Cutting Patents (Class 219/121.67)
  • Patent number: 10993334
    Abstract: A method of layering a layer of circuitry pattern to another layer of circuitry pattern during the manufacturing of a multilayer flexible printed circuit in a reel-to-reel machine. The method includes feeding both layers of circuitry pattern reel-to-reel into the machine, placing a layer of dielectric sheet material on the fly between the two layers of circuitry patterns reel-to-reel, followed by simultaneously passing the two layers of circuitry pattern and the dielectric sheet material under a laser scanner in the reel-to-reel machine to irradiate a laser beam on a layer of circuitry pattern to weld the two layers of circuitry patterns together.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: April 27, 2021
    Assignee: Manaflex, LLC
    Inventor: Robert Clinton Lane
  • Patent number: 10981249
    Abstract: Provided is an epoch-making method in which an original sheet is continuously fed, and a rectangular electrode sheet with a tab can be cut out from the original sheet with a normal laser beam during the continuous feeding. The original sheet 1 is continuously moved. An ear portion 1b is separated from an electrode portion 1a with a first laser beam L1 in an ear portion separating region provided in the middle of movement of the original sheet 1, is taken up at a position where the ear portion 1b is separated, in a direction separated from a running direction of the electrode portion 1a, and the laser beam L1 is moved in the ear portion separating step to cut out a tab 5 connected to the electrode portion 1a, from the ear portion 1b.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: April 20, 2021
    Assignee: O.M.C. CO., LTD.
    Inventor: Shinji Watanabe
  • Patent number: 10967574
    Abstract: A laser additive manufacturing apparatus and a method thereof are provided. The apparatus includes an irradiation unit that irradiates an irradiation region with a laser beam having a light intensity distribution converted by a diffractive optical element, a head having a material supplying unit for supplying powder material to the irradiation region, and a movement mechanism which relatively moves the head and a workpiece. In the irradiation region, irradiation light forms a substantially circular spot having a light intensity distribution in which light intensity in an outer peripheral portion is higher than light intensity in a central portion, and the central portion has predetermined light intensity, and the material supplying unit supplies the powder material to the substantially circular spot.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: April 6, 2021
    Assignee: DMG MORI Company Limited
    Inventor: Masaki Kondo
  • Patent number: 10955358
    Abstract: A workpiece having an outer peripheral portion rotationally symmetric about a symmetry axis can be inspected with high-accuracy while reducing cycle time of the inspection. In an inspection for each of the workpieces, on the basis of the image of the workpiece acquired by executing a first step of capturing an image of the workpiece while holding the workpiece at a pre-alignment position using a holding table and rotating the workpiece about a rotary axis, a position of the workpiece at the holding table is corrected so as to eliminate misalignment of the symmetry axis with respect to the rotary axis. Thereafter, on the basis of the image acquired by executing a fifth step of capturing an image of the workpiece while rotating the workpiece about the rotary axis at an inspection position, the workpiece is inspected. In the inspection of the workpiece, the fifth step for a previous workpiece of two consecutive workpieces and the first step for a next workpiece are executed in parallel with each other.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: March 23, 2021
    Assignee: SCREEN HOLDINGS CO., LTD.
    Inventor: Takumi Yoshida
  • Patent number: 10923398
    Abstract: A wafer processing method of dividing a wafer into a plurality of chips along a plurality of division lines includes: a shield tunnel forming step of causing a focusing point of a pulsed laser beam of a wavelength having a transmitting property with respect to the wafer to be positioned inside the wafer and applying the pulsed laser beam, and then forming a plurality of shield tunnels each including a fine hole and an amorphous region shielding the fine hole along the division lines; and a wafer dividing step of applying an external force to the wafer and then dividing the wafer in which the shield tunnels are formed along the division lines, in which the pulsed laser beam is split to have two or more of the focusing points which are along a direction parallel to the division lines.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: February 16, 2021
    Assignee: DISCO CORPORATION
    Inventor: Noboru Takeda
  • Patent number: 10898974
    Abstract: The present disclosure relates to the field of display technologies, and provides an abutment, a laser cutting device and a control method thereof, so as to improve the yield rate and prolong the service life of a product. Specifically, the abutment comprises a carrying region. The carrying region is used for placing a component to be cut thereon, and comprises an adsorbing region and a cutting region. Furthermore, the adsorbing region is provided with adsorbing holes for adsorbing the component to be cut. Besides, the cutting region extends from a side of the carrying region to an opposite side thereof.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: January 26, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lu Liu, Mingche Hsieh, Hejin Wang
  • Patent number: 10864598
    Abstract: Disclosed herein is an evaluation jig that is a jig to be used for evaluation of a height position detection unit that detects the height position of a holding surface of a chuck table of a laser processing apparatus. The evaluation jig includes a to-be-irradiated surface which is to be irradiated with a detection laser beam, an actuator that moves the to-be-irradiated surface in a Z-axis direction, a base section that supports the actuator and is mounted on the holding surface of the chuck table, and a control unit that controls movement of the actuator.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: December 15, 2020
    Assignee: DISCO CORPORATION
    Inventor: Kenji Furuta
  • Patent number: 10843297
    Abstract: A method of creating thin wafers of single crystal silicon, sapphire and similar materials, wherein an ingot of single crystalline material, or a ribbon of single crystalline material is cleaved, in a plane parallel to a surface, with laser light focused to a line in the desired plane of cleavage, near the growing cleavage furrow. The light is of a wavelength that the material is transparent to, but for which the material has strong two- or three-photon absorption. Consequently the light is not appreciably absorbed until it reached the desired focal line. The light is presented in an extremely short pulse, which heats and expands the material at the line focus, before the heat can be dissipated. This expansion creates tangential stresses around the focal line. These stresses are designed to be precisely normal to the growing cleavage furrow.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: November 24, 2020
    Inventor: Stephen C Baer
  • Patent number: 10814423
    Abstract: An optical processing apparatus includes a light source, a condensing optical system, and a shaping optical system. The light source emits light. The condensing optical system condenses the light emitted from the light source onto a processing target position on a surface of an object to be processed. The shaping optical system shapes a spot shape of the condensed light, such that a ratio of a major axis diameter of the spot shape to a minor axis diameter of the spot shape, in a cross section orthogonal to an optical axis of the condensed light on the object to be processed, is a minimum at or adjacent to a focal position of the shaping optical system. A method for optically processing an object is also provided.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: October 27, 2020
    Assignee: RICOH COMPANY, LIMITED
    Inventor: Hiroyuki Suhara
  • Patent number: 10814425
    Abstract: An improved laser-machining head unit for fabric comprising a diagonal mirror assembly with a tubular sleeve extending downward to an internally threaded distal tip. An annular adapter is provided with an externally-threaded male fining at one end and an internally-threaded receptacle at an opposing end. The externally-threaded male fitting of the adapter is adjustably screw-threaded into the internally threaded distal tip of the tubular sleeve. A laser nozzle has a frusto-conical tip and an annular collar Cm attachment to the adapter, the collar being externally threaded and fixedly screw-inserted into the internally-threaded receptacle of the adapter. In addition, there is a gas inlet affixed to the collar of the laser nozzle for introducing gas at a 90-degree angle thereto. The screw-adjustable configuration ensures proper alignment at all times of the lens, the beam and the nozzle aperture, and air stream.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: October 27, 2020
    Inventor: John Murkin
  • Patent number: 10814433
    Abstract: Disclosed is a system for efficiently cutting a transparent substrate. The system includes a laser source in optical communication with at least one multi-foci optical system. The laser source outputs at least one optical signal to the optical system. The optical system is positioned between the laser source and the substrate to be cut. The optical system includes at least one housing detachably coupled to at least one base member. One or more plate members having one or more apertures formed therein may be coupled to at least one of the housing, the baser member, or both. The aperture formed on the plate member may be configured to permit the optical signal to enter and exit the optical system. Various optical subassemblies may be positioned within or coupled to the optical system.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: October 27, 2020
    Assignee: VERTILED CO. LIMITED
    Inventor: Cheng-Hsi Miao
  • Patent number: 10800116
    Abstract: A method of separating a composite material stack comprising multiple elements (12) in contact with one another is discloses. Each element (12) comprises reinforcement fibers and an uncured resin matrix, and the method comprises the steps of temperature treating the stack and/or applying a stress to the stack to separate the elements.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: October 13, 2020
    Assignee: HEXCEL COMPOSITES SAS
    Inventors: Denis Granger, Jeanne Clouteau
  • Patent number: 10797468
    Abstract: Examples disclosed herein relate to multi-wavelength semiconductor lasers. In some examples disclosed herein, a multi-wavelength semiconductor laser may include a silicon-on-insulator (SOI) substrate and a quantum dot (QD) layer above the SOI substrate. The QD layer may include and active gain region and may have at least one angled junction at one end of the QD layer. The SOI substrate may include a waveguide in an upper silicon layer and a mode converter to facilitate optical coupling of a lasing mode to the waveguide.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: October 6, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Geza Kurczveil, Di Liang, Raymond G. Beausoleil
  • Patent number: 10780527
    Abstract: The invention relates to a machining head for coupling a laser beam into a liquid jet. This machining head comprises an optical unit having at least one optical element for focusing the laser beam, and a coupling unit having a liquid chamber that is delimited by a wall, wherein a nozzle having a nozzle opening for generating a liquid jet is disposed in the wall. In a state in which the coupling unit is connected to the optical unit, the laser beam that is capable of being focused by the optical unit is directable in a beam direction through the liquid chamber of the coupling unit into the nozzle opening, and is capable of being coupled into the liquid jet that is generatable by the nozzle and runs in the beam direction.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: September 22, 2020
    Assignee: SYNOVA SA
    Inventors: Bernold Richerzhagen, Ludovic Anderegg, Maximilian Epple, Annika Richmann
  • Patent number: 10780525
    Abstract: The present application relates to a device for the mask projection of femtosecond or picosecond laser beams (2) onto a substrate surface, in which the laser beam (2) consisting of laser beam pulses is, at a location of the optical axis, formed to make laser beam pulses with an expanded laser beam cross section or laser beam pulses with a reduced laser beam cross section and said laser beam (2) has a homogeneous intensity distribution over the laser beam cross section. A stop (6) with a predetermined stop aperture geometry and a mask (7) with a predetermined mask aperture geometry are positioned in succession in the beam (2) path at the location.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: September 22, 2020
    Assignee: Boegli-Gravures SA
    Inventors: Günter Reisse, Steffen Weissmantel, Andy Engel, Manuel Pfeiffer, Alexander Kratsch, Charles Boegli, Matthias Kahl
  • Patent number: 10751836
    Abstract: This disclosure describes laser machining head gas nozzles that have an exit opening for passage of a laser beam onto a workpiece; an annular gap surrounding the exit opening; and a sleeve disposed and guided displaceably within the annular gap for axial displacement between a rearward and a forward position. The sleeve projects beyond the exit opening at least in the forward position, and the sleeve is tiltably mounted in the annular gap.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: August 25, 2020
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventors: Martin Bea, Tim Hesse
  • Patent number: 10752017
    Abstract: A laser marking system includes a laser, an image capture device, a marking head including electromagnetic energy deflectors and a lens, beam paths of the laser of the image capture device both passing through the lens, and a computer system. The computer system is programmed to perform a method including generating an image calibration model at each of multiple areas across a marking field of the laser marking system, adjusting the electromagnetic energy deflectors to direct the beam path of the image capture device to multiple different locations within the marking field of the laser marking system, and capturing image tiles at each of the multiple different locations with the image capture device, wherein at each of the multiple different locations, if a location corresponds to an area at which an image calibration model was generated, correcting the image tile according to the image calibration model generated at the location.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: August 25, 2020
    Assignee: ALLTEC ANGEWANDTE LASERLICHT TECHNOLOGIE GMBH
    Inventors: Faycal Benayad-Cherif, Christopher Bahns
  • Patent number: 10745653
    Abstract: A detergent product for treating textiles, in particular for cleaning textiles and/or washing textiles, is illustrated and described, including a film pouch having at least one pouch chamber which is enclosed by at least one water-soluble film and contains a detergent preparation. In order to improve the dissolution behavior of the detergent product, the film pouch has at least one through-flow opening arranged outside of the pouch chamber.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 18, 2020
    Assignee: Henkel AG & Co. KGaA
    Inventors: Frank Meier, Katja Gerhards, Matthias Sunder
  • Patent number: 10692740
    Abstract: A laser oscillator of a laser processing apparatus generates burst pulses each composed of a plurality of sub-pulses. The plurality of sub-pulses are generated in such a manner that the energy of the sub-pulse sequentially changes from a lower energy to a higher energy, and the burst pulses are applied to a wafer, whereby the wafer is formed therein with shield tunnels extending from the front surface to the back surface of the wafer and each being composed of a minute hole and an amorphous phase surrounding the minute hole.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: June 23, 2020
    Assignee: DISCO CORPORATION
    Inventor: Naotoshi Kirihara
  • Patent number: 10688599
    Abstract: A method for laser processing a transparent workpiece includes forming a contour line having defects in the transparent workpiece, which includes directing a pulsed laser beam oriented along a beam pathway through a beam converting element and through a phase modifying optical element such that the portion of the pulsed laser beam directed into the transparent workpiece includes a phase shifted focal line having a cross-sectional phase contour that includes phase contour ridges induced by the phase modifying optical element and extending along phase ridge lines. Moreover, the phase shifted focal line generates an induced absorption within the transparent workpiece to produce a defect within the transparent workpiece including a central defect region and a radial arm that extends outward from the central defect region in a radial defect direction oriented within 20° of the phase ridge lines of the phase shifted focal line.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: June 23, 2020
    Assignee: Corning Incorporated
    Inventors: Anping Liu, Matthew Ryan Ross
  • Patent number: 10677405
    Abstract: A high efficiency daylight directing structure for application on fenestration deploys closely spaced macroscopic bars of transparent resin to eliminate different forms of glare. The spaced apart surfaces provide for efficient reflection of selective incident light, by TIR or metallic surfaces, via the ultra-smooth native surfaces from a mold or casting process. A close spacing is readily obtained in various attachment methods to boost efficiency. The fabrication method allows selective deposition of absorbing layers, such as by of painting/printing between alternating native optical surface to provide one way transparency at high angles of incidence. The bars are supported on at least one common planar surface by transparent support member with an optical quality adhesive material filling any imperfection in the bars common planar surface that form in fabrication.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: June 9, 2020
    Assignee: SERRALUX INC.
    Inventor: Mark E Gardiner
  • Patent number: 10668563
    Abstract: A laser machining method, including: liquid supplying into a rectifying chamber; the rectifying chamber attenuating disturbances in flow of the liquid supplied; a liquid injecting into a liquid oscillating chamber exclusively from one direction from a liquid inlet port arranged on only one portion of a sidewall of the liquid oscillating chamber; the liquid jetting as a jet liquid column into air from a nozzle; a laser beam focusing on the axis of the nozzle and guiding to a machining point by the jet liquid column; a surface wave of the jet liquid column generating and gradually increasing in amplitude in the direction away from the nozzle; a body of the jet liquid column atomizing when the jet liquid column strikes the workpiece on the machining point.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: June 2, 2020
    Assignee: SUGINO MACHINE LIMITED
    Inventors: Yukiaki Nagata, Ryoji Muratsubaki, Masanori Kanemitsu, Masashi Tsunemoto
  • Patent number: 10654133
    Abstract: A method of separating a workpiece into a plurality of sections includes generating one or a plurality of lines of modified material along one or a plurality of predefined separating lines in the workpiece in a first step by local material processing using a laser beam through a surface of the workpiece, which results in a reduction of breaking stress of the workpiece along the separating lines, and dividing, in a second step, the workpiece into the sections along the separating lines by thermal laser beam separation, wherein the one or the plurality of lines are generated completely or at least in portions at a distance from the surface in the workpiece.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: May 19, 2020
    Assignee: 3D-Micromac AG
    Inventors: Matthias Koitzsch, Dirk Lewke, Alexander Tobisch, Hans-Ulrich Zühlke, Frank Allenstein
  • Patent number: 10654129
    Abstract: A laser machining head includes a focusing optical unit for focusing a laser beam in a direction of a machining zone of a workpiece and includes a cross-jet nozzle for producing a cross flow that passes through the focused laser beam transversely (e.g., at a right angle to) a beam axis of the focused laser beam. The distance of the cross-jet nozzle from the workpiece is less than 20 mm (e.g., between 8 mm and 12 mm). A nozzle body having a bottom opening that faces downward toward the workpiece is provided laterally adjacent to the focused laser beam. A protective gas flows out of the bottom opening, which is arranged below the cross-jet nozzle in order to entrain the protective gas flowing between the nozzle body and the workpiece due to the cross flow of the cross-jet nozzle so that the protective gas flows over the machining zone.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: May 19, 2020
    Assignee: TRUMPF Laser- und Systemtechnik GmbH
    Inventors: Gerhard Broghammer, Jeremy Meyer, Volker Rominger
  • Patent number: 10655191
    Abstract: A delivery device that is usable in a laser peening operation emits a columnar flow of a fluid that contains therein a beam of electromagnetic energy. The beam is retained within the interior of the flow of fluid since the total internal reflectivity of the flow is sufficient to do so. The flow of fluid that serves as a conduit for the beam also itself impinges on a workpiece and thus contains and washes away the plasma that forms from a laser peening operation, and this resists the plasma from reaching and possibly damaging the delivery device. The carrying of the beam in the columnar flow of fluid avoids the need to maintain a fixed distance between the delivery device and the workpiece, which simplifies the movement by a robotic manipulator of the delivery device along a non-planar surface of a workpiece during a laser peening operation.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: May 19, 2020
    Assignee: Westinghouse Electric Company LLC
    Inventors: Lyman J. Petrosky, Phillip J. Hawkins
  • Patent number: 10626039
    Abstract: A method is provided for preparing transparent workpieces for separation. The method includes generating aligned filament formations extending transversely through the workpiece along an intended breaking line using ultra-short laser pulses.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: April 21, 2020
    Assignee: SCHOTT AG
    Inventors: Andreas Ortner, Andreas Habeck, Klaus Gerstner, Georg Haselhorst, Fabian Wagner
  • Patent number: 10619307
    Abstract: A support system for holding a sheet of material being cut by a laser has a base and a number of needles extending upwardly from the base. A vacuum generator or suction mechanism is in communication with a lumen in each needle to hold the sheet atop the bed of needles and spaced from the base so as to avoid scorching the sheet by the laser.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: April 14, 2020
    Assignee: The C.W. Zumbiel Company
    Inventor: Edward A. Zumbiel
  • Patent number: 10603745
    Abstract: This disclosure describes laser machining head cutting gas nozzles that include an inner nozzle having a nozzle opening configured to form a core gas flow, an outer nozzle having an annular gap surrounding the nozzle opening and configured to form an annular gas flow, and a sleeve in the annular gap, wherein the sleeve is arranged to be axially displaceable between a rearward position and a forward position, wherein the sleeve projects beyond the inner nozzle at least when in the forward position, and wherein the sleeve widens a cross-sectional area of the outer nozzle to a variable degree as the sleeve is displaced from the rearward to the forward position. Methods of using a cutting gas nozzle are also described.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: March 31, 2020
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventors: Martin Bea, Tim Hesse
  • Patent number: 10569358
    Abstract: A laser processing system capable of appropriately adjusting a timing to switch a laser output command with respect to the movement of an axis, and improving synchronization accuracy between the movement of the axis and a cutting position. A block remaining time of a block in execution is compared to a predetermined switching time. When the block remaining time is equal to or larger than the switching time, a laser output command of the current block is continued. On the other hand, when the block remaining time is smaller than the switching time, the laser output command to a laser oscillator is switched from the command of the current block to a command of a block subsequent to the current block.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: February 25, 2020
    Assignee: FANUC CORPORATION
    Inventor: Kazuhiro Suzuki
  • Patent number: 10556455
    Abstract: A housing for an industrial machine, consists of first and second oppositely facing plates. Two cross beams are connected between the first and second plates to make the first and second plates into endplates of an enclosure for the industrial machine which may be placed inside. Front and rear pivoted closures are located between the endplates above the enclosure, which are opened to provide access to the enclosure for repair, maintenance etc., of the industrial machine housed therein.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: February 11, 2020
    Assignee: Kornit Digital Ltd.
    Inventor: Ohad Snir
  • Patent number: 10520915
    Abstract: A computer numerically controlled machine may include a movable head configured to deliver electromagnetic energy to a part of a working area in which the movable head may be commanded to cause delivery of the electromagnetic energy. The interior space may be defined by a housing and may include an openable barrier that attenuates transmission of light between the interior space and an exterior of the computer numerically controlled machine when the openable barrier is in a closed position. The computer numerically controlled machine may include an interlock that prevents emission of the electromagnetic energy when detecting that the openable barrier is not in the closed position. The commanding may result in the computer numerically controlled machine executing operations of a motion plan for causing movement of the movable head to deliver the electromagnetic energy to effect a change in a material at least partially contained within the interior space.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: December 31, 2019
    Assignee: Glowforge Inc.
    Inventors: Daniel Shapiro, Mark Gosselin, Anthony Wright, Dean Putney, Timothy Ellis, Lauren Banka
  • Patent number: 10518355
    Abstract: This disclosure describes laser machining head cutting gas nozzles that include an inner nozzle having a nozzle opening configured to form a core gas flow, an outer nozzle having an annular gap surrounding the nozzle opening and configured to form an annular gas flow, and a sleeve in the annular gap, wherein the sleeve is arranged to be axially displaceable between a rearward position and a forward position, wherein the sleeve projects beyond the inner nozzle at least when in the forward position, and wherein the sleeve widens a cross-sectional area of the outer nozzle to a variable degree as the sleeve is displaced from the rearward to the forward position. Methods of using a cutting gas nozzle are also described.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: December 31, 2019
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventors: Martin Bea, Tim Hesse
  • Patent number: 10500677
    Abstract: Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: December 10, 2019
    Assignee: IPG Photonics Corporation
    Inventors: Jeffrey P. Sercel, Donald J. Lemmo, Terrence A. Murphy, Jr., Lawrence Roberts, Tom Loomis, Miroslaw Sokol
  • Patent number: 10502911
    Abstract: The invention relates to a transparent auxiliary ring for the adjustment, for the long-term stable operation and for protection of fiber-coupled laser arrangements.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: December 10, 2019
    Assignee: JENOPTIK Optical Systems GmbH
    Inventor: Juergen Wolf
  • Patent number: 10502902
    Abstract: An optical communication connector, an optical communication cable, and an electronic device that have excellent maintenance properties and can prevent parallel light (collimated light) from being directly emitted to the outside of an optical connector during non-optical coupling. There is provided an optical communication connector device that includes a collimating lens configured to collimate light from an optical transmission path; a refracting section arranged on a leading end side with respect to the collimating lens, and configured to refract and eject light from the optical transmission path ejected from the collimating lens; and a scattering section configured to scatter at least a part of the light ejected from the refracting section.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: December 10, 2019
    Assignee: SONY CORPORATION
    Inventors: Kazuaki Toba, Masanari Yamamoto, Ryohei Takahashi, Satoshi Muto, Tatsushi Nashida, Shinpei Hirano, Naofumi Yoneda
  • Patent number: 10477759
    Abstract: A grass mower includes a vehicle speed instruction value calculation section (53) for generating a vehicle speed instruction value including a maximal vehicle speed, based on an operational position of a man-operable vehicle speed controlling tool (15), a mode selection section (70) for selecting a control mode from a plurality of control modes, a control table (52) in which a plurality of control parameters are set, a vehicle speed control target value calculation section (54) configured to calculate a vehicle speed control target value, based on a vehicle speed instruction value generated by the vehicle speed instruction value calculation section (53) and a selected control parameter corresponding to the control mode selected by the mode selection section (70), a cutter blade control target value calculation section (55) configured to calculate a rotational speed control target value for a cutter blade (30), based on the selected control parameter, and a cutter blade control section (4B) configured to contr
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: November 19, 2019
    Assignee: Kubota Corporation
    Inventors: Kazuaki Matsuda, Katsuhiko Uemura, Hirokazu Ito, Yasuhiro Manji
  • Patent number: 10471536
    Abstract: A reflectance detection method in which a workpiece is irradiated with a laser beam and reflectance is detected, irradiating, with a light amount H0, the workpiece with a laser beam with a first wavelength X1 shorter than a detection-target wavelength X and detecting a light amount H1 of reflected return light, irradiating the workpiece with a laser beam with a second wavelength X2 longer than the detection-target wavelength X with the light amount H0 and detecting a light amount H2 of reflected return light, and employing H calculated based on an expression shown below as the light amount of return light obtained when the workpiece is irradiated with the detection-target wavelength X and calculating reflectance obtained when the workpiece is irradiated with the detection-target wavelength X based on H/H0.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: November 12, 2019
    Assignee: DISCO CORPORATION
    Inventor: Taiki Sawabe
  • Patent number: 10470132
    Abstract: A method, system, and device provide power-efficient communications within the context of available power. Transmission and receipt data rates are scalable in accordance with output power available from a power source. Data is transmitted at a data rate determined, at least in part, by the available output power.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: November 5, 2019
    Assignee: SUNRISE MICRO DEVICES, INC.
    Inventors: Edgar H. Callaway, Jr., Paul E. Gorday
  • Patent number: 10456861
    Abstract: Described herein are an apparatus and a method for direct engraving an elastomeric printing plate or sleeve by multiple laser beams simultaneously. In one embodiment, an elastomeric printing plate or sleeve is positioned on an imaging drum for direct engraving. The imaging drum is rotatable around its longitudinal axis. Such rotation defines a circumferential direction, also called the transverse direction. The axis of rotation defines an axial direction, also called the longitudinal direction. The printing plate or sleeve has an body and a surface made of an elastomer (made of polymer or rubber). A drive mechanism provides relative motion between a plurality of laser beams and the plate or sleeve in both the transverse and longitudinal directions.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: October 29, 2019
    Assignee: Esko-Graphics Imaging GmbH
    Inventor: Wolfgang Sievers
  • Patent number: 10459295
    Abstract: A method of manufacturing a stretched display panel, includes: cutting the TFT substrate to a desired size; cutting the color filter substrate so as to have a length smaller than a length of the TFT substrate such that a pixel exposure portion, from which one or more horizontal pixel lines are exposed, is formed at the TFT substrate; forming a short-circuit prevention seal for covering one of the horizontal pixel lines that is adjacent to an end of the color filter substrate in order to prevent occurrence of a short circuit due to introduction of foreign matter; and forming an cutoff line for cutting off the horizontal pixel line(s) that is not covered by the short-circuit prevention seal and the horizontal pixel line that is covered by the short-circuit prevention seal from each other.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: October 29, 2019
    Assignee: TOVIS CO., LTD.
    Inventor: Young Tae Jeong
  • Patent number: 10458610
    Abstract: A generally plano rectangular louvers are capable of being ganged in a stacked tiltable array to enhance light re-direction when titled to follow the solar elevation. Combinations of features and optical characteristic avoid optical artifacts and enhance efficiency of light utilization and manufacturing. Different louvers can be combined in alternative ways in such arrays. Light directly louvers, films, sheets and panels deploy a grooves that re-direct exterior sunlight for deeper penetration into rooms and building interiors. Absorbing structure are combined with films or panel that while reducing total interior illumination, reduce the potential for annoying glare at low solar elevations.
    Type: Grant
    Filed: December 23, 2018
    Date of Patent: October 29, 2019
    Assignee: SerraLux Inc.
    Inventor: Mark E Gardiner
  • Patent number: 10456939
    Abstract: A cell cutting device that cuts a mother substrate for display devices includes a fixing unit configured to move in a state where the mother substrate for display devices is fixed on the fixing unit, a cutter configured to perform a cutting process on the mother substrate for display devices and the cutter faces a surface of the mother substrate during the cutting process, a cutter driving unit driving the cutter in a state where the cutter is fixed thereon, and a buffer member arranged on another surface of the mother substrate to correspond to the cutter. The other surface is opposite the surface facing the cutter.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: October 29, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kyung-Hoe Heo, Seung-Jun Lee
  • Patent number: 10449634
    Abstract: A laser build-up method according to an embodiment includes the processes of: forming an annular counter sunk groove 15 in an edge of an opening of a port on a side of a combustion chamber; and irradiating a laser beam 30 while a metallic powder 26 is being supplied to the counter sunk groove 15 and successively forming a cladding layer 16 for a valve seat, in which: the cladding layer 16 is formed while a seal gas 24 is being sprayed onto a melt pool 31, the cladding layer 16 includes a starting end part 17a, a part formed just after the starting end part is formed 18a, an intermediate part 18b, a part formed just before a terminating end part is formed 18c, and a terminating end part 17b, which are formed in this order.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: October 22, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akinori Eda, Hideki Teshima
  • Patent number: 10442034
    Abstract: A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: October 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung Whan Oh, Yeon Woo Choi, In Hwan Kim, Won Ki Park, Ho Youl Lee, Yong Won Choi
  • Patent number: 10434600
    Abstract: Methods include directing a laser beam to a target along a scan path at a variable scan velocity and adjusting a digital modulation during movement of the laser beam along the scan path and in relation to the variable scan velocity so as to provide a fluence at the target within a predetermined fluence range along the scan path. Some methods include adjusting a width of the laser beam with a zoom beam expander. Apparatus include a laser source situated to emit a laser beam, a 3D scanner situated to receive the laser beam and to direct the laser beam along a scan path in a scanning plane at the target, and a laser source digital modulator coupled to the laser source so as to produce a fluence at the scanning plane along the scan path that is in a predetermined fluence range as the laser beam scan speed changes along the scan path.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: October 8, 2019
    Assignee: nLIGHT, Inc.
    Inventors: Robert J. Martinsen, Qi Wang
  • Patent number: 10413996
    Abstract: A laser processing machine includes a convex lens having a positive focal length, a concave lens having a negative focal length, and a focusing lens having a positive focal length. The convex lens is movable in an optical axis direction and converts divergent light of a laser beam emitted from a laser beam emission end into convergent light. The concave lens is movable in the optical axis direction and is disposed at a position that is shifted from a position where the convergent light is focused toward the convex lens side by the same distance as the focal length of the concave lens according to a position of the convex lens in the optical axis direction. The concave lens converts the convergent light into parallel light. The focusing lens focuses the laser beam emitted from the concave lens and irradiates a plate material with the focused laser beam.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: September 17, 2019
    Assignee: AMADA HOLDINGS CO., LTD.
    Inventors: Ryohei Ito, Hiroaki Ishiguro
  • Patent number: 10410340
    Abstract: Disclosed subject matter relates to image processing that includes a method for marking content on a surface of an object using laser. A transformation identification computing device receives an input image of the object and extracts data corresponding to region of interest in the input image. The extracted data is compared with extracted template data corresponding to regions of interest present in template images of one of one or more template objects. A transformation in position of the object with respect to the position of the one of the one or more template objects is determined, based on the comparison. Finally, an inverse of the transformation is applied to content data that is to be marked at a desired location within the region of interest of the object. The present disclosure analyses the images at a sub-pixel level based on machine learning approach to determine transformation.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: September 10, 2019
    Assignee: Wipro Limited
    Inventor: Sujith Krishnan Pallath
  • Patent number: 10369716
    Abstract: A laser machining apparatus capable of extending the life time of a guide laser is provided. A laser machining apparatus 1 includes a cutting head 2 that irradiates a machining laser light to a machining target W, a guide laser 5 that irradiates a visible guide light to the machining target W, and a power supply 6 that supplies electric power to the guide laser 5. The laser machining apparatus 1 further includes a controller 7 that performs control so that, before the machining laser light is irradiated from the cutting head 2 to the machining target W and laser cutting starts, electric power is supplied from the power supply 6 to the guide laser 5, and the guide light is irradiated from the guide laser 5 to the machining target W according to an output position of the machining laser light output from the cutting head 2 so that the output position of the machining laser light is ascertained.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: August 6, 2019
    Assignee: FANUC CORPORATION
    Inventor: Ryusuke Miyata
  • Patent number: 10359624
    Abstract: To provide a galvanoscanner enabling execution of weaving welding whereby favorable weld quality is easily obtained.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: July 23, 2019
    Assignee: FANUC CORPORATION
    Inventor: Yoshinori Murakami
  • Patent number: 10357856
    Abstract: An apparatus for plate punching and laser cutting, characterized in that it comprises a bearing frame on which, on one machine front, a punching unit and a laser cutting unit are assembled; said punching unit comprising two punching heads, one overlapping the other, an upper head with punches and a lower head with cavities; said laser cutting unit comprises two laser cutting heads, one overlapping the other, an upper head with a laser cutting device, and a lower head with a support frame for the plate to be processed and fumes extraction assembly; each of said heads is set in motion in an independent manner along an axis transversal to the direction of forward movement of a plate to be processed.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: July 23, 2019
    Assignee: PRODUTECH S.R.L.
    Inventor: Fabrizio Mologni