Adhesive Or Autogenous Bonding Of Two Or More Self-sustaining Preforms Wherein At Least Two Of The Preforms Are Not Intended To Be Removed (e.g., Prefabricated Base, Etc.) Patents (Class 216/33)
  • Patent number: 10804103
    Abstract: A method for microassembly of heterogeneous materials comprises contacting a stamp with an ink disposed on a donor substrate to form an inked stamp, where the ink is reversibly bound to the stamp. The inked stamp is stamped onto a receiving substrate or onto an object on the receiving substrate, and the stamp is removed, thereby transferring the ink to the receiving substrate. The ink and the receiving substrate or the ink and the object are thermally joined, thereby forming a microassembly of heterogeneous materials. The ink may comprise a first material and the receiving substrate or the object may comprise a second material different from the first material.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: October 13, 2020
    Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
    Inventors: Seok Kim, Zining Yang, Hohyun Keum
  • Patent number: 10731210
    Abstract: A DNA sequencing device and related methods, wherein the device includes a substrate, a nanochannel formed in the substrate, a first electrode positioned on a first side of the nanochannel, and a second electrode. The second electrode is positioned on a second side of the nanochannel opposite the first electrode, and is spaced apart from the first electrode to form an electrode gap that is exposed in the nanochannel. At least a portion of first electrode is movable relative to the second electrode to decrease a size of the electrode gap.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: August 4, 2020
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Kim Yang Lee, Thomas Young Chang, David S. Kuo, ShuaiGang Xiao, Xiaomin Yang, Koichi Wago
  • Patent number: 10553552
    Abstract: To provide a wafer laminate which permits easy bonding between a support and a wafer, permits easy delamination of a wafer from a support, enables enhanced productivity of a thin wafer, and is suited to production of a thin wafer, and for a method of producing the wafer laminate. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer laminated in such a manner that its front surface having a circuit surface faces the adhesive layer. The adhesive layer includes a light-shielding resin layer A and a non-silicone thermoplastic resin-coating resin layer B in this order from the support side. The resin layer A is composed of a resin that contains a repeating unit having a condensed ring, and the resin layer B has a storage elastic modulus E? at 25° C. of 1 to 500 MPa and a tensile break strength of 5 to 50 MPa.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: February 4, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Yasuda, Michihiro Sugo, Hideto Kato
  • Patent number: 10202990
    Abstract: A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: February 12, 2019
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Scott J. H. Limb, Gregory L. Whiting
  • Patent number: 10205478
    Abstract: To provide cover glass for mobile terminals exhibiting high strength in a thin plate thickness state to enable reductions in thickness of apparatuses when inserted in the apparatuses, cover glass (1) for a mobile terminal of the invention is cover glass (1) that is obtained by forming a resist pattern on main surfaces of a plate-shaped glass substrate, then etching the glass substrate with an etchant using the resist pattern as a mask, and thereby cutting the glass substrate into a desired shape and that protects a display screen of the mobile terminal, where an edge face of the cover glass (1) is formed of a molten glass surface, and as surface roughness of the edge face, arithmetic mean roughness Ra is 10 nm or less.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: February 12, 2019
    Assignee: Hoya Corporation
    Inventor: Tatsuya Fujii
  • Patent number: 10106451
    Abstract: To prevent constriction machining from reducing usage efficiency of a glass rod, provided is a glass rod machining method including softening of softening a portion of the glass rod by heating the portion of the glass rod, and constricting of forming a constricted shape in the glass rod by moving one end of the glass rod relative to the other end of the glass rod at a constriction speed satisfying a condition that a constriction load acting as a tensile force on the glass rod does not extend beyond a predetermined range. In this method, the constricting includes, when constriction speed increases, making an adjustment to decrease a heating temperature of the glass rod. This method may include determining of determining the heating temperature of the glass rod during the constricting by referencing a heating temperature table in which heating temperatures corresponding to the constriction speed are stored in advance.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: October 23, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Tetsuya Otosaka
  • Patent number: 10099954
    Abstract: Methods of fabricating a glass laminate is provided. According to one embodiment, a glass laminate comprised of a microwave absorbing layer and a microwave transparent layer is formed. The microwave absorbing layer is characterized by a microwave loss tangent ?H that is at least a half order of magnitude larger than a loss tangent ?L of the microwave transparent layer. An area of the glass laminate is exposed to microwave radiation. The exposed area comprises a cross-laminate hot zone having a cross-laminate hot zone temperature profile. Substantially all microwave absorbing layer portions of the hot zone temperature profile and substantially all microwave transparent layer portions of the hot zone temperature profile reside above the glass transition temperature TG of the various layers of the glass laminate prior to impingement by the microwave radiation.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: October 16, 2018
    Assignee: CORNING INCORPORATED
    Inventors: Hilary Tony Godard, Gaozhu Peng, Irene Mona Peterson, Rebecca Lynn Schulz, Gary Graham Squier
  • Patent number: 9931804
    Abstract: A method of forming a decorated midsole element for articles of footwear includes obtaining a decorated film having one or more graphic elements applied to a first surface of the film and placing the decorated film in a mold. A midsole element is obtained and placed in the mold, and pressure is applied to the mold to form a midsole element having a decorated surface. The decorated film may include a layer of polyether-block co-polyamide polymer and the midsole element may be formed of ethylvinylacetate. A midsole assembly and an article of footwear having decorated midsole top layers are also described.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: April 3, 2018
    Assignee: NIKE, Inc.
    Inventors: Tony H. Le, Susan D. Cessor, Namkook Kim
  • Patent number: 9814543
    Abstract: A method of manufacturing an orthodontic appliance includes plating a first pattern of a material on a substrate to define a layer. Repeating plating of the first material one or more times forms an additional pattern. A layered structure is built up and forms a portion of the orthodontic appliance. A pattern of a second material different from a first material may be plated on the substrate or on a pattern of the first material. The material may be a sacrificial material that may be later removed. The orthodontic appliance may be an archwire or a self-ligating orthodontic bracket having one or more layered structures formed by plating patterns of the material. Plating may include plating patterns of materials so as to form a movable member in place relative to a bracket body.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: November 14, 2017
    Assignee: Ormco Corporation
    Inventors: Stanley S. Huang, Andres Rodriguez
  • Patent number: 9550349
    Abstract: A method for fabricating a part includes sectionalizing a computer-generated representation of a part into strata having an order, forming layers corresponding to the strata from sheet material, stacking at least two of the layers in the order, and joining the layers together. The method is suitable for producing a phase-change material container for a thermal energy harvesting device, for example.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: January 24, 2017
    Assignee: THE BOEING COMPANY
    Inventors: Ty A Larsen, Emma Romig, Bradley J Mitchell
  • Patent number: 9440285
    Abstract: The invention relates to a device for forming at least one thin film made of a powder material (14). The device includes a storage area, a deposition area (7), and a cylinder (1) having a circular base for depositing and compacting the powder material (14), the latter having been previously moved from a storage area to a deposition area (7). The device further includes a cylinder (1) having a smooth cylindrical surface, said cylinder being rotatably movable (F1) about the axis of revolution (A) thereof, as well as translatably movable in at least one direction (F5) parallel to a main plane in the deposition area (7), between the storage and deposition (7) areas; a scraper (3) that is movable in a direction perpendicular to the main plane of the deposition (7) area, as well as translatably movable in the same direction (F5) as the cylinder (1), between the storage and deposition (7) areas, the scraper (3) being adapted to move the powder material from one area to another (7).
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: September 13, 2016
    Assignee: PHENIX SYSTEMS
    Inventor: Patrick Teulet
  • Patent number: 9404914
    Abstract: The invention relates to a microfluidic system for controlling a concentration profile of molecules capable of stimulating a target, for example formed by an assembly of living cells, this system comprising: —a microfluidic device (1) comprising at least one microfluidic channel (4) equipped with at least one inlet orifice (21) and with at least one outlet orifice (22) for at least one fluid; —at least one means for supplying the microfluidic channel (4) with at least one fluid comprising molecules capable of stimulating the target; —at least one chamber (8) or another microfluidic channel comprising a base (6) intended to receive the target; and —at least one microporous membrane (5) separating the chamber (8) or the other microfluidic channel from the microfluidic channel (4), said microporous membrane (5) being positioned away from the base (6) so that when the supply means provides the microfludic channel (4) with said at least one fluid flowing in laminar flow in contact with the microporous membrane (5)
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: August 2, 2016
    Assignees: Centre National de la Recherche Scientifique-CNRS, Ecole Normale Supérieure, Université Pierre et Marie Curie (Paris 6), Fonds De L'ESPCI-Georges Charpak, Univerité Bordeaux Segalen
    Inventors: Maxime Dahan, Mathieu Morel, Jean-Christophe Galas, Vincent Studer, Denis Bartolo
  • Patent number: 9356603
    Abstract: A thermally tempered glass substrate for transient electronic systems (i.e., including electronic devices that visually disappear when triggered to do so) including two or more fused-together glass structures having different coefficient of thermal expansion (CTE) values disposed in an intermixed arrangement manner that generates and stores potential energy in the form of residual, self-equilibrating internal stresses. In alternative embodiments the substrate includes laminated glass sheets, or glass elements (e.g., beads or cylinders) disposed in a glass layer. A trigger device causes an initial fracture in the thermally tempered glass substrate, whereby the fracture energy nearly instantaneously travels throughout the thermally tempered glass substrate, causing the thermally tempered glass substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. Patterned fracture features are optionally provided to control the final fractured particle size.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: May 31, 2016
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Scott J. H. Limb, Gregory L. Whiting, Sean R. Garner
  • Patent number: 9324564
    Abstract: Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: April 26, 2016
    Assignees: International Business Machines Corporation, KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY
    Inventors: Ibrahim Alhomoudi, Stephen W. Bedell, Cheng-Wei Cheng, Keith E. Fogel, Devendra K. Sadana, Katherine L. Saenger, Norma E. Sosa, Ning Li
  • Patent number: 9321636
    Abstract: A method for producing a holder of at least one substrate from a first and a second plate, each including first and second parallel flat faces, the method including: a) delimitation on the first face of the second plate of plural surfaces by a non-bondable area in which a direct bonding with a face of the first plate is prevented; b) bringing the first face of the second plate into contact with the first face of the first plate; c) direct bonding between the first faces except in the non-bondable area; and d) removal of the portions of the second plate located vertically below surfaces inside the non-bondable area.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: April 26, 2016
    Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
    Inventors: Frank Fournel, Laurent Bally, Marc Zussy
  • Patent number: 9227365
    Abstract: A method of layerwise solid freeform fabrication is disclosed. The method comprises, for each of at least a few of the layers, dispensing and hardening at least a first modeling material and a second modeling material to form a core region and one or more envelope regions at least partially surrounding the core region. In some embodiments, the ratio between the elastic moduli of adjacent regions, when hardened, is from about 1 to about 20.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: January 5, 2016
    Assignee: Stratasys Ltd.
    Inventors: Daniel Dikovsky, Avraham Levy, Eduardo Napadensky
  • Patent number: 9196511
    Abstract: In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: November 24, 2015
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gordon M. Grivna, James M. Parsey, Jr.
  • Patent number: 9184094
    Abstract: A method of fabricating a semiconductor device includes providing an assembly substrate including a split plane defining a handle region and a transfer region, a film layer coupled to the transfer region, and one or more active devices coupled to the film layer. The method also includes providing a device substrate including one or more bonding regions and joining the assembly substrate to the device substrate. The method further includes splitting the assembly substrate to remove the handle region.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: November 10, 2015
    Assignee: Skorpios Technologies, Inc.
    Inventor: Elton Marchena
  • Patent number: 9079269
    Abstract: Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: July 14, 2015
    Assignee: International Business Machines Corporation
    Inventors: Stephen W. Bedell, Cheng-Wei Cheng, Keith E. Fogel, Devendra K. Sadana, Katherine L. Saenger, Norma E. Sosa Cortes, Ning Li, Ibrahim Alhomoudi
  • Publication number: 20150122773
    Abstract: Disclosed is a method for carrying out edge etching and strengthening of an OGS (One-Glass-Solution) touch panel with one-time film lamination. After a prepared large glass sheet has been subjected to a first strengthening treatment, a plurality of touch control circuits and peripheral frames of black, white, or other colors associated with the touch control circuits are laid on a surface of the large glass sheet. Afterwards, an upper lamination film and a lower lamination film are respectively laminated on surfaces of the large glass sheet with a plurality of preservation zones and cutting zones defined therein and are subjected to film cutting to form cut lines. The cutting zones of the upper lamination film and the lower lamination film are peeled off along the cut lines. Then, the large glass sheet is cut into a plurality of small glass cells along the cut lines of the cutting zones. Side edges of the small glass cells are then subjected to etching and strengthening.
    Type: Application
    Filed: July 14, 2014
    Publication date: May 7, 2015
    Inventor: CHUN-YUAN LEE
  • Publication number: 20150093810
    Abstract: A particle manipulation system uses a MEMS-based, microfabricated particle manipulation device, which has an inlet channel, output channels, and a movable member formed on a substrate. The movable member moves parallel to the fabrication plane, as does fluid flowing in the inlet channel. The movable member separates a target particle from the rest of the particles, diverting it into an output channel. However, at least one output channel is not parallel to the fabrication plane. The device may be used to separate a target particle from non-target material in a sample stream. The target particle may be, for example, a stern cell, zygote, a cancer cell, a component of blood, bacteria or DNA sample, for example. The particle manipulation system may also include a microfluidic structure which focuses the target particles in a particular portion of the inlet channel.
    Type: Application
    Filed: October 1, 2013
    Publication date: April 2, 2015
    Applicant: Owl biomedical, Inc.
    Inventors: John S. Foster, Nicholas C. Martinez, Stefan Miltenyi, Kamala R. Qalandar, Kevin E. Shields, Kimberly L. Turner, Mehran R. Hoonejani
  • Publication number: 20150083369
    Abstract: Diffusion bonding a stack of aluminum thin films is particularly challenging due to a stable aluminum oxide coating that rapidly forms on the aluminum thin films when they are exposed to atmosphere and the relatively low meting temperature of aluminum. By plating the individual aluminum thin films with a metal that does not rapidly form a stable oxide coating, the individual aluminum thin films may be readily diffusion bonded together using heat and pressure. The resulting diffusion bonded structure can be an alloy of choice through the use of a carefully selected base and plating metals. The aluminum thin films may also be etched with distinct patterns that form a microfluidic fluid flow path through the stack of aluminum thin films when diffusion bonded together.
    Type: Application
    Filed: September 25, 2014
    Publication date: March 26, 2015
    Inventors: Jack Merrill Fryer, Geoff Campbell, Brian S. Peotter, Lloyd Droppers
  • Patent number: 8974680
    Abstract: A pattern forming method includes forming a coating film containing a hydrophilic first homopolymer having a first bonding group and a hydrophobic second homopolymer having a second bonding group capable of bonding with the first bonding group, forming a bond between the first and second bonding group to produce a block copolymer of the first and second homopolymers, and heating the coating film to microphase-separating the copolymer into a hydrophilic domain and a hydrophobic domain. The hydrophilic and hydrophobic domains are arranged alternately. The bond is broken, then selectively dissolving-removing either domain by a solvent to provide a polymer pattern of a remainder domain.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: March 10, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroki Tanaka, Ryosuke Yamamoto, Naoko Kihara
  • Publication number: 20150060399
    Abstract: A method to produce a fabric applique includes the steps of providing a piece of steel, removing oxide layers from the steel, and forming a pattern on the steel. The steel is etched and coded. A die cutting laminate including the coded steel is prepared and compressed to cut fabric.
    Type: Application
    Filed: January 7, 2014
    Publication date: March 5, 2015
    Inventor: J. Michael Dywan
  • Patent number: 8968585
    Abstract: Methods to fabricate reaction cartridges for biological sample preparation and analysis are disclosed. A cartridge may have a reaction chamber and openings to allow fluids to enter the chamber. The cartridge may also have handles to facilitate its use. Such cartridges may be used for polymerase chain reaction.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: March 3, 2015
    Assignee: California Institute of Technology
    Inventors: Imran R. Malik, Axel Scherer, Erika F. Garcia, Xiomara L. Madero
  • Publication number: 20150047725
    Abstract: The present invention discloses a section of tubing including a fluoropolmer tubular body which has an interior surface defining a fluid passage through the tubular body. At least a first portion of the interior surface has a first hydrophobicity which is less than that of the remainder of the tubular body. At least a first portion of the interior surface can have a molar ratio of fluorine to oxygen of no greater than 30 to 1. Products can include the tubular bodies of the present invention attachable to fluid processing instruments such as immunodiagnostic instruments. The present invention also discloses methods for manufacturing the disclosed tubular bodies.
    Type: Application
    Filed: March 21, 2013
    Publication date: February 19, 2015
    Applicant: Siemens Healthcare Diagnostics Inc.
    Inventors: Mark Edwards, Aarti Kriplani, Alan R. Toth, Ruairi Cunningham
  • Publication number: 20150044497
    Abstract: This disclosure concerns bonding a thin film of diamond to a second thick diamond substrate in a way that does not cause the exposed (un-bonded) diamond surface to become contaminated by the bonding process or when the bonded diamond is held at high temperature for many hours in vacuum.
    Type: Application
    Filed: June 16, 2014
    Publication date: February 12, 2015
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Jonathan L. Shaw, Jeremy Hanna
  • Patent number: 8951426
    Abstract: An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After each coupon is shaped or components mounted to the coupon, the coupons are bonded together. The adhesive is dissolved to remove the device from the backing or backings to which it is attached.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: February 10, 2015
    Assignee: Stryker Corporation
    Inventors: Robert Brindley, John Janik, Edward Chia-Ning Tang
  • Patent number: 8948562
    Abstract: The present invention provides templating methods for replicating patterned metal films from a template substrate such as for use in plasmonic devices and metamaterials. Advantageously, the template substrate is reusable and can provide plural copies of the structure of the template substrate. Because high-quality substrates that are inherently smooth and flat are available, patterned metal films in accordance with the present invention can advantageously provide surfaces that replicate the surface characteristics of the template substrate both in the patterned regions and in the unpatterned regions.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: February 3, 2015
    Assignee: Regents of the University of Minnesota
    Inventors: David J. Norris, Sang Eon Han, Aditya Bhan, Prashant Nagpal, Nathan Charles Lindquist, Sang-Hyun Oh
  • Patent number: 8920661
    Abstract: A method for making a graphene/carbon nanotube composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing at least one carbon nanotube film structure on the graphene film, and combining the at least one carbon nanotube film structure with the graphene film, and combining the polymer layer with the at least one carbon nanotube film structure and the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: December 30, 2014
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Kai-Li Jiang, Xiao-Yang Lin, Lin Xiao, Shou-Shan Fan
  • Publication number: 20140377534
    Abstract: A circuit substrate, including a porous glass film with the volume percentage ratio of the glass being above 45%, a resin adhesion layer located on either side of the glass film respectively, and a metal foil located in the outside of resin adhesion layer. The glass film, the resin adhesion layer and the metal foil join together through suppressing, and the resin of the resin adhesion layer is filled in the gaps of the glass film. The circuit substrate employs a porous glass film as a carrier material, so that the resin adhesion layer and the surface of the glass film surface have a good binding force, and the CTE of the circuit substrate in the direction of X and Y is reduced compared to instances before, and has good formability, which is simple and convenient in process operation. In addition, also provided is a manufacturing method for a circuit substrate.
    Type: Application
    Filed: December 29, 2011
    Publication date: December 25, 2014
    Inventors: Minshe Su, Qianfa Liu
  • Publication number: 20140370210
    Abstract: A radar reflection-damping glazing includes a first substrate and a second substrate arranged above the first substrate in terms of surface area. A first radar-reflecting structure is arranged on the outside surface or on the inside surface of the first substrate. A second radar-reflecting structure is arranged on the inside surface or on the outside surface of the second substrate. The first radar-reflecting structure is an electrically conducting coating, into which linear decoated regions are introduced.
    Type: Application
    Filed: November 19, 2012
    Publication date: December 18, 2014
    Inventors: Walter Schreiber, Frank Rubbert, Andreas Frye, Klaus Schmalbuch, Bernd Stelling
  • Patent number: 8911636
    Abstract: A method of fabricating a micro-device having micro-features on glass is presented. The method includes the steps of preparing a first glass substrate, fabricating a metallic pattern on the first glass substrate, preparing a second glass substrate and providing one or more apertures on the second glass substrate, heating the first glass substrate and the second glass substrate with a controlled temperature raise, bonding the first glass substrate and the second glass substrate by applying pressure to form a bonded substrate, wherein the metallic pattern is embedded within the bonded substrate, cooling the bonded substrate with a controlled temperature drop and thereafter maintaining the bonded substrate at a temperature suitable for etching, etching the metallic pattern within the bonded substrate, wherein an etchant has access to the metallic pattern via the apertures, forming a void within the bonded substrate, wherein the void comprises micro-features.
    Type: Grant
    Filed: September 29, 2013
    Date of Patent: December 16, 2014
    Inventor: Viswanadam Gautham
  • Patent number: 8877074
    Abstract: Systems and methods for producing micromachined devices, including sensors, actuators, optics, fluidics, and mechanical assemblies, using manufacturing techniques of lead frames, substrates, microelectronic packages, printed circuit boards, flex circuits, and rigid-flex materials. Preferred embodiments comprise using methods from post-semiconductor manufacturing to produce three-dimensional and free-standing structures in non-semiconductor materials. The resulting devices may remain part of the substrate, board or lead frame which can then used as a substrate for further packaging electronic assembly operations. Alternatively, the devices may be used as final components that can be assembled within other devices.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: November 4, 2014
    Assignee: The Regents of the University of California
    Inventors: Mark Bachman, Guann-Pyng Li
  • Publication number: 20140305533
    Abstract: There is provided a method of producing a fluid channel device including laminating a plurality of polyimide films including at least one polyimide film having a port and at least one polyimide film having a channel, the polyimide films including at least one thermoplastic polyimide film; and adhering a plurality of the polyimide films by applying heat such that the ports are communicated with the channels. There is also provided the flow channel device produced by the method.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 16, 2014
    Applicant: Sony Corporation
    Inventor: Yoichi KATSUMOTO
  • Publication number: 20140292317
    Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measureable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.
    Type: Application
    Filed: March 29, 2013
    Publication date: October 2, 2014
    Applicant: STMicroelectronics Pte Ltd.
    Inventors: Olivier Le Neel, Ravi Shankar
  • Patent number: 8845911
    Abstract: A method is provided for producing a microstructured molded object that is intended for culturing of biological cells. According to this method, a plastically deformable first porous film is prepared, as well as a deformable second film and a deformable sacrificial film. The first, second and sacrificial film are placed in a stack. Next, the sacrificial film is subjected to pressure to press the stack into a mold. The mold has recesses, such that deformed regions in the form of cavities are produced in the sacrificial film, the first film and the second film, and undeformed regions remain. During the pressing of the film stack into the mold, the first film and the second film are joined to each other, so that they form a composite film. At least portions of the deformed regions of the second film are etched so that sections of the second film are chemically dissolved.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: September 30, 2014
    Assignee: Technische Universität Ilmenau
    Inventors: Joerg Hampl, Frank Weise, Gregor Schlingloff, Andreas Schober, Uta Fernekorn
  • Patent number: 8845910
    Abstract: The object of the present invention is to strongly join an aluminum alloy part with an FRP prepreg. An object obtained by subjecting an aluminum alloy to a suitable liquid treatment so as to form a surface having large, micron-order irregularities and also fine irregularities with a period of several tens of nanometers, eliminating the presence of sodium ions from the surface and additionally forming a surface film of aluminum oxide, which is thicker than a natural oxide layer, has been found to have a powerful adhesive strength with epoxy-based adhesives. By simultaneously curing an FRP prepreg which uses the same epoxy-based adhesive in the matrix, an integral composite or structure in which FRP and aluminum alloy have been united at a joining strength of unprecedented magnitude is produced.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 30, 2014
    Assignee: Taisei Plas Co., Ltd.
    Inventors: Masanori Naritomi, Naoki Andoh
  • Patent number: 8840797
    Abstract: A unique and cost-effective method for producing a multilayer ceramic structure by using a first green film that contains a ceramic material, and the multilayer ceramic structure produced thereby. The method including the steps of: (a) producing at least one porous region in the first green film, the at least one porous region extending from the surface of the first green film; (b) applying a first layer, in sections, to the surface of the first green film, wherein one section of the first layer is located above the at least one porous region produced in step (a); (c) positioning at least one additional green film on the surface of the first green film, to which the first layer has been applied; (d) laminating the first green film and the at least one additional green film to form a green film composite; and (e) sintering the green film composite.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: September 23, 2014
    Assignees: Micro Systems Engineering GmbH, Technische Universitaet Wien
    Inventors: Thomas Haas, Dieter Schwanke, Achim Bittner, Ulrich Schmid
  • Publication number: 20140224763
    Abstract: This joining method of joining a target substrate and a support substrate includes: an adhesive coating operation that includes coating the target substrate or the support substrate with an adhesive; an adhesive removing operation that includes supplying a solvent of the adhesive onto an outer peripheral portion of the target substrate or the support substrate, which is coated with the adhesive in the adhesive coating operation, to thereby remove the adhesive on the outer peripheral portion; and a joining operation that includes pressing and joining the target substrate and the support substrate together, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the support substrate coated with no adhesive, or pressing and joining the support substrate, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the target substrate coated with no adhesive.
    Type: Application
    Filed: August 3, 2012
    Publication date: August 14, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shinji Okada, Masatoshi Shiraishi, Masatoshi Deguchi
  • Patent number: 8790520
    Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: July 29, 2014
    Assignee: Lexmark International, Inc.
    Inventors: Paul Kevin Hall, Keith Bryan Hardin, Zachary Charles Nathan Kratzer, Qing Zhang
  • Publication number: 20140194862
    Abstract: An optical surgical probe includes a cannula; a light guide within the cannula, configured to receive a light beam from the light source, to guide the light beam to a distal end of the light guide, and to emit the light beam at the distal end of the light guide; and a multi-spot generator at a distal end of the cannula, the multi-spot generator having a faceted proximal surface with oblique facets, configured to receive the light beam emitted at the distal end of the light guide and to split the received light beam into multiple beam-components, and a distal surface through which the multiple beam-components exit the multi-spot generator, wherein the proximal surface of the multi-spot generator is micro-structured with a modulation length smaller than a wavelength of the light beam in order to reduce the reflectance of light back into the probe.
    Type: Application
    Filed: January 8, 2013
    Publication date: July 10, 2014
    Applicant: ALCON RESEARCH, LTD.
    Inventors: Ronald T. Smith, Mark H. Farley, Dustin J. Bouch
  • Patent number: 8771529
    Abstract: A method of imprint lithography includes imprinting a first pattern with a first template on a first substrate of a lithographic template. A second pattern is imprinted with a second template on the substrate of the lithographic template. The first pattern and the second pattern at least partially overlap, thus forming a third pattern. The third pattern is lithographically formed on a second substrate with the lithographic template. In an embodiment, the first pattern is a concentric line pattern formed by thin film deposition. In an embodiment, the second pattern is a radial line pattern. In an embodiment the first pattern and the second pattern may have line frequency increased.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: July 8, 2014
    Assignee: Seagate Technology LLC
    Inventors: Kim Yang Lee, Bing Yen, David Kuo, Koichi Wago, Shih-Fu Lee, Dieter Weller
  • Patent number: 8771533
    Abstract: A dielectric material layer is deposited on exposed surfaces of a bonded structure that includes a first substrate and a second substrate. The dielectric material layer is formed on an exposed planar surface of a second substrate and the entirety of peripheral sidewalls of the first and second substrates. The dielectric material layer can be formed by chemical vapor deposition, atomic layer deposition, or plasma induced deposition. Further, the dielectric material layer seals the entire periphery of the interface between the first and second substrates. If a planar portion of the dielectric material layer can be removed by planarization to facilitate thinning of the bonded structure, the remaining portion of the dielectric material layer can form a dielectric ring.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: July 8, 2014
    Assignee: International Business Machines Corporation
    Inventors: Mukta G. Farooq, Emily Kinser, Richard S. Wise, Hakeem B. S. Akinmade-Yusuff
  • Publication number: 20140178648
    Abstract: The present invention provides methods for hermetically sealing luminescent nanocrystals, as well as compositions and containers comprising hermetically sealed luminescent nanocrystals. By hermetically sealing the luminescent nanocrystals, enhanced lifetime and luminescence can be achieved.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 26, 2014
    Applicant: NANOSYS, INC.
    Inventor: Robert S. Dubrow
  • Patent number: 8758635
    Abstract: The present disclosure relates to a method for making a thermoacoustic element. In the method, a graphene film is arranged on a metal substrate. A nonmetal substrate is stacked with the graphene film located on the metal substrate to form a laminate structure. The graphene film is sandwiched between the nonmetal substrate and the metal substrate. The metal substrate is removed from the stacked structure. A number of through-holes are formed in the nonmetal substrate. The graphene film is exposed through the plurality of through-holes.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: June 24, 2014
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Kai-Li Jiang, Xiao-Yang Lin, Lin Xiao, Shou-Shan Fan
  • Patent number: 8754338
    Abstract: An electronics interconnection system is provided with reduced capacitance between a signal line and the surrounding dielectric material. By using a non-homogenous dielectric, the effective dielectric constant of the material is reduced. This reduction results in less power loss from the signal line to the dielectric material, and therefore reduces the number of buffers needed on the signal line. This increases the speed of the signal, and reduces the power consumed by the interconnection system. The fabrication techniques provided are advantageous because they can be preformed using today's standard IC fabrication techniques.
    Type: Grant
    Filed: May 28, 2011
    Date of Patent: June 17, 2014
    Assignee: Banpil Photonics, Inc.
    Inventor: Achyut Kumar Dutta
  • Patent number: 8746846
    Abstract: A nozzle plate includes: a nozzle plate main body made of metal, the nozzle plate main body having nozzle rows formed of nozzles arranged in parallel and penetrating the nozzle plate main body in a thickness direction, wherein at the outer edge of the nozzles on a droplet discharge surface of the nozzle plate main body, a water-repellent film is provided, and primer treatment is performed on at least part of the periphery of the droplet discharge surface of the nozzle plate main body, the periphery outside the water-repellent film.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: June 10, 2014
    Assignee: Seiko Epson Corporation
    Inventor: Katsuji Arakawa
  • Publication number: 20140151328
    Abstract: A release layer is adequately protected by a protective layer when a laminate is subjected to a desired treatment. A method for forming a laminate 10 includes a protective layer forming step of forming a protective layer 15 for covering a face that is a surface of a release layer 14 and which is not adhered to a support plate 12 and not superimposed at least on an adhesive layer 13; and a protective layer removal step of removing a portion of the protective layer 15, which is exposed at the time of forming the laminate 10.
    Type: Application
    Filed: November 5, 2013
    Publication date: June 5, 2014
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Atsushi Miyanari, Akihiko Nakamura
  • Patent number: 8741159
    Abstract: A method of fabricating a touch screen panel according to an embodiment of the present invention includes: forming a reinforcing layer on the top and the bottom of a glass substrate by reinforcing the entire surface of the glass substrate defining a plurality of unit cell regions; forming the touch screen panels in the unit cell regions on a side of the glass substrate with the reinforcing layers; cutting the reinforced glass substrate into the touch screen panels; forming passivation layers on the outer surfaces of the touch screen panels and sequentially stacking the touch screen panels; and simultaneously with the stacking, performing healing on the non-reinforced cut-sides of the stacked touch screen panels.
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: June 3, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kyu-taek Lee, Kwan-Young Han