Methods Patents (Class 219/121.72)
  • Patent number: 10365479
    Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: July 30, 2019
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, David Sokol, Mark E. O'Loughlin, Jeff L. Dulaney
  • Patent number: 10359617
    Abstract: A microscope includes a holder for holding a sample, an objective for imaging at least apart of a sample held by the holder, a detection module, a control unit for setting the focus position of the objective in a first direction for the recording by means of the detection module, and a focusing module for maintaining a set focus position of the objective. The focusing module includes the control unit, a second detector and first focusing optics with adjustable focal length. The focusing module is switchable into a focus-hold mode, wherein an intensity-modulated object is imaged into the sample via the first focusing optics and the objective, and an image of the imaged object is recorded by means of the second detector. The control unit holds the focus position of the objective on the set focus position, based upon the recording of the second detector.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: July 23, 2019
    Assignee: Carl Zeiss Microscopy GmbH
    Inventors: Matthias Pospiech, Reiner Mitzkus, Marzena Franek, Peter Westphal
  • Patent number: 10279428
    Abstract: While conveying a flat plate material X, a laser blanking apparatus 100 for cutting the plate material X into a blank material with laser light emitted from a laser nozzle 11 includes an endless conveyor 1 for feeding the plate material X, a pair of upstream and downstream support rollers 21a and 21b provided below the laser nozzle 11, and a drawing roller 21c provided below the upstream and downstream support rollers 21a and 21b, wherein the upstream and downstream support rollers 21a and 21b and the drawing roller 21c guide the endless conveyor 1.
    Type: Grant
    Filed: February 8, 2014
    Date of Patent: May 7, 2019
    Assignee: HITACHI ZOSEN FUKUI CORPORATION
    Inventor: Akira Okazaki
  • Patent number: 10253633
    Abstract: A rotor of an exhaust-gas turbocharger includes a rotor hub and rotor blades disposed on the rotor hub. The rotor blades have a blade thickness distribution selected in such a way that the rotor blades have along their extent from a fluid inlet or leading edge to a fluid outlet or trailing edge at least one transition between a stiffness or rigidity-oriented blade thickness distribution and an inertia and stress-oriented blade thickness distribution over the height of the blade.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: April 9, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Michael Klaus, Timo Merenda, Bernhard Lehmayr, Meinhard Paffrath, Ivo Sandor, Endre Barti, Utz Wever
  • Patent number: 10254499
    Abstract: The present disclosure relates to a process, system and apparatus for multi-material additive manufacturing process comprising: extruding an extrudable material through a nozzle capable of moving along one or more axis and concurrently extruding one or more filaments, wherein the filament is embedded in, on or about the extrudable material from the nozzle.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: April 9, 2019
    Assignee: Southern Methodist University
    Inventors: Adam Cohen, Paul Samuel Krueger, Matt Saari, Edmond Richer, Bryan Cox, Bin Xia, Collin Gabriel Clay
  • Patent number: 10246309
    Abstract: There is provided an optical measurement device, a load handling apparatus, a method for protecting an optical measurement device and a method for updating a load handling apparatus, where the optical measurement device comprises a permeable surface for communicating light to and from the optical measurement device. A hydrophilic coating is arranged on the permeable surface.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 2, 2019
    Assignee: KONECRANES GLOBAL CORPORATION
    Inventors: Ari Nieminen, Jorma Merimaa, Hannu Jyväsjärvi
  • Patent number: 10239778
    Abstract: A method for severing a glass sheet includes preferentially heating a region of the glass sheet to form a softened region. A slit is formed in the softened region of the glass sheet to form a slit region. The slit extends at least partially into a thickness of the glass sheet. Heat is preferentially applied to the slit region of the glass sheet.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: March 26, 2019
    Assignee: CORNING INCORPORATED
    Inventors: Steven Edward DeMartino, David Alan Deneka, Aniello M. Palumbo
  • Patent number: 10203817
    Abstract: A method of forming an electrode structure for a capacitive touch sensor in a transparent conductive layer located on a transparent non-conductive layer which is located on a color filter layer by a direct write laser scribing process using a pulsed solid state laser, the laser wavelength, pulse length and beam profile at the substrate being selected to have a wavelength in the range 257 nm to 266 nm, a pulse length in the range 50 fs to 50 ns, and a top hat beam profile having a uniformity of power or energy density between a value (Emax) and a minimum value (Emin) of less than 10%, where uniformity is defined as (Emax?Emin)/(Emax+Emin). 1 Grooves can thus be formed in the transparent conductive layer to electrically isolate areas of the transparent conductive layer on opposite sides of each groove with substantially no damage to the transparent non-conductive layer or the color filter layer beneath the transparent conductive layer.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: February 12, 2019
    Assignee: M-SOLV LTD.
    Inventors: Camilo Prieto Rio, Yuk Kwan Chan
  • Patent number: 10205050
    Abstract: A method of separating a wafer including rows of light emitting devices is described. Dicing streets are provided on the wafer such that a respective one of the dicing streets is provided between each of the rows of light emitting devices on the wafer. The wafer is broken along a first one of the dicing streets to separate a first portion of the wafer from a remaining portion of the wafer. The first portion of the wafer includes more than one of the rows of light emitting devices. The first portion of the wafer is broken along a second one of the dicing streets to separate a second portion of the wafer from the first portion of the wafer.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 12, 2019
    Assignee: Lumileds LLC
    Inventors: Rao S. Peddada, Frank Lili Wei
  • Patent number: 10194533
    Abstract: A method for processing a PCBa panel to individualize the PCBa's on the PCBa panel and depanel the PCBa panel in substantially one step is described. The PCBa panel initially comprises a number of PCBa's having components and traces common to a number of different product SKUs. During processing, the PCBa panel is loaded into a machine containing a first and second laser. The first laser severs extra traces on each PCBa to individualize the PCBa's for specific SKUs and the second laser cuts the links between each PCBa, thereby depaneling the PCBa panel.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: January 29, 2019
    Assignee: SMART WAVE TECHNOLOGIES, INC.
    Inventors: Scott Arthur McMullen, Peter Zosimadis
  • Patent number: 10184828
    Abstract: An apparatus for the determination of geometric parameters of a laser beam, such as, for example, the beam diameter or the focus diameter. The apparatus includes a device for the emission of a laser beam into an active region, a detector arrangement, which can be positioned in the active region, a device for the provision of a relative movement between the laser beam and the detector arrangement, and a device for the registration and evaluation of a temporally varying signal of the detector arrangement. The detector arrangement includes at least one light guide, at least two flight-diffusing structures, and at least one light-sensitive sensor. The light guide has a light-emitting surface and a light-conducting region, with an elongated shape. The at least two light-diffusing structures are essentially extended along two different directions.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: January 22, 2019
    Assignee: Primes GmbH Messtechnik fuer die Produktion mit Laserstrahlung
    Inventors: Reinhard Kramer, Otto Maerten, Stefan Wolf
  • Patent number: 10177123
    Abstract: A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: January 8, 2019
    Assignee: GLO AB
    Inventors: Nathan Gardner, Fredrick A. Kish, Jr., Miljenko Modric, Anusha Pokhriyal, Daniel Bryce Thompson, Fariba Danesh, Sharon N. Farrens
  • Patent number: 10157793
    Abstract: A single-crystal substrate having a film deposited on a surface thereof is processed to divide the single-crystal substrate along a plurality of preset division lines, including a shield tunnel forming step of applying a pulsed laser beam having such a wavelength that permeates through the single-crystal substrate to the single-crystal substrate from a reverse side thereof along the division lines to form shield tunnels, each including a fine hole and an amorphous region shielding the fine hole, in the single-crystal substrate along the division lines, a film removing step of removing the film deposited on the single-crystal substrate along the division lines, and a dividing step of exerting an external force on the single-crystal substrate to which the shield tunnel forming step and the film removing step are performed to divide the single-crystal substrate along the division lines along which the shield tunnels have been formed.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: December 18, 2018
    Assignee: DISCO CORPORATION
    Inventors: Hiroshi Morikazu, Noboru Takeda, Takumi Shotokuji
  • Patent number: 10144668
    Abstract: Methods and apparatus for cutting a glass sheet along a cutting line into a desired shape. A laser source is configured to apply a laser beam to a beam location on the cutting line of the glass sheet. A source of cooling fluid is configured to apply a cooling fluid to a cooling band on the glass sheet to reduce a temperature of the glass sheet along the cooling path while elevating the temperature of the glass sheet at the beam location with the laser beam. The source of cooling fluid is configured to apply the cooling path as a cooling ring to circumscribe the beam location on the cutting line with the cooling band circumferentially spaced from the beam location while the cooling path and the beam location move simultaneously together in order to propagate a fracture in the glass sheet along the cutting line.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: December 4, 2018
    Assignee: Corning Incorporated
    Inventors: Andrew Stephen Altman, Todd Benson Fleming, Anping Liu, James Joseph Watkins
  • Patent number: 10124440
    Abstract: A laser processing device forms a modified region in an object to be processed by converging ultrashort pulse laser light at the object and comprises a laser light source emitting the laser light, a converging optical system converging the laser light emitted from the laser light source at the object, and an aberration providing part imparting an aberration to the laser light converged at the object by the converging optical system.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: November 13, 2018
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Daisuke Kawaguchi, Makoto Nakano, Ryota Sugio, Tsubasa Hirose, Keisuke Araki
  • Patent number: 10109765
    Abstract: LED module chips are assembled by preparing red, green and blue LED substrates in regions partitioned at predetermined intervals. A module substrate has on its upper face a plurality of module chips each having an accommodation region for accommodating the red, green and blue LEDs therein. The front face of the LED substrate on which the LEDs are formed is opposed to the upper face of the module substrate. One of the LEDs is positioned to a predetermined one of the accommodation regions of the module chip, and a laser beam is irradiated from a rear face of the LED substrate to a buffer layer of LED with a condensing point of the laser beam positioned to the buffer layer to peel off the LED from an epitaxy substrate and accommodate the LED into the predetermined accommodation region of the module chip.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: October 23, 2018
    Assignee: DISCO Corporation
    Inventor: Kazuma Sekiya
  • Patent number: 10010436
    Abstract: A method of manufacturing a polymeric stent by forming a pattern on a polymer tube with a laser, where the pattern formed on the polymer tube comprises a plurality of repeating units comprising a plurality of unit cells, each having a V-shaped configuration and polymeric stents formed by the methods. The pattern may be formed on the polymer tube (e.g., polylactic acid tube) using a second harmonic generator laser in which a wavelength ranging from 940 nm to 1552 nm is converted.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: July 3, 2018
    Assignee: DOTTER INTELLECTUAL PTE, LTD.
    Inventor: Hyung-Il Kim
  • Patent number: 9984909
    Abstract: The present application discloses methods, and systems for laser-scribing a solar panel and the solar panels. The method for laser-scribing the solar panel may comprise: capturing consecutively images of parts of a first line on the solar panel, the first line having a pre-designed shape; acquiring location information of each of the captured images of the first line; and laser-scribing parts of a second line on the solar panel consecutively, according to the acquired location information of the first line, so that the scribed second line has the pre-designed shape of the first line and maintains a fixed distance from the first line.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: May 29, 2018
    Assignee: The Chinese University of Hong Kong
    Inventors: Xiaofu Zhang, Shihang Yang, Jinlong Gao, Jiakuan Zhu, Kefan Wang, Xudong Xiao
  • Patent number: 9981345
    Abstract: A laser processing machine employs a step of forming a pierced hole at a sheet material portion on an inner or outer side of a closed route when a processing to form a hole in the sheet material by cutting along a closed route is carried out. Following this pierced hole a step to perform a cutting process to cut to a predetermined position with a center of the laser beam traversing the closed route and a step of returning, in a condition in which laser irradiation is interrupted, a position of the laser processing head relative to the sheet material to assume a start position lying on the route during a step of cutting to the predetermined position and on the closed route are employed. Thereafter, a step of performing the cutting process from the start position along the closed route is carried out.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: May 29, 2018
    Assignee: Murata Machinery, Ltd.
    Inventor: Keita Matsumoto
  • Patent number: 9972575
    Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a split laser beam laser scribing process, such as a split shaped laser beam laser scribing process, to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: May 15, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Jungrae Park, Wei-Sheng Lei, Brad Eaton, James S. Papanu, Ajay Kumar
  • Patent number: 9919383
    Abstract: A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: March 20, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventor: Junji Kano
  • Patent number: 9908168
    Abstract: The invention relates to a method for producing a shaped sheet metal part including the following steps, continuous feeding of a sheet metal band unwound from a coil to a jet cutter, concurrent cutting, by means of the jet cutter, of a blank out of the sheet metal band as it moves at a constant speed, the time required to produce the blank defining a cycle, picking up the blank by means of a first transfer device operating in time with the cycle, transferring the blank by means of a first transfer device to a shaping system operating in time with the cycle, and shaping the blank into a shaped sheet metal part by means of the shaping system.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: March 6, 2018
    Assignee: SCHULER AUTOMATION GMBH & CO. KG
    Inventors: Martin Liebel, Thomas Pohl
  • Patent number: 9889524
    Abstract: Systems and techniques for optimizing the operation of a beam emitter during material processing maintain an optimal polarization of the beam with respect to the material throughout processing—e.g., even as the beam path varies or the nature or thickness of the material changes.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: February 13, 2018
    Assignee: TERADIODE, INC.
    Inventors: Parviz Tayebati, Wang-Long Zhou, Bien Chann, Robin Huang
  • Patent number: 9884391
    Abstract: Use of a laser beam (1) which has one external and one internal laser beam area (4,7) with different intensities enables a higher temperature gradient to be produced in the z-direction.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: February 6, 2018
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Georg Bostanjoglo, Bernd Burbaum
  • Patent number: 9873167
    Abstract: A laser system comprising a laser that produces a pulsed laser beam is configured to form a laser-induced channel in a multi-layer substrate including first and second material layers. The material layers may have different refractive indices. The laser-induced channel includes a uniform distribution of self-focus damage volumes through at least a portion of the thickness of one or both of the material layers. One of the material layers may be partially transparent or non-transparent. An optical assembly of the laser system can be configured to produce uniformly distributed self-focus damage volumes at an effective focal region corresponding to the substrate thickness. The distribution of damage volumes can be tailored to include areas or peaks of high damage volume density where it is desired to ablate material.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: January 23, 2018
    Assignee: GENTEX CORPORATION
    Inventors: Kurtis L. Geerlings, Donald L. Bareman, William L. Tonar
  • Patent number: 9861508
    Abstract: A method of laser machining a polymer construct to form a stent that includes a bioresorbable polymer and an absorber that increases absorption of laser energy during laser machining. The laser cuts the tubing at least in part by a multiphoton absorption mechanism and the polymer and absorber have a very low absorbance or are transparent to light at the laser wavelength.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: January 9, 2018
    Assignee: Abbott Cardiovascular Systems Inc.
    Inventors: Stephen D. Pacetti, Joel Harrington
  • Patent number: 9850159
    Abstract: A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL1, CSL2), and at least one interface region (IR1, IR2) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL1, CSL2) and is transparent to allow propagation of the laser beam (14) through the layered material (31).
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: December 26, 2017
    Assignee: Corning Incorporated
    Inventors: Manoj K. Bhuyan, Ottavia Jedrkiewicz, Paolo Di Trapani, Vytautas Sabonis, Mindaugas Mikutis
  • Patent number: 9773941
    Abstract: Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The light emitting devices are disposed in rows. The method includes dividing the wafer into a plurality of regions. Each region comprises a plurality of rows of light emitting devices and a first region is wider than a second region. For each region, the method includes determining a position of first and second dicing streets. The dicing streets are located between the rows of light emitting devices. The method includes determining, using the position of the first and second dicing streets, positions of a plurality of dicing streets disposed between the first and second dicing streets. The method includes cutting the wafer along streets.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: September 26, 2017
    Assignee: Koninklijke Philips N.V.
    Inventors: Satyanarayana Rao Peddada, Frank Lili Wei
  • Patent number: 9768141
    Abstract: An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: September 19, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: JaeYong Park, Junyoung Ko, Whasu Sin, Kyhyun Jung
  • Patent number: 9755192
    Abstract: A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: September 5, 2017
    Assignee: Samsung Display Co., Ltd.
    Inventors: Junghwa You, Taeyong Kim, Hyojin Kim, Ilyoung Jeong, Gyoowan Han, Jekil Ryu, Jinho Lee
  • Patent number: 9691923
    Abstract: An apparatus for and a method of forming a plurality of groups of laser beams (2, 2?, 2?) are defined. Each group (2, 2?, 2?) may comprise two or more laser beams. The apparatus comprises a first diffractive optical element (3, referred as DOE) and a second diffractive optical element (8), the first DOE (3) being arranged to receive a first laser beam (1) and to divide this into a plurality of second laser sub-beams and the second DOE (8) being arranged to receive said plurality of second laser sub-beams and to divide each of these into two or more groups of third laser sub-beams (2, 2?, 2?), the separation of the groups in a direction perpendicular to a first axis being adjustable by rotation of the first DOE (3) about its optical axis and the separation of the third laser sub-beams (2, 2?, 2?) within each group in a direction perpendicular to the first axis being adjustable by rotation of the second DOE (8) about its optical axis.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: June 27, 2017
    Assignee: M-SOLV LTD.
    Inventors: Adam North Brunton, Simon John Henley
  • Patent number: 9653638
    Abstract: A method of fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a metal layer on the dielectric layer. The method can also include configuring a laser beam with a particular shape and directing the laser beam with the particular shape on the metal layer, where the particular shape allows a contact to be formed between the metal layer and the solar cell structure.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: May 16, 2017
    Assignees: SunPower Corporation, Total Marketing Services
    Inventors: Matthieu Moors, David D. Smith, Gabriel Harley, Taeseok Kim
  • Patent number: 9624121
    Abstract: Methods and apparatus provide for supporting a source glass sheet and defining an at least partially non-straight cutting line that establishes a closed pattern that circumscribes a desired final shape; scoring the glass sheet at an initiation line using a mechanical scoring device; applying a laser beam to the glass sheet starting at the initiation line and continuously moving the laser beam relative to the glass sheet along the cutting line to elevate a temperature of the glass sheet at the cutting line to a substantially consistent temperature, where the laser beam is of a circular shape; and applying a cooling fluid simultaneously with the application of the laser beam, such that the cooling fluid at least reduces the temperature of the glass sheet in order to propagate a fracture in the glass sheet along the cutting line.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: April 18, 2017
    Assignee: Corning Incorporated
    Inventors: Anatoli Anatolyevich Abramov, Bernd Christoph Hoetzel
  • Patent number: 9610729
    Abstract: A device and a method for performing and monitoring a plastic laser transmission welding process includes a processing beam source for emitting a processing radiation into a joining zone between two joining members so that a weld seam is formed, a measuring beam source for irradiating a measuring zone with a measuring radiation, a detection unit for detecting the measuring radiation reflected by an interface between the weld seam and its surroundings in the joining members, and an evaluation unit connected to the detection unit for determining the depth position of the interface in the joining members from the detected reflected measuring radiation.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: April 4, 2017
    Assignee: LPKF LASER & ELECTRONICS AG
    Inventors: Manuel Sieben, Dominik Hertle
  • Patent number: 9592571
    Abstract: A laser apparatus for welding is disclosed. The laser apparatus includes: a laser optic head adapted and configured to modify a spot size of a laser beam oscillated by a laser oscillator and to project the laser beam into a joining portion of joining members, wherein the laser optic head is adapted and configured to modify the spot size to selectively perform brazing or welding. A method of selectively brazing or welding according to one or more exemplary embodiments of the present invention includes: providing a laser apparatus of as described herein; and actuating the laser optic head to modify the spot size of the laser beam and project the laser beam into the joining portion of the joining members to selectively perform brazing or welding.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: March 14, 2017
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Kwang Min Oh
  • Patent number: 9566663
    Abstract: There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: February 14, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kanji Nishida, Naoyuki Matsuo, Atsushi Hino
  • Patent number: 9455149
    Abstract: A plate-like object processing method for processing a plate-like object including a substrate and a laminate formed on a front surface of the substrate, includes a substrate exposing step of exposing the substrate by removing the laminate by irradiating a region in which the laminate of the plate-like object is desired to be removed with a laser beam set at an energy density that destroys the laminate but does not destroy the substrate.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: September 27, 2016
    Assignee: DISCO CORPORATION
    Inventors: Yuki Ogawa, Yuki Ishida, Tsubasa Obata
  • Patent number: 9422184
    Abstract: Provided is a cutting method for a glass sheet, comprising radiating a laser beam to a cutting portion (C) of a glass sheet (G) having a thickness of 500 ?m or less to fuse the glass sheet (G), wherein a narrowest gap between fused end surfaces (Ga1 and Gb1) of the glass sheet (G), which face each other in the cutting portion (C), is managed to satisfy a relationship of 0.1?b/a?2, where “a” is a thickness of the glass sheet (G) and “b” is the narrowest gap.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: August 23, 2016
    Assignee: NIPPON ELECTRIC GLASS CO., LTD.
    Inventors: Takahide Fujii, Setsuo Uchida, Naotoshi Inayama, Takayuki Noda, Sho Itoh, Michiharu Eta
  • Patent number: 9360643
    Abstract: There are provided high power laser connectors and couplers and methods that are capable of providing high laser power without the need for active cooling to remote, harsh and difficult to access locations and under difficult and harsh conditions and to manage and mitigate the adverse effects of back reflections.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: June 7, 2016
    Assignee: Foro Energy, Inc.
    Inventors: Charles C. Rinzler, William C. Gray, Jason D. Fraze, Brian O. Faircloth, Mark S. Zediker, Ryan P. McKay
  • Patent number: 9312178
    Abstract: A method of dicing a plurality of integrated devices included in a semiconductor substrate using laser energy comprises the steps of directing a first laser beam onto a cutting line along the substrate to ablate a portion of the substrate located along the cutting line to be diced, the portion of the substrate that is ablated forming a recast material adjacent to the cutting line of the substrate that has been diced. A second laser beam is directed onto another portion of the substrate adjacent to the cutting line to conduct heat processing of the recast material formed adjacent to the cutting line.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: April 12, 2016
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Karel Maykel Richard Van Der Stam, Guido Martinus Henricus Knippels, Mark Christian Mueller, Juergen Roland Betz
  • Patent number: 9295969
    Abstract: A planar object to be processed 1 comprising a hexagonal SiC substrate 12 having a front face 12a forming an angle corresponding to an off-angle with a c-plane is prepared. Subsequently, the object 1 is irradiated with pulse-oscillated laser light L along lines to cut 5a, 5m such that a pulse pitch becomes 10 ?m to 18 ?m while locating a converging point P of the laser light L within the SiC substrate 12. Thereby, modified regions 7a, 7m to become cutting start points are formed within the SiC substrate 12 along the lines 5a, 5m.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: March 29, 2016
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Junji Okuma, Takeshi Sakamoto
  • Patent number: 9296069
    Abstract: A method of preparing an apparatus for material processing by generating optical breakthroughs in an object. The apparatus includes a variable focus adjustment device. A contact element is mounted to the apparatus, the contact element has a curved contact surface having a previously known shape. The position of the contact surface is determined prior to processing the object, by focusing measurement laser radiation near or on the surface by the variable focus adjustment device, and the focus position is adjusted in a measurement surface intersecting the expected position of the contact surface. Radiation from the focus of the measurement laser radiation is confocally detected. The position of points of intersection between the measurement surface and the contact surface is determined from the confocally detected radiation to determine the position of the contact surface from the position of the points of intersection and the previously known shape of the contact surface.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: March 29, 2016
    Assignee: Carl Zeiss Meditec AG
    Inventors: Mark Bischoff, Gregor Stobrawa
  • Patent number: 9278485
    Abstract: Apparatus, method and system for cutting a polymeric stent including the use of a polymeric mandrel as a laser shielding device. The polymeric mandrel is allowed to roll freely within a polymeric tube that is cut into a polymeric stent.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: March 8, 2016
    Assignee: Abbott Cardiovascular Systems Inc.
    Inventors: David C. Gale, Yunbing Wang, Svava Maria Atladottir, Klaus Kleine
  • Patent number: 9226402
    Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 29, 2015
    Assignee: MC10, INC.
    Inventor: Yung-Yu Hsu
  • Patent number: 9193214
    Abstract: Various flexible heat sealable decorative articles and methods of making the same are described. The flexible heat sealable decorative articles are lightweight and can be combined with other decorative elements, such as metalized films. Various decorative are mixed or combined with one another to form highly attractive flexible heat sealable decorative articles.
    Type: Grant
    Filed: October 14, 2013
    Date of Patent: November 24, 2015
    Assignee: High Voltage Graphics, Inc.
    Inventor: Louis Brown Abrams
  • Patent number: 9174306
    Abstract: A laser processing method for a nonlinear crystal substrate having a plurality of crossing division lines which includes the step of applying a pulsed laser beam to a work surface of the nonlinear crystal substrate along the division lines to thereby form a plurality of laser processed grooves on the work surface along the division lines. The pulse width of the pulsed laser beam is set to 200 ps or less and the repetition frequency of the pulsed laser beam is set to 50 kHz or less.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: November 3, 2015
    Assignee: Disco Corporation
    Inventors: Hiroshi Morikazu, Yoko Nishino
  • Patent number: 9130031
    Abstract: A wafer processing method including a modified layer forming step of applying a laser beam having a transmission wavelength to a substrate from the back side of the substrate along division lines. The modified layer forming step includes the steps of making the polarization plane of linearly polarized light of the laser beam parallel to the direction perpendicular to each division line, shifting the beam center of the laser beam from the optical axis of a focusing lens of a focusing unit for focusing the laser beam, in the direction perpendicular to each division line, and shifting the focal point of the laser beam by the focusing lens in the same direction as the direction where the beam center of the laser beam has been shifted.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: September 8, 2015
    Assignee: Disco Corporation
    Inventor: Tomohiro Endo
  • Patent number: 9099546
    Abstract: A dividing method for a workpiece having a substrate with a film formed on the front side thereof. A first laser beam is applied to the film from the front side of the workpiece along the streets formed on the film, thereby forming a plurality of laser processed grooves along the streets to cut the film along the streets. Thereafter, an adhesive tape is attached to the front side of the workpiece. Thereafter, a second laser beam is applied to the substrate from the back side of the workpiece along the streets in the condition where the focal point of the second laser beam is set inside the substrate, thereby forming a plurality of modified layers inside the substrate along the streets. Thereafter, the adhesive tape is expanded to thereby divide the substrate along the streets, thereby obtaining a plurality of individual devices. Thereafter, the back side of the substrate of each device is ground to remove the modified layers and reduce the thickness of each device to a predetermined thickness.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: August 4, 2015
    Assignee: Disco Corporation
    Inventor: Masaru Nakamura
  • Patent number: 9076800
    Abstract: A method for forming an identification mark on a silicon carbide single crystal substrate according to the present invention includes: (a) scanning a principal surface of a silicon carbide single crystal substrate with a laser beam at a first energy density such that a groove is formed in the principal surface of the silicon carbide single crystal substrate, thereby forming an identification mark which is constituted of one or more grooves in the principal surface of the silicon carbide single crystal substrate; and (b) scanning an inside of the groove formed in the principal surface of the silicon carbide single crystal substrate with a laser beam at a second energy density that is lower than the first energy density.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: July 7, 2015
    Assignee: Hitachi Metals, Ltd.
    Inventor: Sadahiko Kondo
  • Patent number: RE45885
    Abstract: A method of fabricating an electronic device, the device including a plurality of layers on a substrate, the layers including an upper conductive layer and at least one patterned underlying layer between said conductive layer and said substrate. The method includes patterning said underlying layer, and patterning said upper conductive layer by laser ablation using a stepwise process in which successive areas of said upper conductive layer are ablated by successively applied laser patterns. The successively applied laser patterns overlap one another in an overlap region. The method further includes configuring a said laser pattern and said patterned underlying layer with respect to one another such that in a said overlap region said patterned underlying layer is substantially undamaged by said stepwise laser ablation.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: February 9, 2016
    Assignee: Flexenable Limited
    Inventors: Paul A. Cain, Carl Hayton