Abstract: A joining method includes: an overlapping step of overlapping a front surface of a first metal member with a back surface of a second metal member; and a welding step of welding the first metal member with the second metal member by hybrid welding, with use of a hybrid welding machine including a leading laser welding unit and a trailing arc welding unit. In the welding step, laser welding, by irradiating a laser beam, and arc welding are performed, along a preset travel route set on an inner corner portion formed by the front surface of the first metal member and an end surface of the second metal member, to the inner corner portion and the laser beam is oscillated to cross the preset travel route.

Abstract: To provide Ti—Cu alloy formulations and additive manufacturing process configurations for fabrication of a bulk metallic glass (BMG) product that is biocompatible and antimicrobial, compositions of Ti-based metal alloy powder, comprising: Ti; Cu within a range of 5-30 atomic percent; transition metal within a range of 0-50 atomic percent, wherein such transition metal is one or a plurality of Zr, Nb, Ta, Pd, and Co, are disclosed. Moreover, additive manufacturing processes disclosed herein are capable of fabricating a bulk metallic glass of one or a combination of following phasic structures: fully amorphous microstructure; amorphous beta titanium phase; amorphous copper phase; and amorphous (Ti,M)2Cu phase. The resulting biocompatible metal alloy product may be a medical device, particularly but not limited to a medical implant.

Abstract: A joining layer of a joined body includes a joining material which contains, as a main component, a metal having a surface tension of 1000 mN/m or less at its melting point, and a metal layer which has a plurality of pores formed therein and in which at least some of the pores are impregnated with the joining material.

Abstract: The present disclosure provides methods, devices, and systems for the butt welding of two, e.g., planar, workpieces composed of glass, e.g., quartz glass, by a pulsed laser beam, e.g., an ultrashort pulse (“USP”) laser beam, which is directed into the workpiece material parallel to the joining surface of the two workpieces and which is focused into the workpiece material in the region of the joining surface to locally melt the two workpieces in the region of their joining surface, wherein the laser focus of the laser beam focused into the workpiece material is moved in or counter to the beam direction of the laser beam to produce in the region of the joining surface a weld seam extending along the beam direction.

Abstract: A laser machining apparatus includes, a processing chamber, a window disposed in a surface of the processing chamber, a substrate carrier disposed inside the processing chamber and facing the window, a laser irradiator which irradiates a laser onto the substrate carrier through the window, a protector supplier disposed on a side of the processing chamber, a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber, and a protector which connects the protector supplier with the protector retriever, where at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.

Abstract: Base materials of a butt welded joint with a welded portion have a carbon concentration of 0.1 mass % or greater and 0.35 mass % of less. The welded portion is formed by heating by keyhole welding and then reheating by heat conduction welding, and the welded portion has a melted and solidified portion by the keyhole welding, a reheated solidified portion by the heat conduction welding, and a remelted and solidified portion. A width W0 and a depth d0 of the melted and solidified portion and a width W1 and a depth d1 of the remelted and solidified portion have the following relationships: 0.46W0?W1; and 0.14d0?d1?0.73d0.

Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier having a first surface on which the electronic device to be transferred is disposed and a second surface, a target substrate, a target substrate, and a light-transmissible pin having a pressing end are provided. The flexible carrier is spaced from the target substrate with the first surface thereof facing the target substrate. The flexible carrier is deformed by exerting the pin to press the second surface with the pressing end thereof at a position corresponding to the electronic device until the electronic device is in contact with the target substrate. An energy beam emitted from a light source standing outside the pin and then traveling through the pin and going out from the pressing end to bond the electronic device onto the target substrate is applied. The pin is released from pressing the flexible carrier.

Abstract: An apparatus for fabricating a laminated core includes a lower mold including a die including a die hole, an upper mold including a punch, a stripper plate operable to restrict upward and downward movements of a metal sheet at a lowest descending position during punching out of the metal sheet by the punch, an adhesive applicator included in the lower mold and operable to apply an adhesive onto a lower surface of the metal sheet, and a controller configured or programmed to control the stripper plate and the adhesive applicator. The controller is configured or programmed to include a movement controller to control upward and downward movements of the stripper plate, and an applicator controller to cause the adhesive applicator to apply the adhesive onto the lower surface of the metal sheet while the stripper plate is not located at the lowest descending position.

Abstract: A sterling silver chain and method of manufacturing a sterling silver chain comprising a plurality of chain links. Each of the chain links can comprise a sterling silver wire, the sterling silver wire comprising a first end and a second end. Each of the first end and the second end of each of the plurality of chain links can be joined together through a weld. Each of the plurality of chain links can comprise at least 92.5% by weight silver and at least 6.5% by weight tin.

Abstract: A rechargeable battery includes a case having an opening and accommodating an electrode assembly therein; a cap plate closing and sealing the opening; and a welding bead part along a circumference of the cap plate and at a contact surface of the case and the cap plate, wherein the welding bead part includes first and second regions on a cross-section vertical to a welding progressing direction of the welding bead part, the first region has a first boundary line on the cross-section, a contact surface is between end parts of the first boundary line, the second region has a second boundary line on the cross-section, the first region is between end parts of the second boundary line to form first and second contact points in contact with the first boundary line, the first region is deeper than the second region, and the second region is wider than the first region.

Abstract: A welding method includes: disposing a workpiece formed by stacking a plurality of metal foils in an area to be irradiated with laser light that contains a plurality of beams; irradiating a surface of the workpiece with the beams of the laser light by dispersing positions of the beams such that centers of the beams do not overlap with each other within a prescribed area on the surface; melting an irradiated part of the workpiece and performing welding; and setting each of the beams to have a power density with which no hole opens in the metal foils, and setting the power density of the beams and dispersing irradiating positions to be emitted so as to form a weld pool penetrating the workpiece by the beams.

Abstract: An optical-path calibration module is provided. The optical-path calibration module defines a first light inlet, a second light inlet, and a first light outlet, and a first light-splitting device is disposed in the optical-path calibration module. The first light inlet is configured to receive a calibration beam of a calibration light-source or be closed. The second light inlet is configured to receive a target-light-source beam or the calibration beam from the calibration light-source. The first light outlet is configured to emit a detection beam to a photoelectric sensor. An angle of 45° is defined between the first light-splitting device and each of the first light inlet and the second light inlet.

Abstract: Provided is a laser processing method including overlapping a plurality of plate-shaped members that include a first plate-shaped member disposed on one end side of an overlapping direction and a second plate-shaped member disposed on the other end side of the overlapping direction; branching a laser beam into a first branched laser beam and a second branched laser beam; irradiating the first plate-shaped member with the first branched laser beam and the second branched laser beam in a state where the first branched laser beam and the second branched laser beam are emitted in parallel; forming line-shaped melting portions on the first plate-shaped member by moving the branched laser beams in a direction intersecting a direction in which the branched laser beams are aligned; and joining overlapped plate-shaped members in a state where the melting portion formed by using the first branched laser beam and the melting portion formed by using the second branched laser beam are connected to each other in the second

Abstract: A vehicular camera assembly includes an imager printed circuit board (imager PCB) having an imager disposed at a first side of the imager PCB. A lens barrel accommodates a lens and has an inner end. The inner end of the lens barrel is disposed at a first portion of a camera housing. The imager PCB is attached at a second portion of the camera housing that joins with the first portion so that the imager faces the lens. The second portion is adjustable relative to the first portion to align the imager and the lens. With the second portion engaging the first portion and the imager and lens aligned, a weld washer is laser welded to the first and second portions to join the second portion to the first portion.

Abstract: While a laser-beam application position is moved along a locus which circularly or elliptically circles around a locus center so as to cross a weld line that is a boundary between a first metal plate and a second metal plate overlapped with each other, the locus center is moved in a direction parallel to a weld line. A moving direction of the laser-beam application position is set such that the laser beam is first applied to the first metal plate and then to the second metal plate when the laser beam passes through an unmelted zone of the first metal plate and the second metal plate. The unmelted zone is located downstream of a range through which the laser beam has already passed in the direction parallel to the weld line.

Abstract: The present invention relates to a method for joining two blanks made of aluminum material, using a laser source, by controlling the laser power distribution. In particular, the method comprises placing the first and second blanks for welding; laser welding the first and second blanks following a welding path and modulating a laser power distribution, wherein the welding path combines a linear movement along a welding direction and oscillating movements substantially transverse to the welding direction, wherein the oscillating movement has a frequency between 50 Hz and 1500 Hz and an amplitude ranging from 0.3 mm and 3.0 mm, and wherein the laser power distribution is dynamically controlled during the oscillating movement, and wherein said power is modulated between 0 and 100% of the maximum laser power. The present invention also related to a process of modulating said laser powder distribution.

Abstract: An electronic device includes a housing formed of a resin member having a predetermined light absorption property and having an opening, a circuit board accommodated in the housing and on which an electronic circuit is formed, at least one terminal including one end portion and the other end portion electrically connected to the circuit board, and a cover portion covering the opening of the housing, penetrating the at least one terminal, and formed of a resin member having a predetermined light transmitting property. The one end portion of the at least one terminal is located opposite to the other end portion with reference to the cover portion, and the cover portion is molded at a mold temperature of 100 degrees to 180 degrees. The at least one terminal and the circuit board are electrically connected by solder joining. The housing and the cover portion are connected by laser welding.

Abstract: A sensing system comprises a mechanical component that is subject to an applied force. The mechanical component has an outer surface with bores. A concentrator is connected to the mechanical component via fasteners that pass through openings that align with the bores. The concentrator comprises a central neck portion with an elevated pedestal, a first extremity region extending outwardly away from the central neck portion and a second extremity region opposite the first extremity region. The second extremity region extends outwardly away from the central neck portion. A strain sensor is mounted on or coupled to the concentrator to transmit the applied force from the mechanical component via or through the concentrator to the mechanical component.

Abstract: An additive manufacturing system may include an energy source, an optical system to modify and direct an energy beam from the energy source toward a component to form a melt pool, and a material delivery device to deliver material to the melt pool. The optical system may form an annular energy beam, direct the annular energy beam toward the component, receive at least a portion of thermal emissions produced by the annular energy beam and the melt pool, and direct the portion of the thermal emissions toward an imaging device, which may be used to control the energy source.

Abstract: A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.

Abstract: A camera captures a predetermined range including a beam spot of a laser beam irradiated on the first and second sheet metals to be welded. An image analysis device determines whether a welding defect has occurred, based on an image signal obtained by capturing the first and second sheet metals. The image analysis device sets an analysis window in a frame of the image signal, and a center of the beam spot is located at a reference point set in the analysis window. A region extractor extracts pixels of a region of interest whose position is set with reference to the reference point corresponding to a welding defect of a determination target, among pixels included in the analysis window. A welding defect determination unit determines whether the welding defect of the determination target has occurred, based on luminance in the region of interest.

Abstract: A laser system for dicing a semiconductor structure is disclosed. The laser system includes a laser source and a laser energy adjusting unit. The laser source is configured to generate a laser. The laser energy adjusting unit is movably provided on a laser light path between the laser source and the semiconductor structure. The laser energy adjusting unit is moved to the laser light path between the laser source and the semiconductor structure based on a first determination that the laser source is focused on a first preset region of the semiconductor structure having a first material.

Abstract: A stamped part includes a first blank, a second blank, and a weld joining the first blank to the second blank. The weld includes opposing ends. At least one of the opposing ends of the weld is recessed from adjacent edges of the first and second blanks.

Abstract: An improved laser welding method of materials by means of long pulse and high energy pulses of solid state lasers in such a manner that large depth of penetration with full depth or partial depth of penetration can be achieved with minimum surface evaporation in first pass of laser beam and enhanced surface smoothness having average surface smoothness of 5 mm by second pass of laser beam of lower power density and inclined at a particular inclination.

Abstract: A method of producing a plurality of analytical test strips using a reel-to-reel process, comprising providing at least one continuous first layer web, having disposed on a first side at least one first electrode layer, the first layer web having a first layer edge; continuously disposing at least one continuous spacer layer web onto the first side of the first layer web, wherein the spacer layer web has a spacer layer edge, wherein the disposing is position-controlled in a master-slave fashion by using a position of the first layer edge as a master position and a position of the spacer layer edge as a slave position; and continuously disposing at least one continuous second layer web onto the spacer layer web, the second layer web having disposed on a first side at least one second electrode layer, wherein the second layer web has a second layer edge.

Abstract: A method of joining at least two substrates includes welding the at least two substrates together with a multi-step welding process. The multi-step welding process includes: reducing a mismatch between the at least two substrates by melting on both sides of the at least two substrates to form a melted portion that does not overlap a joint line between the at least two substrates with a first welding step; and increasing melt volume and penetration depth of the melted portion between the at least two substrates with a second welding step.

Abstract: A laser welding device is configured to switch an irradiation position of a measurement beam between a position of a keyhole coaxial with the optical axis of a laser beam and a position of a weld bead behind the center of an optical axis of the laser beam in a welding direction. The laser welding device determines whether there is a gap between an upper metal plate and a lower metal plate based on a measured value of a recess depth measured at the position of the weld bead.

Abstract: A fiber optic cable conducts optical fiber to downhole gauges in a wellbore. Cable connections are used to protect splicing of the optical fiber between cable sections and the gauges. The cable connection includes adjoining tubes, which have passages for the optical fiber. The tubes are nested together and enclose the splicing of the optical fiber. A cable-end tube is affixed to a section of the cable with the passage overlaying a jacket of the cable, and a gauge-end tube is affixed to an end of the downhole gauge with the passage overlaying the end of the downhole gauge. At least one spanning tube has ends that are affixed nested inside the passages of the adjoining ones of the tubes. The cable connections allow the cable and gauges to be wound on a spool or reel for installing into the wellbore.

Abstract: A harmonic welding wire oscillator configured to oscillate a stretch of welding wire within a wire liner. The oscillator may include an actuator configured to oscillate the welding wire at a resonant frequency of the stretch of welding wire. The oscillation causes reciprocation of the welding wire at the tip of the welding torch.

Abstract: Systems, methods and apparatuses are used for monitoring material processing using imaging signal density calculated for an imaging beam directed to a workpiece or processing region, for example, during inline coherent imaging (ICI). The imaging signal density may be used, for example, to monitor laser and e-beam welding processes such as full or partial penetration welding. In some examples, the imaging signal density is indicative of weld penetration as a result of reflections from a keyhole floor and/or from a subsurface structure beneath the keyhole. The monitoring may include, for example, automated pass/fail or quality assessment of the welding or material processing or parts produced thereby. The imaging signal density may also be used to control the welding or material processing, for example, using imaging signal density data as feedback. The imaging signal density may be used alone or together with other measurements or metrics, such as distance or depth measurements.

Abstract: A method for determining defects that occur while carrying out a surface modification method of a surface region of a component includes providing an image sequence of a surface region to be assessed. Each image of the image sequence shows an image detail of the surface region and the image details of the individual images overlapping at least partially. The method further includes assigning the individual images to at least two image classes, where at least one image class among the at least two image classes is indicative of a defective image class. The method further includes checking whether a set of individual images of a predeterminable number of directly consecutive individual images in the image sequence have been assigned to the defective image class, and outputting a defect signal.

Abstract: Methods and systems of using a laser beam to weld an object with a non-flat surface, including curved surfaces, are described, where at least one piece of the object is transparent. An optical guide with a flat surface and an interface surface is placed on a piece of an object to welded. The interface surface is fabricated to form-fit the non-flat surface of the object to be welded, and is opposite the flat surface. A liquid optical medium is applied between the non-flat surface and the interface surface, filling any gaps or surface defects. The laser beam is then transmitted through the optical guide, liquid optical medium, and into the object to be welded, to a location to be welded. The laser beam then welds the object to be welded at pre-determined points.

Abstract: A wafer-level optoelectronic packaging method includes fabricating a pre-singulated wafer. The pre-singulated wafer has a plurality of sub-mounts. A first sub-mount of the plurality of sub-mounts includes an optical waveguide formed on a substrate, a multi-layered sub-mount boundary wall that is formed on the optical waveguide, and a v-groove that is external to the sub-mount boundary wall. A plurality of optical dies are attached to the corresponding plurality of sub-mounts, such that each optical die is aligned to the optical waveguide of the corresponding sub-mount. A cap-wafer including a plurality of caps is attached to the pre-singulated wafer to obtain an encapsulated pre-singulated wafer. The encapsulated pre-singulated wafer is diced to obtain a plurality of optoelectronic packages. The optical waveguide of each optoelectronic package serves as an interconnection conduit between the corresponding optical die and an optical fiber placed in the corresponding v-groove.

Abstract: A computer-implemented method for operating a laser material processing machine. An estimated result is ascertained as a function of predefined process parameters, which characterize how good an actual result of the laser material processing will be, and the process parameters are varied by means of Bayesian optimization with the aid of a data-based model, until an actual result of the laser material processing is sufficient enough.

Abstract: This invention relates to a method for manufacturing a metal part which comprises attaching a powder forged or wrought outer raced ID splined plate to a powdered metal inner splined connection gear, wherein the outer raced ID splined plate incorporates a female ID profile on the race, wherein the inner splined connection gear contains a mail OD profile on the exterior of the part, and wherein the splined plate and the splined connection gear are attached together by (1) sinter brazing, (2) laser brazing, (3) laser welding, (4) sintering a mechanical joint, or (5) staking. In practicing this method a tight mechanical joint is formed between the splined plate and the splined connection gear which can be made of highly dissimilar materials, such as a wrought metal and a sintered powder metal.

Abstract: A powder-deposition apparatus for an additive manufacturing system includes a recoater, a mixer, and a powder feeder. The recoater is configured to discharge powder such that a powder layer is formed from the powder. The mixer is configured to mix a plurality of powder constituents to produce the powder and to dispense the powder to the recoater. The powder feeder is configured to selectively dispense a mass of each one of the plurality of powder constituents to the mixer such that a composition of the powder is selectively controlled.

Abstract: The embodiment of the present disclosure provides a welding device, a welding method, and an installation and debugging method thereof. The welding device includes a baseboard, comprising: a left welding nozzle and a right welding nozzle, a power shaft, a bidirectional moving wheel, and two welding nozzle connecting shafts, wherein the welding nozzle connecting shafts are connected to the left welding nozzle and the right welding nozzle respectively, and the bidirectional moving wheel which is driven by the power shaft drives the two welding nozzle connecting shafts to move towards or away from each other.

Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.

Abstract: A laser welding device includes: an irradiator configured to overlap laser light and measurement light coaxially with each other and apply the laser light and the measurement light to a weld part, a wavelength of the measurement light being different from a wavelength of the laser light; a measuring instrument configured to repeatedly measure a weld penetration depth of the weld part based on the measurement light that is emitted from the irradiator and reflected on the weld part so as to generate measured values; and a determiner configured to determine the weld penetration depth of the weld part based on (i) one or more measured values; or (ii) an average value of the one or more measured values, the one or more measured values being included within a predetermined range with reference to a greatest side measured value of the plurality of measured values.

Abstract: A machining condition adjustment device adjusts laser beam machining conditions for a laser beam machining device to carry out laser beam machining of a workpiece, produces each of state variables including machining condition data, workpiece data, and plasma generation amount data and determination data including plasma generation amount determination data, and learns adjustment action for the laser beam machining conditions with respect to an amount of plasma generated in the laser beam machining of the workpiece under prescribed laser beam machining conditions, with use of the produced state variables and the produced determination data.

Abstract: A rotor blade is a rotor blade to be attached to a rotor shaft rotatable about an axis, and includes a blade body extending in a radial direction with respect to the axis and having a blade-shaped cross-section orthogonal to the radial direction; a fillet portion provided on a radial outer side of the blade body and having a hollow portion formed therein; a shroud provided on a radial outer side of the fillet portion and extending in a circumferential direction; and a seal fin projecting from the shroud to an outer circumferential side and extending in a direction intersecting the blade body when viewed from the radial direction. A wall thickness on a suction side of the fillet portion is greater than a wall thickness on a pressure side of the fillet portion on a leading edge side of the blade body as demarcated by an intersection portion between the blade body and the seal fin serving as a boundary.

Abstract: A connection pin of a feedthrough of an implantable medical electronic device has a primarily cylindrical pin body and at least one flattened end section. The flattened end section has at least one planar connecting surface formed on it, especially for connection by material bonding of a band-shaped conductor.

Abstract: A joint method includes a groove formation step of removing part of a first projection and part of the second projection to form a groove region between the first projection and the second projection, a first welding step of joining a first member and a second member to each other by butt welding, and a second welding step of filling the groove region by buildup welding. The groove formation step forms a first inclined surface in the first projection facing the groove region to be gradually distant from a joint position joined with the second projection so as to be closer to an outer surface of the first projection, and forms a second inclined surface in the second projection facing the groove region to be gradually distant from the joint position joined with the first projection so as to be closer to an outer surface of the second projection.

Abstract: A compressor includes a casing, a housing inside the casing, and first and second welds. The casing includes a tubular barrel casing and an end casing. The first weld welds the barrel casing and the housing together. The second weld welds the barrel casing and the end casing together along a circumferential direction. The second weld includes a repeatedly welded portion formed by one end portion and an other end portion of the second weld overlapping each other, or the second weld includes a plurality of second welds each including a repeatedly welded portion formed by an end portion of the second weld and an end portion of an other one of the second welds overlapping each other. The repeatedly welded portion are formed to reduce deformation of the barrel casing. The repeatedly welded portion and the first weld are aligned along an axial direction of the barrel casing.

Abstract: A method of joining electrical connections together includes evaluating at least one weld joint between at least two substrates, determining mismatch between the at least two substrates, and welding the at least two substrates together with a multi-step welding process. The multi-step welding process includes compensating for mismatch between the at least two substrates by welding on both sides but not overlapping a joint line between the at least two substrates with a first welding step and increasing melt volume and penetration depth of a weld between the at least two substrates with a second welding step.

Abstract: A method for synchronizing welding currents of at least two welding current sources prior to performing a simultaneous welding process on at least one workpiece, in particular a welding process with non-consumable electrodes, wherein the method includes the following steps: a first welding current source outputting a reference signal, wherein the reference signal contains synchronization information; a second welding current source measuring or receiving the reference signal and evaluating the synchronization information contained in the reference signal; synchronizing a second welding current of the second welding current source with a first welding current of the first welding current source on the basis of the synchronization information. The invention furthermore relates to a welding current source and to a system having at least two welding current sources.

Abstract: A method of joining a razor blade to a blade support to form a razor blade assembly, the method including: directing a laser beam having an adjustable power output at an upper surface of the razor blade; and while advancing the laser beam along the razor blade: a) applying the laser beam at a first power output to the razor blade; b) reducing the first power output of the laser beam to a second power output; and c) applying the laser beam at the second power output to the razor to form a weld area joining the razor blade to the blade support. The weld area may be elongated and may include (i) a ratio of depth:width that is greater than about 2:1, and/or (ii) a ratio of length:width that is greater than about 5:1.

Abstract: This disclosure describes various methods and apparatus for characterizing an additive manufacturing process. A method for characterizing the additive manufacturing process can include generating scans of an energy source across a build plane; measuring an amount of energy radiated from the build plane during each of the scans using an optical sensor; determining an area of the build plane traversed during the scans; determining a thermal energy density for the area of the build plane traversed by the scans based upon the amount of energy radiated and the area of the build plane traversed by the scans; mapping the thermal energy density to one or more location of the build plane; determining that the thermal energy density is characterized by a density outside a range of density values; and thereafter, adjusting subsequent scans of the energy source across or proximate the one or more locations of the build plane.

Abstract: According to one aspect, there is provided a method of cleaning a 3D object on a platform. The method comprises generating with a cleaning module a cleaning airflow to remove powder particles from a 3D object and an extraction airflow to extract any removed powder particles, determining a quantity of powder particles in the extraction airflow, and moving the cleaning module relative to the platform based on the determined quantity of powder particles.

Abstract: A guide frame of a fishing line guide includes a hollow frame body, and a core member inserted into at least a part of the frame body. The frame body includes a frame member configured to abut a prescribed angle region on a circumference of a guide ring, an attachment foots configured to attach to a fishing rod and a support leg configured to connect ends of the frame member and then attachment foots.