Abstract: Provided is an apparatus for producing a joined-resin product in which two or more resin members are joined. The apparatus includes: a surface treatment mechanism comprising an electrode unit generating ionized gas, and a member holding mechanism arranged at a position separated from the electrode unit by a space and holding the resin member, the surface treatment mechanism activating a surface to be joined of the resin member held by the member holding mechanism, by the ionized gas generated by the electrode unit; and a joining mechanism bonding the two or more resin members together where at least one of surfaces to be joined facing each other is activated by the surface treatment mechanism, at the respective surfaces to be joined.

Abstract: It is an object to provide a substrate for epitaxial growth having a metal base material laminated with a copper layer. On a surface of the copper layer, an area occupied by crystal grains having crystal orientations other than a (200) plane present within 3 ?m from the surface can be less than 1.5%. A surface roughness along a same direction as a rolling direction per unit length of 60 ?m when measured by AFM can be Ra1<10 nm.

Abstract: According to examples, an apparatus may include a build platform and a chamber. The chamber may support a layer forming station including a spreading component to spread a layer of build material particles onto the build platform and an agent delivery component to apply fusing agent onto selected locations on the spread layer of build material particles and a heating station including a heating component to apply energy onto the spread layer of build material particles and the applied fusing agent, in which the heating station is separated from the layer forming station. The apparatus may also include an actuator to move the chamber with respect to the build platform or vice versa while maintaining the separation between the layer forming station and the heating station.

Abstract: A component carrier and a method for manufacturing the same are disclosed. The component carrier includes an electrically conductive layer structure and an overhanging end. A first surface finish is formed on a first surface portion of the electrically conductive layer structure. Furthermore, the component carrier further includes a second surface finish on a second surface portion of the electrically conductive layer structure connected to the first surface finish and extending under the overhanging end.

Abstract: An assembly 2 comprises a rigid, self-supporting AM component 4 which is in the form of a T-shaped pipe having an elongate section 6 which is open at its ends 8, 10 and a section 12 which extends transversely to elongate section 6 and opens at its end 13. The component 4 forms internal walls of a capsule which is subjected to Hot Isostatic Pressing (HIP). External walls of the capsule are defined by sheet metal sections (referenced 14 in FIG. 1 and described in more detail with reference to FIGS. 3 to 5) and are arranged to define the outer shape of at least a portion of a final component made by HIP. Between its inner and outer walls a void is defined into which powdered metal 16 is introduced so the capsule encases the powdered metal 16. In use, the assembly is subjected to HIP and, thereafter, the sheet metal sections of the capsule are removed to define a final component comprising both the AM component 4 and HIPed powder 16.

Abstract: A method for the additive production of a ceramic main part has the following steps: providing a slip of ceramic base material particles suspended in a liquid phase; producing a slip layer; orienting the radiation of a laser light source onto a section of the slip layer; evaporating liquid phase out of the slip layer in the section of the slip layer onto which the radiation of the laser light source is oriented or was oriented; forming a section of the ceramic main part in the slip layer in a sinter-free manner; optionally repeating the steps of producing a slip layer, orienting the radiation, evaporating the liquid phase, and forming a section of the main part in a sinter-free manner until the ceramic main part is provided; and separating the ceramic main part from the slip.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed for a structure of an engine component, including a first plurality of unit cells offset from a neutral plane in a first direction, a second plurality of unit cells offset from the neutral plane in a second direction, a plurality of nodes joining ones of the first plurality of unit cells and ones of the second plurality of unit cells, wherein the first plurality of unit cells and the second plurality of unit cells are arranged in pairs such that ones of the first plurality of unit cells are laterally adjacent to and interconnected with ones of the second plurality of unit cells, and wherein the structure is a stiffened structure.

Abstract: A piston of a cylinder of an internal combustion engine includes: an upper piston crown; a radially outer surface; a plurality grooves arranged on the radially outer surface; and a plurality of piston rings each positioned in a respective one of the grooves. The radially outer surface forms a top land arranged between the upper piston crown and an uppermost one of the grooves of the piston, and the top land has an axial length and a non-abrasion-proof coating.

Abstract: A method of forming a flexible glass-polymer laminate structure includes heating a polymer layer to an elevated temperature of greater than 20° C. and below a working temperature of a flexible glass substrate adjacent the polymer layer. The flexible glass substrate has a thickness of no more than about 0.3 mm. The flexible glass substrate is shaped with the polymer layer at the elevated temperature. The polymer layer is cooled below the elevated temperature such that the flexible glass-polymer laminate structure maintains a non-planar formation.

Abstract: A system is disclosed for use in additively manufacturing a structure. The system may include an additive manufacturing machine, a memory having computer-executable instructions stored thereon, and a processor. The processor may be configured to execute the computer-executable instructions to determine a characteristic of an existing point to be used as an anchor for a path of composite material discharged by the additive manufacturing machine. The processor may also be configured to execute the computer-executable instructions to selectively cause the additive manufacturing machine to discharge the path of composite material with a variable ratio of matrix-to-fiber at the existing point that is based on the characteristic.

Abstract: The yield of a manufacturing process of a semiconductor device is increased. The mass productivity of a semiconductor device is increased. A semiconductor device is manufactured by forming a first material layer over a substrate; forming a second material layer over the first material layer; and separating the first material layer and the second material layer from each other; and heating the first material layer and the second material layer that are stacked before the separation. The first material layer includes a gas containing hydrogen, oxygen, or hydrogen and oxygen (e.g., water) in a metal oxide, for example. The second material layer includes a resin. The first material layer and the second material layer are separated from each other by a break of a hydrogen bond. Specifically water is separated out at the interface or near the interface, and then adhesion is reduced due to the water present.

Abstract: A system is disclosed for use in additively manufacturing a structure. The system may include an additive manufacturing machine, a memory having computer-executable instructions stored thereon, and a processor. The processor may be configured to execute the computer-executable instructions to cause the additive manufacturing machine to discharge a path of composite material, including a continuous fiber and a matrix at least partially coating the continuous fiber. The processor may also be configured to execute the computer-executable instructions to monitor an energy level within the continuous fiber during discharging, to make a determination that the continuous fiber has lost continuity based on a reduction in the energy level, and to selectively interrupt the discharging based on the determination.

Abstract: Methods and apparatus for creating an interface between a surface and a substrate, where the thermal conductivity of the substrate exceeds that of the surface. At least one of the surface and the substrate is subtractively nanostructured to create a nanostructured surface, each nanostructured surface is functionalized, and the surface is bonded to the substrate. The nanostructured surface may be functionalized using at least one of the processes of surface acid etching, oxygen plasma etching, atomic layer deposition, sputtering, e-beam deposition, and ion-beam bombardment or implantation, with or without subsequent reflow.

Abstract: Three-dimensional (3D) printing systems include a 3D printer that includes a print bed that has one or more walls arranged to enclose a basin configured to contain a printing material. A compression plate is configured to fit slidably within, or on top surfaces of, the one or more walls of the print bed. A bottom plate forms a base of the basin and is configured to fit slidably within the one or more walls of the print bed. An elevation controller moves one or both of the compression plate and the bottom plate towards each other to apply a specified compressive force on printing material within the basin. The compression plate and the bottom plate together seal the basin sufficiently to avoid leakage of the print material from the basin.

Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.

Abstract: A glass article exhibiting improved resistance to frictive surface damage and a method for making it, the method comprising removing a layer of glass from at least a portion of a surface of the article that is of a layer thickness at least effective to reduce the number and/or depth of flaws on the surface of the article, and then applying a friction-reducing coating to the portion of the article from which the layer of surface glass has been removed.

Abstract: Primer formulation which contains (1) at least one alkoxysilane monomer of the general formula R1nSi(OR2)4-n (I), wherein R1 stands for an organic residue which contains at least one ethylenically unsaturated, polymerizable group, R2 stands for a C1-C8 alkylorganic residue and n is 1, 2 or 3, wherein the residues R1 and R2 can each be the same or different; (2) at least one polyhydrogen fluoride salt of the general formula (R9)+(Hx-1Fx)?z (II), wherein R9 stands for a metal cation from the series of the alkali, alkaline earth or transition metals or for an ammonium ion of the formula (R5)(R6)(R7)(R8)N+, in which R5 R6 R7 and R8 each independently of each other stand for H or C1 to C12 alkyl, C3 to C12 alkenyl or C6-C12 aryl residues, wherein R5, R6, R7 and R8 can be the same or different, and wherein two of these residues can be bound together to form a heterocycle together with the nitrogen atom and wherein three of the residues and the nitrogen atom can together form a pyridinium ion, x is an integer from 2

Abstract: A configuration for joining a ceramic layer has a thermal insulating material to a metallic layer. The configuration includes an interface layer made of metallic material located between the ceramic layer and the metallic layer, which includes a plurality of interlocking elements on one of its sides, facing the ceramic layer, the ceramic layer comprising a plurality of cavities aimed at connecting with the corresponding interlocking elements of the interface layer. The configuration also includes a brazing layer by means of which the interface layer is joint to the metallic layer. The invention also refers to a method for obtaining such a configuration.

Abstract: [Object] To provide a laser processing apparatus and a laser processing method which are capable of reducing roughness of a cut surface in laser cutting using laser beams transmitted through optical fibers. [Solution] A laser processing apparatus according to the present invention includes at least one laser oscillator configured to emit laser beams, a plurality of optical fibers configured to transmit the emitted laser beams, and at least one optical element configured to focus the laser beams emitted from the optical fibers and irradiate a surface of a workpiece with the focused laser beams. At output ends of the optical fibers, the output ends of the plurality of optical fibers are placed in one or a plurality of ring shapes.

Abstract: A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.

Abstract: In a method for solid body joining of a carrier body (10) and a cover layer (20), in particular by anodic bonding, the cover layer (20) is pressed with a pressing force against a curved carrier body surface (11), wherein the pressing force during the solid body joining is distributed by way of a pressure intermediary device (30) areally and simultaneously over the whole cover layer (20) and is directed perpendicularly to the curvature of the carrier body surface (11). A composite component comprising a carrier body (10) and a cover layer (20) is also disclosed, wherein a curved areal joining region (13) is formed between a cover layer surface (21) and a carrier body surface (11).

Abstract: Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.

Abstract: A method for balancing a rotor, notably of a turbomachine, includes a step of determining an unbalancing mass, and a step of balancing by chemical machining of the rotor. The chemical machining includes arranging a bath containing a chemical machining agent so that the bath has a capacity of heterogeneous material removal as a function of the depth in the bath, an amount of material removal at a first depth in the bath is greater than an amount of material removal at a second depth in the bath; immersing the rotor in the bath; and orienting the rotor in the bath taking account of the capacity of heterogeneous material removal so that the quantity of material removed from the rotor in a zone of the unbalancing mass is sufficient to balance the rotor.

Abstract: Disclosed are a supporting substrate for manufacturing a flexible information display device capable of easily separating the flexible information display device from the supporting substrate without deforming or damaging the flexible information display device, a manufacturing method thereof, and a flexible information display device manufactured thereby. The supporting substrate for manufacturing a flexible information display device includes: a coating layer formed therein with a plurality micro-protrusions formed on the supporting substrate; and a temporary bonding/debonding layer formed on the coating layer and including an adhesive material mechanically interlocked with and bonded to the supporting substrate through Van der Waals bonding force.

Abstract: A new and novel method utilizing current nano-technological processes for fabricating a range of micro-devices with significantly expanded capabilities, unique functionalities at microscopic levels, enhanced degree of flexibilities, reduced costs and improved performance in the fields of bioscience and medicine is disclosed in the within patent application. Micro-devices fabricated using the disclosed nano-technological techniques have significant improvements in many areas over the existing, conventional methods. Such improvements include, but are not limited to reduced overall costs, early disease detection, targeted drug delivery, targeted disease treatment and reduced degree of invasiveness in treatment. Compared with existing, conventional approaches, the said inventive approach disclosed in this patent application is much more microscopic, sensitive, accurate, precise, flexible and effective.

Abstract: The invention relates to a bicycle component, for example a rim, comprising a body made from aluminium and a body made from composite material coupled with a first surface portion of the body made from aluminium. Such a first surface portion has been subjected to a deoxidation surface treatment. An adhesive substance has been then applied on at least part of said first surface portion for gluing the body made from aluminium to the body made from composite material. A second surface portion of the body made from aluminium has been subjected to an oxidation surface treatment with subsequent fixing of the oxide.

Abstract: A process for fabricating an acoustic wave resonator comprising a suspended membrane comprising a piezoelectric material layer, comprises the following steps: production of a first stack comprising at least one layer of first piezoelectric material on the surface of a first substrate; production of a second stack comprising at least one second substrate; production of at least one non-bonding initiating zone by deposition or creation of particles of controlled sizes leaving the surface of one of said stacks endowed locally with projecting nanostructures before a subsequent bonding step; direct bonding of said two stacks creating a blister between the stacks, due to the presence of the non-bonding initiating zone; and, thinning of the first stack to eliminate at least the first substrate.

Abstract: A method for producing a holder of at least one substrate from a first and a second plate, each including first and second parallel flat faces, the method including: a) delimitation on the first face of the second plate of plural surfaces by a non-bondable area in which a direct bonding with a face of the first plate is prevented; b) bringing the first face of the second plate into contact with the first face of the first plate; c) direct bonding between the first faces except in the non-bondable area; and d) removal of the portions of the second plate located vertically below surfaces inside the non-bondable area.

Abstract: Plasma etching of a liquid dielectric material such as a polyurethane solution results in volatile byproducts that are deposited onto the surface of an inert substrate. The surface treatment increases adhesiveness so that the surface of the inert material may be bonded to another material. Portions of a medical device comprising an inert substrate such as a fluoropolymer may therefore be securely affixed to other portions of the medical device formed of polymeric, metallic, or ceramic materials.

Abstract: A composition for providing acid resistance to copper surfaces in the production of multilayered printed circuit boards. The composition comprises an acid, an oxidizer, a five-membered heterocyclic compound and a thiophosphate or a phosphorous sulfide compound. In a preferred embodiment, the phosphorous compound is phosphorus pentasulfide. The composition is applied to a copper or copper alloy substrate and the copper substrate is thereafter bonded to a polymeric material.

Abstract: Disclosed is an inertial sensor, including a membrane, a mass body provided underneath a central portion of the membrane, a post provided underneath a peripheral portion of the membrane, and a cap having a peripheral portion bonded to a lower surface of the post using low-temperature silicon direct bonding. A method of manufacturing the inertial sensor is also provided.

Abstract: A method for bonding a sheath made of a first metallic material to an airfoil made of a second metallic material includes treating the bonding surface of the airfoil; treating the bonding surface of the sheath; placing an adhesive between the bonding surfaces of the airfoil and the sheath; and pressing the airfoil and sheath together so that the adhesive bonds the sheath to the airfoil.

Abstract: Embodiments relate to the design and use of a low profile ablation catheter with a liquid core for use in laser ablation removal of arterial plaque blockages to restore blood flow.

Abstract: A bonding structure includes a first connecting body, an adhesive, and a second connecting body. The first connecting body has a bonding surface subject to one or more recessed grooves. The second connecting body is bonded to the bonding surface of the first connecting body by the adhesive. The bonding surface of the first connecting body defines an adhesive receiving groove, the adhesive is received in the adhesive receiving groove and bonds with the second connecting body; the adhesive receiving groove defines an initial adhesive receiving portion recessed from a bottom surface of a portion of the adhesive receiving groove; the initial adhesive receiving portion is for receiving injected adhesive, a depth of the initial adhesive receiving portion is slightly greater than that of the adhesive receiving groove to allow flow and expansion of the glue into the adhesive receiving groove when external force to bond is applied.

Abstract: Disclosed is a method for forming a glass-plastic composite which includes the steps of: a) activating a first surface of a glass substrate, b) applying an adhesive material on the first surface that has been activated to form an adhesive layer on the first surface, and c) placing the glass substrate together with the adhesive layer in a mold and injection molding a plastic material over the adhesive layer. A glass-plastic composite made according to the method is also disclosed.

Abstract: Methods for improving adhesion or bonding between materials used in forming components of directional drilling assemblies, such as rotors and stators, are provided. A surface of a component may be treated, such as through cleaning, etching and/or activating a surface. The use of plasma treatment may enhance the adhesion between the surfaces and/or materials to be bonded, thereby reducing the degradation or mechanical failure of these materials in oilfield applications.

Abstract: A method for improving adhesion between polymeric materials is provided. The method includes treating a surface of a first polymeric material with plasma of oxygen gas and hydrogen-containing gas. The first polymeric material may be a fully cured polymeric material. A second polymeric material may then be deposited on the plasma treated surface of the first polymeric material. The second polymeric material may be an uncured polymeric material. This plasma treatment may be used in improving the adhesion between polymeric components of an inkjet printer. It provides good adhesion between the polymeric components of the inkjet printer even after long exposure to ink.

Abstract: Plasma etching of a polymeric dielectric material such as polyurethane results in volatile byproducts that are deposited onto the surface of an inert substrate. The surface treatment increases adhesiveness so that the surface of the inert material may be bonded to another material. Portions of a medical device comprising an inert substrate such as a fluoropolymer may therefore be securely affixed to other portions of the medical device formed of polymeric, metallic, or ceramic materials.

Abstract: The present invention relates to a method of producing a microstructured device, as well as a method of processing a microstructured substrate to heal surface defects therein, a method of bonding substrates and healing surface defects in a substrate, and microstructured devices produced by these methods.

Abstract: A ceramics composite member includes a structure in which a first ceramic member and a second ceramic member are integrated with a joint portion. The joint portion has a texture in which a silicon phase having an average diameter of 0.05 ?m or more and 10 ?m or less is continuously provided in a network form in interstices of silicon carbide particles having an average particle diameter of 0.1 ?m or more and 0.1 mm or less.

Abstract: A fluidic chip device configured for processing a fluidic sample includes two outer boundary layers, and at least one reinforcing layer arranged between the two outer boundary layers and being at both of its opposing main surfaces laminated with directly adjacent layers to reinforce pressure resistance of the fluidic chip device by the lamination, in which at least a part of the layers of the fluidic chip device includes a hole forming at least a part of a fluidic conduit for conducting the fluidic sample under pressure.

Abstract: The disclosure provides in one embodiment a method of promoting adhesion on a composite surface. The method comprises providing a composite structure having at least one composite surface to be bonded. The method further comprises preparing the at least one composite surface. The method further comprises providing a chemical derivatization compound containing active functional groups that promote adhesion. The method further comprises depositing the chemical derivatization compound on the prepared composite surface to form a functional group-adhesive promoter derivatized layer. The method further comprises applying an adhesive layer to the derivatized layer. The method further comprises heat curing the adhesive layer to result in a bond with another structure made of a composite, a metal, or a combination thereof.

Abstract: Novel cellular solids and foams from amorphous materials with a glass transition temperature (Tg) and methods of forming such materials are provided. In particular, foams are formed by expanding or compressing hollow spheres made of a high strength amorphous material, which is defined as a material having high strength characteristics, but also possessing a glass transition within a confined space. Using such a method, it has been unexpectedly found that it is possible to make cellular structures, including both open and closed cell foams, with customizable properties from materials that have been inaccessible with conventional methods. Moreover, based on calculations high specific strengths and stiffnesses are expected.

Abstract: This disclosure provides systems, methods, and apparatus for treating a self-assembled monolayer coating on a dielectric layer to improve epoxy adhesion to the self-assembled monolayer coating. In implementations of the methods, a dielectric layer on a surface of a substrate is provided. A self-assembled monolayer coating is formed on the dielectric layer. A seal region of the self-assembled monolayer coating is selectively treated. A component is bonded to the seal region of the self-assembled monolayer coating with an epoxy. Implementations of the methods may be used to encapsulate an electromechanical systems device on the substrate with a cover using an epoxy.

Abstract: Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric is disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.

Abstract: A method of using TTIr welding to weld together two high transmissivity plastic parts includes providing one or both parts with a modified surface that increases that plastic part's absorbtivity to laser light. The two parts are then laser welded by directing a beam of infrared laser light to the parts which are oriented so that the beam of infrared laser light first passes through one of the parts, impinges the modified surface (or surfaces) at a weld interface where the two plastic parts abut each other to melt the plastic parts at the weld interface, and then passes through the other plastic part.

Abstract: A method for bonding a sheath made of a first metallic material to an airfoil made of a second metallic material includes treating the bonding surface of the airfoil; treating the bonding surface of the sheath; placing an adhesive between the bonding surfaces of the airfoil and the sheath; and pressing the airfoil and sheath together so that the adhesive bonds the sheath to the airfoil.

Abstract: A process for fabricating an acoustic wave resonator comprising a suspended membrane comprising a piezoelectric material layer, comprises the following steps: production of a first stack comprising at least one layer of first piezoelectric material on the surface of a first substrate; production of a second stack comprising at least one second substrate; production of at least one non-bonding initiating zone by deposition or creation of particles of controlled sizes leaving the surface of one of said stacks endowed locally with projecting nanostructures before a subsequent bonding step; direct bonding of said two stacks creating a blister between the stacks, due to the presence of the non-bonding initiating zone; and, thinning of the first stack to eliminate at least the first substrate.

Abstract: The invention relates to a pressure-sensitive tape, particularly for producing or sticking together optical liquid crystal data displays (LCDs), comprising a top side and an underside. The pressure-sensitive adhesive tape also comprises a carrier film with a top side and an underside, and the pressure-sensitive adhesive tape is provided with a pressure-sensitive adhesive layer both on the top side as well as on the underside. The pressure-sensitive adhesive tape is characterized in that the carrier film has a content of antiblocking agents of less than 4000 ppm, and at least one light-absorbing chromophoric layer is provided between the carrier film and the pressure-sensitive adhesive layers.

Abstract: The disclosure is directed to a laminate structure including an encapsulant layer and a thermoplastic polymer layer. The encapsulant layer has a major surface, wherein the major surface of the encapsulant is treated to increase adhesion. The thermoplastic polymer layer has a melting point temperature or glass transition temperature greater than about 165° C., wherein the thermoplastic layer has a major surface that is treated to increase adhesion and is disposed on the treated major surface of the encapsulant layer. The disclosure is further directed to a method of forming the aforementioned laminate structure.