanced layer over the copper layer by treatment with N2 or O2 or N2 with alkyl-silane or alkyl silane.

Abstract: A method of manufacturing an electrode for a secondary battery by depositing a thin film composed of active material on a current collector in which a surface-treated layer such as an antirust-treated layer is formed, including the steps of: removing at least part of the surface-treated layer by etching the surface of the current collector with an ion beam or plasma in order to improve the diffusion of the current collector material into the active material thin film; and depositing the thin film on the surface of the current collector subjected to the etching step.

Abstract: A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.

Abstract: A method for manufacturing micromechanical components, and a micromechanical component, in which a movable element is produced on a sacrificial layer. In a subsequent step the sacrificial layer beneath the movable element is removed so that the movable element becomes movable. After removal of the sacrificial layer, a protective layer is deposited on a surface of the movable element. Silicon oxide and/or silicon nitride is used for the protective layer.

Abstract: An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manufacturing of a printed wiring board to simplify the manufacturing. The etchant may contain an oxo acid such as sulfuric acid, peroxide such as hydrogen peroxide and an auxiliary component such as an azole and chlorine. The azole may comprise benzotriazole (BTA). The chlorine may be in the form of sodium chloride (NaCl). The etchant permits a copper surface to be roughened in an acicular manner.

Abstract: A donor substrate (12) which is patterned to include a donor mesa (18) is bonded to a receiving substrate (20). In a one embodiment, a bulk portion of the donor substrate is removed while leaving a transferred layer (26) bonded to the receiving substrate. The transferred layer is a layer of material transferred from the donor mesa. A portion of receiving substrate can be processed to form a recess (27, 28, or 32) to receive the donor mesa. Alternatively, the transferred layer can be formed over a dummy feature (46) formed on the receiving substrate, either with or without the use of mesas on the donor substrate. In a preferred embodiment, the transferred layer is used to form an optical device such as a photodetector in a semiconductor device. With the invention, bonding can be achieve despite having a non-planar surface on the receiving substrate.

Abstract: A connection component for making microelectronic assemblies includes a dielectric structural layer having a first surface and a plurality of conductive leads having first and second ends overlying the first surface of the dielectric structural layer. An adhesive is provided between the second ends of the leads and the dielectric structural layer such that the adhesive forms connections between the second ends of the leads and the structural layer. The formed connections have areas smaller than the areas of the second ends. The second ends of the leads are releasably attached to the structural layer by the connections. Thus, the second ends of the leads may be engaged with features on a microelectronic device and the microelectronic elements may be moved away from the structural layer so as to bend the second ends of the leads away from the structural layer.

Abstract: The invention relates to a method for reproducing images or text on a metalized holographic film, comprising a coupling step, in which a bottom metalized holographic film is laminated to a second film, thereon an adhesive mass has been preliminarily deposited, a spreading step in which on the bottom film a copolymeric primer is spread, a printing step in which a suitably activated basic substance is printed, a staged spreading removal step, in which demineralized water and decanting are used in order to remove the crystallized material obtained by the basic substance, a forced air hot bed drying step, a reinforcement processing step, and a printing step in which the text or image is printed in polymeric material colors.

Abstract: A continuous process for forming multilayer circuit structures which includes applying and curing a film forming polymer onto the matte side of a copper foil. The opposite (shiny) side of the foil is optionally but preferably cleaned, and applied with a photoresist which is then optionally but preferably dried. The photoresist is exposed, and developed to remove the nonimage areas but leave the image areas. The foil under the removed nonimage area is then etched to form a copper pattern, and the remaining photoresist is optionally but preferably removed. The foil is then cut into sections, and then optionally but preferably punched with registration holes. The copper pattern is then optionally but preferably treated with a bond enhancing treatment, optionally but preferably inspected for defects, and laminated onto a substrate to form a multilayered circuit structure.

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.

Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.

Abstract: A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering.

Abstract: An object of the present invention is to provide a solid electrolytic capacitor with excellent electrostatic capacitance and reduced dispersion of capabilities by treating the surface of a chemically formed aluminum film to form a dielectric film which is in contact an electrically conducting substance provided thereon with sufficiently high adhesion. Another object of the present invention is to provide a method for producing the solid electrolytic capacitor, which includes providing an organic electrically conducting polymer as a solid electrolyte on a chemically formed aluminum substrate having thereon an aluminum oxide dielectric film, where a chemically formed aluminum substrate, which was cut into a predetermined shape, is treated with an aqueous acid solution to dissolve a part of the dielectric film on the substrate surface.

Abstract: A method is described wherein a pre-printed film or paper web is selectively demetallized in register with the images pre-printed on the web. This provides the ability to demetallize micro-text, photographs or pictures, or demetallize a pattern (wallpaper) over an already demetallized area, or demetallize in patterns to create moiré patterns for security applications and/or for enhancing the attractiveness of internal and external packaging.

Abstract: A process is described which is useful in treating metal surfaces to increase the adhesion of polymeric materials thereto. The process involves treating the metal surface with a pre-dip which comprises an aqueous solution with pH of from 5 to 12 and then further treating the metal surface with an adhesion-promoting composition comprising an acid, an oxidizer and a corrosion inhibitor.

Abstract: A composition and method for etching a polymer substrate in particular for forming micro vias includes a dihydric alcohol having from two to five carbon atoms, a hydroxide compound selected from the group of lithium hydroxide, sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, strontium hydroxide and mixtures thereof, and water. In one embodiment the composition includes glycol, potassium hydroxide and deionized water, wherein the glycol and the water are present in a ratio of from about 0.5:1 to about 8.5:1 and the potassium hydroxide is present in an amount of from about 40 to about 80 grams per 100 ml of glycol and water solution.

Abstract: A method of removing a ceramic coating, such as a thermal barrier coating (TBC) of yttria-stabilized zirconia (YSZ), from the surface of a component, such as a gas turbine engine component. The method generally entails subjecting the ceramic coating to an aqueous solution of ammonium bifluoride, optionally containing a wetting agent, such as by immersing the component in the solution while maintained at an elevated temperature. Using the method of the invention, a ceramic coating can be completely removed from the component and any cooling holes, with essentially no degradation of the bond coat.

Abstract: The present invention is for a method wherein a printed circuit board can be fabricated in an electroless process with a minimum number of manufacturing steps using mild etchant conditions on an intermediary seed layer to produce low-defect, fine conductive line printed circuit boards.

Abstract: A membrane electrode assembly is provided comprising an ion conducting membrane and one or more electrode layers that comprise nanostructured elements, wherein the nanostructured elements are in incomplete contact with the ion conducting membrane. This invention also provides methods to make the membrane electrode assembly of the invention. The membrane electrode assembly of this invention is suitable for use in electrochemical devices, including proton exchange membrane fuel cells, electrolyzers, chlor-alkali separation membranes, and the like.

Abstract: A method of preparing a supporting substrate of an optical subassembly for metal-oxide bonding an optical element to the substrate. The method includes providing a supporting substrate including a metalized region for metal-oxide bonding an optical element to the substrate and rinsing the substrate in a potassium hydroxide solution. The potassium hydroxide solution removes any excess metal oxide or other contaminants from the surface of the metalized region.

Abstract: A method for making a patterned metal foil/substrate laminate by laminating a sheet of metal foil to a substrate by applying an adhesive between the metal foil and substrate and irradiating the metal foil with a laser beam in a predetermined pattern to vaporize the irradiated portions of the metal foil. Particularly where the laminate is intended for microwave packaging applications, the laminate further includes a sheet of barrier layer material, preferably polymer film, laminated to the patterned metal foil layer. The polymer film layer-containing laminate can be formed into a container for packaging food intended for heating in a microwave oven. A particularly effective pattern comprises a plurality of metal foil islands electrically separated by dielectric substrate gaps. Preferably, the metal foil is aluminum foil, desirably unannealed aluminum foil, and the substrate is selected from paper and coated or uncoated paperboard.

Abstract: A process for producing a partially transparent, visually discernible surface pattern with surface elements which diffusely scatter, reflect or diffract light incident on the surface pattern commences with a base foil which may include a carrier foil and a lacquer layer, and also an intermediate layer between these two layers to provide for good adhesion. Before or after application of the microscopically fine relief structures in the lacquer layer, the free surface thereof is covered over its entire area with a reflection layer. A printed image is then printed with an etching agent for the reflective material on the reflection layer in such a way that, at surface portions corresponding to the printed image, the reflection layer is removed and the surface of the lacquer layer is exposed again.

Abstract: A patterned metal foil/substrate laminate wherein the pattern is formed by laminating a sheet of metal foil to a substrate by applying an adhesive between the metal foil and substrate in a predetermined pattern which defines areas where adhesive is present and areas where no adhesive is present, cutting the metal foil, as by rotary die cutting or laser cutting, in a pattern which corresponds to the boundaries of the adhesive-containing areas and removing the areas of metal foil which are not adhesively adhered to the substrate. Particularly where the laminate is intended for microwave packaging, the laminate further includes a sheet of barrier layer material, preferably polymer film, laminated to the patterned metal foil layer.