Abstract: The sun imparts 174 petawatt per second on the earth, and a large portion of this energy is absorbed by the earth's atmosphere in the form of translational energy for the gaseous molecules, i.e. continuous random motion in the average speed range of 500 meters per second on earth's surface. This invention utilizes a partition with large number of through-holes which all have the characteristic of providing greater cross section for gas molecules to transit from one side to the other than the reverse, thus creating a higher statistical probability for the molecules to move from one side of the partition to the other side.

Abstract: The present invention is directed to a method for the production of highly demanded pieces at low cost. The method is especially well suited for deep drawing dies, but also any other type of tooling. It is also very well suited for machine components of big dimensions and with high mechanical solicitations, like rotors and cages in wind mills and other big machines. The pieces or tools are cast with a low cost ceramic, like a high resistance concrete (with special mention to HPC or UHPC) or a low water admixture castable or any other low cost high mechanical resistance material (low cost ceramics or high resistance polymers are especially suited). Once cast, the working surface of the die or piece is coated with a metal, an intermetallic or a high performance ceramic. Projection or deposition techniques are used to obtain the high value working surface.

Abstract: A method of manufacturing thin closure magnetic read/write heads, such as magnetic tape heads is provided. The method provides improved flexural strength of the closure so that the closure breakage during fabrication of the heads is mitigated and closure thickness is reduced. An array of chips is fabricated on a wafer. The array is closed, with a closure strip bonded to each row of the array. Closures span only the length of a row, so that the closures are not subjected to flexure during processing and breakage due to flexure is mitigated. Side bars are bonded to the array to form a column with dimensions similar to prior art columns. This allows columns manufactured by the invention to undergo additional processing using existing processes.

Abstract: Methods for manufacturing a microstructure, wherein use is made of a powder blasting and/or etching and a single mask layer with openings and structures of varying dimensions, wherein the mask layer at least at one given point in time has been wholly worn away within at least one region by mask erosion while the microstructure is not yet wholly realized. Use can be made of a combination of ‘vertical’ erosion, i.e. parallel to the thickness direction and ‘horizontal’ erosion, i.e. perpendicularly of the thickness direction, of the mask layer. The horizontal mask erosion occurs at the edges of the mask structure.

Abstract: Certain MEMS devices include layers patterned to have tapered edges. One method for forming layers having tapered edges includes the use of an etch leading layer. Another method for forming layers having tapered edges includes the deposition of a layer in which the upper portion is etchable at a faster rate than the lower portion. Another method for forming layers having tapered edges includes the use of multiple iterative etches. Another method for forming layers having tapered edges includes the use of a liftoff mask layer having an aperture including a negative angle, such that a layer can be deposited over the liftoff mask layer and the mask layer removed, leaving a structure having tapered edges.

Abstract: The invention relates to a method (1) of manufacturing a silicon-metal composite micromechanical component (51) combining DRIE and LIGA processes. The invention also relates to a micromechanical component (51) including a layer wherein one part (53) is made of silicon and another part (41) of metal so as to form a composite micromechanical component (51). The invention concerns the field of timepiece movements.

Abstract: When a recess of a bulb-type recess gate is formed, the recess formed in a device isolation region is formed to be separated from an edge of an active region. This structure thereby prevents damage of a semiconductor substrate of the edge of the active region and a defect during a Self Alignment Contact (SAC) process. As a result, characteristics and yield of devices improve.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses and light illumination to a coated surface. Reflected light resulting from the light illumination impinging the coated surface is directed to a photosensitive detector and analyzer. The reflected light is either sensed directly from the coated surface by the photosensitive detector or the reflected light is directed along at least a portion of the common optics path to the photosensitive detector. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the coating removal apparatus is configured as a head component coupled to a body component.

Abstract: A method for forming a hollow microneedle structure includes processing the front side of a wafer to form at least one microneedle projecting from a substrate and a through-bore passing through the microneedle and through a thickness of the substrate. An entire length of the through-bore is formed by a dry etching process performed from the front side of the wafer. Most preferably, upright surfaces of the microneedle structure and the through bore of the structure are formed by dry etching performed via a single mask with differing depths obtained by harnessing aspect ratio limitations of the dry etching process.

Abstract: The invention concerns a device forming an imprint mould in three dimensions and comprising at least: a substrate, comprising at least one alternation of layers having at least one part perpendicular to the plane of the substrate, in a first type of material and a second type of material which can be etched selectively relative to each other, a surface topology comprising at least: a) first patterns whose top lies at a first level relative to a surface of the substrate located either side of said topology, these first patterns being in a first type of material, b) and second patterns having at least a second level relative to said surface of the substrate, different from and lower than the first level, and these second patterns being in a second type of material.

Abstract: An atmospheric pressure plasma source includes a body including a distal end, a blade extending from the distal end and terminating at a blade edge, a plasma-generating unit, and a plasma outlet communicating with the plasma-generating unit and positioned at the distal end. The plasma outlet is oriented at a downward angle generally toward the blade edge, wherein the plasma outlet provides a plasma path directed generally toward the blade edge. The plasma may be applied to the coating at an interface between the coating and an underlying substrate. While applying the plasma, the blade is moved into contact with the coating at the interface, wherein the blade assists in separating the coating from the substrate while one or more components of the coating react with energetic species of the plasma.

Abstract: A method of repairing a photomask with a depression defect includes providing a photomask including a depression defect on a transparent substrate, forming a protection layer which covers the depression defect, etching a predetermined depth of the transparent substrate of the photomask with the protection layer as the etch mask, and removing the protection layer and the transparent substrate under the unetched protection layer, wherein a defect free photomask is produced.

Abstract: A combined wide-image and loop-cutter pattern is provided for both cutting and forming a wide-image section to a hard mask on a substrate formed by sidewall imaging techniques in a reduced number of photolithographic steps. A single mask is formed which provides a wide mask section while additionally providing a mask to protect the critical edges of an underlying hard mask during hard mask etching. After the hard mask is cut into sections, the protective portions of the follow-on mask are removed to expose the critical edges of the underlying hard mask while maintaining shapes necessary for defining wide-image sections. Thus, the hard mask cutting, hard mask critical edge protecting, and large area mask may be formed in a reduced number of steps.

Abstract: A chuck that includes a supporting element that is connected to a closing element. An upper surface of the supporting element includes a chemically etched zone and an un-etched zone. The chemically etched zone includes multiple upper areas that are surrounded by trenches. At least one pressurized gas conduit is formed in the supporting element so as to enable pressurized gas provided to a lower surface of the supporting element to propagate through the trenches. The un-etched zone is shaped in response to a shape of an object to be placed on the supporting element. The un-etched zone reduces pressurized gas leakage from the un-etched zone and the closing element reduces pressurized gas leakage from a lower surface of the supporting element when the object is placed on the chuck in alignment with the un-etched zone and pressurized gas is provided to the chuck.

Abstract: A method for manufacturing a micro/nano three-dimensional structure including the following steps is described. A mold is provided, and a pattern structure including a plurality of convex portions and concave portions is set in the mold. A transfer material layer including a first portion on the convex portions and a second portion on the concave portions is formed. A flexible substrate is disposed on the mold and contacts with the first portion of the transfer material layer. A heating step is performed to partially heat the flexible substrate through the first portion. A pressure is applied on the flexible substrate to adhere or press the first portion to the flexible substrate. The mold is removed. An etching step is performed on the flexible substrate by using the first portion of the transfer material layer as a mask to form a micro/nano three-dimensional structure in the flexible substrate.

Abstract: The present invention is directed to a method of forming an imprinting layer on a substrate including high resolution features, and transferring the features into a solidified region of the substrate. Desired thickness of the residual layer may be minimized in addition to visco-elastic behavior of the material.

Abstract: A strip-form silicon carbide furnace heating element is provided having a higher radiating surface area to volume ratio than a conventional tubular element.

Abstract: A method of forming features on substrates by imprinting is provided. The method comprises: (a) forming a polymer solution comprising at least one polymer dissolved in at least one polymerizable monomer; and (b) depositing the polymer solution on a substrate to form a liquid film thereon; and then either: (c) curing the liquid film by causing the monomer(s) to polymerize and optionally cross-linking the polymer(s) to thereby form a polymer film, the polymer film having a glass transition temperature (Tg); and imprinting the polymer film with a mold having a desired pattern to form a corresponding negative pattern in the polymer film, or (d) imprinting the liquid film with the mold and curing it to form the polymer film. The temperature of imprinting is as little as 10° C. above the Tg, or even less if the film is in the liquid state. The pressure of the imprinting can be within the range of 100 to 500 psi.

Abstract: Hydrogen energy systems for obtaining hydrogen gas from a solid storage medium using controlled laser beams. Also disclosed are systems for charging/recharging magnesium with hydrogen to obtain magnesium hydride. Other relatively safe systems assisting storage, transport and use (as in vehicles) of such solid storage mediums are disclosed.

Abstract: A method that includes forming a chamber in a substrate, forming a silicon layer overlying the chamber, etching the silicon layer to remove selected regions and retain a selected portion overlying the chamber, the selected portion being at a location and having dimensions that correspond to a location and to dimensions of a nozzle, and forming a first metal layer adjacent to the selected portion. The method also includes forming a path in the substrate to expose the chamber concurrently with removing the selected portion of the silicon layer to expose the nozzle, the nozzle being in fluid communication with the path, the chamber, and a surrounding environment.

Abstract: A liquid drop discharge head includes a chip 21 that is formed by separation of a silicon wafer 20. The silicon wafer 20 has a first direction and a second direction which are mutually intersected. The chip 21 is separated from the silicon wafer 20 by etching the wafer along a separation line 22 parallel to the first direction of the wafer and by dicing the wafer 20 along a separation line 23 parallel to the second direction of the wafer.

Abstract: There are provided a method of processing an amorphous material which is capable of forming surface projections of uniform height in desired positions on the amorphous material, and a magnetic disk substrate using the amorphous material. A predetermined pressure is applied to selected parts of a surface of an amorphous material using fine particles having a hardness higher than that of the amorphous material to form high-density compressed layers, and a surface layer of the amorphous material is removed using a treatment agent that has a different removal capacity in the compressed layers and a remaining uncompressed layer, thus making the compressed layers project out. For example, the treatment agent may be an etching solution having a different etching rate in the compressed layers and the uncompressed layer.

Abstract: Apparatus for double-sided imprint lithography of an apertured substrate comprises a pair of correspondingly apertured molds, a support for an assembly of the substrate and molds, and an alignment mechanism with radially movable elements for aligning the apertures of the molds and the substrate. The movable elements can be at least partially disposed in a spindle and can be removed radially outward by a conically tapered drive rod. Opposing surfaces of the substrate can then be imprinted in registration at the same time, preferably by fluid pressure imprint lithography.

Abstract: An article has a curved surface. Disposed upon the curved surface is a plurality of patterns. Each pattern is defined by a plurality of spaced apart features attached to or projected into the curved surface. The plurality of features each have at least one neighboring feature having a substantially different geometry, wherein an average spacing between adjacent features is about 1 nanometer and about 1 millimeter in at least a portion of the curved surface. The plurality of spaced apart features are represented by a periodic function.

Abstract: A method of making a fluorinated ether includes combining, in a polar aprotic solvent: a fluorinated alcohol represented by the formula X—Rf1CH2OH, and a fluorinated sulfonate ester represented by the formula Rf2CH2OS(?O)2Rf3, and base; and obtaining a fluorinated ether represented by the formula Y—Rf1CH2OCH2Rf2—Y. Rf1 is selected from perfluorinated C1-C10 alkylene groups having from 1 to 10 carbon atoms and partially fluorinated C1-C10 alkylene groups, and derivatives thereof having catenated heteroatom(s). X represents H, F, or an HOCH2— group. Rf2 is selected from perfluorinated C1-C10 alkyl groups and partially fluorinated C1-C10 alkyl groups, and derivatives thereof having catenated heteroatom(s). Rf3 is a C1-C4 alkyl group. Y represents H, F, or an Rf2CH2OCH2— group. A variant method, useful for preparing symmetric fluorinated ethers, is also disclosed. The present disclosure also provides fluorinated ethers preparable according to the methods.

Abstract: An imprint lithography template includes a porous material defining a multiplicity of pores with an average pore size of at least about 0.4 nm. The porous material includes silicon and oxygen, and a ratio of Young's modulus (E) to relative density of the porous material with respect to fused silica (pporous/pfused silica) is at least about 10:1. A refractive index of the porous material is between about 1.4 and 1.5. The porous material may form an intermediate layer or a cap layer of an imprint lithography template. The template may include a pore seal layer between a porous layer and a cap layer, or a pore seal layer on top of a cap layer.

Abstract: A drop dispense apparatus may be manufactured utilizing an imprint lithography process. Exemplary methods for manufacturing a drop dispense apparatus are described.

Abstract: To provide a silica glass crucible, wherein there are no problems of generating a sinking and buckling when said crucible is used for pulling up silicon single crystal at a high temperature. The silica glass crucible used for pulling up the silicon single crystal, wherein at least an outer surface of a wall part of the crucible is covered with fine grooves having a length of less than 200 ?m, a width of less than 30 ?m and a depth of from more than 3 ?m to less than 30 ?m. Preferably, said fine groves are formed by carrying out a sand-blast treatment and a hydrofluoric acid etching and exist on more than 10% of the outer surface of the crucible, and a sliding frictional coefficient of the outer surface of the crucible to a carbon at 1500 degree C. is more than 0.6.

Abstract: The main surface of a quartz component is divided by an offset into a first region having a larger height around an inner perimeter and a second region adjacent to the outer perimeter of the first region. Repeated restoration of a damaged component by forming a bulge on the first region and machining the bulge to make a flat surface while maintaining the offset enables long term use of the component.

Abstract: In some embodiments, the present invention is directed to methods that involve the combination of step-and-flash imprint lithography (SFIL) with a multi-tier template to simultaneously pattern multiple levels of, for example, an integrated circuit device. In such embodiments, the imprinted material generally does not serve or act as a simple etch mask or photoresist, but rather serves as the insulation between levels and lines, i.e., as a functional dielectric material. After imprinting and a multiple step curing process, the imprinted pattern is filled with metal, as in dual damascene processing. Typically, the two printed levels will comprise a “via level,” which is used to make electrical contact with the previously patterned under-level, and a “wiring level.” The present invention provides for the direct patterning of functional materials, which represents a significant departure from the traditional approach to microelectronics manufacturing.

Abstract: A method of producing a glass substrate for a mask blank has the steps of measuring a convex/concave profile of a surface of the glass substrate, controlling a flatness of the surface of the glass substrate to a value not greater than a predetermined reference value by specifying the degree of convexity of a convex portion present on the surface of the glass substrate with reference to a result of measurement obtained in the profile measuring step and executing local machining upon the convex portion under a machining condition depending upon the degree of convexity, and polishing, after the flatness control step, the surface of the glass substrate subjected to the local machining. The surface of the glass substrate subjected to the local machining is subjected to acid treatment after the flatness control step and before the polishing step.

Abstract: A method for manufacturing a working template for use in imprint lithography is disclosed, which in an embodiment, involves contacting a first target region of an imprintable medium on a working template substrate with a master template to form a first imprint in the medium, the imprint defining a part of a working template pattern, separating the master template from the imprinted medium, contacting a second target region of the medium with the master template to form a second imprint in the medium, the second imprint defining a further part of the working template pattern, and separating the master template from the imprinted medium.

Abstract: Novel and significantly simplified procedures for fabrication of fully integrated nanoelectrospray emitters have been described. For nanofabricated monolithic multinozzle emitters (NM2 emitters), a bottom up approach using silicon nanowires on a silicon sliver is used. For microfabricated monolithic multinozzle emitters (M3 emitters), a top down approach using MEMS techniques on silicon wafers is used. The emitters have performance comparable to that of commercially-available silica capillary emitters for nanoelectrospray mass spectrometry.

Abstract: The inventive method includes a preparation step during which the substrate is covered with a layer, a pressing step in which a mould including a pattern of recesses and protrusions is pressed into part of the thickness of the aforementioned layer, at least one etching step in which the layer is etched until parts of the surface of the substrate have been stripped, and a substrate etching step whereby the substrate is etched using an etching pattern which is defined from the mould pattern. The preparation step includes a sub-step consisting of the formation of a lower sub-layer of curable material, a step involving the curing of said layer and a sub-step including the formation of an outer sub-layer which is adjacent to the cured sub-layer. Moreover, during the pressing step, the above-mentioned protrusions in the mould penetrate the outer sub-layer until contact is reached with the cured sub-layer.

Abstract: A magnetoresistive sensor having a pinned layer that extends beyond the stripe height defined by the free layer of the sensor. The extended pinned layer has a strong shape induced anisotropy that maintains pinning of the pinned layer moment. The extended portion of the pinned layer has sides beyond the stripe height that are perfectly aligned with the sides of the sensor within the stripe height. This perfect alignment is made possible by a manufacturing method that uses a mask structure for more than one manufacturing phase, eliminating the need for multiple mask alignments.

Abstract: The present invention relates to a method of producing a diamond surface including the steps of providing an original diamond surface, subjecting the original diamond surface to plasma etching to remove at least 2 nm of material from the original surface and produce a plasma etched surface, the roughness Rq of the plasma etched surface at the location of the etched surface where the greatest depth of material has been removed satisfying at least one of the following conditions: Rq of the plasma etched surface is less than 1.5 times the roughness of Rq of the original surface, or Rq of the plasma etched surface is less than 1 nm.

Abstract: A system and method is disclosed for increasing the emissivity of solid materials, wherein first the surface of the material is mechanically worked to create micro-level defects, and then etched to create a deep micro-rough surface morphology. In this manner, higher efficiencies and lower energy consumption can be obtained when these modified materials are used for heating elements. Heating elements made in accordance with this process thus operate at lower temperatures with longer lifetimes, when the improved heating elements are used with various heating devices.

Abstract: There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching.

Abstract: Certain MEMS devices include layers patterned to have tapered edges. One method for forming layers having tapered edges includes the use of an etch leading layer. Another method for forming layers having tapered edges includes the deposition of a layer in which the upper portion is etchable at a faster rate than the lower portion. Another method for forming layers having tapered edges includes the use of multiple iterative etches. Another method for forming layers having tapered edges includes the use of a liftoff mask layer having an aperture including a negative angle, such that a layer can be deposited over the liftoff mask layer and the mask layer removed, leaving a structure having tapered edges.

Abstract: It is an object to manufacture a composite of a metal part and a resin composition part, which is improved so as to securely join and integrate stainless steel and a resin. A stainless steel part whose surface has been suitably roughened by chemical etching or the like can be used. An integrated product is obtained by inserting a stainless steel piece 1 with its surface treated into a cavity formed by a movable-side mold plate 2 and a fixed-side mold plate 3 of a metallic mold for injection molding 10 and injecting a specific resin. PBT, PPS or an aromatic polyamide resin can be used as the main resin component of a resin composition 4 that is used. High injection joining strength is obtained if the resin composition contains, as an auxiliary component, PET and/or a polyolefin resin in the case of PBT, a polyolefin resin in the case of PPS and an aliphatic polyamide resin in the case of an aromatic polyamide resin.

Abstract: The present invention relates to a metal structure with anti-erosion wear-proof and manufactured method thereof. The metal structure with anti-erosion wear-proof includes a metal substrate; a protective layer formed on the metal substrate, the protective layer has a plurality of openings; and an oxide layer formed on the protective layer. The manufactured method of metal structure with anti-erosion wear-proof includes the steps of providing a metal substrate; forming a protective layer on the metal substrate, the protective layer has a plurality of openings; and forming an oxide layer on the protective layer. The present invention transforms the surface of the protective layer into the oxide layer to increase the anti-erosion and wear-proof character of the metal substrate.

Abstract: Disclosed is a channel filter for separating microparticles, and more particularly to a channel filter which can easily separate a sample having various sized microparticles by using a surface topology. In the disclosed channel filter, a topology having an upward/downward reference height from a sample inlet to an outlet is continuously or discontinuously formed, and thus it is possible to efficiently separate microparticles from a sample liquid.

Abstract: Adaptive nanotopography sculpting may be used to alter nanotopography and roughness without altering the nominal shape of a surface. Generally, adaptive nanotopography sculpting provides a surface having desired shape characteristics. Topography of a first surface is mapped to provide a density map. The density map is evaluated to provide a drop pattern for dispensing polymerizable material on the first surface. The polymerizable material is solidified and etched to provide a second surface having the desired shape characteristics.

Abstract: A process for producing a silicon wafer comprising a single-wafer etching step of performing an etching by supplying an etching solution through a supplying-nozzle to a surface of a single and a thin-discal wafer obtained by slicing a silicon single crystal ingot and rotating the wafer to spread the etching solution over all the surface of the wafer; and a grinding step of grinding the surface of the wafer, in this order, wherein the etching solution used in the single-wafer etching step is an aqueous acid solution which contains hydrogen fluoride, nitric acid, and phosphoric acid in an amount such that the content of which by weight % at a mixing rate of fluoric acid:nitric acid:phosphoric acid is 0.5 to 40%:5 to 50%:5 to 70%, respectively.

Abstract: A method for superfinishing a high density carbide steel component using chemically accelerated finishing is provided. The high density carbide steel component is vibrated in a vessel containing a plurality of media, with active chemistry being added to the vessel at a low flow rate. An active chemistry composition is also provided, consisting of one or more conversion coating agents having preferably a phosphate radical, and one or more chelating agents preferably including citric acid.

Abstract: The invention is directed to a chamfering apparatus for a silicon wafer to chamfer outer edge of a silicon wafer by using a chamfering grindstone, the chamfering apparatus including at least: a holder holding and rotating a silicon wafer; a chamfering grindstone chamfering the outer edge of the silicon wafer held by the holder; and a control apparatus for controlling a chamfered shape by controlling a relative position of the outer edge of the silicon wafer and the chamfering grindstone by numerical control, wherein the control apparatus controls and changes the relative position of the outer edge of the silicon wafer and the chamfering grindstone at the time of chamfering depending on the circumferential position of the silicon wafer held by the holder, a production method, and an etched silicon wafer.

Abstract: Provided is a method of forming a nanostructure having a nano-sized diameter and a high aspect ratio through a simple and economical process. To form the nanostructure, a polymer thin film is formed on a substrate and a mold is brought to contact the polymer thin film. Then, a polymer patterning is formed to contact the background surface of an engraved part of the mold, and then the polymer pattern is extended out by removing the mold out of the polymer thin film. The nanostructure forming method of the present research can reproduce diverse cilia optimized in the natural world. Also, it can be used to develop new materials with an ultra-hydrophobic property or a high adhesiveness. Further, it can be applied to a nanopattern forming process for miniaturizing electronic devices and to various ultra-precise industrial technologies together with carbon nanotube, which stands in the highlight recently.

Abstract: The present invention is a method for adjusting the resonant frequency of a mechanical resonator whose frequency is dependent on the overall resonator thickness. Alternating selective etching is used to remove distinct adjustment layers from a top electrode. One of the electrodes is structured with a plurality of stacked adjustment layers, each of which has distinct etching properties from any adjacent adjustment layers. Also as part of the same invention is a resonator structure in which at least one electrode has a plurality of stacked layers of a material having different etching properties from any adjacent adjustment layers, and each layer has a thickness corresponding to a calculated frequency increment in the resonant frequency of the resonator.

Abstract: The present invention pertains to a heat transfer label that can be modified by an end user in order to indicate variable data prior to transfer of the heat transfer label to a substrate. The label can include fixed data and a region where the variable data is provided or applied and through which the data is viewed when the label is affixed to an object or item. A method for marking the variable data or graphic into the heat transfer label includes punching holes through, or selectively removing ink from, an area of ink located on the heat transfer label tape or strips. The blocks of inked areas are punched or the ink is removed from portions of the block inked area to form a pattern or code correlating to the variable data or graphic and may be configured to be read by human or machine.

Abstract: A method of manufacturing a slider includes forming a slider material containing a portion to be the slider body and a head element. The slider material is processed to form an air bearing surface by lapping a surface to be a medium facing surface of the slider material to form a lapped surface that includes a third surface. Selectively etching the lapped surface for form a second surface and after the selectively etching, lapping a part of the lapped surface to form the first surface, the third surface and a border part.