Abstract: A method of operating a plasma arc torch system includes placing a work piece to be cut on a table of the plasma arc torch system, wherein at least a portion of the work piece has a planer surface facing away from the table. A plasma arc torch is positioned adjacent the planer surface of the work piece using a positioning apparatus, wherein the positioning apparatus has at least five degrees of freedom about which it can move the plasma arc torch relative the work piece for cutting the work piece on the table. The method further includes angling the torch relative the planer surface of the work piece such that the torch is held at an angle of between about 1 and about 4 degrees from perpendicular with the planer surface to back burn a produced kerf such that a kerf edge is perpendicular relative the planer surface of the work piece. Additionally, the planer surface of the work piece is calculated by contacting the work piece with the torch at least three times.

Abstract: A direct metal deposition (DMD) process is stabilized by monitoring the temperature and the shape of the melt pool during deposition, applying a recursive least square (RLS) model estimation algorithm to adaptively identify process characteristics in accordance with the temperature and the shape of the melt pool, and delivering the process characteristics to a generalized predictive controller with input constraints to control the process. The process may be controlled by adjusting laser power or by adjusting the speed of the movement of the laser. In the preferred embodiment the temperature is monitored using a two-color pyrometer, and the shape of the melt pool is monitored by detecting the edge of the melt pool with a camera and/or photodetector.

Abstract: A method of brazing including melting a surface region (26) of a substrate (12, 14, 22) and contacting a braze material (10) with the melted surface region, the braze material including a plurality of braze fillers (16) and a plurality of carbon structures (18). The method further includes subjecting the braze material to an amount of energy effective to melt the braze fillers but not the carbon structures, and cooling the braze material to form a brazement (28, 32) including the carbon structures within at least a portion of the substrate. The brazement includes a gradient (30) of the carbon structures, wherein a concentration of the carbon structures increases in a direction away from an interior of the substrate.

Abstract: A method for controlling the parallelism of first and second surfaces that define an optically resonant cavity is disclosed. The surfaces are separated by a first separation that is based on a support that holds the first surface relative to the second surface. The support comprises a first material and includes one or more regions in which the material stress of the first material is heat tuned to locally induce a stress gradient that results in a localized deformation. By controlling the locations and amounts of one or more localized deformation regions, the orientation of the first surface relative to the second surface is controlled.

Abstract: A levitation apparatus and a levitation method are provided. The levitation apparatus includes a top electrode and a bottom electrode disposed to be spaced apart from each other, a main power source adapted to apply a voltage to the top electrode or the bottom electrode such that a charged object levitates against gravity by using an electrostatic force generated by the voltage, a laser to heat the charged object, and spherical mirrors to re-reflect reflected light reflected from the charged object to the charged object. The reflected light may be generated when output light of the laser passing through a through-hole formed in a surface central region of each of the spherical mirrors is reflected by the charged object.

Abstract: The embodiments described herein relate to forming anodized films that have a white appearance. In some embodiments, an anodized film having pores with light diffusing pore walls created by varying the current density during an anodizing process is described. In some embodiments, an anodized film having light diffusing micro-cracks created by a laser cracking procedure is described. In some embodiments, a sputtered layer of light diffusing aluminum is provided below an anodized film. In some embodiments, light diffusing particles are infused within openings of an anodized layer.

Abstract: Cladding and remanufacturing a machine component includes directing cleaning and welding beams split from an incident laser beam toward the machine component, and moving the machine component relative the cleaning and welding beams such that the welding beam trails behind the cleaning beam along a common travel path. A surface of the machine component is decontaminated by the cleaning beam, whilst a cladding material is melted via the welding beam such that upon solidifying the cladding material forms a coating metallurgically bonded to base material and previously deposited cladding material of the machine component.

Abstract: A method for forming three-dimensional anchoring structures on a surface is provided. This may result in a thermal barrier coating system exhibiting enhanced adherence for its constituent coatings. The method involves applying a laser beam (10) to a surface (12) of a solid material (14) to form a liquefied bed (16) on the surface of the solid material, then applying a pulse of laser energy (18) to a portion of the liquefied bed to cause a disturbance, such as a splash (20) or a wave (25) of liquefied material outside the liquefied bed. A three-dimensional anchoring structure (22) may thus be formed on the surface upon solidification of the splash or wave of liquefied material.

Abstract: A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.

Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

Abstract: A method for manufacturing a fluid-leading component includes positioning a base element machined by a material-removing method with a planar upper face in a mounting support. The method at least includes the initial application of a layer section with predetermined dimensions of a particulate material in a predetermined region on the planar upper face of the base element; the heating of the layer section by a heat source in such a manner that the particles of the material within predetermined dimensions bond; and the application thereto and heating of at least one further layer section with predetermined dimensions of a particulate material in a predetermined region. In this way it is possible, in the generative manufacturing method, to obviate the need to provide support structures that subsequently have to be removed, and the base element is a functional part of the component to be manufactured.

Abstract: A repairing method includes heating a base material by a heater, and irradiating a laser beam to a repair region of the base material by using a laser oscillator unit, after the base material is heated. In the method, generation of a crack and a break can be suppressed, and the repair region can be repaired more appropriately.

Abstract: Methods, devices and systems for laser decoating of coated metal sheets, in particular for removing a metal protective layer from a metal sheet by a laser beam. The laser beam is directed onto a surface of a metal sheet coated with a metal protective layer, such that the laser beam strikes the surface of the metal sheet at a laser spot and melts material of the metal protective layer. A gas is directed by a plurality of nozzles at a pressure of at least 3 bar and at an acute angle with respect to the laser beam onto the laser spot. The nozzles are arranged around the laser beam such that the gas directed from the nozzles blows away the melted material of the metal protective layer from the metal sheet.

Abstract: A method for manufacturing an endless metal ring by cutting an annular member made of maraging steel containing molybdenum into a ring element having a predetermined width, wherein a melted-solidified layer is formed on an outer circumference of the annular member, and the melted-solidified layers are arranged to be continuous in a circumferential direction of the ring element.

Abstract: A method for marking components (2) by a plurality of pulses (4) of a pulsed beam of a laser is disclosed. At first, a melted burr is formed when the marking (2) is being created. Subsequently, the melted burr is removed, whereby the pulsed laser beam is moved over the melted burr at a second speed. The sequential pulses (4) hardly overlap or not at all.

Abstract: The described invention provides a method of patterning a thin film deposited on a substrate comprising applying a moving focused field of thermal energy to the thin film deposited on the substrate; and dewetting the thin film from the substrate. Dewetting the thin film from the substrate is characterized by a negative space of a desired design; and displacement of the thin film into adjacent structures, thereby accumulating thin film in the adjacent structures.

Abstract: A method and apparatus (1) for machining a semiconductor or ceramic workpiece (32) causes a portion of the workpiece to undergo high pressure phase transformation to form a high pressure phase transformation portion which has altered optical properties from the remainder of the workpiece. A laser is irradiated on the high pressure transformation portion to heat the high pressure transformation portion and cause it to soften and then the workpiece is plastically deformed, at smaller loads and forces, along the softened portion in order to accomplish the machining of the workpiece with a machining tool (21).

Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.

Abstract: The present disclosure is directed to methods and systems for processing a thin film samples. In an exemplary method, semiconductor thin films are loaded onto two different loading fixtures, laser beam pulses generated by a laser source system are split into first laser beam pulses and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. In a preferred embodiment, at least a portion of the thin film that is loaded on the first loading fixture is irradiated while at least a portion of the thin film that is loaded on the second loading fixture is also being irradiated. In an exemplary embodiment, the laser source system includes first and second laser sources and an integrator that combines the laser beam pulses generated by the first and second laser sources to form combined laser beam pulses.

Abstract: A method for manufacturing an electrical steel sheet is provided. The method for manufacturing an electrical steel sheet includes forming a groove having first and second side surfaces and a bottom surface by melting a surface of a steel sheet by laser irradiation, and forming an opening by removing melted byproducts of the steel sheet formed on the first and second side surfaces and the bottom surface through air blowing or suctioning to expose at least one surface of the first side surface, the second side surface, and the bottom surface in the forming of the groove.

Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings may be precisely formed using a laser. Processing may be used to increase reflectivity of the markings.

Abstract: The present concept is a method of cladding and fusion welding of superalloys and includes the steps of firstly application of a composite filler powder that consists of 5-50% by weight brazing powder which includes melting point depressants, and 50-95% by weight high temperature welding powder, to a superalloy base material. Secondly there is simultaneous heating of the base material and the composite filler powder by a welding heat source that is movable relative to the base material. There is heating to a temperature that will fully melt the brazing powder and at least partially melt the high temperature welding powder and also melt a surface layer of the base material, thereby forming a weld pool. Thirdly upon solidification and cooling of the weld pool, there is coalescence between the weld bead and the base material.

Abstract: In order to sharpen and harden a corner portion of a score line edge portion of an iron golf club having a plurality of score lines on a face surface within a prescribed range, heat input is implemented on an edge portion of a groove through laser irradiation after the groove is machined and, as a result, the edge portion is hardened and melted to form a rounded corner R. The hardness is set at a Vickers hardness value (HV) of at least 350. The corner R forms a part of a contour line of the edge portion and this contour line is formed to exist between a first circle that contacts the face surface and a side surface of the groove and has a radius of 0.010 inches (0.254 millimeters) and a second circle that is concentric with the first circle and has a radius of 0.011 inches (0.2794 millimeters).

Abstract: A method for re-melting and refilling a defect (7) in a surface (19) of a substrate (4) by re-melting the defect (7) causing a hollow (28) to be produced above the re-melt, and the hollow (28) is refilled. A nickel- or cobalt-based substrate (4) is re-melted by a laser re-melting method. Subsequently, the hollow (28) that is produced is refilled by a laser application method, in particular by soldering. Also, a component having a re-melted region (25) and a solder region (31) thereover is disclosed.

Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on sub-surfaces of the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on a sub-surface the outer housing surface yet still be visible from the outside of the housing. Since the markings are beneath the surface of the housing, the markings are durable.

Abstract: A method of modifying an end wall contour is provided. The method includes creating a weld pool using a laser, adding a metal or a ceramic powder or a wire filler to the melt pool and modifying the part of the turbine in a manner that results in a change of about 0.005 to about 50 volume percent in the part of the turbine. The weld pool is created on a turbine component and contains molten metal or ceramic derived as a result of a heat interaction between the laser and the turbine component.

Abstract: A method of integrally forming at least one stiffener onto a sheet metal component configured to carry a load is provided including generating a stereolithography file. The stereolithography file includes a surface geometry of the at least one stiffener extending from a surface of the sheet-metal component. The surface geometry of the stereolithography file is sliced into a plurality of thin strips. The plurality of thin strips is substantially parallel to the surface of the sheet metal component. Energy from an energy source is applied to a powdered material such that the powdered material fuses to form the plurality of thin strips. One of the plurality of thin strips is integrally formed with the surface of the sheet-metal component. Each of the plurality of thin strips is integrally formed with an adjacent thin strip to create at least one stiffener.

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract: Crater-like intricate indents formed by melting and scattering of a metal surface are provided by irradiating with high density energy such as a laser beam or an electron beam the surface of the metal member. By using the irradiation condition that the crater-like indents have partially overlapped regions, gangue-like prominent portions formed by melting and scattering of the metal surface, a spherical metal splash formed at the top end of the prominent portions, and a roughed surface shape where particulate sputtering formed upon fabrication is secured. Thus, the molded resin intrudes into the constricted space formed by surface roughening to provide an anchoring effect against volume change of the resin in the direction where the resin is peeled from the surface of the metal member.

Abstract: A configuration for joining a ceramic layer has a thermal insulating material to a metallic layer. The configuration includes an interface layer made of metallic material located between the ceramic layer and the metallic layer, which includes a plurality of interlocking elements on one of its sides, facing the ceramic layer, the ceramic layer comprising a plurality of cavities aimed at connecting with the corresponding interlocking elements of the interface layer. The configuration also includes a brazing layer by means of which the interface layer is joint to the metallic layer. The invention also refers to a method for obtaining such a configuration.

Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.

Abstract: An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.

Abstract: In a laser cladding method, a laser beam is emitted from a semiconductor laser to melt alloy powder for laser cladding on the surface of a hydraulic support column. The semiconductor laser is a laser functioning with semiconductor material as gain medium and lighting by means of semiconductor material transition among energy bands. The hydraulic support column is mainly made of alloy steel of 27 SiMn. With the laser cladding method, the energy absorption efficiency of laser beam can be increased, and the energy utilization efficiency is increased, so that the power consumption is saved reduced.

Abstract: The invention relates to a method for additively manufacturing an article made of a difficult-to-weld highly-precipitation-strengthened Ni-base super alloy that comprises Al and Ti in the sum of more than 5 wt.-% or a difficult-to weld carbide/solution-strengthened cobalt (Co)-base super alloy, whereby a metal particle mixture of at least a first phase and a second phase is provided as a starting material, said first phase of the mixture being a base material and said second phase of the mixture being a material which is a derivative of the first material and has relative to said material of said first phase an improved weldability, and whereby the metal particle mixture is processed by means of an additive manufacturing process which is one of selective laser melting (SLM), selective laser sintering (SLS), electron beam melting (EBM), laser metal forming (LMF), laser engineered net shape (LENS), or direct metal deposition (DMD).

Abstract: A guide vane for a turbomachine axially pivotably coupled to a radially outwardly disposed flow-limiting wall and to a radially inwardly disposed inner ring of the turbomachine; and a trailing edge gap being formed between an upper trailing edge of the guide vane and the flow-limiting wall and/or between a lower trailing edge of the guide vane and the inner ring; the upper trailing edge and/or the lower trailing edge of the guide vane having at least one air outlet opening for an air outflow for forming an air curtain for at least partially sealing the trailing edge gap in the area of the upper trailing edge and/or the lower trailing edge in the area of the lower trailing edge. Also, a guide vane cascade, as well as a method for manufacturing a guide vane or a guide vane cascade.

Abstract: A laser annealing apparatus reduces laser annealing time and has a simple configuration. A laser annealing method is used to manufacture a display apparatus. The laser annealing apparatus includes a mounting unit, a substrate mounted on the mounting unit, first and second driving modules installed on the mounting unit and adjusting locations of first and second mark masks to be placed on a part of the substrate, first and second image modules that may obtain image data regarding the first and second mark masks to be location-adjusted by first and second driving modules, and a laser module that radiates a laser beam to the substrate and changes at least a part of an amorphous silicon layer of the substrate to crystalline silicon.

Abstract: A display device is manufactured by forming a semiconductor film over a substrate and irradiating the film with laser light. The laser light is generated from an oscillator, passes through an attenuator that includes a filter, and passes through an optical system after passing through the attenuator. A first region of the semiconductor film is irradiated with the laser light passed through the optical system such that one point of the first region of the semiconductor film is irradiated with at least two shots. A second region of the semiconductor film is also irradiated with the laser light passed through the optical system such that one point of the second region of the semiconductor film is irradiated with at least two shots. The first region and the second region have a portion at which they overlap, and the semiconductor film is etched into semiconductor layers for transistors in areas outside the portion.

Abstract: The sealing component 1 of the invention is provided with a metallic housing 19 that comprises a base part 19a, a side wall 19b connected to the base part 19a and an opening portion 19c facing to the base part 19a, and a metallic lid 20 to cover the opening portion 19c, wherein a melted portion 24 is formed around the boundary between the lid 20 and the upper edge 19b1, the melted portion 24 is formed to reach the corner 19b3 of the side wall 19b, and the melted portion 24 has a convexly-curved outward form 24a from the top face of the lid 20 to the corner 19b3 in the longitudinal cross-sectional view of the sealing component 1.

Abstract: Compositions and methods for making a three dimensional structure comprising: designing a three-dimensional structure; melting the three-dimensional structure from two or more layers of a metal powder with a high energy electron or laser beam is described herein. The position where the metal is melted into the structure is formed along a layer of metal powder, wherein the location and intensity of the beam that strikes the metal layer is based on the three-dimensional structure and is controlled and directed by a processor. The instant invention comprises a novel dry state sonication step for removing metal powder that is not melted from the three dimensional structure.

Abstract: A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements. The antenna resonating elements may be electrically connected to the antenna ground using solder. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The antenna ground may be formed form stamped sheet metal and may have slanted steps adjacent to the antenna resonating elements. To form a solder joint between the metal antenna resonating element traces and the sheet metal of the antenna ground, laser light may be applied to the sheet metal of the antenna ground in the vicinity of the solder paste. Separate metal members may also be provided in the vicinity of the solder paste and may be heated using the laser to join metal traces on plastic carriers.

Abstract: The invention refers to a method for manufacturing a hybrid component including the following steps of manufacturing a preform as a first part of the hybrid component, then successively building up on that preform a second part of the component from a metallic powder material by means of an additive manufacturing process by scanning with an energy beam, thereby establishing a controlled grain orientation in primary and in secondary direction of at least a part of the second part of the component. The controlled secondary grain orientation is realized by applying a specific scanning pattern of the energy beam, which is aligned to the cross section profile of the component or to the local load conditions for the component.

Abstract: A fiber mount device 2 includes a fiber sub-mount main body 31 that is made of ceramic transmitting a laser beam having a predetermined wavelength, a bonding pad 33 that is provided on the upper surface of the fiber sub-mount main body 31, and a laser absorption layer 32 that is provided on at least a part of the lower surface of the fiber sub-mount main body 31 and absorbs the laser beam having the predetermined wavelength.

Abstract: A laser beam irradiation apparatus irradiates a laser beam onto a sealing unit disposed between a first substrate and a second substrate so as to seal the first substrate and the second substrate. A center portion of the laser beam comprises a first beam profile having a beam intensity which increases toward a beam center portion, and a center of each of a plurality of peripheral portions of the laser beam is included in an area onto which the first beam profile is irradiated. The plurality of peripheral portions are symmetrically distributed around the first beam profile, and comprise a plurality of second beam profiles having the same beam intensities. The first beam profile and the plurality of second beam profiles are symmetrically distributed around a center point of the first beam profile and move in synchronization with one another.

Abstract: A housing includes first and second housing elements, each of which is heat conductive. The housing elements are joined by a joining process in which a joining material is configured between the first and second housing elements and at least one of the housing elements is heated such that the joining material is conditioned for the joining of the housing elements. At least one of the housing elements has a localized reduction in the heat conductivity such that the dissipation of heat in the at least one housing element is reduced.

Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

Abstract: Certain example embodiments of this invention relate to apparatuses for sealing the tips of pump-out tubes of vacuum insulating glass (VIG) units, and/or associated methods. In certain example embodiments, a laser source used in sealing the pump-out tube is thermally insulated from the VIG unit and emits a laser beam through one or more windows in an oven towards a mirror located therein. The mirror is located so as to redirect the laser beam onto the pump-out tube to thereby seal it. For instance, a substantially horizontal laser beam emitted from a laser source located outside the oven enters into the oven through one or more windows and is reflected by a mirror towards the pump-out tube to be sealed. The repositioning of the laser source advantageously can change its effective focal length and/or the location of the laser beam, e.g., because of the fixed location of the mirror.

Abstract: Provided is a method for manufacturing a metal structure in which an array of a plurality of pin arrangements is formed on a surface of a metal, in which the method includes: performing a laser processing along a route between pin regions in which the pins are to be formed on a metal base material to form a dross on the pin regions, and repeating the laser processing. As the dross formed in each pin region is repeatedly cast and recast during the repetitive laser processing, the recast layer is formed in a shape of the pin.

Abstract: Surface asperities, such as roughness characteristics, are reduced or otherwise mitigated via the control of surface regions including the asperities in different regimes. In accordance with various embodiments, the height of both high-frequency and low-frequency surface asperities is reduced by controlling characteristics of a surface region under a first regime to flow material from the surface asperities. A second regime is implemented to reduce a height of high-frequency surface asperities in the surface region by controlling characteristics of the surface region under a second regime to flow material that is predominantly from the high-frequency surface asperities, the controlled characteristics in the second regime being different than the controlled characteristics in the first regime. Such aspects may include, for example, controlling melt pools in each regime via energy pulses, to respectively mitigate/reduce the asperities.

Abstract: The present invention relates to a method and a device for manufacturing a three-dimensional object, wherein the object is generated by successively solidifying single layers of fluid or powdery solidifiable building material by the action of electromagnetic radiation. The method comprises steps for emitting a first pulsed electromagnetic radiation onto a first area of a layer of the building material, and for emitting a second continuous electromagnetic radiation onto a second area of the layer of the building material.

Abstract: Re-melting the material of a component transversely to the propagation direction of a crack in the component, providing a welding beam on the component and moving the welding beam at least transversely over the crack for re-melting the material, and more material is re-melted and increasing the strength of the re-melted crack.