Abstract: Certain example embodiments of this invention relate to apparatuses for sealing the tips of pump-out tubes of vacuum insulating glass (VIG) units, and/or associated methods. In certain example embodiments, a laser source used in sealing the pump-out tube is thermally insulated from the VIG unit and emits a laser beam through one or more windows in an oven towards a mirror located therein. The mirror is located so as to redirect the laser beam onto the pump-out tube to thereby seal it. For instance, a substantially horizontal laser beam emitted from a laser source located outside the oven enters into the oven through one or more windows and is reflected by a mirror towards the pump-out tube to be sealed. The repositioning of the laser source advantageously can change its effective focal length and/or the location of the laser beam, e.g., because of the fixed location of the mirror.

Abstract: Certain example embodiments of this invention relate to apparatuses for sealing the tips of pump-out tubes of vacuum insulating glass (VIG) units, and/or associated methods. In certain example embodiments, a laser source used in sealing the pump-out tube is thermally insulated from the VIG unit and emits a laser beam through one or more windows in an oven towards a mirror located therein. The mirror is located so as to redirect the laser beam onto the pump-out tube to thereby seal it. For instance, a substantially horizontal laser beam emitted from a laser source located outside the oven enters into the oven through one or more windows and is reflected by a mirror towards the pump-out tube to be sealed. The repositioning of the laser source advantageously can change its effective focal length and/or the location of the laser beam, e.g., because of the fixed location of the mirror.

Abstract: Cutting a workpiece with a laser beam includes using the laser beam to melt and/or vaporize at least a portion of the workpiece, and moving at least one of the workpiece and the laser beam relative to one another to form a cutting front on the workpiece, in which the laser beam includes either at least two different radially polarized beam portions offset relative to each along an advancing direction of the laser beam, or multiple laser beam strips extending along the advancing direction of the laser beam. Each laser beam strip has a different linear polarization direction, and the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam.

Abstract: A welding electrode hybrid laser arc welding is provided which is either a solid or metal core electrode. The electrode contains at least carbon, manganese, silicon, sulfur and phosphorus. The electrode has is no more than 0.02% carbon, manganese in the range of 0.6 to 1.2%, silicon in the range of 0.3 to 0.6%, no more than 0.01% sulfur, and no more than 0.01% phosphorus in % by weight of the electrode.

Abstract: A method of forming, on the surface of a glass material, a raised feature having a height within a target range, comprising (1) providing a glass material having a surface, (2) providing the glass material locally, at a location at or below the surface, with an amount of energy causing local expansion of the glass material so as to raise a feature on the surface at the location, (3) detecting the height of the raised feature or the height over time of the raised feature, (4) (a) if the height is below or approaching a value below the target range, providing the glass material at the location with energy in a greater amount, or (b) if the height is above or approaching a value above the target range, providing the glass material at the location with energy in a lesser amount, and (5) repeating steps (3) and (4) as needed to bring the height within the target range. Methods and devices for automating this process are also disclosed.

Abstract: A method of repairing damage in an optical element includes providing a laser system including at least one optical element having a coating layer having an incident light surface and directing a laser pulse from the laser system to impinge on the incident light surface. The method also includes sustaining damage to a portion of the incident light surface and melting the damaged portion of the incident light surface and a region adjacent to the damaged portion. The method further includes flowing material from the region adjacent the damaged portion to the damaged portion and solidifying the material in the damaged portion and the region adjacent to the damaged portion.

Abstract: A method of sealing a surface crack in a member is provided includes steps of irradiating a region of the member at which the crack is produced with a heating laser beam so as to heat the region to a temperature lower than a melting point of the member, and then irradiating a region of the member at which the crack is produced with a welding laser beam subsequent to irradiation of the heating laser beam so as to heat the region to a temperature higher than or equal to the melting point of the member, thereby sealing an opening of the surface crack of the member.

Abstract: A process for modifying or repairing a metallic component, such as a combustion cap effusion plate for a gas turbine, is disclosed. The method includes generating a notch or groove in the metallic component and depositing a filler material in the notch or groove. A pulsed laser is applied to the filler material. The pulsed laser has a power, frequency, and pulse width sufficient to apply heat to the metallic component and to the filler material to make at least a portion of the metallic component and the filler material melt in order to weld the filler material to the metallic component and repair or modify the metallic component. Various operating parameters of the pulsed laser can be configured to reduce undesirable heating affects.

Abstract: A high energy, high repetition rate workpiece surface heating apparatus is disclosed which comprise a XeF laser producing a laser output light pulse beam, an optical system narrowing the laser output light pulse beam in the short axis of the laser output light pulse beam and expanding the laser output light pulse beam to form in a long axis of the beam a workpiece covering extent of the long axis, the optical system focuses the laser output light pulse beam at a field stop with a magnification sufficient to maintain an intensity profile that has sufficiently steep sidewalls to allow the field stop to maintain a sufficiently steep beam profile at the workpiece.

Abstract: A vent member (10) includes: a support body (4) having a vent passage (a vent hole (3)) between an interior space (22) and an exterior space (24) of a housing (20); a gas-permeable membrane (2) disposed on the support body (4) to close the vent passage (3) on the side of the exterior space (24); a cover (6) attached to the support body (4) to protect the gas-permeable membrane (2); and a laser welding portion (12) that joins the cover (6) and the support body (4) together. For example, the support body (4) is made of a first material that relatively easily absorbs laser light for forming a laser welding portion (12). The cover (6) is made of a second material that absorbs less laser light than the first material and can transmit laser light.

Abstract: A method of producing an orthopedic implant including the steps of building a flat open model of at least a portion of an implant. The flat open model may be built using a selective laser sinter process. The flat open model preferably includes at least one groove along either a first surface or a second surface of the model. Next a force may be applied to the flat open model at predetermined locations to thereby cause the model to bend and assume a shape similar to a desired result. The now bent model may be resurfaced by either applying additional material such that the bent flat open model assumes the shape of a desired implant or the bent open model may be snap fit to an additional element.

Abstract: A glass container has a multiplicity of three-dimensional discernible glass fracture patterns disposed between the inside and outside surfaces of the container wall. The fracture patterns preferably are disposed in a visually discernible non-random pattern, such as in the form of text, a logo, a decorative pattern or a combination thereof. The glass container wall thus decorated preferably is substantially stress-free.

Abstract: Methods and apparatus for the calibration and use of test glide head gimbal assemblies are disclosed. Calibration is performed by pulse laser adjustment of the flexure mounted to the glide head, while the head is flying above a media test disk having asperities of known dimensions. The calibration process normalizes the fly heights of glide heads used to measure defects on both upper and lower surfaces of disk drive media, allowing upper and lower surfaces to be scanned simultaneously.

Abstract: It is an object to achieve continuous crystal growth without optical interference using a compact laser irradiation apparatus. A megahertz laser beam is split and combined to crystallize a semiconductor film. At this point of time, an optical path difference is provided between the split beams to reduce optical interference. The optical path difference is set to have a length equivalent to the pulse width of the megahertz laser beam or more and less than a length equivalent to the pulse repetition interval; thus, optical interference can be suppressed with a very short optical path difference. Therefore, laser beams can be applied continuously and efficiently without energy deterioration.

Abstract: The invention relates to a laser spot welding process for executing a spot weld in two successive steps, namely a first step of preparing the surface state of the material to be welded and a second step of welding as such. The luminous energy (BR) reflected by the weld region of the material is measured in real time during the first step and then processed by a controller circuit (37) connected to a control circuit (30) of the laser source (31). In this way, the characteristics (LM) of the laser beam are adjusted in real time as a function of the measurements effected to allow effective control of the quality of the weld obtained, and in particular of its dimensions. The invention also relates to a welding device for implementing this process.

Abstract: A continuous furnace 4 to which a laser is coupled by conventional optical means that allows the surface treatment of a part, with which it is possible to achieve temperatures of up to 3000° C. on said surface while the remainder of the part is at a substantially lower temperature. The part in the furnace is heated to a temperature of the order of 500° C. and, via an opening 5, a laser-beam bundle is applied to the part, scanning a line perpendicular to the direction of movement of the part such that the entire surface is scanned by means of the mechanical advance of the part. This scanning should extend beyond the lateral ends of the part. This type of laser-beam generator must be made compatible with the various colors with which the surface of the part is decorated. The furnace is divided into different zones, with independent temperature controls, for successfully achieving the desired values, both for heating and for cooling.

Abstract: A conductive terminal member is disposed at a portion between an insulating base film and an insulating cover film while insulating intermediate members are disposed at other portions therebetween. In this event, the intermediate members are formed in predetermined shapes and are located so as not to overlap the terminal member. The base film and the cover film are each melt-fixed to the intermediate members so that the terminal member is fixedly held between the base member and the cover film.

Abstract: A laser beam treatment device capable of solving problem in a conventional technology that any uniform laser anneal cannot be realized since use of a galvano mirror changes the angle of incidence of the laser beam to the substrate and the reflected light from a back side of a transmissive substrate interferes with the reflected light from a surface of a semiconductor film or an interface between the semiconductor film and the substrate. Laser anneal is performed by using the laser beam treatment device comprising a laser, an optical system for shaping the laser beam oscillated from the laser, and a substrate holds to hold a work formed on the transmissive substrate, in which the substrate holder holds a liquid, and the liquid is brought into contact with the surface.

Abstract: A method of making a solenoid actuator by laser direct metal deposition can comprise heating with a laser an outer surface of a circumferential groove of a solenoid tube blank constructed of a first material to create a heated area and depositing a second material upon the heated area to form a layer of second material. The second material can melt and then cool to thereby bond to the solenoid tube blank. A bore can be defined in the solenoid tube blank such that the bore includes an interior surface having a ring of second material disposed between a pair of portions of first material.

Abstract: A method of cutting bulk amorphous alloy includes: positioning a target cutting path of the bulk amorphous alloy in an atmosphere of an inert gas; cutting the target cutting path to form a cut surface using a pulsed laser; and removing a plurality of burrs located on the cut surface produced during the cut.

Abstract: A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line 5 along which the object is intended to be cut. Thereafter, the object 1 is irradiated with laser light L2 transmittable through an unmodified region of the object 1, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line 5 along which the object is intended to be cut. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line 5 along which the object is intended to be cut.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Abstract: A method for manufacturing a semiconductor light emitting element from a wafer in which a gallium nitride compound semiconductor has been laminated on a sapphire substrate having an orientation flat, comprises of: laminating a semiconductor layer on a first main face of the sapphire substrate having an off angle ? in a direction Xo parallel to the orientation flat; forming a first break groove that extends in a direction Y substantially perpendicular to the direction Xo, on the semiconductor layer side; forming a second break line that is shifted by a predetermined distance in the ±Xo direction from a predicted split line within the first break groove and parallel to the first break groove in the interior of the sapphire substrate and corresponding to the inclination of the off angle ?; and splitting the wafer along the first and/or second break line.

Abstract: An RFID transponder having a semiconductor die with a solderable contact area and an antenna made from a winding wire, wherein the winding wire is soldered to the contact area, and the solderable contact area is made from a nickel based alloy.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: Alternative designs, materials and manufacturing methods for guidewires. Some embodiments pertain to a composite guidewire having proximal and distal section, and a connector adapted and configured for permanently joining the proximal section to the distal section. In some embodiments, at least one of the sections is made of a linear-elastic nickel-titanium alloy. Several alternative guidewire tip constructions and/or designs including methods and techniques of construction are also disclosed.

Abstract: A method of manufacturing a vehicle structure including a laser welded fastener includes positioning a first panel in engagement with a second panel to provide access to the first panel by a laser beam. The first panel is laser welded to the second panel. A fastener including projections axially extending from a first surface of a flange are formed. The projections are engaged with a surface of the first panel to space apart the first surface of the flange from the surface of the first panel. Laser welding is initiated by directing a laser beam toward one of the flange of the fastener and the first panel. Gas is vented from an area between the first surface of the flange and the surface of the first panel. The flange is laser welded to the first panel.

Abstract: A selective layer melting or other additive layer fabrication method in which powdered material is fused by heating it with a pulsed laser, the pulses being modulated whilst the laser is traversing the substrate so as to control the thickness and/or width of the layer being formed. Initial layers of the fabrication structure may be formed more thickly than subsequent layers, e.g. by means of a CW laser, to reduce distortion. This aspect of the invention may be employed independently of the use of a pulsed laser to form the subsequent layers.

Abstract: A thin beam directional crystallization system configured to process a substrate comprises a laser configured to produce laser light, the laser configured to have a high energy mode and a low energy mode. The high energy mode is configured to produce light energy sufficient to completely melt a substrate coated with amorphous silicon film, while the low energy mode is configured to produce light energy that is not sufficient to completely melt a substrate coated with amorphous silicon film. The system further comprises beam shaping optics coupled to the laser and configured to convert the laser light emitted from the laser into a long thin beam with a short axis and a long axis, a stage configured to support the substrate and film, and a translator coupled with the stage, the translator configured to advance the substrate and film so as to produce a step size in conjunction with the firing of the laser.

Abstract: An energy storage device may include a housing and a fluid access aperture extending through a sidewall of housing that is used to fill the device with electrolytic fluid. In some examples, the fluid access aperture may define a length extending through the housing that is greater than a major width that extends across a cross-sectional area of the fluid access aperture. In some additional examples, the fluid access aperture may be angled relative to an axis that is substantially orthogonal to the housing. Depending on the situation, such example fluid access apertures may prevent electrolytic fluid from escaping from the energy storage device while the fluid access aperture is being sealed.

Abstract: Methods and apparatuses are provided for improving the intensity profile of a beam image used to process a semiconductor substrate. At least one photonic beam may be generated and manipulated to form an image having an intensity profile with an extended uniform region useful for thermally processing the surface of the substrate. The image may be scanned across the surface to heat at least a portion of the substrate surface to achieve a desired temperature within a predetermined dwell time. Such processing may achieve a high efficiency due to the large proportion of energy contained in the uniform portion of the beam.

Abstract: The invention relates to a method for the generation of raised and/or recessed structures on workpieces comprising the steps: applying a pressure difference between one side of a wall of the workpiece and another side substantially opposite thereto; local heating of the wall of the workpiece to a softening temperature of the workpiece by a heat source in order to induce local deformation of the wall of the workpiece; and cooling of the workpiece. The invention relates, moreover, to an apparatus for carrying out this method.

Abstract: A method of retouching metal parts joined by brazing at high temperatures is disclosed. The brazed zones are retouched by a retouching laser. The peak power of the retouching laser is between 1500 and 3000 W. The retouching laser is used in pulsed mode.

Abstract: A method for irradiating semiconductor material including irradiating a region of a semiconductor material layer surface with a first laser having laser irradiation parameters to melt at least a part of the region and controlling the irradiation process by adapting the irradiation parameters by determining the depth of the melted region part. An apparatus for irradiating semiconductor material is disclosed which has a first laser for irradiating a region of a semiconductor layer surface to melt at least a part of the region. The laser having laser irradiation parameters and a controller for controlling the irradiation process by adapting the laser irradiation parameters by determining the depth of the melted region part.

Abstract: A method of repairing damage in an optical element includes providing a laser system including at least one optical element having a coating layer having an incident light surface and directing a laser pulse from the laser system to impinge on the incident light surface. The method also includes sustaining damage to a portion of the incident light surface and melting the damaged portion of the incident light surface and a region adjacent to the damaged portion. The method further includes flowing material from the region adjacent the damaged portion to the damaged portion and solidifying the material in the damaged portion and the region adjacent to the damaged portion.

Abstract: The present invention discloses a method of efficiently manufacturing fuel cells having coated bipolar plates. The present invention contemplates the laser welding together of individual plates already having a coating thereon to form the bipolar plates that are used in a fuel cell. The laser welding of the coated plates together does not result in sensitization of the plates to a magnitude sufficient to cause an undesirable level of corrosion resistance. This result is achieved regardless of the presence of the organic coating in the region of the plates being welded and regardless of the ablating of the organic coating by the laser beam.

Abstract: An energy collector is used to assist a laser coupling process by reducing the amount of output power of a laser that is used to modify a device attaching element. The energy collector includes an energy collector tip configured to be placed proximate to a device attaching element during the laser coupling process. The energy collector tip is configured to receive laser energy reflected from the device attaching element during the laser coupling process and is formed from a material that converts this reflected energy to heat. Sufficient thermal coupling is created between the energy collector and a surface to provide a conductive pathway for the energy, which has been converted to heat, between the energy collector and the device attaching element.

Abstract: A system, method and masking arrangement are provided of enhancing the width of polycrystalline grains produced using sequential lateral solidification using a modified mask pattern is disclosed. One exemplary mask pattern employs rows of diamond or circular shaped areas in order to control the width of the grain perpendicular to the direction of primary crystallization.

Abstract: A method of repairing a turbomachine blisk having at least one damaged zone by build-up of metal in the damaged zone using a laser build-up welding machine is disclosed. The method includes preparing the damaged zone by machining the damaged zone to obtain a zone of defined profile to be repaired, build-up welding of a start-of-run test piece that includes the defined profile using the laser build-up welding machine, checking geometric and metallurgical quality of the test piece, and build-up welding the zone to be repaired of the blisk using the laser build-up welding machine.

Abstract: Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.

Abstract: In one embodiment, a method of fabricating an implantable pulse generator, comprises: providing a lead body including a plurality of conductors, the plurality of conductors being enclosed in insulative material along a first length of the conductors, a second length of the conductors being exposed from the insulative material; providing a tubular structure over the lead body with the plurality of conductors extending through the tubular structure; providing a feedthrough assembly including a plurality of feedthrough pins surrounded by insulator material, the feedthrough assembly further comprising a ferrule extending about an outer surface of the feedthrough assembly; attaching the plurality of conductors to the plurality of feedthrough pins; welding the ferrule of the feedthrough assembly to the tubular structure to form an intermediate assembly; welding the intermediate assembly to one or more housing components of the implantable pulse generator to hermetically seal the implantable pulse generator; and pro

Abstract: In one embodiment, a method of fabricating an implantable pulse generator, comprises: providing a lead body including a plurality of conductors, the plurality of conductors being enclosed in insulative material along a first length of the conductors, a second length of the conductors being exposed from the insulative material; providing a feedthrough component comprising a plurality of feedthrough pins; electrically coupling pulse generating circuitry through switching circuitry with the plurality of feedthrough pins; hermetically enclosing the pulse generating circuitry and switching circuitry within a housing, the feedthrough component being welded to the housing; laser machining each of the plurality of feedthrough pins to comprise a notch along a surface of the respective feedthrough pin; placing a respective conductor of the plurality of conductors in the slot of each of the plurality of feedthrough pins; and performing welding operations to connect the plurality of conductors of the lead body with the p

Abstract: To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.

Abstract: A system of interconnecting structures fabricated utilizing an additive manufacturing process is described. The system includes a first component comprising a first unit of an interconnection mechanism, and a second component comprising a second unit of an interconnection mechanism. The first component and first unit are integrally formed utilizing the additive manufacturing process as are the second component and the second unit. The first unit and the second unit are operable to engage one another to attach the first component to the second component.

Abstract: A method for manufacturing an eyeless needle by which a satisfactory hole can be formed in the end surface of a fine suture needle having a needle diameter less than 150 micrometers is proposed. In a method for manufacturing an eyeless needle by forming a hole for inserting and fixing one end of a suture thread by caulking in the end surface of the eyeless suture needle made of stainless steel, the hole is formed by irradiating the end surface of a needle material thicker by 6 to 20 micrometers than a desired needle diameter of the suture needle less than 150 micrometers with one shot of a laser beam, and subsequently, a portion thicker than the desired needle diameter is removed by electrolytic polishing or chemical polishing.

Abstract: A high energy, high repetition rate workpiece surface heating apparatus is disclosed which comprise a XeF laser producing a laser output light pulse beam, an optical system narrowing the laser output light pulse beam in the short axis of the laser output light pulse beam and expanding the laser output light pulse beam to form in a long axis of the beam a workpiece covering extent of the long axis, the optical system focuses the laser output light pulse beam at a field stop with a magnification sufficient to maintain an intensity profile that has sufficiently steep sidewalls to allow the field stop to maintain a sufficiently steep beam profile at the workpiece.

Abstract: By laser beam being slantly incident to the diffractive optics, an aberration such as astigmatism or the like is occurred, and the shape of the laser beam is made linear on the irradiation surface or in its neighborhood. Since the device has a very simple configuration, the optical adjustment is easier, and the device becomes compact in size. Furthermore, since the beam is slantly incident with respect to the irradiated body, the return beam can be prevented.

Abstract: With many coated sheets, in particular zinc-coated sheets as used in the automobile industry, the coating material has a much lower boiling point than the material of the sheet. On welding said sheets together the above leads to explosive evaporation of coating material which seriously affects the quality of the connection. In order to improve the quality of the connection it has already been disclosed that narrow gaps between the sheets can be produced by means of spacers, through which the coating material can escape. The spacers can be produced for example, by means of laser bombardment of the sheets. A disadvantage is the relatively long time necessary for machining, which causes large costs in particular for serial production. The aim of the invention is to reduce the time necessary for machining the sheets whilst at least maintaining, preferably improving the quality of the machining.

Abstract: A method of laser annealing a workpiece for reduction of warpage, slip defects and breakage, the method comprising (a) moving a workpiece through a laser beam in a x-axis first direction, (b) moving the workpiece in a y-axis second direction, (c) moving the workpiece through a laser beam in a minus x-axis first direction and repeating (a)-(c) until the workpiece is fully annealed in two successive laser annealing iterations.

Abstract: A laser processing head in accordance with the present invention comprises: a laser emitting unit for irradiating a workpiece with a laser light; and a powder feeder disposed around a periphery of the laser emitting unit for discharging filler material powder to the workpiece, in which the powder feeder includes: a position adjustment mechanism for adjusting a position where the powder concentrates; and a powder concentration diameter adjustment mechanism for adjusting a diameter of the filler material powder. The laser processing head further comprises a controller for controlling the position adjustment mechanism and the powder concentration diameter adjustment mechanism.