Abstract: Systems and methods are described for efficient laser processing of a moving web-based material. In one embodiment, a moving web is provided at a selected speed. A laser beam is generated having a focal point positioned to provide either a score or cut in the web. The focal point of the laser beam is moved at a speed less than the selected speed for a selected distance thereby producing a discreet score or cut in the web in the machine direction. The focal point is repositioned to form another discreet score or cut once the prior discreet score or cut is formed. The repositioned focal point is moved at a speed less than the selected speed for another selected distance. The step of repositioning is repeated to form a plurality of discreet scores or cuts in the web moving at the selected speed. The laser beam is therefore able to be generated using less power than would be needed to produce the same type of discreet score or cut if the focal point were stationary as the web is moved at the selected speed.

Abstract: The present invention relates to a device for the treatment of a workpiece, in particular of a substantially flat substrate, comprising a table (2) for supporting the workpiece (5), a flow generation apparatus (6, 11) producing a gas flow (22) on a top face (17.1, 17.2) of the table (2) in a region between the workpiece (5) and the top face (17.1, 17.2) of the table (2), on which gas flow the workpiece (5) is supported during the treatment.

Abstract: In a method and system for slitting thin strip magnetic steel such as transformer core material, a laser is mounted above the material and the material is wound from a pay-out reel to one or more take-up reels.

Abstract: To provide a curable composition from which a cured film having a low dielectric constant and a low water-absorption and being capable of laser processing, is obtained a laser processing method of the cured film, and a process for producing a multilayer wiring structure. A curable composition comprising a fluorinated polyarylene prepolymer (A) having a crosslinkable functional group, a laser processing method comprising irradiating a cured film obtained by curing the composition with laser light to remove a part of the cured film, and a process for producing a multilayer wiring structure, comprising a step of forming a via hole in an insulation film made of the cured film by the processing method.

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

Abstract: Methods for making devices include providing a tubular member to be formed into a device, placing a removable sacrificial block material in the lumen of the tubular member and laser cutting the tubular member. A tubular member made from nickel-titanium alloy can be tightly adhered to a sacrificial sleeve utilizing the phase changes associated with nickel-titanium. A mandrel which includes an enlarged diameter section causes the workpiece to expand slightly within its elastic deformation range to dislodge islands from the workpiece. Such a mandrel could be formed from a tubular member which has a central lumen that can be used to deliver a pressurized medium to “blast” islands from the workpiece.

Abstract: Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.

Abstract: A device for removing a coating formed in a slot of a stator core. The device includes a carriage movably attached to a first guide rail assembly to enable movement of the carriage in a longitudinal direction. The device also includes a first drive screw wherein rotation of the first drive screw moves the first guide rail assembly in the longitudinal direction. In addition, the device includes a second guide rail assembly that is attached to the carriage wherein the second guide rail assembly enables movement of the carriage in a direction transverse to the longitudinal direction. Further, the device includes a second drive screw wherein rotation of the second drive screw moves the carriage in the transverse direction. The carriage includes a laser beam emitting head that moves within the slot in either or both the longitudinal or transverse directions wherein the laser beam emitting head emits a laser beam to remove the coating.

Abstract: The invention relates to a method for producing a contour cut in a sheet metal web (BB) transported in a direction of transport (T) by means of a conveying apparatus (3). To accelerate the production of the contour cut, it is proposed in accordance with the invention to divide the sheet metal web (BB) into a plurality of overlapping processing strips and to assign successively two laser cutting units (10, 11) to at least two processing strips in the direction of transport (T).

Abstract: There are provided using high power laser systems for performing decommissioning welding and repair of structures in boreholes, off-shore, and other remote and hazardous locations. In a particular embodiment the laser system is a Class I system.

Abstract: A system prevents oxidation of a laser cut workpiece by utilizing a laser source that utilizes laser source with an inert gas, such as argon or helium, rather than air or oxygen, to create the slots or kerfs which form the pattern cut into the workpiece. The system introduces oxygen gas through the workpiece as it is being laser cut to oxidize any slag or dross created during the laser cutting process. Oxygen or a mixture of oxygen with other gases cools the slag and the workpiece while at the same time oxidizing the slag to either completely burn or partial burn the slag before it strikes an exposed surface of the tubular member.

Abstract: A stent is formed by encasing or encapsulating metallic rings in an inner polymeric layer and an outer polymeric layer. At least one polymer link connects adjacent metallic rings. The stent is drug loaded with one or more therapeutic agent or drug, for example, to reduce the likelihood of the development of restenosis in the coronary arteries. The inner and outer polymeric materials can be of the same polymer or different polymer to achieve different results, such as enhancing flexibility and providing a stent that is visible under MRI, computer tomography and x-ray fluoroscopy.

Abstract: Methods for utilizing 10 kW or more laser energy transmitted deep into the earth with the suppression of associated nonlinear phenomena to enhance the formation of Boreholes. Methods for the laser operations to reduce the critical path for forming a borehole in the earth. These methods can deliver high power laser energy down a deep borehole, while maintaining the high power to perform operations in such boreholes deep within the earth.

Abstract: A method for production of safety/rupture discs (1) comprises the steps providing a foil element (1a), selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut (2) in the foil element by directly applying said laser beam to the foil element to remove material from the foil element (1a) thereby obtaining a safety/rupture disc.

Abstract: In an embodiment, a bearing assembly includes superhard bearing elements distributed circumferentially about an axis. At least one of the superhard bearing elements may include a first arcuate end portion, a second arcuate end portion, a first substantially planar face, a second substantially planar face, and a bearing surface. The first and second arcuate end portions may be generally opposite each other. The first substantially planar face may extend between the first and second arcuate end portions. The second substantially planar face may be generally opposite the first substantially planar face. The first substantially planar face may have a length greater than a length of the second substantially planar face. The bearing surface may extend between the first arcuate end portion, the second arcuate end portion, the first substantially planar face, and the second substantially planar face. The bearing assembly includes a support ring that carries the superhard bearing elements.

Abstract: Disclosed are systems, devices and methods for optimizing the manufacture and/or production of patient-specific orthopedic implants. The methods include obtaining image data of a patient, selecting a blank implant to be optimized for the patient, and modifying the blank implant utilizing techniques disclosed herein to alter specific features of the implant to conform to the patient's anatomy.

Abstract: In one embodiment, a method of fabricating an implantable pulse generator, comprises: providing a lead body including a plurality of conductors; providing a feedthrough component comprising a plurality of feedthrough pins; hermetically enclosing pulse generating circuitry and switching circuitry within a housing, the feedthrough component being welded to the housing; laser machining each of the plurality of feedthrough pins to comprise a slot along a surface of the respective feedthrough pin; placing a respective conductor from the lead body in the respective slot of each of the plurality of feedthrough pins; and performing welding operations to connect the plurality of conductors of the lead body with the plurality of feedthrough pins of the feedthrough component.

Abstract: A method of laser cutting through dissimilar materials separated by a metal foil. A material stack includes a semiconductor layer or film, with a metal foil layer attached to the back surface. The metal foil layer is attached to an insulative support material layer. A laser parameter is selected and optimized for the material stack. A laser beam creates a kerf in the material stack down to the metal foil layer. The laser beam removes metal through the kerf primarily by gasification rather than melting. Kerf formation continues after optimization of the laser parameter for removal of material from the remaining layers. A debris field resulting from the laser cutting of the metal layer is reduced and/or a portion of the debris is removed in an assisted manner as the beam cuts. The materials are diced by cutting the kerf through all materials.

Abstract: A process to cut sheet material using a laser is improved by performing a first plurality of routings using a first toolpath for the laser and performing at least a second routing using a second toolpath for the laser after performing the first plurality of routings using the first toolpath, the second toolpath traverse from a kerf formed by the laser as a result of performing the first plurality of routings. A z-height shift can be simultaneously implemented with the transverse shift. By shifting the toolpath, interference of plasma generated during laser processing is minimized by maximizing the coupling of the laser and the material, resulting in less discoloration and/or burning of the material.

Abstract: This laser cutting apparatus is a laser cutting apparatus that cuts a workpiece by radiating a laser beam thereon, and is provided with a laser entrance portion to which an optical fiber that transmits the laser beam is fixed and an optical system through which the laser beam radiated from the optical fiber fixed by the laser entrance portion passes, wherein the laser entrance portion includes a moving portion that moves or tilts the optical fiber with respect to the optical system and a fixing portion that fixes the moved or tilted optical fiber with respect to the optical system.

Abstract: There is disclosed a method of processing a security item 1. The security item comprises a holographic security feature 2 having at least one metallised layer. The holographic security feature 2 is applied to the reverse of a substantially transparent film through which the holographic security feature is viewed in use of the security item. The transparent film protects the holographic security feature from the environment in the finished security item. The method includes the step of applying laser radiation to the metallised layer of the holographic security feature through the transparent film to remove a portion of the metallisation to define a pattern of identifying information on the holographic security feature. The method has the advantage that the hologram can be customised with identifying information after manufacture of the security item.

Abstract: The present disclosure relates to a method of cutting a flexible display device, capable of preventing a generation of a defect at the time of cutting the flexible display device, the method including providing a glass mother substrate having a flexible substrate attached thereon and an insulating layer formed on the flexible substrate; melting the flexible substrate and the insulating layer on the mother substrate by irradiating with a first laser beam; and cutting the mother substrate exposed by the irradiation of the first laser beam using a cutting device.

Abstract: Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

Abstract: Methods of separating a strengthened glass substrate having a compressive surface layer and an inner tension layer include translating a laser beam on a surface of the strengthened glass substrate along a line of desired separation from a first edge of the strengthened glass substrate toward a second edge of the strengthened glass substrate. Methods further include backward-propagating a controlled full-body crack within the strengthened glass substrate from the second edge toward the first edge substantially along the line of desired separation. A scribe line may be formed on a surface of the strengthened glass substrate such that the strengthened glass substrate self-separates along the scribe line. A residual stress field may be created within the strengthened glass substrate such that a full-body crack backward-propagates from an exit defect located at the second edge toward the first edge along a line of desired separation, thereby separating the strengthened glass substrate.

Abstract: An apparatus and a method are provided for cutting, cutting-out and perforating web or sheet substrates. The apparatus has a laser cutting device disposed above or below a transport plane for processing a substrate. The laser cutting device includes at least one laser array extending over the width of the substrate and having individually drivable lasers. The laser array is composed, in particular, of a plurality of individual arrays. The lasers are, in particular, constructed as vertical-cavity surface-emitting lasers. In this way, processing of the substrate at high transport speeds is made possible.

Abstract: Systems devices and methods for the transmission of 1 kW or more of laser energy deep into the earth and for the suppression of associated nonlinear phenomena. Systems, devices and methods for the laser perforation of a borehole in the earth. These systems can deliver high power laser energy down a deep borehole, while maintaining the high power to perforate such boreholes.

Abstract: A laser beam machining apparatus includes laser beam irradiation unit for irradiating a wafer held on a chuck table with a laser beam, and control unit. The laser beam irradiation unit includes a laser beam oscillator for oscillating a laser beam with such a wavelength as to be transmitted through said wafer, repetition frequency setting section for setting a repetition frequency of pulses in the laser beam oscillated from the laser beam oscillator.

Abstract: Laser assisted machining process and machine utilizing multiple distributed laser units that are strategically distributed around the workpiece being machined to simultaneously heat the workpiece, creating a desired temperature distribution for laser assisted machining. Sequential incremental heating from different directions and positions are used, resulting in longer tool life and shorter machining time.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: The invention relates to a method for fracture splitting workpieces and to a workpiece that is produced according to such a method. According to the invention, the feed rate and/or the laser pulse is modulated during the laser machining process dependent on the workpiece geometry and/or the laser power.

Abstract: A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features.

Abstract: An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.

Abstract: A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A liquid flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a liquid inside the airfoil, and disrupting the first fluid column with the liquid flowing inside the airfoil.

Abstract: The present invention relates to a printing stencil, for example, for applying a contacting (contact finger, busbar(s)) to a substrate of a solar cell and to a method for producing such a printing stencil. The printing stencil can include a carrier layer and a structure layer located below the carrier layer, the structure layer having at least one printed image opening which corresponds to at least a portion of the printed image of the contacting (contact finger, busbar(s)), the carrier layer having one or more carrier layer openings and the one or more carrier layer openings overlapping when the printing stencil is viewed from above, with respect to the printed image opening in such a manner that the printing stencil has an opening which is formed from the at least one printed image opening and the one or more carrier layer openings, and is suitable for applying contacting material to the substrate through the opening.

Abstract: A method for production of safety/rupture discs comprises the steps providing a foil element, selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut in the foil element by directly applying said laser beam to the foil element to remove material from the foil element thereby obtaining a safety/rupture disc.

Abstract: The invention relates to a laser nozzle that can be used in laser cutting, notably with a fibre or disc laser, comprising a nozzle body comprising an axial housing passing axially through said nozzle body and comprising a first outlet orifice situated at the front face of the nozzle body, and a movable element comprising a skirt-forming front part arranged in the axial housing of the nozzle body, said movable element being capable of translational movement in the axial housing of the nozzle body and comprising an axial passage with a second outlet orifice opening onto the skirt-forming front part.

Abstract: A device for joining by a laser beam two components along a ring-shaped contact zone, where a first of the two components is transmissive for the laser beam and a second of the two components is absorptive for the laser beam. The device includes a receptacle configured to affix the absorptive component and an internal clamping chuck configured for placement on the transmissive component within an open inside area of the contact zone. The device also includes a pressure element with an open inside area that is larger than an extension of the contact zone, a laser source configured to emit the laser beam, and a rotatable holding wheel. The pressure element is connected to the internal clamping chuck via an external axial bearing, the holding wheel and an internal axial bearing so as to transmit to the internal clamping chuck contact pressure exerted on the pressure element.

Abstract: There is provided a mobile high power laser system and conveyance structure for delivering high power laser energy to and for performing high power laser operations in remote and difficult to access locations. There is further provide such systems with high power laser, handling equipment and conveyance equipment that are configured to avoid exceeding the maximum bending radius of high power optical fibers used with the conveyance structures. There are also provided embodiments of the conveyance structures having channels, lines and passages for delivering materials such as fluids.

Abstract: The invention relates to an optimized laser cutting method for cutting a part from a material by means of a cutting system comprising: a laser source for producing a laser beam having a certain power; and a cutting head comprising an end nozzle for passage of a cutting laser beam, wherein the method comprises: determining a cutting power Pd such that Pd=Max(Popt;?e) where Max is the mathematical operator of the maximum, Popt is an optimal power of the laser beam of the cutting system, which is predetermined in accordance with the part to be cut, and/or with cutting parameters and/or with system parameters, in order to minimize the amount of aerosols produced when the part is cut, ? is a leading coefficient representing the number of kW required for cutting the part per mm of the thickness of the part, and e is the thickness of the part in mm.

Abstract: Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance.

Abstract: A method of forming an aperture in an article includes directing a laser at the article and traversing the high energy beam to form a cut extending along the periphery of the aperture in a first direction to a second point on the periphery and then reversing the direction of cutting along the periphery till the aperture is formed.

Abstract: A pulsed machining method for the optimized machining of a contour which is characterized in that the instantaneous frequency ratio of ? of the pulse frequency of tool fL and of the rotational frequency of tool fCNC is optimized to achieve a highest possible degree of coverage of the individual machining pulses in the context of a shortest possible machining duration and without a direct concatenation of the machining pulses. It is especially preferred that this be achieved in that frequency ratio ? is an irrational number, thus cannot be expressed by the ratio of two whole numbers. By applying the method according to the present invention, a considerable time savings is achieved since there is no longer a need for time-consuming preliminary trials to ascertain an at least sufficient frequency ratio ?.

Abstract: An cutting element incorporates a non-magnetic and electrically conductive substrate on which a layer of polycrystalline diamond particles is sintered to the substrate. An method of forming a cutting element comprises sintering the substrate, a layer of diamond particles and a catalyst source at a pressure greater than 20 kbar and a temperature greater than 1200° C. to form a layer of polycrystalline diamond particles bonded to the substrate. Cutting elements incorporating non-magnetic and electrically conductive substrates can be sectioned using ablation techniques, such as laser cutting.

Abstract: A method of making a probe (and the resulting probe) comprising providing a metal foil, creating a tip on an edge of the foil, and laser cutting a body of the probe from the foil with one or more tips at an end of the body.

Abstract: A system and method is provided to use a laser system to remove excess weld bead build up from a workpiece after a welding operation. After a weld bead is formed a weld bead can have a protrusion which extends above a surface of a workpiece and it is desirable to remove the protrusion. A system and method is provided which uses a laser beam oriented at an angle and delivered with an intensity sufficient eliminate or remove the excess weld bead build up.

Abstract: Methods for separating glass articles from glass substrate sheets are described herein. In one embodiment, a method includes focusing a laser beam on at least one surface of the glass substrate sheet such that the laser beam has an asymmetrical intensity distribution at the at least one surface of the glass substrate sheet. The method further includes translating the laser beam on the at least one surface of the glass substrate sheet along a desired groove line to form at least one groove on the at least one surface of the glass substrate sheet. The at least one groove extends partially through a thickness of the glass substrate sheet along the desired groove line and has bevelled or chamfered walls. The glass article may be separated from the glass substrate sheet along the at least one groove.

Abstract: A system and method for removing material in a workpiece is provided. The system includes a laser system that melts a portion of the workpiece by heating the workpiece. The system includes a wire feeder system that feeds a wire to the workpiece to remove molten metal from the workpiece by using the wire. The wire is configured such that the molten metal adheres to the wire when the wire makes contact with the molten metal. The melting by the laser system includes a cutting or a gouging of the workpiece. In some embodiments, the system includes a hot wire power supply that supplies heating current through a length of the wire to heat the length of the wire to a desired temperature. The heating of the wire facilitates the adherence of the molten metal to the wire.

Abstract: The invention relates to a reticle with a visible pattern in a transparent substrate for a telescope. The pattern of the reticle is made of open grooves which are engraved in a surface of the transparent substrate, wherein the engraved open grooves define groove surfaces at an angle to said substrate surface in which the open grooves are engraved. The groove surfaces have a surface roughness which is large enough to scatter light directed onto the reticle perpendicular to the substrate surface when the reticle is illuminated in transmission mode, such that the pattern becomes visible relative to the remaining substrate surface by said light scattering at the groove surfaces in the transmission mode when viewed from a direction perpendicular to the substrate surface. The reticle is produced with direct laser engraving of the grooves.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: Systems and methods are provided for scribing wafers with short laser pulses so as to reduce the ablation threshold of target material. In a stack of material layers, a minimum laser ablation threshold based on laser pulse width is determined for each of the layers. The highest of the minimum laser ablation thresholds is selected and a beam of one or more laser pulses is generated having a fluence in a range between the selected laser ablation threshold and approximately ten times the selected laser ablation threshold. In one embodiment, a laser pulse width in a range of approximately 0.1 picosecond to approximately 1000 picoseconds is used. In addition, or in other embodiments, a high pulse repetition frequency is selected to increase the scribing speed. In one embodiment, the pulse repetition frequency is in a range between approximately 100 kHz and approximately 100 MHz.