Abstract: A laser cutting tool with protective enclosure assembly for manipulating a workpiece on a movable platen includes a frame, a top protection assembly, a middle protection shield, a bottom protection assembly and a laser torch head. The top protection assembly, middle protection assembly, and bottom protection assembly are removably mounted to the frame such that they form a cavity enclosing only substantially the laser torch head.

Abstract: According to one implementation, a laser peening processing apparatus includes: a laser oscillator; and a nozzle. The laser oscillator oscillates a laser light. The nozzle focuses the laser light and irradiates a surface to be processed of a workpiece with the focused laser light while flowing a liquid toward the surface to be processed. A straightening part that straightens a flow of the liquid is disposed on the nozzle. Furthermore, according to one implementation, a laser peening processing method includes: oscillating a laser light; manufacturing a product or a semi-product by focusing the laser light and irradiating a surface to be processed of a workpiece with the focused laser light toward while flowing a liquid on the surface; and straightening the liquid using a straightening structure.

Abstract: The present invention relates to an improved cutting device and an improved cutting method, specifically For processing and cutting sheets of a stiff material, such as cardboard and others, in which the sheets are supplied and moved In a stable way along a first direction, and a laser cutting unit (or at least the resulting laser beams) is moved along a second, substantially perpendicular direction, in which by coordinating the two movements, a desired cut is executed in the sheets.

Abstract: Described are methods for identifying the in-field positions of plant features on a plant by plant basis. These positions are determined based on images captured as a vehicle (e.g., tractor, sprayer, etc.) including one or more cameras travels through the field along a row of crops. The in-field positions of the plant features are useful for a variety of purposes including, for example, generating three-dimensional data models of plants growing in the field, assessing plant growth and phenotypic features, determining what kinds of treatments to apply including both where to apply the treatments and how much, determining whether to remove weeds or other undesirable plants, and so on.

Abstract: A CNC machine includes a lower body; an upper body that extends from the lower body and is movably attached to the lower body; a tool that is movably attached to the upper body; and a flexible mat that is attached to the lower body. The tool may be a laser generator with the flexible mat resistant to the laser beam. The flexible mat has at least one orientation such that an outer periphery of the flexible mat is greater than the full extent of range of motion of the tool. The upper body may be connected to the lower body by a pivot mechanism configured to allow the upper body to pivot from a first position to a second position and to rotationally fix the upper body relative to the lower body in the second position, with the first and second positions being ninety degrees apart.

Abstract: A substrate processing apparatus according to an aspect of the present disclosure includes a mounting section on which a substrate is placed, a structure member provided above the mounting section so as to face the mounting section, and an optical sensor. The optical sensor is configured to detect a height of the mounting section, a height of the structure member, and a height of the substrate, by emitting light from above the structure member to a predetermined location of the mounting section, a predetermined location of the structure member, and the substrate, and by receiving reflection light from the mounting section, the structure member, and the substrate.

Abstract: A semiconductor die includes a substrate having a semiconductor surface layer bon a front side with active circuitry including at last one transistor therein and a back side. The sidewall edges of the semiconductor die have at least one damage region pair including an angled damage feature region relative to a surface normal of the semiconductor die that is above a damage region that is more normal to the surface normal of the die as compared to the angled damage feature region.

Abstract: A computer numerically controlled machine may include a movable head configured to deliver electromagnetic energy to a part of a working area in which the movable head may be commanded to cause delivery of the electromagnetic energy. The interior space may be defined by a housing and may include an openable barrier that attenuates transmission of light between the interior space and an exterior of the computer numerically controlled machine when the openable barrier is in a closed position. The computer numerically controlled machine may include an interlock that prevents emission of the electromagnetic energy when detecting that the openable barrier is not in the closed position. The commanding may result in the computer numerically controlled machine executing operations of a motion plan for causing movement of the movable head to deliver the electromagnetic energy to effect a change in a material at least partially contained within the interior space.

Abstract: A simplified switchable object and methods of making same are provided. The methods may include steps of applying a switchable material on a first surface of a first substrate, the switchable material having a thickness and a shape; applying a barrier material on the first substrate, circumferential to the switchable material; and applying a second substrate over top of, and in contact with, the switchable material and the barrier material, the first substrate, second substrate and barrier material defining a closed chamber encapsulating the switchable material. The methods may further include a step of applying a seal material.

Abstract: A method of manufacturing a medical device including a case having a first and a second case portion mated together. The case having a space inside and an elastic membrane attached to the case. A first housing space covered by the first case portion and a second housing space covered by the second case portion. Fixing parts at peripheries of the first and the second case portions and at which the first and the second case portions are mated. Holding surfaces at the peripheries of the first and the second case portions. A sealing part at the periphery of the first or the second ease portions with respect to the fixing parts and that seals an entirety of the peripheral edge of the elastic membrane. Forming an air gap between the sealing part and the fixing parts by depressurization or heating the fixing parts that connect the case portions.

Abstract: An optical module for a machine for machining workpieces and/or for producing molded bodies by way of location-selective solidification of material powder into contiguous regions by a laser beam includes a housing for releasably fastening the optical module to the machine and a collimation optics changer releasably arranged in the housing, having at least two collimation optics which can be moved into a beam path of the laser beam for collimating the laser beam. The collimation optics changer has a mechanism for automatically changing the collimation optics.

Abstract: A laser cutting nozzle for a laser machining unit is described, the nozzle including a passage for the laser beam and cutting gas. The passage extends between a nozzle inlet and a nozzle mouth along a passage longitudinal axis. The passage comprises a convergence portion and a divergence portion. In the entire divergence portion, the wall of the passage forms an angle of inclination relative to the passage longitudinal axis of at most 5°. In addition, the length of the divergence portion is less than 5 times the diameter of the constriction.

Abstract: The present disclosure includes a device for recycling a payment card, which can include a payment card receiver for receiving a payment card that has a substrate and an information-saving component, an image capture device configured to identify a location of the information-saving component on the substrate, a separating device configured to remove the information-saving component from the substrate, and a storage portion configured receive the substrate and the information-saving component.

Abstract: A gas flow can be provided together with a liquid jet guided laser beam to remove accumulated liquid on the processing surface. The gas flow can be configured to have minimum interference with the liquid jet guided laser beam, while functions to blow away liquid generated by the liquid jet. Keeping the surface free from accumulated liquid can improve the efficiency of the liquid jet guided laser processing.

Abstract: A laser crystallizing apparatus may include a laser light source, an optical system, and an optical module. The laser light source may generate a laser beam. The optical system may convert the laser beam into a line laser beam. The optical module may disperse energy of the line laser beam in a first direction for generating a dispersed line laser beam. The first direction may be perpendicular to a lengthwise direction of the optical module.

Abstract: A method of creating thin wafers of single crystal silicon, sapphire and similar materials, wherein an ingot of single crystalline material, or a ribbon of single crystalline material is cleaved, in a plane parallel to a surface, with laser light focused to a line in the desired plane of cleavage, near the growing cleavage furrow. The light is of a wavelength that the material is transparent to, but for which the material has strong two- or three-photon absorption. Consequently the light is not appreciably absorbed until it reached the desired focal line. The light is presented in an extremely short pulse, which heats and expands the material at the line focus, before the heat can be dissipated. This expansion creates tangential stresses around the focal line. These stresses are designed to be precisely normal to the growing cleavage furrow.

Abstract: A production system and method of using the same for forming filtration tubes. The system includes: a six-axis robotic arm that moves tubes between sub-systems. The arm moves an unprocessed tube from an input-output subsystem, to an inspection system, a laser cutting system, and optional post-processing system. The inspection may include a laser and/or camera that scans a surface of a tube to determine abnormalities, defects, and/or quality issues. The laser cutting system cuts pores, holes, or slots into and through a wall of the tube, that passes inspection, to form a filtration tube used to filter solids from fluids. The post-processing system may post-process and/or clean the tube after cutting. If the tube fails inspection, it is moved to a reject bin or tray. The arm moves completed filtration tubes to a finished tube bin or tray.

Abstract: A particle removal device includes: a stage on which a target substrate is disposed; an inner case defining a first discharge opening through which the stage is exposed to an internal space of the inner case; an outer case including: a side wall portion surrounding the inner case, a protrusion portion protruded from the side wall portion toward the inner case, and a second discharge opening in fluid connection with the first discharge opening; a suction pump connected to the second discharge opening; an air injector in fluid connection with the internal space; and an intake opening in fluid connection with the first and second discharge openings. A width of the intake opening as a distance between the distal end of the inner case and the distal end of the protrusion portion is smaller than a width of the first discharge opening.

Abstract: Methods include directing a laser beam to a target along a scan path at a variable scan velocity and adjusting a digital modulation during movement of the laser beam along the scan path and in relation to the variable scan velocity so as to provide a fluence at the target within a predetermined fluence range along the scan path. Some methods include adjusting a width of the laser beam with a zoom beam expander. Apparatus include a laser source situated to emit a laser beam, a 3D scanner situated to receive the laser beam and to direct the laser beam along a scan path in a scanning plane at the target, and a laser source digital modulator coupled to the laser source so as to produce a fluence at the scanning plane along the scan path that is in a predetermined fluence range as the laser beam scan speed changes along the scan path.

Abstract: An optical device that is intended for laser treatment of internal surfaces of a covering part of the leading-edge type, including a collimator that is intended to be connected to a laser source via an optical fibre to produce a laser beam having a collimated and flat spatial pulse profile, a cylindrical lens that is configured to focus the laser beam along a spatial line that is transverse to the propagation of the laser beam thus forming a line-laser-beam, a reflecting optical component that is configured to be able to be introduced into the interior of the covering part and to uniformly reflect the line-laser-beam onto at least one internal surface of the covering part and in directions of incidence that are almost normal to at least one internal surface.

Abstract: A linear motor according to an exemplary embodiment of the present invention includes a frame having a bottom and two sidewalls and extending in a longitudinal direction, multiple coil modules repeatedly disposed on the bottom in the longitudinal direction and configured to constitute a stator, a mover disposed on the two sidewalls in a width direction intersecting the longitudinal direction, the mover being movable in the longitudinal direction, thrust magnets mounted at a lower side of the mover and selectively corresponding to the multiple coil modules, and a Hall switching board mounted on an inner surface of one of the two sidewalls and having first Hall sensors (switching Hall sensors) operated by a magnetic field corresponding to the thrust magnets so that a driver controls phase conversion of the multiple coil modules.

Abstract: A system and method for automated laser ablation includes an end effector for performing laser ablation at a location with restricted access. The systems and methods of the present disclosure specifically provide for a miniature laser end effector which may be inserted through a port or bore in order to ablate the surface of an internal component of a complex assembly. In several embodiments of the present subject matter, the end effector is mounted on an automated machine and coupled to a laser system.

Abstract: A laser system capable of producing a stable and accurate high-power output beam from one or more input beams of corresponding laser sources comprises one or more optical elements configured to receive the input beams wherein at least one of said one or more optical elements is made of high purity fused silica.

Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

Abstract: Provided is an apparatus for forming a tab from a moving original sheet with a laser beam. This apparatus is a tab forming apparatus in a tabbed electrode sheet producing apparatus (100) for moving, in one direction, an original sheet (1) including an electrode portion (1a) obtained by applying an active material layer to a long metal foil (4) and an ear portion (1b).

Abstract: Systems and methods for laser processing systems and associated methods for using and manufacturing such systems are disclosed herein. In some embodiments, a laser processing system includes a controller, a laser source, a material support, and a beam delivery subsystem operably coupled to the controller. The beam delivery subsystem comprises an optical carriage assembly configured to receive and modify a laser beam from the laser source, and direct the laser beam toward a material to be processed carried by the material support. The optical carriage assembly is further configured to focus the laser beam within a material processing field to obtain an adjustable power density within a material processing plane and achieve an optimal selected condition for the material to be processed.

Abstract: A laser machining nozzle includes: a nozzle body coupled to a machining head; and a flow path formed through the nozzle body in a longitudinal axis of the nozzle body to allow a machining-assist gas to be injected toward a workpiece therethrough while a laser beam is emitted toward the workpiece, wherein the flow path comprises a first flow path formed in a flow direction of the machining-assist gas and generating a supersonic flow of the machining-assist gas; a second flow path connected to the first flow path in the flow direction of the machining-assist gas and expanding a volume of the machining-assist gas having passed through the first flow path; and a flow path boundary defining a boundary between the first flow path and the second flow path.

Abstract: In a method for determining a deviation of a spatial orientation of a beam axis (S) of a beam processing machine from a spatial nominal orientation (S0) of the beam axis (S), contour sections (KA1, KB2) are cut with a processing beam into a test workpiece from two sides of the workpiece. The contour sections (KA1, KB2) extend parallel to a nominal orientation of a rotation axis (B, C), where the rotation axis is to be calibrated. The contour sections (KA1, KA2) are probed from one side of the test workpiece by a measuring device for determining the spatial position of the contour sections (KA1, KB1). Deviation of the spatial orientation of the beam axis (S) of the beam processing machine from the spatial nominal orientation (S0) is determined based on the spatial positions of the contour sections (KA1, KB1).

Abstract: A 3D laser machining system comprises: a move state simulation unit that simulates a move state of a machining head using 3D CAD data about a workpiece containing material information defining thermophysical properties and 3D CAD data about a machining head under a condition of moving the machining head relative to the workpiece while the machining head is maintained at a predetermined angle a predetermined distance along a machining line in virtual space; a thermal fluid simulation unit that conducts non-stationary thermal fluid simulation for obtaining a temperature distribution in a region covering the workpiece to be changed by the move of the machining head outputting a laser beam; and a machining condition setting unit that sets a laser machining condition containing a relative move condition for the machining head and a laser beam output condition before laser machining on the basis of results of the simulations.

Abstract: A machine for separative machining of a plate-shaped workpiece by a processing beam. The machine has a first movement unit for moving the workpiece in a first direction, a second movement unit for moving a processing head in a second direction, two workpiece bearing supports for bearing the workpiece, and a parts chute. The two workpiece bearing supports are separated from each other by a gap that extends along the second direction. The parts chute is movable between a first chute position and a second chute position so as to move a cut-free workpiece part that has dropped into the gap, laterally away from the gap. The machine includes a receiving unit movable in the second direction, to receive the cut-free workpiece part at a transfer position and transport the workpiece part to one or more discharging positions of the machine along the second direction.

Abstract: A laser processing apparatus includes a laser beam applying unit having a focusing unit applying a laser beam to a workpiece held on a chuck table, a feeding mechanism relatively moving the chuck table and the laser beam applying unit, and a chamber having a top wall connected to the focusing unit and a side wall connected to the top wall to define an enclosed space, the top wall having a transparent plate located directly below the focusing unit and allowing the pass of the laser beam applied from the focusing unit. The laser processing apparatus further includes a liquid supplying unit supplying a liquid into the enclosed space to make a condition that the enclosed space is filled with the liquid under a predetermined pressure.

Abstract: This disclosure describes laser machining head gas nozzles that have an exit opening for passage of a laser beam onto a workpiece; an annular gap surrounding the exit opening; and a sleeve disposed and guided displaceably within the annular gap for axial displacement between a rearward and a forward position. The sleeve projects beyond the exit opening at least in the forward position, and the sleeve is tiltably mounted in the annular gap.

Abstract: A method for hard-surfacing metal parts for an aircraft turbofan, the method involving the use of a nozzle outputting a laser beam or an electron beam, which is to heat a sprayed powder for hard-surfacing the metal part, the method including positioning the metal part to be hard-surfaced in an enclosure, the top portion of which has an opening; positioning a mobile cover covering the opening of the top portion, the mobile cover having an opening; positioning the nozzle at the opening of the mobile cover; feeding an inert gas into the enclosure; spraying metal powders and emitting the laser or electron beam for hard-surfacing the metal part; moving the nozzle relative to the enclosure along a path for hard-surfacing the metal part, the movement of the nozzle causing the movement of the mobile cover on the top surface of the enclosure.

Abstract: A laser processing apparatus includes a liquid supply mechanism at an upper portion of a holding unit. The liquid supply mechanism includes: a liquid chamber provided with a transparent plate located with a gap formed between the transparent plate and an upper surface of a workpiece held by the holding table; a liquid supply nozzle adapted to supply a liquid to the gap from one side of the liquid chamber; and a liquid discharge nozzle adapted to recover the liquid from the other side of the liquid chamber, to produce a flow of the liquid. A laser beam applying unit includes a condenser adapted to focus a laser beam emitted by a laser oscillator, to apply the laser beam to the workpiece held by the holding table through the transparent plate and the liquid supplied to the gap.

Abstract: A focal-length measuring apparatus for a sub-wavelength optical imaging device includes a laser, a beam-expanding and collimating system, a sub-wavelength optical imaging device, and a nanoscale stepped height standard sample block. The nanoscale stepped height standard sample block is connected to a power device, and the power device is connected to a computer control system. The nanoscale stepped height standard sample block is coated with a photoresist and includes a plurality of steps arranged at equal intervals Among all the steps, the heights of the steps gradually increase from a middle step to an upper side, and the values of the corresponding focal lengths decrease. While, the heights of the steps gradually decrease from the middle step to a lower side, and values of corresponding focal lengths increase. A wavelength of the laser is equal to a designed wavelength of an input light source of the sub-wavelength optical imaging device.

Abstract: The invention relates to a support device (200) for supporting a rod-shaped workpiece (110) for a machine tool (100) along a longitudinal axis (L) of a support area (220).

Abstract: This disclosure relates to methods and apparatuses for piercing workpieces at a piercing point using a laser beam, which exits from a laser processing nozzle with a process gas, whereby a bulge is formed on the workpiece surface around the piercing point during the piercing. A distance between the laser processing nozzle and the bulge is determined during the piercing and at least one piercing parameter is changed in dependence on the distance determined.

Abstract: A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; and a tubular enclosure disposed between the nozzle and a workpiece and enclosing the jet, wherein the enclosure has a changeable radial inner dimension, and is configured to adjust the position of the maximum point by changing the inner dimension.

Abstract: A system for forming apertures in a flexible film is provided. The system includes a punching tool for forming apertures in a flexible film. The punching tool defines a through hole therethrough. The system also includes a support plate. The punching tool is configured to press the flexible film against the support plate to form the apertures.

Abstract: A laser machining device includes a reflective plate disposed perpendicular to the optical axis of emitting light and having a constant reflectance to the emitting light; a return light measurement unit which measures intensity distribution of return light reflected off the reflective plate and returning to the external optical system via a beam splitter; a storage unit which stores the return light intensity distribution in a normal state as reference data; a preprocessing unit which performs processing of identifying at least one of an optical axis shift, a beam diameter anomaly, a mode anomaly, a ghost, contamination of a protective window, and a focus shift due to thermal lens effect on the basis of comparison between measurement data of the return light intensity distribution and the reference data, before laser machining; and a warning unit which warns of an anomaly in the external optical system in accordance with the preprocessing unit.

Abstract: The invention relates to a welding device (1) having a welding torch (2), a feeder (3) for feeding a melting filler material (4) at a feed rate (v) to a weld (S), where the filler material (4) is melted with the aid of an electric arc (L), and a pre-heater (9) for heating the filler material (4) upstream of the weld (S) by means of a laser beam (7) having a laser power (P) and generated in a laser device (6). For space-saving and safe heating of the filler material (4) upstream of the weld (S), the pre-heater (9) includes a feed channel (5) for the filler material (4), and at least one deflector (8) is attached to the pre-heater (9) for deflecting the laser beam (7) to the filler material (4) in such a way that the laser beam (7) strikes the filler material (4) inside the feed channel (5) of the pre-heater (9).

Abstract: The laser processing machine includes a beam oscillation mechanism that oscillates a beam spot on a surface of a sheet metal. The control device controls the beam oscillation mechanism so as to oscillate the beam spot with an oscillation component in a direction orthogonal to a cutting direction of the sheet metal in a non-holding region, in which a holding portion of the conveyance apparatus for conveying a product is not held, when cutting the product from the sheet metal by irradiating the sheet metal with the laser beam. The non-holding region is at least a part of a periphery of a protrusion portion of the product, or at least a part of a periphery of a recess forming region in which a recess of the product is formed.

Abstract: A method of layering a layer of circuitry pattern to another layer of circuitry pattern during the manufacturing of a multilayer flexible printed circuit in a reel-to-reel machine. The method includes feeding both layers of circuitry pattern reel-to-reel into the machine, placing a layer of dielectric sheet material on the fly between the two layers of circuitry patterns reel-to-reel, followed by simultaneously passing the two layers of circuitry pattern and the dielectric sheet material under a laser scanner in the reel-to-reel machine to irradiate a laser beam on a layer of circuitry pattern to weld the two layers of circuitry patterns together.

Abstract: Provided is an epoch-making method in which an original sheet is continuously fed, and a rectangular electrode sheet with a tab can be cut out from the original sheet with a normal laser beam during the continuous feeding. The original sheet 1 is continuously moved. An ear portion 1b is separated from an electrode portion 1a with a first laser beam L1 in an ear portion separating region provided in the middle of movement of the original sheet 1, is taken up at a position where the ear portion 1b is separated, in a direction separated from a running direction of the electrode portion 1a, and the laser beam L1 is moved in the ear portion separating step to cut out a tab 5 connected to the electrode portion 1a, from the ear portion 1b.

Abstract: A laser additive manufacturing apparatus and a method thereof are provided. The apparatus includes an irradiation unit that irradiates an irradiation region with a laser beam having a light intensity distribution converted by a diffractive optical element, a head having a material supplying unit for supplying powder material to the irradiation region, and a movement mechanism which relatively moves the head and a workpiece. In the irradiation region, irradiation light forms a substantially circular spot having a light intensity distribution in which light intensity in an outer peripheral portion is higher than light intensity in a central portion, and the central portion has predetermined light intensity, and the material supplying unit supplies the powder material to the substantially circular spot.

Abstract: A workpiece having an outer peripheral portion rotationally symmetric about a symmetry axis can be inspected with high-accuracy while reducing cycle time of the inspection. In an inspection for each of the workpieces, on the basis of the image of the workpiece acquired by executing a first step of capturing an image of the workpiece while holding the workpiece at a pre-alignment position using a holding table and rotating the workpiece about a rotary axis, a position of the workpiece at the holding table is corrected so as to eliminate misalignment of the symmetry axis with respect to the rotary axis. Thereafter, on the basis of the image acquired by executing a fifth step of capturing an image of the workpiece while rotating the workpiece about the rotary axis at an inspection position, the workpiece is inspected. In the inspection of the workpiece, the fifth step for a previous workpiece of two consecutive workpieces and the first step for a next workpiece are executed in parallel with each other.

Abstract: A wafer processing method of dividing a wafer into a plurality of chips along a plurality of division lines includes: a shield tunnel forming step of causing a focusing point of a pulsed laser beam of a wavelength having a transmitting property with respect to the wafer to be positioned inside the wafer and applying the pulsed laser beam, and then forming a plurality of shield tunnels each including a fine hole and an amorphous region shielding the fine hole along the division lines; and a wafer dividing step of applying an external force to the wafer and then dividing the wafer in which the shield tunnels are formed along the division lines, in which the pulsed laser beam is split to have two or more of the focusing points which are along a direction parallel to the division lines.

Abstract: The present disclosure relates to the field of display technologies, and provides an abutment, a laser cutting device and a control method thereof, so as to improve the yield rate and prolong the service life of a product. Specifically, the abutment comprises a carrying region. The carrying region is used for placing a component to be cut thereon, and comprises an adsorbing region and a cutting region. Furthermore, the adsorbing region is provided with adsorbing holes for adsorbing the component to be cut. Besides, the cutting region extends from a side of the carrying region to an opposite side thereof.

Abstract: Disclosed herein is an evaluation jig that is a jig to be used for evaluation of a height position detection unit that detects the height position of a holding surface of a chuck table of a laser processing apparatus. The evaluation jig includes a to-be-irradiated surface which is to be irradiated with a detection laser beam, an actuator that moves the to-be-irradiated surface in a Z-axis direction, a base section that supports the actuator and is mounted on the holding surface of the chuck table, and a control unit that controls movement of the actuator.

Abstract: A method of creating thin wafers of single crystal silicon, sapphire and similar materials, wherein an ingot of single crystalline material, or a ribbon of single crystalline material is cleaved, in a plane parallel to a surface, with laser light focused to a line in the desired plane of cleavage, near the growing cleavage furrow. The light is of a wavelength that the material is transparent to, but for which the material has strong two- or three-photon absorption. Consequently the light is not appreciably absorbed until it reached the desired focal line. The light is presented in an extremely short pulse, which heats and expands the material at the line focus, before the heat can be dissipated. This expansion creates tangential stresses around the focal line. These stresses are designed to be precisely normal to the growing cleavage furrow.