Abstract: A method of manufacturing magnetic heads comprises the step of: fabricating a magnetic head substructure by forming a plurality of components of the magnetic heads on a single substrate, wherein a plurality of rows of pre-head portions that will be the respective magnetic heads later are aligned in the substructure; and fabricating the magnetic heads by separating the pre-head portions from one another through cutting the substructure. In the step of fabricating the substructure, a plurality of indicators are formed, each of the indicators serving as a reference for indicating the location of a region ABS in which the medium facing surfaces of the magnetic heads are to be formed.

Abstract: A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combination thereof. In one embodiment, the periodic acid is present in an amount in a range of from about 0.05 to about 0.3 moles/kilogram, and the abrasive is present in an amount in a range of from about 0.2 to about 6 weight percent. In another embodiment, the composition further comprises a pH-adjusting agent present in an amount sufficient to cause the pH of the composition to be in a range of from about pH 5 to about pH 10, or of from about pH 1 to about pH 4.

Abstract: A manufacturing method of a structure by an imprint process includes a first imprint step of forming a first resin material layer by applying a first resin material onto a substrate and then transferring an imprint pattern of a mold onto the first resin material layer, a second imprint step of forming a second resin material layer by applying a second resin material onto the first resin material layer formed in the first imprint step and onto an area of the substrate adjacent to the first resin material layer and then transferring the imprint pattern of the mold onto the second resin material layer, and a step of forming a pattern by etching the first and second resin material layers.

Abstract: A method for etching an insulating film includes the steps of forming an insulating film; forming a first resin layer composed of a non-silicon-containing resin on the insulating film; forming a pattern including projections and recesses in the first resin layer; forming a second resin layer composed of a silicon-containing resin to cover the projections and the recesses of the pattern in the first resin layer; etching the second resin layer by reactive ion etching with etching gas containing CF4 gas and oxygen gas until the projections of the first resin layer are exposed, a Si component of the second resin layer being oxidized in etching the second resin layer; selectively etching the first resin layer until the insulating film is exposed using as a mask the second resin layer buried in the recesses of the first resin layer to form a resin layer mask; and etching the insulating film using the resin layer mask.

Abstract: An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group consisting of the substrate and the electronic device; a supporting part, sandwiched between and interconnecting the first and the second surfaces while enabling the areas of the two ends of the supporting part to be small than those of the first and the second surfaces in respective; and a buffer, arranged surrounding the supporting part for absorbing and buffering stresses.

Abstract: Disclosed herein is a new improved large planetary gear system used on the input stage of wind turbine power generators. This improved planetary gear system reduces or eliminates lubricant debris traditionally generated from the gear teeth, thereby eliminating an initiating source for bearing failure. To achieve these results, some and preferably all of the gear teeth within the planetary gear system are superfinished using chemically accelerated vibratory finishing to a surface roughness of approximately 0.25 micron or less. Several objects and advantages of the invention are to provide a gearbox with reduced metal debris, improved bearing life, reduced wear, reduced vibro-frictional noise, improved contact fatigue, improved fretting resistance, improved lubrication, to simplify the run-in process, and to enhance the durability and efficiency of the gearbox.

Abstract: An inner peripheral edge of a toroidal glass substrate for a magnetic disk is subjected to mechanical polishing in such a manner that the surface roughness is no greater than 9 nm in terms of Rmax. Then, the inner peripheral edge is subjected to chemical polishing to remove at least 2 ?m of a surface layer. The inner peripheral edge has a non-conventional mirror-finished surface obtained by mechanical polishing. Thus, sufficient ring strength is obtained even when the chemical polishing depth is smaller than in the past. A polishing depth of less than 5 ?m is sufficient.

Abstract: An introducer assembly includes a sheath having a sheath proximal end and distal end, and a passage therethrough. The introducer assembly further includes a handle assembly that is mechanically and/or bonded coupled with a tubular sheath.

Abstract: A method for controlling ADI-AEI CD difference ratios of openings having different sizes is provided. First, a first etching step using a patterned photoresist layer as a mask is performed to form a patterned Si-containing material layer and a polymer layer on sidewalls thereof. Next, a second etching step is performed with the patterned photoresist layer, the patterned Si-containing material layer and the polymer layer as masks to at least remove an exposed portion of a etching resistive layer to form a patterned etching resistive layer. A portion of a target material layer is removed by using the patterned etching resistive layer as an etching mask to form a first and a second openings in the target material layer. The method is characterized by controlling etching parameters of the first and second etching steps to obtain predetermined ADI-AEI CD difference ratios.

Abstract: A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

Abstract: The present disclosure provides a compound according to the formula: Rf1[CH(—O—CH(3-m)Rf2m)(—O—CF2—CFH—Rf3)]n ??[I] wherein n is 1 or 2, wherein m is 1, 2 or 3, wherein, when n is 1, Rf1 is selected from the group consisting of highly fluorinated alkyl groups which are linear, branched, cyclic, or a combination thereof, which may optionally be substituted, and which may optionally contain one or more catenated heteroatoms; wherein, when n is 2, Rf1 is selected from the group consisting of highly fluorinated alkylene groups which are linear, branched, cyclic, or a combination thereof, which may optionally be substituted, and which may optionally contain one or more catenated heteroatoms; wherein each Rf2 is independently selected from the group consisting of alkyl groups which are linear, branched, cyclic, or a combination thereof, which may optionally be substituted, and which may optionally contain one or more catenated heteroatoms; wherein at least one Rf2 is highly fluorinated; wherein each Rf3 is indepe

Abstract: Super-hydrophobic and self-cleaning articles produced by imprinting exposed surfaces with suitable fine-grained and/or amorphous metallic embossing dies to transfer a dual surface structure, including ultra-fine features less than or equal to 100 nm embedded in and overlaying a surface topography with macro-surface structures greater than or equal to 1 micron are disclosed.

Abstract: A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.

Abstract: A process for selectively stripping a coating from a component of a turbomachine, and particularly a coating having a ceramic matrix that contains metallic particles dispersed therein that render the coating more difficult to remove from the component after the component has been subjected to elevated temperatures during operation of the turbomachine. The process generally includes immersing the component in an aqueous solution containing ferric chloride, nitric acid, and phosphoric acid, for a duration sufficient to attack the metallic particles in the coating. The component is then removed from the aqueous solution and its surface rinsed of the aqueous solution. The immersing and removing steps are then sequentially repeated a sufficient number of times to sufficiently attack the metallic particles to enable the coating to be mechanically removed from the component.

Abstract: Embodiments of the present invention may provide a microchip applicable to an electrophoresis employing UV detection and a method of manufacturing the same. The microchip of the present invention has a glass channel plate, which is formed on an upper surface thereof with a loading channel and a separation channel and is provided on the upper surface thereof with an optical slit layer made of silicon except the channel region, and a glass reservoir plate, which is formed with sample solution reservoirs and buffer solution reservoirs. The loading channel and the separation channel are formed on the channel plate by deep reactive ion etching. The sample solution reservoirs and the buffer solution reservoirs are formed in the reservoir plate by sand blasting. The channel plate and the reservoir plate are combined by anodic bonding the optical slit layer and the reservoir plate. Electrodes for sample and electrodes for buffer are deposited by sputtering Pt with a shadow mask after anodic bonding.

Abstract: The invention defines a surface of a titanium-based metal implant to be inserted into bone tissue, characterised in that it comprises substantially pure titanium oxide and has a thickness of 8-50 nm. Also, the invention defines a procedure for obtaining the surface, as well as the metal implant that exhibits it. This surface exhibits good micrometric roughness and a composition that is practically free from impurities and a thickness that is approximately three times the thickness of conventional surfaces; these characteristics provide it with very good osseointegration properties.

Abstract: A sub-master template is patterned to provide at least double the density of features of a master template. The sub-master template and master template may employ the use of alignment marks during the patterning process.

Abstract: This invention relates to the manufacture of iodixanol(1,3-bis(acetamido)-N,N?-bis[3,5-bis(2,3-dihydroxypropylaminocarbonyl)-2,4,6-triiodophenyl]-2-hydroxypropane), more specifically to the purification of iodixanol by crystallization by using wet milling.

Abstract: The present invention relates to a method of making a robust wafer level chip scale package and, in particular, a method that prevents cracking of the passivation layer during solder flow and subsequent multiple thermal reflow steps. In one embodiment, a passivation layer that is formed using an insulating material applied in a highly compressive manner is used. In another aspect, another layer is applied over the passivation layer to assist with preventing cracking of the passivation layer.

Abstract: The present invention relates to shear sensors. In particular, the present invention relates to deformable sensors for measurement of shear forces during chemical mechanical polishing.

Abstract: A silica glass crucible used for pulling up silicon single crystal at a high temperature. The silica glass crucible may have at least an outer surface of a wall part of the crucible covered with fine grooves having a length of less than 200 ?m, a width of less than 30 ?m and a depth of from more than 3 ?m to less than 30 ?m. The fine groves may be formed by carrying out a sand-blast treatment and a hydrofluoric acid etching and may exist on more than 10% of the outer surface of the crucible, and a sliding frictional coefficient of the outer surface of the crucible to a carbon at 1500° C. is more than 0.6.

Abstract: PBI compositions include solutions comprising PBI and acrylate monomer and coatings comprising PBI and polyacrylate. The solutions may also include polymerization initiator, solvent, co-polymers. The coatings are thermally resistant, electrically insulating (dielectric), and adhesive. The PBI compositions are used in the manufacture of microelectronics and related products. Methods for applying the PBI compositions are also discussed.

Abstract: To provide a manufacturing method of a superconducting radio-frequency acceleration cavity used in a charged particle accelerator enabling the manufacturing with few waste amounts of the niobium material at low cost in a short time, the manufacturing method has each of the steps of (a) obtaining an ingot made from a disk-shaped niobium material, (b) slicing and cutting the niobium ingot into a plurality of niobium plates each with a predetermined thickness, by vibrating multiple wires back and forth while spraying fine floating abrasive grains with the niobium ingot supported, (c) removing the floating abrasive grains adhered to the sliced niobium plates, and (d) performing deep draw forming on the niobium plates and thereby obtaining a niobium cell of a desired shape.

Abstract: Methods for wafer-scale fabrication of needle arrays can include mechanically modifying a wafer to produce a plurality of vertically-extending columns. The columns are etched to round and reshape the columns into substantially uniformly shaped needles. Needle arrays having needle width non-uniformity of less than about 3% and length non-uniformity of less than about 2% can be produced.

Abstract: A method for manufacturing a shell body includes the steps of: a) processing a glass substrate to form a glass panel having a top surface, a bottom surface, and a peripheral face extending between the top and bottom surfaces, the peripheral face being formed with a coupling portion, the coupling portion being one of a protrusion protruding from the peripheral face and a recess indented from the peripheral face; and b) molding a plastic member onto the glass panel, the plastic member being coupled fittingly to the coupling portion of the glass panel. A shell body with a plastic member molded onto a glass panel is also disclosed.

Abstract: Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and two or more sacrificial secondary metals that provide structural support for the primary metal component during machining. A first secondary metal is thinly plated around the primary metal and over the entire surface of the substrate without using photolithography. A second secondary metal, is then thickly plated over the deposited first secondary metal without using photolithography. Additionally, techniques are disclosed to increase the deposition rate of the first secondary metal between primary metal features in order to prevent voiding and thus enhance structural support of the primary metal during machining.

Abstract: Method for producing a stationary wave field of arbitrary shape comprising the steps of defining at least one volume being limited in the direction of the axis of propagation of a beam, of the type 0?z?L; defining an intensity pattern within the said region 0?z?L by a function F(z), describing the said localized and stationary intensity pattern, which is approximated by means of a Fourier expansion or by a similar expansion in terms of (trigonometric) orthogonal functions; providing a generic superposition of Bessel or other beams highly transversally confined; calculating the maximum number of superimposed Bessel beams the amplitudes, the phase velocities and the relative phases of each Bessel beam of the superposition, and the transverse and longitudinal wavenumbers of each Bessel beam of the superposition.

Abstract: Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component during machining More specifically, techniques are disclosed to increase the rate of secondary metal deposition between primary metal features in order to prevent voiding in the sacrificial secondary metal and thus enhance structural support of the primary metal during machining.

Abstract: A microfluidic flow cell having a body with a fluid transport channel disposed therein, the fluid transport channel having a proximal end and a distal end defining a fluid flow path, a fluid inlet port disposed at the proximal end of the fluid transport channel at a central portion of the body and an outlet port disposed at the distal end of the fluid transport channel at an outer portion of the body, and a plurality sample wells disposed in the fluid transport channel substantially perpendicular to the fluid flow path in the fluid transport channel. The microfluidic flow cell may have hundreds or thousands of individual, sub-microliter sample wells. The microfluidic flow cell can be filled by applying a flowable liquid to the inlet port and spinning the flow cell to cause fluid to flow into fluid transport channel. The microfluidic flow cells described herein can be used in a variety of applications where small sample size and/or a large number of replicates are desirable.

Abstract: An aircraft forward pressure bulkhead and an aircraft crown panel are described herein. The forward pressure bulkhead includes a malleable and deformable dome that is configured to “catch” foreign objects, such as birds. The dome is intentionally designed to deform in response to a foreign object strike that imparts at least a threshold amount of impact energy to the bulkhead. The dome is free of rigid stiffeners and non-deformable reinforcement members that would otherwise hinder the flexible characteristic of the dome. Practical embodiments of the bulkhead utilize fewer parts, are less heavy, and are less expensive than traditional bulkheads that utilize rigid stiffeners. The crown panel has similar compliant characteristics. The crown panel is designed to simultaneously deform and deflect in response to foreign object impacts such as birds and hail. The crown panel is formed from a monolithic one-piece material, such as aluminum, and various reinforcing features are integrally formed in the material.

Abstract: A polymeric composition and method of preparation for application in sub-micron lithography, comprising a blend of A-B and B?-C block, random, branched, or graft copolymers, where: (i) the B and B? blocks or grafts have attractive supramolecular interactions characterized by a negative Flory-Huggins parameter; (ii) the composition exhibits a microphase-separated, three-domain morphology with A, C, and B/B? domains comprised largely of A blocks or grafts, C blocks or grafts, and a mixture of B and B? blocks or grafts, respectively. Long-range ordering of nanometer-scale domain features has been achieved in thin films of such supramolecular polymer blends, while avoiding macrophase separation. The strategy offers a diversity of morphologies for sub-micron lithographic applications in tandem with ease of chemical synthesis.

Abstract: An internal filter includes a lower substrate and an upper substrate. Fluid passages are formed by etching grooves into the surface(s) of the upper and/or lower substrates, and/or in one or more intermediate layers. The filter pores extending between the fluid passages are formed by etching second grooves that fluidly connect the fluid passages. Two or more sets of the one or two intermediate layers can be implemented to provide additional filter passages and/or pores. Each set can be connected to a separate fluid source and/or a separate microfluidic device. In another internal filter, the inlet and outlet passages and the filter pores are formed on the same upper or lower substrate. The inlet and outlet passages are partially formed in a first step. In a second step, the inlet and outlet passages are completed at the same time that the filter pores are formed.

Abstract: An object of this invention is to provide a manufacturing method that, by using a general-purpose semiconductor fabrication process, can easily manufacture an ink jet print head in which energy generating elements are complicatedly installed in the ink path. To this end, the present invention comprising steps of providing a substrate having a removal projected portion, forming an energy generating element along the projected portion, forming a supporting member on the energy generating element, and forming a ink chamber by removing the projected portion from the substrate.

Abstract: Provided are a method of manufacturing graphene, graphene manufactured by the method, a conductive thin film including the graphene, a transparent electrode comprising the graphene, and a radiating or heating device comprising the graphene. The method includes: preparing a graphene member including a base member, a hydrophilic oxide layer formed on the base member, a hydrophobic metal catalyst layer formed on the oxide layer, and graphene grown on the metal catalyst layer; applying water to the graphene member; separating the metal catalyst layer from the oxide layer; and removing the metal catalyst layer using an etching process.

Abstract: A method of producing a particle includes fabricating a precursor particle structure that has a first sub-structure, a second sub-structure proximate the first sub-structure and an interconnecting sub-structure connected to the first and second sub-structures, the precursor particle structure being in a first configuration; and exposing the precursor particle structure to a stochastic excitation process to cause a deformation of the interconnecting sub-structure to reconfigure at least one of a position and an orientation of the first sub-structure relative to the second sub-structure from the first configuration to form the particle in a second configuration. The first sub-structure and the second sub-structure are substantially free of deformation during the exposing, and a maximal spatial dimension of the particle in the second configuration is less than about one millimeter.

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract: In an embodiment, there is provided an imprint lithography method that includes providing a first amount of imprintable medium on a first area of a substrate, the first amount of imprintable medium, when fixed, having a first etch rate; and providing a second amount of imprintable medium on a second, different area of the substrate, the second amount of imprintable medium, when fixed, having a second, different etch rate.

Abstract: An elevator load bearing member assembly includes at least one traction enhancing surface (46) on a jacket (44). In one example, a mechanical removal process is used to strip away at least some of an amide-rich layer from the surface (46) after the jacket has been extruded onto tension members (42). In another example, a chemical removal process is used. Another disclosed example includes disrupting the surface.

Abstract: A metal composite for fuel cells according to the present invention, which includes: a core of a metal; cladded layers of a corrosion resistant metal covering both surfaces of the core; and a through-hole formed through the core and cladded layers. The through-hole has, on a hole wall of the core region of the through-hole, a concave portion which is recessed relative to hole walls of the cladded layer regions of the through-hole.

Abstract: The present disclosure generally relates to a method for producing lens patterns on a roll which is used to produce optical films wherein the method comprises forming a resin film on a roll comprising a plated layer which has been surface-plated with copper (Cu) or nickel (Ni); producing a preliminary lens pattern by striking the surface of the resin film on the roll with a chisel; etching with an etching solution the roll having the preliminary lens pattern formed thereon; and removing the resin film, and a roll for producing optical films comprising lens patterns formed thereon by the same method.

Abstract: A method for removing an undesirable material from an electronic or electrical component and introducing a desirable material in place of the undesirable material. The method can include the replacement of a leaded material found on the component with a no-lead material to meet governmental directives including those of the European Union.

Abstract: A method realizes a multispacer structure including an array of spacers having same height. The method includes realizing, on a substrate, a sacrificial layer of a first material; b) realizing, on the sacrificial layer, a sequence of mask spacers obtained by SnPT, which are alternately obtained in at least two different materials; c) chemically etching one of the two different materials with selective removal of the mask spacers of this etched material and partial exposure of the sacrificial layer; d) chemically and/or anisotropically etching the first material with selective removal of the exposed portions of the sacrificial layer; e) chemically etching the other one of the two different materials with selective removal of the mask spacers of this etched material and obtainment of the multispacer structure.

Abstract: An epicyclic gear assembly includes a ring gear, a sun gear, at least one star gear enmeshed between the ring gear and sun gear, a carrier and a journal bearing. The carrier is disposed adjacent the rotatable sun gear and star gear. The journal bearing is disposed in the at least one star gear and connected to the carrier. The journal bearing has an outer radial surface with an amorphous surface finish of less than about 5 micro inches (127 micro mm) measured on an Ra scale and the outer surface of the journal bearing interfaces with an inner surface of the star gear.

Abstract: A processing method for a wafer includes: preparing a wafer which has a device region having plural devices formed on a surface of the wafer; and a peripheral reinforcing portion which is integrally formed around the device region and has a projection projecting outwardly on a rear surface of the wafer. The processing method further includes: removing at least the projection of the peripheral reinforcing portion of the wafer; and transferring the wafer after the removing. In the removing, while the wafer is held on a holding table such that the rear surface of the wafer is exposed and the surface of the wafer closely contacts the holding table, at least the projection of the peripheral reinforcing portion is removed. After the removing of at least the projection, while the wafer is held on the holding table, a holding tape is applied to the rear surface of the wafer and the holding tape is supported by a frame.

Abstract: Medical balloons and balloon preforms are made by methods which include the step of selectively removing material from the proximal and/or distal ends of a segment. In the case of a thermoplastic material characterized by one or more glass transition temperatures, the segment may optionally be maintained at a temperature below the glass transition temperature of the segment during the material removal step.

Abstract: An object of the present invention is to obtain a composite in which a copper or copper alloy is securely integrated with and joined to PBT or PPS. A copper product that has been suitably roughened by chemical etching and also blackened can be used favorably. A surface-treated copper piece 1 is inserted into a cavity formed by a movable molding plate 2 and a stationary molding plate 3 of an injection molding mold 10, and a specific resin is injected to obtain an integrated product. PBT or PPS can be used as the resin component of a resin composition 4 that is used here. High injection joining strength is obtained if the resin composition contains, as an auxiliary component, PET and/or a polyolefin resin in the case of PBT, and a polyolefin resin in the case of PPS.

Abstract: In a method of reusing a consumable part for use in a plasma processing apparatus, a silicon carbide (SiC) lump is formed by depositing SiC by chemical vapor deposition (CVD), and a consumable part for the plasma processing apparatus is manufactured by processing the SiC lump, the consumable part having a predetermined shape. A first plasma process is performed on a substrate by using the manufactured consumable part. A surface of the consumable part that has been eroded by the plasma process is subjected to a clean process for a specific period of time. SiC is deposited on the cleaned surface of the eroded consumable part by CVD. A consumable part having the predetermined shape is remanufactured by processing the eroded consumable part having the surface on which the SiC is deposited. A second plasma process is performed on a substrate by using the remanufactured consumable part.

Abstract: A non-slick surface-seeded exposed aggregate concrete product and method of making the same enhances the coefficient of friction of an exposed surface thereof to reduce undesirable slipping and sliding. Implementations of the present invention are characterized by the use of fine sand and aggregate broadcast over the exposed surface, which surface has been prepared to receive the same. After curing, the exposed surface is then ground and acid-etched to define fissures, cracks, and/or sharp edges of the aggregate. Subsequently finishing steps are performed to produce the non-slick concrete product which may be used for high traffic pedestrian areas where foot gripping and traction are important, such as on stairs, ramps, walkways, courtyards, and the like.

Abstract: Textured surface having micro recesses such that the outer surface overhangs the micro recesses. Embodiments of the textured surface include sharp edges for promoting bone deposition and growth within the micro recesses, protrusions of varying depth from the surface that include overhangs, and micro recesses that are at least partially defined by complex ellipsoids.

Abstract: A microphone manufacturing method that includes forming an etching protective film on a surface of a semiconductor substrate, opening an etching window through the etching protective film, and forming a sacrifice layer in the etching window and also on an upper face of the etching protective film. The method includes forming a vibration film above said sacrifice layer and starting an etching process of said sacrifice layer through a preformed port at a location wherein said sacrifice layer is sandwiched by said vibration film and the etching protective film and located apart from the etching window. The etching process uses an etchant to which the etching protective film is resistant, to open the etching window. The method includes crystal anisotropically etching said semiconductor substrate through the port and the etching window by using an etchant to which the etching protective film is resistant so that a cavity is formed.