Abstract: A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

Abstract: Example embodiments are directed to a wafer dividing apparatus and method thereof. The wafer dividing apparatus includes a chuck unit having upper and lower chucks, a cutting wire that is provided in a space between the upper and lower chucks to cut a wafer and driven by a first driving unit, and an etchant supplying nozzle supplying etchant to a groove of the wafer, which is formed by the cutting wire.

Abstract: The present application relates to a porous thin film having holes, wherein the holes are formed in the top part and/or the bottom part of the thin film and the holes are linked to the pores of the thin film; and the present invention also relates to a production method for a porous thin film having holes, comprising the use of a particle alignment layer as a mould.

Abstract: A method for manufacturing a flexible display device in which a flexible substrate is acquired by forming display devices on one side of the substrate and thinning the substrate by removing surface portions on an opposite side of the substrate. The thickness of the substrate is changed from a first thickness, which gives rigidity to the substrate to the second thickness, which gives flexibility to the substrate.

Abstract: A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure.

Abstract: A method of the present invention comprises: preparing the first substrate comprising a surface with a first recess and a second recess of which a bottom comprises a first electrode; immersing the first substrate into a electrolyte solution; inserting a second electrode into the electrolyte solution; injecting a bubble into the electrolyte solution with applying a voltage between the first and the second electrodes to dispose the bubble onto only the first recess; dispersing the first microstructure into the electrolyte solution to dispose it onto the first recess; injecting the bubble into the electrolyte solution to dispose the bubble onto the second recess; and dispersing the second microstructure into the electrolyte solution to dispose it onto the second recess.

Abstract: An apparatus for etching a substrate includes (a) a nozzle system including at least one nozzle through which acid solution containing at least hydrofluoric acid is sprayed onto the substrate, (b) a mover which moves at least one of the nozzle system and the substrate relative to the other in a predetermined direction in such a condition that the substrate and the nozzle system face each other, (c) a filter system which filters off particles out of the acid solution having been sprayed onto the substrate, and (d) a circulation system which circulates the acid solution having been sprayed onto the substrate, to the filter system, and further, to the nozzle system from the filter system.

Abstract: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.

Abstract: A method for fabricating a membrane is disclosed, to provide both hydrophilicity and hydrophobicity to predetermined positions of a surface of a single membrane. The method for fabricating a membrane includes: preparing a template with nano-scale holes formed on its outer surface; coating a polymer material on a predetermined pattern region of the outer surface of the template; attaching a hydrophilic film on the outer surface of the template; and removing the template from the hydrophilic film.

Abstract: Plasma etching of a polymeric dielectric material such as polyurethane results in volatile byproducts that are deposited onto the surface of an inert substrate. The surface treatment increases adhesiveness so that the surface of the inert material may be bonded to another material. Portions of a medical device comprising an inert substrate such as a fluoropolymer may therefore be securely affixed to other portions of the medical device formed of polymeric, metallic, or ceramic materials.

Abstract: A method for realizing a nanometric circuit architecture includes: realizing plural active areas on a semiconductor substrate; realizing on the substrate a seed layer of a first material; realizing a mask-spacer of a second material on the seed layer in a region comprised between the active areas; realizing a mask overlapping the mask-spacer and extending in a substantially perpendicular direction thereto; selectively removing the seed layer exposed on the substrate; selectively removing the mask and the mask-spacer obtaining a seed-spacer comprising a linear portion extending in that region and a portion substantially orthogonal thereto; realizing by MSPT from the seed-spacer an insulating spacer reproducing at least part of the profile of the seed-spacer; realizing by MSPT a nano-wire of conductive material from the seed-spacer or insulating spacer, the nano-wire comprising a first portion at least partially extending in the region and a second portion contacting a respective active area.

Abstract: A dilatation balloon is fabricated according to a process that forms cavities and indentations in the balloon and/or catheter sections. A length of tubing is axially elongated and radially expanded in a form to provide the requisite biaxial orientation and strength. Then, an excimer laser or another type of laser or mechanical material removal tool is used to remove the polymeric material, virtually without thermal effects. Cavities in the sleeve sections of the balloon are defined and if desired, indentations in the cone sections are defined. Material removal, particularly near the balloon sleeves enables a thinner, more flexible bonding area between the catheter shaft and the balloon. Further, the indentations along the cone sections enables tighter wrapping of the balloon for a reduced delivery profile. Rigidity near the sleeves is reduced for better maneuverability of the catheter in tortuous passageways.

Abstract: A method for trimming a structure obtained by bonding a first wafer to a second waver on contact faces and thinning the first waver, wherein at least either the first wafer or the second wafer is chamfered and thus exposes the edge of the contact face of the first wafer, wherein the trimming concerns the first wafer. The method includes a) selecting the second wafer from among wafers with a resistance to a chemical etching planned in b) that is sufficient with respect to the first wafer to allow b) to be carried out; b) after bonding the first wafer to the second wafer, chemical etching the edge of the first wafer to form in the first wafer a pedestal resting entirely on the contact face of the second wafer and supporting the remaining of the first wafer; and c) thinning the first wafer until the pedestal is reached and attacked, to provide a thinned part of the first wafer.

Abstract: A micropattern is joined to a substrate (W1) by: a first group of covering step and micropattern forming step by etching in a transfer step; and a second group of covering step and micropattern forming step by etching in the transfer step.

Abstract: A micropattern is joined to a substrate (W1) by: a first group of covering step and micropattern forming step by etching in a transfer step; and a second group of covering step and micropattern forming step by etching in the transfer step.

Abstract: Provided is a thin film patterning method for patterning a thin film made of one of inorganic, organic, and organic/inorganic materials provided on a first substrate including: forming and patterning a thin film made of a material A on the first substrate; forming a thin film made of a material B, which is one of inorganic, organic, and organic/inorganic materials, on the first substrate and on the thin film; bonding the thin film, which is formed on the thin film, to a second substrate, thereby laminating the first substrate and the second substrate together to produce a laminated substrate; and removing the thin film and the thin film, which is provided on the thin film, from the first substrate.

Abstract: A method of multi-stage substrate etching is provided.

Abstract: [Problem to be Solved] A method for producing a flexible glass substrate which is approximately 100% impermeable to gas or vapor and excellent in bendability and a flexible glass substrate are provided. [Solution] After forming of a pattern P on a surface of a glass substrate 1, a support 3 is temporarily attached to the surface, the glass substrate 1 is thinned by etching another surface of the glass substrate 1, a film base 5 is laminated to the etched another surface, and the temporarily attached support 3 is peeled off from the one surface of the glass substrate 1.

Abstract: A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. A reinforcement edge side of the reinforcement plate is located at the outside of an auxiliary edge side of the auxiliary layer.

Abstract: Processes for making a membrane having a curved feature are disclosed. A profile-transferring substrate surface having a curved feature is created by vacuum bonding a membrane to a top surface of a substrate, where the top surface has a cavity formed therein. The surface of the membrane is exposed to a fluid pressure such that the membrane deforms and the undersurface of the membrane touches the bottom of the cavity. The curved feature formed in the deformed membrane can be made permanent by annealing the bonding areas between membrane and substrate. A uniform layer of material deposited over the exposed surface of the membrane will include a curved feature at the location where the membrane has bent into the cavity. After at least one layer of material has been uniformed deposited on the membrane, the cavity can be etched open from the bottom to remove the membrane from the underside.

Abstract: According to one embodiment, an inkjet head includes a base member, a nozzle plate, a frame and an adhesive. The nozzle plate is opposed to the base member. The frame is interposed between the base member and the nozzle plate, the frame including an adhering surface to which the nozzle plate is adhered, and a groove which is provided in the adhering surface. The adhesive is interposed between the adhering surface and the nozzle plate.

Abstract: Embodiments of the invention are directed to multi-layer, multi-material fabrication methods (e.g. electrochemical fabrication methods) which provide improved versatility in producing complex microdevices and in particular in removing sacrificial material from passages, channels, or cavities that are complex or that include etching access ports in their final configurations that are small relative to passage, channel, or cavity lengths. Embodiments of the present invention provide for removal of sacrificial material from these passages, channels or cavities using one or more initial or preliminary removal steps that occur prior to completion of the such passages that results from the completion of the layer forming steps. In some embodiments, first sacrificial material is replaced after a secondary solid sacrificial material after the initial removal step or steps. In other embodiments, the first sacrificial material is replaced after a liquid material after the initial removal step or steps.

Abstract: A molding composition and a method of forming an pattern. The method includes forming on a substrate a molding layer of a molding composition of aromatic divinyl ethers; pressing the template into the molding layer, the template having a relief pattern, the molding layer filling voids in the relief pattern, the template not contacting the substrate; exposing the molding layer to actinic radiation, the actinic radiation converting the molding layer to a cured molding layer having thick and thin regions corresponding to the relief pattern; removing the template; filling the thin regions of the relief pattern with a backfill material; removing regions of the molding layer not protected by the backfill material to expose regions of the substrate; forming trenches in the exposed regions of the substrate; and removing any remaining molding layer and backfill material. A transfer layer may be used between the molding layer and the substrate.

Abstract: There is provided a thin-sheet glass substrate laminate which is approximately 100% impermeable to gas or vapor and has a high transparency and a thin thickness, and a method of manufacturing the same. A support is temporarily attached to one surface of a glass substrate after forming a pattern P on the one surface, the glass substrate is thinned by etching another surface of the glass substrate, a film base is temporarily attached to the etched another surface, the temporarily attached support is peeled off from the one surface of the glass substrate, the one surface from which the support is peeled off is laminated to a surface of a cover glass, and the temporarily attached film base is peeled off from the another surface.

Abstract: The method for manufacturing an adhesion body according to the present invention is a method for manufacturing an adhesion body in which a first adherend and a second adherend are bonded to each other via an adhesive pattern, comprising a step of providing an adhesive layer containing a thermosetting component on a first adherend; a step of forming an adhesive pattern by etching the adhesive layer in a state in which a protective layer for protecting a predetermined portion of the adhesive layer from etching is provided on a surface of the adhesive layer opposite to a surface in contact with the first adherend; and a step of bonding a second adherend to the adhesive pattern after the protective layer is removed.

Abstract: A process for manufacturing an inkjet print head comprising the steps of providing a print head wafer comprising a plurality of print head dice coated with a barrier layer, each print head die comprising a plurality of actuators and interconnections, the barrier layer comprising a plurality of openings in correspondence with the plurality of actuators and interconnections, providing a debondable SOI wafer comprising a handle layer, a buried layer, and a device layer, forming a protective layer on the surface of the device layer, bonding the device layer to the barrier layer, debonding the handle layer from the SOI wafer, etching the device layer so as to realize a plurality of openings in correspondence with the plurality of actuators and interconnections, and removing the protective layer in correspondence of the plurality of openings.

Abstract: A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.

Abstract: A method for producing a medical functional element having a self-supporting lattice structure which has interconnected webs. The method applies a first layer to the substrate layer, the first layer is structured by an etching process, the structured first layer is under-cut of a wet chemical etching process acting on the substrate layer, the substrate layer is removed in order to form the self-supporting lattice structure, a web constructional layer is applied to the first layer. The method is distinguished by the forming the first web attachment layer which has a smaller layer thickness than the web constructional layer and is intimately bonded to the web constructional layer in such a way that the web attachment layer, together with the web constructional layer, forms the webs of the self-supporting lattice structure.

Abstract: An optical filter comprising a first substrate, a second substrate having a support portion which supports the first substrate, a first optical film provided on the first substrate, a second optical film provided on the second substrate and arranged to face the first optical film, a first protective film covering at least the first optical film, a second protective film covering at least the second optical film, a first bonding film, a portion of the first bonding film overlapping a surface of the first protective film in a plan view but does not overlapping the first optical film and a second bonding film, a portion of the second bonding film overlapping a surface of the second protective film in the plan view but does not overlapping the second optical film.

Abstract: A method for modifying crystalline structure of a copper element with a planar surface, including: a) producing a copper standard having large grains, wherein the standard includes a planar surface, b) reducing roughness of the planar surfaces to a roughness of less than 1 nm, c) cleaning the planar surfaces, d) bringing the two planar surfaces into contact, and e) annealing.

Abstract: A method for making a micro-device including at least one receiving site for components, formed in a thickness of a substrate. The method includes: a) making in at least one first substrate adhesively bonded to a second substrate via a discontinuous adhesive bonding interface, at least one first trench around at least one sacrificial block of the first substrate, by etching the first substrate so as to expose the adhesive bonding interface; and b) removing the sacrificial block so as to make at least one first cavity in the first substrate.

Abstract: A microchip with capillaries and method for making same is described. A sacrificial material fills microchannels formed in a polymeric substrate, the filled microchannels are covered by a top cover to form filed capillaries, and the sacrificial material is removed to form the microcapillaries. The sacrificial material fills the microchannels as a liquid whereupon it becomes solid in the microchannels, and is liquefied after the top cover is applied and affixed to remove the sacrificial material. The top cover may be solvent sealed on the substrate and of the same or different material as the substrate. The top cover may also be an in situ applied semipermeable membrane.

Abstract: The present disclosure relates to a method for making a transmission electron microscope grid. The method includes: (a) providing a substrate with a graphene layer on a surface of the substrate; (b) applying a carbon nanotube film structure to cover the graphene layer; (c) removing the substrate, to obtain a graphene layer-carbon nanotube film composite structure; and (d) placing the graphene layer-carbon nanotube film composite structure on a grid.

Abstract: The present invention provides a nozzle plate, the nozzle plate including: a first silicon substrate; and a second silicon substrate which has a crystal orientation different from that of the first silicon substrate and is bonded to the first silicon substrate, wherein the first silicon substrate includes a first through hole, and the second silicon substrate includes a second through hole which the first through hole communicates with, and has a different structure from that of the first through hole.

Abstract: A liquid ejecting head includes pressure generating chambers; nozzles that communicate with respective pressure generating chambers; a manifold that communicates with a liquid introduction opening and that serves as a common flow channel for the multiple pressure generating chambers; liquid supply channels, having liquid supply openings that open into the manifold, that communicate between the manifold and the pressure generating chambers; and a pressure generating element that causes liquid to be ejected through the nozzles by generating pressure within the pressure generating chambers. At least one of the liquid supply openings is physically separated from at least one adjacent liquid supply opening, such as by a partition, which prevents air bubbles from moving between adjacent liquid supply openings.

Abstract: A method and an apparatus for manufacturing a graphene transfer film are provided. The method of manufacturing the graphene transfer film includes: forming graphene on a graphene growth film comprising a carbonization catalyst; disposing a carrier film and the graphene growth film so that the carrier film and the graphene growth film, on which the graphene is formed, face each other; applying air pressure to at least one of the graphene growth film and the carrier film so that the graphene and the carrier film are attached to each other; and removing at least a part of the graphene growth film.

Abstract: A method for fabricating a component-embedded PCB includes: providing a carrier plate having a plating metal layer plated thereon; disposing an electronic component on the plating metal layer of the carrier plate; laminating a metal layer onto the plating metal layer having the electronic component disposed thereon and the carrier plate by a dielectric film; removing the carrier plate and exposing the plating metal layer; and patterning at least one of the metal layer and the plating metal layer to be a circuit layer.

Abstract: A dilatation balloon is fabricated according to a process that forms cavities and indentations in the balloon and/or catheter sections. A length of tubing is axially elongated and radially expanded in a form to provide the requisite biaxial orientation and strength. Then, an excimer laser or another type of laser or mechanical material removal tool is used to remove the polymeric material, virtually without thermal effects. Cavities in the sleeve sections of the balloon are defined and if desired, indentations in the cone sections are defined. Material removal, particularly near the balloon sleeves enables a thinner, more flexible bonding area between the catheter shaft and the balloon. Further, the indentations along the cone sections enables tighter wrapping of the balloon for a reduced delivery profile. Rigidity near the sleeves is reduced for better maneuverability of the catheter in tortuous passageways.

Abstract: A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board.

Abstract: A method for making a TEM micro-grid is provided. The method includes the following steps. A carrier, a carbon nanotube structure, and a protector are provided. The carrier defines a first through opening. The protector defines a second through opening. The protector, the carbon nanotube structure and the carrier are stacked such that the carbon nanotube structure is located between the carrier and the protector. The second through opening at least partly overlaps with the first through opening.

Abstract: Disclosed is a method of preparing a support structure suitable for use, e.g., in microscopic studies, comprising a free standing atomically thin film (e.g. graphene) suspended across an opening in the support structure. The method in one aspect comprises the steps of preparing a thin film which is an atomically thin film (e.g., graphene) on a surface of a solid substrate to form a graphene-layered substrate; attaching the graphene layer to a hole-containing support mesh; removing the solid support, thereby transferring the graphene layer from the substrate to the carbonaceous hole-containing layer on the support mesh; and then removing contaminants to obtain said structure. In another aspect, the present method does not involve a transfer, but comprises a lithography and etching process in which the atomically thin layer is applied to a support which is marked with a lithographic pattern and selectively etched, leaving the free standing film.

Abstract: A wavelength variable interference filter includes: a first substrate which has a light transmissive property; a second substrate which has a light transmissive property and is disposed to face one surface of the first substrate and is bonded thereto; a first reflection film which is provided on the first substrate; a second reflection film which is provided on the second substrate; and a variable section which varies the gap; wherein the second substrate includes: a first layer which has a movable section; and a second layer which is laminated to a surface of the first layer facing the first substrate, is formed in a plate shape with a uniform thickness, and has a support section configured to displaceably support the movable section; and the first layer is not laminated to at least a region overlapping with the support section in the planar view.

Abstract: A method for transferring a layer onto a support includes transferring the layer, assembled on an initial substrate, onto a liquid layer that has been previously deposited on the support. The layer is subsequently released from the initial substrate by chemical etching, and the liquid layer is evacuated to allow molecular adhesion of the layer to the support.

Abstract: A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.

Abstract: An accelerometer or a seismometer using an in-plane suspension geometry having a suspension plate and at least one fixed capacitive plate. The suspension plate is formed from a single piece and includes an external frame, a pair of flexural elements, and an integrated proof mass between the flexures. The flexural elements allow the proof mass to move in the sensitive direction in the plane of suspension while restricting movement in all off-axis directions. Off-axis motion of the proof mass is minimized by the use of intermediate frames disbursed within and between the flexural elements. Intermediate frames can include motion stops to prevent further relative motion during overload conditions. The device can also include a dampening structure, such as a spring or gas structure that includes a trapezoidal piston and corresponding cylinder, to provide damping during non-powered states. The capacitive plate is made of insulating material.

Abstract: A forming method includes: drawing, using a liquid which has a thermosetting property due to addition of a heat curing agent and a non-water-soluble property in at least a cured state, a sectional pattern of a three dimensional object which is a forming target on a water-soluble recording medium which has acceptability for the liquid and contains the heat curing agent; heating, in a state where the plurality of recording mediums on which the sectional pattern is drawn is stacked, the plurality of recording mediums, after the drawing; and dissolving at least an area outside the sectional pattern in each of the plurality of recording mediums using a liquid which includes water, after the heating.

Abstract: A method for encapsulating structures (11) (typically MEMS structures) supported by a carrier substrate (12) (typically made of glass or silicon), includes: application, on the carrier substrate (12), of at least one cover (7) supported by a mould (1, 2, 6), the mould including a catching layer (6), each cover (7) being in contact with the catching layer (6); then fastening of at least one cover (7) onto the carrier substrate (12); and then separation of the mould (1, 2, 6) from the at least one cover (7). The catching layer (6) includes a fluoropolymer. Preferably, the mould (1, 2, 6) is mechanically separated from the at least one cover (7), by pulling the mould (1, 2, 6) away from the at least one cover (7). Thus, the mould (1) can be reused, which considerably simplifies encapsulating operations carried out on an industrial scale.

Abstract: Provided are methods of manufacturing a surface light source device, the methods include forming a first structure that includes a first substrate and a plurality of glass beads each partially embedded in the first substrate. A second structure is formed that includes a second substrate and an adhesive material layer formed on the second substrate. The first structure and the second structure are adhered to each other in such a way that the glass beads are each partially embedded into the adhesive material layer.

Abstract: A flexible display device and a method for manufacturing a flexible display are provided. The flexible display device includes a flexible substrate, a display element layer formed on the flexible substrate; an insulating protective layer covering the display element layer; and a rigid substrate. The rigid substrate has an etching selectivity at least 20 times greater than that of the insulating protective layer.

Abstract: A multilayer printed wiring board manufacturing method including forming conductor posts, which are of substantially uniform thickness and with which the top surfaces are protected by a resist, on a conductor pattern disposed on an upper surface of a build-up layer formed on a core substrate, shaping the conductor posts to have a constriction by adjusting the time of immersion in an etching solution that etches the conductor posts, forming a low elastic modulus layer of substantially the same height as the conductor posts after removing the resist at the top surfaces, and forming mounting electrodes on upper surfaces of the conductor posts.