Abstract: The present invention provides a molding method of molding, using a mold, an uncured composition arranged on a substrate as a film continuously covering a surface of the substrate, including obtaining unevenness information concerning an unevenness of a surface of an uncured first composition arranged as the film on the substrate, arranging a droplet of an uncured second composition on a concave portion of the surface of the first composition based on the unevenness information obtained in the obtaining, and after the arranging the droplet is performed, molding a composition including the film of the first composition and the droplet of the second composition by the mold.

Abstract: A substrate surface planarization method includes an arranging step of arranging a liquid curable composition onto a substrate surface having unevenness, a waiting step of waiting until the surface of the layer of the liquid curable composition becomes smooth, and a light exposure step of applying light to cure the layer of the liquid curable composition in this order. The arranging step includes a first arranging step of arranging a layer made of a first liquid curable composition (A1) containing at least a polymerizable compound (a1), and a second arranging step of arranging droplets of a second liquid curable composition (A2) containing at least a polymerizable compound (a2) onto the layer made of the first liquid curable composition (A1) by dropping the droplets discretely.

Abstract: A microelectromechanical (MEMS) gas sensor operating based on Knudsen thermal force is disclosed. The sensor includes a substrate, at least one stationary assembly that is fixedly coupled to the substrate, and at least one moveable assembly that is positioned above the substrate which is biased to move substantially according to a main axis and juxtaposed with the at least one stationary assembly.

Abstract: A method of making a silicon on insulator structure comprises: providing a bonded structure, the bonded structure comprises the first substrate, the second substrate and the insulating buried layer, the insulating buried layer is positioned between the first substrate and the second substrate; peeling off a layer of removing region of the first substrate from the bonded structure to obtain a first film; at a first temperature, performing a first etching to etch the first film to remove a first thickness of the first film; at a second temperature, performing a second etching to etch the first film to planarize the first film and remove a second thickness of the first film, the first temperature being lower than the second temperature, the first thickness being greater than the second thickness, and a sum of the first thickness and the second thickness being a total etching thickness of the first film.

Abstract: A grinding method includes an oblique grinding step of rotating a grinding wheel about the central axis of a second shaft, tilting the second shaft to a first shaft of a rotatable chuck table such that the bottom of a first portion of the grinding wheel that is positioned above an outer circumferential portion of the chuck table is higher than the bottom of a second portion of the grinding wheel that is positioned above a central portion of the chuck table, and then moving the grinding wheel and the chuck table relatively closer to each other along a direction parallel to the first shaft, thereby forming a disk-shaped recess in the reverse side of the workpiece, and a tilt changing and grinding step of grinding the reverse side of the workpiece while gradually changing a tilt of the second shaft to orient parallel to the first shaft.

Abstract: A cutting die for rotary die-cutting of a label laminates is described herein. The cutting tools of the die include at least one of the following cutting edge parameters: effective height, shape and bevel angle arranged to be different in a first direction when compared to a second direction of the cutting die. The use of the cutting die, a method for designing a cutting die and a method for die-cutting a label laminate are also described.

Abstract: A method includes: forming first and second pixel electrodes on a substrate; exposing upper surfaces of the first and second pixel electrodes; forming a pixel defining layer covering edges of the first and second pixel electrodes; sequentially forming a first lift-off layer, a first shape memory alloy layer, and a first photoresist; forming a first opening exposing an upper surface of the first pixel electrode by patterning the first lift-off layer, the first shape memory alloy layer, and the first photoresist; forming, on the first pixel electrode and the first photoresist, a first organic functional layer including a first emission layer; deforming an end portion of the first shape memory alloy layer, in the first opening, in a direction away from a horizontal surface of the substrate; forming a first protection layer over the first organic functional layer; and removing a remainder of the first lift-off layer.

Abstract: The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) s

Abstract: A microfluidic device includes a flow path through which a reaction solution flows, and an introducing portion for introducing the reaction solution into the flow path, wherein the flow path passes alternately and repeatedly several times through a first temperature region and a second temperature region having different predetermined temperatures, and the flow path includes the repeating unit portions passing through the first temperature region and the second temperature region, the repeating unit portions having decreasing lengths as the repeating unit portions are located farther away from the introducing portion.

Abstract: Methods and apparatus for planarization of a substrate. Material is dispensed onto the substrate that varies depending upon the substrate topography variation. A superstrate is brought into contact with the material, the material takes on a shape of the superstrate. The material is solidified. The superstrate is lifted away from the solidified material. Material has a first shrinkage coefficient. Second material is dispensed onto the solidified material with an average thickness. The average thickness is greater than a second material thickness threshold that is dependent upon step height of the substrate and the first shrinkage coefficient. The second material is then solidified.

Abstract: A wafer polishing apparatus is described herein. The wafer polishing apparatus includes a polish module configured to apply air pressure to a first surface of a wafer while performing a polishing process on a second surface of the wafer. In some implementations, the polish module is further configured to perform a cleaning process and/or a drying process on the second surface of the wafer, such that the same wafer polishing apparatus is configured to perform the polishing process, the cleaning process, and/or the drying process. In some implementations, the polishing module is further configured to air seal edges of the wafer during the polishing process, the cleaning process, and/or the drying process.

Abstract: The disclosed technology generally relates to preparing two-dimensional material layers, and more particularly to releasing a graphene layer from a template substrate. According to an aspect, a method of releasing a graphene layer includes providing a template substrate on which the graphene layer is provided, the method comprising: subjecting the graphene layer and the template substrate to a water treatment by soaking the graphene layer and the template substrate in water such that water is intercalated between the template substrate and the graphene layer; and subjecting the graphene layer and the template substrate to a delamination process, thereby releasing the graphene layer from the template substrate.

Abstract: A method for producing a silicon carbide wafer includes: providing a silicon carbide wafer having an unpolished surface; in which the unpolished surface has a first crystal face and a second crystal face; polishing one face of the first crystal face and the second crystal face of the unpolished surface in a first polishing solution by using a polisher; in which the polisher includes a polishing pad and a plurality of abrasive particles fixed on the polishing pad; and polishing the other face of the first crystal face and the second crystal face of the unpolished surface in a second polishing solution by using the polisher; in which a pH value of the first polishing solution is less than or equal to 7, and a pH value of the second polishing solution is greater than or equal to 7. The present disclosure also provides a silicon carbide wafer.

Abstract: A system operating based on Knudsen thermal force includes a microelectromechanical (MEMS) gas sensor, the MEMS gas sensor includes a substrate. The sensor further includes at least one stationary assembly fixedly coupled to the substrate, the at least one stationary assembly terminating at corresponding pads configured to receive an electrical current for heating the at least one stationary assembly. Additionally, the sensor includes at least one moveable assembly disposed above the substrate and biased to move substantially according to a main axis and juxtaposed with the at least one stationary assembly.

Abstract: A thermal chemical vapor deposition (CVD) system includes a bottom chamber, an upper chamber, a workpiece support, a heater and at least one shielding plate. The upper chamber is present over the bottom chamber. The upper chamber and the bottom chamber define a chamber space therebetween. The workpiece support is configured to support a workpiece in the chamber space. The heater is configured to apply heat to the workpiece. The shielding plate is configured to at least partially shield the bottom chamber from the heat.

Abstract: A semiconductor manufacturing method according to a present embodiment includes forming a supporter on a second surface of a semiconductor substrate opposite to a first surface to be ground of the semiconductor substrate. The semiconductor manufacturing method includes thinning the thickness of the semiconductor substrate by grinding the first surface. In the semiconductor manufacturing method, the supporter contains a resin.

Abstract: A process for fabricating an Integrated Circuit (IC) and the IC formed thereby is disclosed. The process comprises providing a substrate. The process further comprises forming a plurality of longitudinal trenches in the substrate and depositing a layer of a first conductive material on at least one longitudinal trench of the plurality of longitudinal trenches. A first layer of a second conductive material is deposited on the layer of the first conductive material. Thereafter, the process includes depositing a second layer of the second conductive material on the first layer of the second conductive material. The second layer of the second conductive material at least partially fills the at least one longitudinal trench. The first conductive material is selected such that a reduction potential of the first conductive material is less than a reduction potential of the second conductive material.

Abstract: Imprint lithography methods that incorporate depositing droplets of polymerizable material in patterns that improve fill time performance when employing directionally-oriented imprint templates. The patterns are based on grid arrays formed of repeating sets of rows of droplets oriented along fast and slow axes, with droplets of each row offset along the slow axis relative to droplets in adjacent rows.

Abstract: An imprint lithography method is disclosed for forming a patterned layer from an imprintable liquid medium on a substrate by means of an imprint template having a patterned surface. The method involves contacting the patterned surface and imprintable liquid medium together for a filling period. Light emergent (e.g., scattered or reflected) from an interface between the medium and the patterned surface is collected and measured during the filling period to obtain data concerning one or more voids at the interface, and an estimated end time for the filling period is derived from a relationship between the data and time. The method may allow subsequent process steps to be undertaken more rapidly, with reduced risk of defects arising from remnants of unfilled voids. An imprint lithography apparatus and component for putting the method into effect are also disclosed.

Abstract: The present invention discloses a pixilated direct conversion photon counting detector with a direct conversion material layer and a pixilated electrode. Individual electrode pixels are segmented into three segments (510, 520, 530), wherein one of the segments (520) is operated at a more electrically repellant value than that of the other two (510, 530). Said other two segments are connected to electric circuitry (610, 611, 620, 630) that is arranged to generate signals which are indicative of a count of electrons or holes that approach each of the respective electrode pixel segments and to subtract the generated signals from each other.

Abstract: A method for preventing tampering with the accessibility of resources specified by Universal Resource Locators (URLs) comprising receiving a primary URL from a web server; creating a unique identifier and associating, in a database, the unique identifier with the received primary URL; creating a secondary URL that includes the unique identifier; and providing the secondary URL to the web server wherein the primary URL is cross referenced to the secondary URL through the unique identifier.

Abstract: A method for manufacturing a SiC substrate is provided. The method includes: a sacrificial film-forming process of forming a sacrificial film on a surface of a SiC substrate in a film thickness that is equal to or greater than a maximum height difference of the surface; a sacrificial film planarization process of planarizing a surface of the sacrificial film by mechanical processing; and a SiC substrate planarization process of performing dry etching under conditions in which etching selectivity between the SiC substrate and the sacrificial film is in a range of 0.5 to 2.0 so as to remove the sacrificial film and so as to planarize the surface of the SiC substrate.

Abstract: An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.

Abstract: Processes for producing interbody spinal implants having a body with a top surface, a bottom surface, opposing lateral sides, opposing anterior and posterior portions, a substantially hollow center, and a single vertical aperture; and optionally, one or two integration plates affixed to the body. The processes include applying an additive process, a subtractive process, or both processes to at least one surface of the interbody spinal implant to form a roughened surface topography having a regular repeating pattern. The roughened surface topography is specifically designed to provide certain frictional characteristics, load dispersion, and to influence the biological responses that occur during bone healing and fusion.

Abstract: A method of fabricating an aberration monitor on a production mask used in photolithographic patterning of a semiconductor substrate is provided. The method may include placing a production mask within a nanomachine repair tool and generating, using the nanomachine repair tool, a phase shifting pattern within a region of the production mask.

Abstract: A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.

Abstract: A microfluidic cartridge having a microfluidic channel may have at least one surface that has been roughened, etched or otherwise treated to alter its surface characteristics. In some instances, a microfluidic cartridge may have a microfluidic channel that is configured to provide even distribution of a lysing reagent across the channel. The surface may be roughened or etched using a laser, an abrasive, application of a solvent or in any other suitable manner.

Abstract: The present invention relates to a light-emitting button key and a manufacturing method thereof.

Abstract: Damascene processes using physical vapor deposition (PVD) sputter carbon film as a chemical mechanical planarization (CMP) stop layer for forming a magnetic recording head are provided. In one embodiment, one such process includes providing an insulator, removing a portion of the insulator to form a trench within the insulator, depositing a carbon material on first portions of the insulator using a physical vapor deposition process, disposing at least one ferromagnetic material on second portions of the insulator to form a pole including a portion of the ferromagnetic material within the trench, and performing a chemical mechanical planarization on the at least one ferromagnetic material using at least a portion of the carbon material as a stop for the chemical mechanical planarization.

Abstract: It is an object of the present invention to securely and integrally join a metal and a resin, more particularly, a shaped titanium alloy substrate and a resin composition. A titanium alloy substrate is used that has undergone surface roughening by chemical etching or the like so as to have a ultrafine textured face in which bent, ridge-like protrusions having a width and height of from ten to a few hundred nanometers and a length of from a few to a few hundred microns rise up on the surface at a spacing period of from ten to a few hundred nanometers. A titanium alloy piece 1 with its surface treated is inserted into the cavity of a metallic mold for injection molding 10 and a specific resin composition 4 is injected to obtain an integrated composite 7. The main resin component of the resin composition 4 that is used can be a polyphenylene sulfide resin (PPS) or a polybutylene terephthalate resin (PBT).

Abstract: Disclosed herein is a method of forming a structure, comprising forming a mandrel layer over a substrate, masking the mandrel layer with a first mask and performing a first etch on the mandrel layer, the first etch forming a first opening exposing a first portion of the substrate. The mandrel layer is masked with a second mask and a second etch is performed on the mandrel layer. The second etch forms a second opening exposing a second portion of the substrate, and also forms a protective layer on the first portion of the substrate and in the first opening.

Abstract: A method for producing three-dimensional microstructures in which a source material is applied on a substrate, with a property changing by exposure with electromagnetic radiation. A three-dimensional source structure is written via spatially-resolving exposure in the source material, the source material is removed except for the source structure, and the source structure is molded with a target material, from which the microstructure to be produced is made. Here, a shell structure is provided surrounding the microstructure to be produced, with the source structure being created as the shell structure or the shell structure is produced using the source structure, and subsequently the target material is inserted into the shell structure.

Abstract: The present invention provides an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, and a method of using it for etching a multilayer thin film containing a copper layer and a titanium layer, that is, an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, which comprises (A) hydrogen peroxide, (B) nitric acid, (C) a fluoride ion source, (D) an azole, (E) a quaternary ammonium hydroxide and (F) a hydrogen peroxide stabilizer and has a pH of from 1.5 to 2.5, and a etching method of using it.

Abstract: A pattern forming method includes forming a coating film containing a hydrophilic first homopolymer having a first bonding group and a hydrophobic second homopolymer having a second bonding group capable of bonding with the first bonding group, forming a bond between the first and second bonding group to produce a block copolymer of the first and second homopolymers, and heating the coating film to microphase-separating the copolymer into a hydrophilic domain and a hydrophobic domain. The hydrophilic and hydrophobic domains are arranged alternately. The bond is broken, then selectively dissolving-removing either domain by a solvent to provide a polymer pattern of a remainder domain.

Abstract: A method for single side texturing of a crystalline semiconductor substrate (10) comprises: providing a substrate (10), for example a semiconductor substrate, comprising a first surface (12) and a second surface (14) opposite to one another with respect to the substrate (10); providing a masking layer (21) with a random pattern on the first surface (12) of the substrate (10); and etching the substrate (10) in a polishing solution, thereby texturing the first surface (12) of the substrate (10) and polishing the second surface (14) in a single wet etching step.

Abstract: A method of forming an architectural concrete structure having a desired look (i.e., color) and texture, wherein the method generally includes pouring a base concrete layer using conventional concrete. A surface concrete mixture is prepared and includes a mixture of sand and small aggregates to give the surface concrete mixture the desired color and texture for the architectural concrete structure. The base concrete layer provides strength and durability to the concrete structure, while the surface concrete layer provides the desired look and texture of the concrete surface. The surface concrete mixture preferably includes small aggregates to create a smooth and uniform texture.

Abstract: The present invention includes methods and materials for cleaning materials, particles, or chemicals from a substrate with a brush or pad. The method comprising: engaging a surface of a rotating wafer with an outer circumferential surface of a rotating cylindrical foam roller, the cylindrical foam roller having a plurality of circumferentially and outwardly extending spaced apart nodules extending from the outer surface, each nodule defining a height extending from the outer surface of the cylindrical foam roller to a substrate engagement surface of the nodule, the substrate engagement surface of one or more of the nodules having a rounded configuration; and positioning the cylindrical foam roller on the substrate such that the one or more nodules are positioned to have only the rounded substrate engagement surface contact the substrate such that no linear surface of the one or more nodules contacts the substrate.

Abstract: A catheter with a film composite structure. The catheter at least includes a polymer film that is shaped such that a first polymer film layer, which is arranged inwardly relative to the catheter, and a second polymer film layer, which is arranged outwardly relative to the catheter, are produced; one or more electrodes arranged at least partially on an outer surface of the film composite structure; and a conductor structure, which includes conductive tracks for the electrical connection of the electrodes and which is arranged at least in part between the first and second polymer film layers. An associated production method for the catheter is also contemplated herein.

Abstract: An element molded from a particle foam, including for example expanded polypropylene foam, includes at least one visible exterior surface defined by the particle foam. The visible exterior surface is textured having a roughness depth of less than or equal to 1.00 mm and a plurality of vent interfaces each having a maximum width of less than or equal to 0.4 mm. Methods of molding the element, together with a mold and a method of making the mold, are also provided.

Abstract: Process for providing structures for an improved protein adherence on the surface of a body including the steps of a) providing a basic body made of titanium or a titanium alloy, b) acid-etching the basic body, c) storing the acid-etched basic body in an aqueous solution, whereby nanostructures are formed on the surface of the basic body, and d) drying the basic body with the nanostructures formed on its surface.

Abstract: The invention provides a polishing composition comprising (a) silica, (b) one or more compounds that increases the removal rate of silicon, (c) one or more tetraalkylammonium salts, and (d) water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.

Abstract: A micro-needle array having tips disposed along a non-planar surface is formed by shaping the wafer surface into a non-planar surface to define the tips of the micro-needles. A plurality of trenches are cut into the wafer to form a plurality of columns having tops corresponding to the non-planar surface. The columns are rounded and sharpened by etching to form the micro-needles.

Abstract: Methods for removing, reducing or treating the trace metal contaminants and the smaller fine sized cerium oxide particles from cerium oxide particles, cerium oxide slurry or chemical mechanical polishing (CMP) compositions for Shallow Trench Isolation (STI) process are applied. The treated chemical mechanical polishing (CMP) compositions, or the CMP polishing compositions prepared by using the treated cerium oxide particles or the treated cerium oxide slurry are used to polish substrate that contains at lease a surface comprising silicon dioxide film for STI (Shallow trench isolation) processing and applications. The reduced nano-sized particle related defects have been observed due to the reduced trace metal ion contaminants and reduced very smaller fine cerium oxide particles in the Shallow Trench Isolation (STI) CMP polishing.

Abstract: A process of fabricating a heat dissipation substrate is provided. A metal substrate having an upper surface, a lower surface, first recesses located on the upper surface and second recesses located on the lower surface is provided. The metal substrate is divided into carrier units and connecting units connecting the carrier units. A first and a second insulating materials are respectively filled into the first and the recesses. A first conductive layer is formed on the upper surface and the first insulating material. A second conductive layer is formed on the lower surface and the second insulating material. The first and the second conductive layers are patterned to form a first and a second patterned conductive layers. The first and the second insulating materials are taken as an etching mask to etch the connecting units of the metal substrate so as to form a plurality of individual heat dissipation substrates.

Abstract: A cleaning solution of the present invention contains a sodium ion, a potassium ion, an iron ion, an ammonium salt of a sulfuric ester represented by General Formula (1), and water, and each content of the sodium ion, the potassium ion, and the iron ion is 1 ppb to 500 ppb. ROSO3—(X)+ (1) where R is an alkyl group with a carbon number of 8-22 or an alkenyl group with a carbon number of 8-22, and (X)+ is an ammonium ion.

Abstract: A method for making a nanoporous membrane is disclosed. The method provides a composite film comprising an atomically thin material layer and a polymer layer, and then bombarding the composite film with energetic particles to form a plurality of pores through at least the atomically thin material layer. The nanoporous membrane also has a atomically thin material layer with a plurality of apertures therethrough and a polymer film layer adjacent one side of the graphene layer. The polymer film layer has a plurality of enlarged pores therethrough, which are aligned with the plurality of apertures. All of the enlarged pores may be concentrically aligned with all the apertures. In one embodiment the atomically thin material layer is graphene.

Abstract: A method for manufacturing a glass substrate for a magnetic disk comprises a surface grinding step of processing a mirror-surface plate glass, having a main surface in the form of a mirror surface, to a required flatness and surface roughness using fixed abrasive particles. The method comprises, before the surface grinding step using the fixed abrasive particles, a surface roughening step of roughening the surface of the mirror-surface plate glass by frosting.

Abstract: An object of the invention is to effectively remove particles on the glass substrate surfaces, even in the case wherein abrasive particles having a small particle size is used in the polishing step of the glass substrate and a supersonic treatment is performed at a high frequency at the supersonic cleaning step after the polishing step. In a manufacturing method of a glass substrate for a magnetic disk comprising a polishing step for performing polishing of the glass substrate and a supersonic cleaning step for performing supersonic cleaning of the glass substrate after the polishing step, the polishing step uses abrasive particles having a particle size of 10 nm to 30 nm and a first supersonic cleaning is performed at a frequency of 300 kHz to 1,000 kHz to form secondary particles and then a second supersonic cleaning is performed at a frequency of 30 kHz to 100 kHz in the supersonic cleaning step.

Abstract: A method for producing analytical aids for obtaining bodily fluid, in particular lancets or microsamplers, in which the aids are formed as a shaped part (10) from a flat metallic material by material separation on shaped part edges (28), wherein at least one sharp shaped part edge (28) is finished by laser irradiation, a laser beam (36) is guided repeatedly over the shaped part (10) along an irradiation path (38) in irradiation intervals, and the shaped part edge (28) is rounded by the cumulative energy input of the laser beam (36).

Abstract: A method of manufacturing a printhead includes providing a substrate and a filter membrane structure. A first portion of the substrate defines a plurality of nozzles and a second portion of the substrate defines a plurality of liquid chambers. Each liquid chamber of the plurality of liquid chambers is in fluid communication with a respective one of the plurality of nozzles. The filter membrane structure is adhered, for example, laminated, to the second portion of the substrate. Each liquid chamber of the plurality of liquid chambers is in fluid communication with a distinct portion of the filter membrane structure. Pores are formed in the filter membrane structure using a photo-lithography process.