Methods Patents (Class 219/121.72)
  • Patent number: 11114341
    Abstract: A laser processing method for a substrate with a device formed on a front surface thereof and including an electrode pad, the method including: a laser beam applying step of applying the laser beam to the back surface of the substrate to form a fine hole in the substrate at a position corresponding to the electrode pad; a detecting step of detecting first plasma light emitted from the substrate at the same time that the fine hole is formed in the substrate by the laser beam applied thereto, and second plasma light emitted from the electrode pad; and a laser beam irradiation finishing step of stopping application of the laser beam when the second plasma light is detected in the detecting step. A peak power density of the laser beam to be applied is set in a range from 175 GW/cm2 or less to 100 GW/cm2 or more.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: September 7, 2021
    Assignee: DISCO CORPORATION
    Inventor: Hiroshi Morikazu
  • Patent number: 11065708
    Abstract: A plasma-torch cutting machine gantry moves in a first axis and the torch mounted through a pantograph to a drive box moves along the gantry in a second axis. The drive box rotates the torch about a third axis, and tilts the torch about a fourth axis. The drive box moves vertically in a fifth axis. The torch is mountable with tip at pantograph focal point or in an extended position. A controller firmware computes and apply offsets in the first, second and fifth axis to maintain the plasma torch tip in desired position despite the torch being mounted in extended position, rotation and tilt of the torch. In embodiments the torch is rotatable ?/+90 degrees from vertical; and a laser scanner maps surfaces and edges of beams to determine movements and rotations for cutting beams.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: July 20, 2021
    Inventor: Matthew Fagan
  • Patent number: 11034102
    Abstract: A process arrangement and a process for the production of a fiber-reinforced plastics component made of at least one continuous-fiber-reinforced semifinished textile fiber product with reactive thermoplastic matrix material, where during the manufacture of the semifinished fiber product trimming residues (mR, mA) arise, composed of a composite made of fibers and of the reactive thermoplastic matrix material, and during finishing of the finished plastics component final-trimming residues (mE) arise, composed of a composite of fibers and of polymerized thermoplastic matrix material, and are further processed in a recycling unit to give a recyclate. The trimming residues arising during the manufacture of the semifinished fiber product are polymerized in a preparatory unit and then are delivered in the invention to the recycling unit.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: June 15, 2021
    Assignee: Volkswagen Aktiengesellschaft
    Inventors: Thomas Mertens, Max Ehleben, Christine Kunze, Olaf Täger, Maurice Bitterlich, Katja Zeuner, Philippe Desbois, Andreas Wollny
  • Patent number: 11037812
    Abstract: The transfer of devices or device components from a carrier substrate to a further carrier substrate or to a plurality of further carrier substrates can be performed with little effort (few transfer steps) to the at least one further carrier substrate. The method comprises producing first devices on the first carrier substrate in a two-dimensional grid. It comprises defining positions on the second carrier substrate on the basis of the two-dimensional grid for at least some of the first devices. It comprises releasing a plurality of the first devices from the first carrier substrate while maintaining the two-dimensional grid. Finally, the plurality of first devices are applied to the second carrier substrate in the defined positions while maintaining the two-dimensional grid or a multiple thereof in at least one of the two directions.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: June 15, 2021
    Assignee: X-FAB SEMICONDUCTOR FOUNDRIES GMBH
    Inventors: Ralf Lerner, Oliver Haluch
  • Patent number: 11030736
    Abstract: A method for applying AOI to copper coils thinned by laser etching includes placing a half-finished product under a scanning unit; scanning the half-finished product to generate an image; sending the image to an image analysis unit which is activated to analyze the image, identify cutting boundaries of the half-finished product, compare the cutting boundaries with an original processing path file, and identify defects of the half-finished product; activating the image analysis unit to find points around the half-finished product; activating the image analysis unit to simulate an optimum path; activating the image analysis unit to convert the optimum path into an optimum processing path file; activating the image analysis unit to send the optimum processing path file to a program unit; conveying the half-finished product to dispose under a laser processing unit; and activating the program unit to instruct the laser processing unit to process the half-finished product.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: June 8, 2021
    Assignees: Laser Tek Taiwan Co., Ltd
    Inventors: Meng-I Huang, Hsueh-Yi Hsiung, Po-Nien Su
  • Patent number: 11022754
    Abstract: The present disclosure generally relates to a method for processing optical fibers supported by a multi-fiber ferrule. The method can include laser cutting first and second rows of optical fibers in a first fiber cutting step by directing a laser beam in a first direction relative to the ferrule. The laser beam can cut the second row of optical fibers to a first fiber extension length and cut the first row of optical fibers to a second fiber extension length. The method can also include laser cutting the first row of optical fibers by directing a laser beam in a second direction relative to the multi-fiber ferrule. The laser beam cuts the first row of optical fibers to the first fiber extension length and by-passes the second row of optical fibers such that optical fibers of the second row of optical fibers remain at the first fiber extension length.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: June 1, 2021
    Assignee: CommScope Asia Holdings B.V.
    Inventor: Marcellus P J Buijs
  • Patent number: 11014193
    Abstract: A method and a control device for deflection of a laser beam for laser-based additive manufacturing processes includes first and second orthogonally rotatable mirrors designed to reflect the laser beam and guide the laser beam to an irradiation field. The first mirror and the second mirror are secured on respective first and second shafts, with the first mirror performing a continuous first vibration with a first frequency, and the second mirror performing a continuous second vibration with a second frequency different from the first frequency and/or with a phase difference with respect to the first vibration. Each of the two shafts has a known position such that the first vibration is synchronous with the second vibration. The laser is activated/deactivated upon reaching/leaving an irradiation point. The generated vibrations of the mirrors describe a continuous Lissajous curve.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: May 25, 2021
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Matthias Dürr
  • Patent number: 11004728
    Abstract: A method for sawing a semiconductor wafer is provided. The method includes sawing a semiconductor wafer to form a first opening. In addition, the semiconductor wafer includes a dicing tape and a substrate attached to the dicing tape by a die attach film (DAF), and the first opening is formed in an upper portion of the substrate. The method further includes sawing through the substrate and the DAF of the semiconductor wafer from the first opening to form a middle opening under the first opening and a second opening under the middle opening, so that the semiconductor wafer is divided into two dies. In addition, a slope of a sidewall of the middle opening is different from slopes of sidewalls of the first opening and the second opening.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: May 11, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Chun-Yen Lo, Kuo-Chio Liu
  • Patent number: 10987759
    Abstract: When water jet guided laser drilled through the first body, there is a confined embodiment between the first body and the second body. To prevent water jet guided laser to continue in this direction and create damage on the second body, a volume vibrator is connected to the embodiment and media that filled embodiment get pumped in and pumped out from the embodiment at adjustable frequency and cycle volume. Mechanical energy is then transferred into the embodiment to generate local media vibration. The laminar flowing state of the water jet is interrupted and the laser beam confined in the water jet is dispersed. Plugging method is also involved to insure when there are multiple holes on the embodiment, there will be enough mechanical energy get transferred to the laser breakthrough location.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: April 27, 2021
    Inventor: Zhaoli Hu
  • Patent number: 10930560
    Abstract: A method for creating a detachment area in a solid, in particular for detaching the solid along the separating region. Said solid portion that is to be detached is thinner than the solid body from which the solid portion has been removed. Said method preferably comprises at least the following steps: the crystal lattice of the solid is modified by means of a modifying agent, in particular by means of at least one laser, in particular a pico- or femtosecond laser. The modifications, in particular the laser beams penetrate into the solid via a surface of the solid portion which is to be detached, several modifications are created in the crystal lattice, said crystal lattice penetrates, following said modifications, in the areas surrounding the modifications, at least in one particular part.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: February 23, 2021
    Assignee: Siltectra GmbH
    Inventors: Christian Beyer, Jan Richter
  • Patent number: 10921255
    Abstract: An achromatic 3D STED measuring optical process and optical method, based on a conical diffraction effect or an effect of propagation of light in uniaxial crystals, including a cascade of at least two uniaxial or conical diffraction crystals creating, from a laser source, all of the light propagating along substantially the same optical path, from the output of an optical bank to the objective of a microscope. A spatial position of at least one luminous nano-emitter, structured object or a continuous distribution in a sample is determined. Reconstruction of the sample and its spatial and/or temporal and/or spectral properties is treated as an inverse Bayesian problem leading to the definition of an a posteriori distribution, and a posteriori relationship combining, by virtue of the Bayes law, the probabilistic formulation of a noise model, and possible priors on a distribution of light created in the sample by projection.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: February 16, 2021
    Inventors: Gabriel Y. Sirat, Lionel Moisan, Clément Fallet, Julien Caron, Maxime Dubois
  • Patent number: 10898975
    Abstract: A laser processing device includes: a support table; a laser light source; a converging optical system; an imaging unit configured to image a front surface of an object; a candidate line setting unit configured to set a plurality of candidate lines; an operation controller configured to control operation of at least one of the support table, the laser light source, and the converging optical system such that a modified region is formed inside the object along each of the plurality of candidate lines, and a crack reaches the front surface of the object from the modified region; and a reference line setting unit configured to set a reference line determined as a line indicating a crystal orientation of the object on the basis of an image of the crack.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: January 26, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Junji Okuma, Yo Sugimoto
  • Patent number: 10892191
    Abstract: A method of manufacturing a semiconductor device, includes irradiating a division region of a semiconductor wafer with laser to form a plurality of modified portions arranged in a direction along the division region in the semiconductor wafer, and splitting the semiconductor wafer into a plurality of semiconductor chips using a groove generated from the plurality of modified portions in the semiconductor wafer. The plurality of modified portions is at a first interval in a first part of the division region and at a second interval smaller than the first interval in a second part of the division region.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: January 12, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takanobu Ono, Yusuke Dohmae
  • Patent number: 10840666
    Abstract: Laser systems and methods are disclosed. One laser system comprises: a plurality of laser resonators, each resonator being operable to discharge an input laser beam; a relay assembly including at least one curved reflective surface that redirects each input laser beam, and reduces a beam size of the redirected beam; a galvo including a curved reflective surface that receives each redirected beam, and outputs a combined laser beam at power level greater than a power level of each laser input beam; and a coupling assembly that reduces spherical aberrations in the combined laser beam, and directs the combined laser beam into an optical fiber. In this system, the combined laser beam may have a maximum beam parameter product lower than a minimum beam parameter product of the optical fiber. Related systems and methods are also disclosed.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: November 17, 2020
    Assignee: Boston Scientific Scimed, Inc.
    Inventor: Honggang Yu
  • Patent number: 10835990
    Abstract: In one aspect, methods of fabricating cutting tools employing ultrahard materials are described herein. A method of making a cutting tool comprises electronically loading a cutting tool pattern into a laser machining system and providing a blank to the laser machining system, the blank comprising a layer of ultrahard material. The cutting tool pattern is administered to the blank via a single laser processing step to form the cutting tool including at least one as-formed cutting edge comprising the ultrahard material and having an edge radius less than 10 ?m. The single laser processing step can provide the cutting tool in final form, thereby obviating further processing steps.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: November 17, 2020
    Assignee: KENNAMETAL INC.
    Inventors: Naveen Kumar Kondameedi, Christoph Gey, Joseph Velesig, Gerald Natter
  • Patent number: 10828717
    Abstract: A lap welding method of a steel sheet includes spot welding in a state in which the flange portion of a second steel sheet member having the flange portion and a standing wall portion is overlapped with the first steel sheet member, thereby forming a nugget between a first steel sheet member and a flange portion; and, after the spot welding, laser welding a region between an R stop of the standing wall portion and the nugget, thereby forming a weld bead, and, in the weld bead, a length dimension is equal to or longer than a diameter of the nugget, and a width dimension is 0.5 to 3.0 mm.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: November 10, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Seiji Furusako, Tohru Okada, Koichi Sato, Yasunobu Miyazaki
  • Patent number: 10821707
    Abstract: The present invention generally relates to multi-layer, flat glass structures and a method of manufacturing multi-layer, flat glass structures.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: November 3, 2020
    Assignee: VAON, LLC
    Inventor: Henry B Steen
  • Patent number: 10814422
    Abstract: Methods, machines, and computer-readable mediums for determining distance correction values of a desired distance between a laser processing nozzle on a laser processing head and a workpiece during laser processing of the workpiece are provided. In some implementations, the workpiece is scanned along a desired path of a surface of the workpiece separately by the laser processing nozzle and a measurement head arranged in place of the laser processing nozzle on the laser processing head, with a capacitively measured distance identical to the desired distance. The measurement head has a lower lateral sensitivity of a capacitance measurement than the laser processing nozzle. Respective scanned movement paths of the laser processing nozzle and the measurement head are determined. The distance correction values for the desired distance of the laser processing nozzle are then determined from the scanned movement paths determined with the laser processing nozzle and the measurement head.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: October 27, 2020
    Assignee: TRUMPF Laser-und Systemtechnik GmbH
    Inventors: Tobias Hagenlocher, Thomas Kieweler, Michael Reyer, Wolf Wadehn
  • Patent number: 10766101
    Abstract: The invention relates to a device for producing an adhesive tape (2), comprising a supply unit (5) for supplying a strip-type textile carrier (3) of the adhesive tape (2), and a coating unit (6) for applying an at least lamellar adhesive coating (4) to at least one side of the carrier (3). The invention also relates to an ultrasound unit (9 and 10) and/or a laser unit for producing perforations and/or cut edges in the carrier (3).
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: September 8, 2020
    Assignee: certoplast Technische Klebebaender GmbH
    Inventors: Peter Rambusch, Rene Rambusch, Timo Leermann
  • Patent number: 10759005
    Abstract: A laser cutting and machining method for plated steel plated, when irradiating a laser beam LB on to the upper surface of a plated steel plate W and laser cutting and machining same: a plating layer-containing metal that has been melted and/or evaporated by the irradiation of the laser beam LB is caused to flow on to a cut surface of the plated steel plate W as a result of assist gas that is jetted towards a laser machining units; and the plating layer-containing metal is coated on the cut surface.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: September 1, 2020
    Assignees: AMADA HOLDINGS CO., LTD., NISSHIN STEEL CO., LTD.
    Inventors: Hideo Hara, Masahito Ito, Masanori Uehara, Hiroshi Asada, Hirokazu Sasaki, Hiroshi Horikawa
  • Patent number: 10689286
    Abstract: A method includes cutting an outer diameter into a glass substrate. An inner diameter within the outer diameter is also cut into the glass substrate. A first region inside the outer diameter and a second region inside the inner diameter are heated. The second region inside the inner diameter is cooled, wherein the cooling causes the second region to detach from the first region.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: June 23, 2020
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: David Marcus Tung, Donald E. Curtiss, Henry Luis Lott, Valeriu Rusu, Mitchell Tomio Inouye, Gabriel V. Sapinoso, Joachim Walter Ahner
  • Patent number: 10668561
    Abstract: An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: June 2, 2020
    Assignee: coherent, inc.
    Inventors: Michael R. Greenberg, David M. Gaudiosi, Jochen Deile
  • Patent number: 10646961
    Abstract: A laser-machining device includes an arrangement for producing and guiding a working laser beam. The arrangement includes a nozzle having an opening for emission of the working laser beam to a machining zone. An optical axis is defined in the arrangement and at least one element focuses the working laser beam near the opening of the nozzle. The machining process is monitored via at least one group of detector arrangements for a radiation characteristic of the machining process and an associated evaluating unit. The detector arrangements of each group are arranged in a ring shape about the optical axis. The observation direction of the detector arrangements extends, at least in a sub-region, between the focusing element closest to the machining zone and the machining zone, at a polar angle, in relation to the optical axis of the working laser beam.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: May 12, 2020
    Assignee: BYSTRONIC LASER AG
    Inventors: Roland Bader, Andreas Lüdi
  • Patent number: 10589445
    Abstract: A method of cleaving off a daughter single crystal substrate from a parent single crystal substrate includes providing a stress-mandrel and the parent a single crystal substrate. The parent single crystal substrate has a major surface and an edge surface that intersects the major surface. The major surface extends along a major surface plane. The stress-mandrel has a stress-mandrel coefficient of thermal expansion that is higher than the parent single crystal coefficient of thermal expansion. The method includes bonding the stress-mandrel to the major surface, and cooling the parent single crystal substrate and the stress-mandrel. The cooling of the parent single crystal substrate bonded to the stress-mandrel provides a thermal stress in the parent single crystal substrate sufficient to cleave the parent single crystal substrate. The cleaving extends substantially along a plane parallel to the plane of the major surface. In one embodiment the cleaved daughter substrate was used to make a photovoltaic cell.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: March 17, 2020
    Assignee: Semivation, LLC
    Inventors: Toshiharu Furukawa, Mark Charles Hakey, David Vaclav Horak, Peter H. Mitchell, William P. Parker, William R. Tonti
  • Patent number: 10589380
    Abstract: The present invention has as its object to inhibit fracture due to a HAZ softened part in substantially circular laser lap welding taking the place of resistance spot welding for joining a superposed plurality of steel sheets including a high strength steel sheet. To solve this problem, the inventors discovered lap welding comprising superposing a plurality of steel sheets and firing a laser to form a substantially circular laser weld (1), which lap welding firing the laser in a straight line through an outer edge of the substantially circular laser weld (1) so as to form a hardened part (8) at the steel sheets and thereby suppressing fracture arising from the HAZ softened part.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: March 17, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Hiroki Fujimoto, Tohru Okada, Takashi Imamura
  • Patent number: 10584054
    Abstract: A method for separating a thin glass, in which method the thin glass is progressively heated along a path which forms a parting line, wherein the heating of the glass is realized by way of the energy of at least one energy source within an area of action of the energy source on the thin glass, and, by way of a temperature gradient of the glass heated by way of the at least one energy source in relation to the surrounding glass, a mechanical stress is generated in the glass, by way of which mechanical stress, a crack propagates, following the mechanical stress, along the parting line.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: March 10, 2020
    Assignee: Schott AG
    Inventors: Jürgen Vogt, Thomas Rossmeier, Dirk Förtsch
  • Patent number: 10510923
    Abstract: Disclosed are a display device and a method of manufacturing a display device. The method of a display device according to an exemplary embodiment of the present disclosure includes: a first transferring step of transferring a plurality of LEDs disposed on a wafer onto a plurality of donors; and a second transferring step of transferring the plurality of LEDs transferred onto the plurality of donors onto a display panel, in which in the second transferring step, an area where one of the plurality of donors overlaps the display panel partially overlaps an area where the other one of the plurality of donors overlaps the display panel. Therefore, the plurality of LEDs having different wavelengths is uniformly transferred to reduce a boundary caused by the difference in wavelengths and improve color uniformity.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: December 17, 2019
    Assignee: LG Display Co., Ltd.
    Inventor: ChungHwan An
  • Patent number: 10365479
    Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: July 30, 2019
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, David Sokol, Mark E. O'Loughlin, Jeff L. Dulaney
  • Patent number: 10359617
    Abstract: A microscope includes a holder for holding a sample, an objective for imaging at least apart of a sample held by the holder, a detection module, a control unit for setting the focus position of the objective in a first direction for the recording by means of the detection module, and a focusing module for maintaining a set focus position of the objective. The focusing module includes the control unit, a second detector and first focusing optics with adjustable focal length. The focusing module is switchable into a focus-hold mode, wherein an intensity-modulated object is imaged into the sample via the first focusing optics and the objective, and an image of the imaged object is recorded by means of the second detector. The control unit holds the focus position of the objective on the set focus position, based upon the recording of the second detector.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: July 23, 2019
    Assignee: Carl Zeiss Microscopy GmbH
    Inventors: Matthias Pospiech, Reiner Mitzkus, Marzena Franek, Peter Westphal
  • Patent number: 10279428
    Abstract: While conveying a flat plate material X, a laser blanking apparatus 100 for cutting the plate material X into a blank material with laser light emitted from a laser nozzle 11 includes an endless conveyor 1 for feeding the plate material X, a pair of upstream and downstream support rollers 21a and 21b provided below the laser nozzle 11, and a drawing roller 21c provided below the upstream and downstream support rollers 21a and 21b, wherein the upstream and downstream support rollers 21a and 21b and the drawing roller 21c guide the endless conveyor 1.
    Type: Grant
    Filed: February 8, 2014
    Date of Patent: May 7, 2019
    Assignee: HITACHI ZOSEN FUKUI CORPORATION
    Inventor: Akira Okazaki
  • Patent number: 10254499
    Abstract: The present disclosure relates to a process, system and apparatus for multi-material additive manufacturing process comprising: extruding an extrudable material through a nozzle capable of moving along one or more axis and concurrently extruding one or more filaments, wherein the filament is embedded in, on or about the extrudable material from the nozzle.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: April 9, 2019
    Assignee: Southern Methodist University
    Inventors: Adam Cohen, Paul Samuel Krueger, Matt Saari, Edmond Richer, Bryan Cox, Bin Xia, Collin Gabriel Clay
  • Patent number: 10253633
    Abstract: A rotor of an exhaust-gas turbocharger includes a rotor hub and rotor blades disposed on the rotor hub. The rotor blades have a blade thickness distribution selected in such a way that the rotor blades have along their extent from a fluid inlet or leading edge to a fluid outlet or trailing edge at least one transition between a stiffness or rigidity-oriented blade thickness distribution and an inertia and stress-oriented blade thickness distribution over the height of the blade.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: April 9, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Michael Klaus, Timo Merenda, Bernhard Lehmayr, Meinhard Paffrath, Ivo Sandor, Endre Barti, Utz Wever
  • Patent number: 10246309
    Abstract: There is provided an optical measurement device, a load handling apparatus, a method for protecting an optical measurement device and a method for updating a load handling apparatus, where the optical measurement device comprises a permeable surface for communicating light to and from the optical measurement device. A hydrophilic coating is arranged on the permeable surface.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 2, 2019
    Assignee: KONECRANES GLOBAL CORPORATION
    Inventors: Ari Nieminen, Jorma Merimaa, Hannu Jyväsjärvi
  • Patent number: 10239778
    Abstract: A method for severing a glass sheet includes preferentially heating a region of the glass sheet to form a softened region. A slit is formed in the softened region of the glass sheet to form a slit region. The slit extends at least partially into a thickness of the glass sheet. Heat is preferentially applied to the slit region of the glass sheet.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: March 26, 2019
    Assignee: CORNING INCORPORATED
    Inventors: Steven Edward DeMartino, David Alan Deneka, Aniello M. Palumbo
  • Patent number: 10203817
    Abstract: A method of forming an electrode structure for a capacitive touch sensor in a transparent conductive layer located on a transparent non-conductive layer which is located on a color filter layer by a direct write laser scribing process using a pulsed solid state laser, the laser wavelength, pulse length and beam profile at the substrate being selected to have a wavelength in the range 257 nm to 266 nm, a pulse length in the range 50 fs to 50 ns, and a top hat beam profile having a uniformity of power or energy density between a value (Emax) and a minimum value (Emin) of less than 10%, where uniformity is defined as (Emax?Emin)/(Emax+Emin). 1 Grooves can thus be formed in the transparent conductive layer to electrically isolate areas of the transparent conductive layer on opposite sides of each groove with substantially no damage to the transparent non-conductive layer or the color filter layer beneath the transparent conductive layer.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: February 12, 2019
    Assignee: M-SOLV LTD.
    Inventors: Camilo Prieto Rio, Yuk Kwan Chan
  • Patent number: 10205050
    Abstract: A method of separating a wafer including rows of light emitting devices is described. Dicing streets are provided on the wafer such that a respective one of the dicing streets is provided between each of the rows of light emitting devices on the wafer. The wafer is broken along a first one of the dicing streets to separate a first portion of the wafer from a remaining portion of the wafer. The first portion of the wafer includes more than one of the rows of light emitting devices. The first portion of the wafer is broken along a second one of the dicing streets to separate a second portion of the wafer from the first portion of the wafer.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 12, 2019
    Assignee: Lumileds LLC
    Inventors: Rao S. Peddada, Frank Lili Wei
  • Patent number: 10194533
    Abstract: A method for processing a PCBa panel to individualize the PCBa's on the PCBa panel and depanel the PCBa panel in substantially one step is described. The PCBa panel initially comprises a number of PCBa's having components and traces common to a number of different product SKUs. During processing, the PCBa panel is loaded into a machine containing a first and second laser. The first laser severs extra traces on each PCBa to individualize the PCBa's for specific SKUs and the second laser cuts the links between each PCBa, thereby depaneling the PCBa panel.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: January 29, 2019
    Assignee: SMART WAVE TECHNOLOGIES, INC.
    Inventors: Scott Arthur McMullen, Peter Zosimadis
  • Patent number: 10184828
    Abstract: An apparatus for the determination of geometric parameters of a laser beam, such as, for example, the beam diameter or the focus diameter. The apparatus includes a device for the emission of a laser beam into an active region, a detector arrangement, which can be positioned in the active region, a device for the provision of a relative movement between the laser beam and the detector arrangement, and a device for the registration and evaluation of a temporally varying signal of the detector arrangement. The detector arrangement includes at least one light guide, at least two flight-diffusing structures, and at least one light-sensitive sensor. The light guide has a light-emitting surface and a light-conducting region, with an elongated shape. The at least two light-diffusing structures are essentially extended along two different directions.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: January 22, 2019
    Assignee: Primes GmbH Messtechnik fuer die Produktion mit Laserstrahlung
    Inventors: Reinhard Kramer, Otto Maerten, Stefan Wolf
  • Patent number: 10177123
    Abstract: A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: January 8, 2019
    Assignee: GLO AB
    Inventors: Nathan Gardner, Fredrick A. Kish, Jr., Miljenko Modric, Anusha Pokhriyal, Daniel Bryce Thompson, Fariba Danesh, Sharon N. Farrens
  • Patent number: 10157793
    Abstract: A single-crystal substrate having a film deposited on a surface thereof is processed to divide the single-crystal substrate along a plurality of preset division lines, including a shield tunnel forming step of applying a pulsed laser beam having such a wavelength that permeates through the single-crystal substrate to the single-crystal substrate from a reverse side thereof along the division lines to form shield tunnels, each including a fine hole and an amorphous region shielding the fine hole, in the single-crystal substrate along the division lines, a film removing step of removing the film deposited on the single-crystal substrate along the division lines, and a dividing step of exerting an external force on the single-crystal substrate to which the shield tunnel forming step and the film removing step are performed to divide the single-crystal substrate along the division lines along which the shield tunnels have been formed.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: December 18, 2018
    Assignee: DISCO CORPORATION
    Inventors: Hiroshi Morikazu, Noboru Takeda, Takumi Shotokuji
  • Patent number: 10144668
    Abstract: Methods and apparatus for cutting a glass sheet along a cutting line into a desired shape. A laser source is configured to apply a laser beam to a beam location on the cutting line of the glass sheet. A source of cooling fluid is configured to apply a cooling fluid to a cooling band on the glass sheet to reduce a temperature of the glass sheet along the cooling path while elevating the temperature of the glass sheet at the beam location with the laser beam. The source of cooling fluid is configured to apply the cooling path as a cooling ring to circumscribe the beam location on the cutting line with the cooling band circumferentially spaced from the beam location while the cooling path and the beam location move simultaneously together in order to propagate a fracture in the glass sheet along the cutting line.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: December 4, 2018
    Assignee: Corning Incorporated
    Inventors: Andrew Stephen Altman, Todd Benson Fleming, Anping Liu, James Joseph Watkins
  • Patent number: 10124440
    Abstract: A laser processing device forms a modified region in an object to be processed by converging ultrashort pulse laser light at the object and comprises a laser light source emitting the laser light, a converging optical system converging the laser light emitted from the laser light source at the object, and an aberration providing part imparting an aberration to the laser light converged at the object by the converging optical system.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: November 13, 2018
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Daisuke Kawaguchi, Makoto Nakano, Ryota Sugio, Tsubasa Hirose, Keisuke Araki
  • Patent number: 10109765
    Abstract: LED module chips are assembled by preparing red, green and blue LED substrates in regions partitioned at predetermined intervals. A module substrate has on its upper face a plurality of module chips each having an accommodation region for accommodating the red, green and blue LEDs therein. The front face of the LED substrate on which the LEDs are formed is opposed to the upper face of the module substrate. One of the LEDs is positioned to a predetermined one of the accommodation regions of the module chip, and a laser beam is irradiated from a rear face of the LED substrate to a buffer layer of LED with a condensing point of the laser beam positioned to the buffer layer to peel off the LED from an epitaxy substrate and accommodate the LED into the predetermined accommodation region of the module chip.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: October 23, 2018
    Assignee: DISCO Corporation
    Inventor: Kazuma Sekiya
  • Patent number: 10010436
    Abstract: A method of manufacturing a polymeric stent by forming a pattern on a polymer tube with a laser, where the pattern formed on the polymer tube comprises a plurality of repeating units comprising a plurality of unit cells, each having a V-shaped configuration and polymeric stents formed by the methods. The pattern may be formed on the polymer tube (e.g., polylactic acid tube) using a second harmonic generator laser in which a wavelength ranging from 940 nm to 1552 nm is converted.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: July 3, 2018
    Assignee: DOTTER INTELLECTUAL PTE, LTD.
    Inventor: Hyung-Il Kim
  • Patent number: 9984909
    Abstract: The present application discloses methods, and systems for laser-scribing a solar panel and the solar panels. The method for laser-scribing the solar panel may comprise: capturing consecutively images of parts of a first line on the solar panel, the first line having a pre-designed shape; acquiring location information of each of the captured images of the first line; and laser-scribing parts of a second line on the solar panel consecutively, according to the acquired location information of the first line, so that the scribed second line has the pre-designed shape of the first line and maintains a fixed distance from the first line.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: May 29, 2018
    Assignee: The Chinese University of Hong Kong
    Inventors: Xiaofu Zhang, Shihang Yang, Jinlong Gao, Jiakuan Zhu, Kefan Wang, Xudong Xiao
  • Patent number: 9981345
    Abstract: A laser processing machine employs a step of forming a pierced hole at a sheet material portion on an inner or outer side of a closed route when a processing to form a hole in the sheet material by cutting along a closed route is carried out. Following this pierced hole a step to perform a cutting process to cut to a predetermined position with a center of the laser beam traversing the closed route and a step of returning, in a condition in which laser irradiation is interrupted, a position of the laser processing head relative to the sheet material to assume a start position lying on the route during a step of cutting to the predetermined position and on the closed route are employed. Thereafter, a step of performing the cutting process from the start position along the closed route is carried out.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: May 29, 2018
    Assignee: Murata Machinery, Ltd.
    Inventor: Keita Matsumoto
  • Patent number: 9972575
    Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a split laser beam laser scribing process, such as a split shaped laser beam laser scribing process, to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: May 15, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Jungrae Park, Wei-Sheng Lei, Brad Eaton, James S. Papanu, Ajay Kumar
  • Patent number: 9919383
    Abstract: A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: March 20, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventor: Junji Kano
  • Patent number: 9908168
    Abstract: The invention relates to a method for producing a shaped sheet metal part including the following steps, continuous feeding of a sheet metal band unwound from a coil to a jet cutter, concurrent cutting, by means of the jet cutter, of a blank out of the sheet metal band as it moves at a constant speed, the time required to produce the blank defining a cycle, picking up the blank by means of a first transfer device operating in time with the cycle, transferring the blank by means of a first transfer device to a shaping system operating in time with the cycle, and shaping the blank into a shaped sheet metal part by means of the shaping system.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: March 6, 2018
    Assignee: SCHULER AUTOMATION GMBH & CO. KG
    Inventors: Martin Liebel, Thomas Pohl
  • Patent number: 9889524
    Abstract: Systems and techniques for optimizing the operation of a beam emitter during material processing maintain an optimal polarization of the beam with respect to the material throughout processing—e.g., even as the beam path varies or the nature or thickness of the material changes.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: February 13, 2018
    Assignee: TERADIODE, INC.
    Inventors: Parviz Tayebati, Wang-Long Zhou, Bien Chann, Robin Huang