Abstract: A laser machining device according to the invention is provided with a laser oscillator for generating a laser beam, a main deflecting galvannometer mirror, an F&thgr; lens, and a sub-deflecting means arranged in an optical path between the laser oscillator and the main deflecting galvanometer mirror. A means for splitting a laser beam is provided, and the sub-deflecting means is inserted into the optical path of one of the split laser beams. At the same time, both the split laser beams are incident from the same main deflecting galvannometer mirror to the F&thgr; lens, and a numerical aperture in the optical system constituted by the main deflecting galvannometer mirror, the F&thgr; lens, and an object is set to be not more than 0.08.

Abstract: A system for creating a pattern on a workpiece sensitive to light radiation, such as a photomask, a display panel or a microoptical device, comprising a source for emitting light pulses in the wavelength range from EUV to IR, a spatial light modulator (SLM) having at least one modulating clement (pixel), adapted to being illuminated by at least one emitted light pulse and a projection system creating an image of the modulator on the workpiece.

Abstract: A method of laser beam machining which has a simple construction and which is capable of suitably processing a part to be processed by means of laser beams is provided. A plurality of laser diode arrays 3 are stacked and disposed in such a manner as to allow radiation of laser beams in the direction of a width W of a part 1 to be processed. Each of the laser diode arrays 3 is controlled such that outputs 2R, 2L of laser beams with which the part 1 to be processed is irradiated in its width (W)-wise marginal portions 1R, 1L become higher than an output 2C of laser beams with which the part 1 to be processed is irradiated in its width (W)-wise central portion 1C. While the part 1 to be processed is irradiated with the laser beams with the distribution of energy thus changed, the laser beams are displaced relatively in the longitudinal direction of the part 1 to be processed.

Abstract: The present invention comprises an array lens illumination system for shaping laser light in a band-like beam, a mask which is arranged in an optical path of the laser light from the array lens illumination system and on which a plurality of circular apertures are formed in a staggered shape in accordance with an arranged state of orifices formed on an orifice plate, a shift member which is arranged at the incident side of the laser light rather than the mask, and which splits the laser light incident on the mask into a plurality of beams in accordance with the number of circular apertures and irradiates the split beams onto the respective circular apertures of the mask, and a projecting lens for forming an image of the laser light passing through the mask on the orifice plate.

Abstract: A laser machining method and apparatus for performing high- speed and high-precision machining on a thin film deposited on a substrate, as well as a liquid crystal panel having an electrode structure patterned using the laser machining apparatus and according to this method are disclosed.

Abstract: Embodiments of methods and an apparatus for creating points or areas of laser-induced damage inside a transparent material are disclosed. One or more embodiments of the invention comprise a method and system for producing etch points by control of breakdown process development. In one embodiment, at the beginning an applied laser radiation level just exceeds an energy threshold for creating a plasma condition in the material, and thereafter the energy level of the applied laser radiation is just maintain the plasma condition and is applied before the plasma condition extinguishes, but after a shock wave associated therewith has passed. Other embodiments of the invention comprise a method and a system for producing etch points by controlling a space structure of laser beam. According to the invention a laser generates a TEMmnm radiation. The values of the integers m and n are controlled and determined so as to reproduce particular gray shades for a particular point of an image.

Abstract: A laser beam generating assembly for materials processing includes a resonator to generate a linearly polarized laser beam, and a beam forming assembly which includes mirrors to orient the polarization plane of the laser beam in a prescribed orientation relative to the vertical and a delay plate which has its reflective surface oriented so that the polarization plane of the beam impinges thereon is at an angle of 45°. The delay plate serves to produce a polarized laser beam with a rotating polarization vector, and in particular an elliptical or circular polarization of the laser beam.

Abstract: A laser hole boring apparatus comprising a galvanomirror beam scanning system, a DOE beam diffraction system and a selecting device for the two systems optionally. The DOE system bores many holes simultaneously on printed circuit boards or packages by converting a laser beam into two dimensional diffraction beams and converging the diffraction beams by an f sin &thgr; lens into spots on the object (board, package). The galvanomirror system bores many holes sequentially on printed circuit boards or packages by scanning a pulse laser beam in two dimensions and converging the scanned beam by an f sin &thgr; lens into a spot on the object.

Abstract: A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.

Abstract: The present invention comprises an array lens illumination system for shaping laser light in a band-like beam, a mask which is arranged in an optical path of the laser light from the array lens illumination system and on which a plurality of circular apertures are formed in a staggered shape in accordance with an arranged state of orifices formed on an orifice plate, a shift member which is arranged at the incident side of the laser light rather than the mask, and which splits the laser light incident on the mask into a plurality of beams in accordance with the number of circular apertures and irradiates the split beams onto the respective circular apertures of the mask, and a projecting lens for forming an image of the laser light passing through the mask on the orifice plate.

Abstract: A process and device are disclosed for fine and micro-machining workpieces by means of laser beams. The process is conducted in several stages and the device has a modular design. The process and device make it possible to generate highly uniform cut seams or grooves, to set the required conicity, to work in a highly accurate and reproducible manner and give a great freedom of design during machining.

Abstract: An optical system that controls laser beam spot profile for forming a high performance thin film by a laser heat treatment process is provided. In the optical system that irradiates a rectangular laser beam on a film formed on a substrate, intensity distribution forming, apparatus makes the intensity distribution uniform in the longitudinal direction while maintaining the properties of the laser beam 2 such as directivity in the direction of shorter side, making it possible to concentrate the light to a limit permitted by the nature of the laser beam and achieve the maximum intensity gradient on the film disposed on the substrate. Thus a steep temperature distribution can be generated on the film disposed on the substrate and, as a result, high performance thin film can be formed.

Abstract: A method for material processing using a pulsed laser includes generating a beam of laser pulses, focusing the beam in a plane above the surface of a workpiece, causing breakdown of matter at a lasing point, and removing or modifying material of the workpiece. Positioning the focal plane of the laser above the workpiece permits the use of higher intensity laser beam pulses and minimizes ill effects of workpiece surface conditions on laser energy absorption. In a second aspect, a method for material processing further includes using vacuum to remove the material removed by the beam, preferably by a push-pull type air vacuum system located slightly above the workpiece surface, thereby providing cleaner workpiece and feature surfaces.

Abstract: A high power laser optical amplifier system for material processing comprises multiple stage fiber amplifiers with rejection of propagating ASE buildup in and between the amplifier stages as well as elimination of SBS noise providing output powers in the range of about 10 &mgr;J to about 100 &mgr;J or more. The system is driven with a time varying drive signal from a modulated semiconductor laser signal source to produce an optical output allowing modification of the material while controlling its thermal sensitivity by varying pulse shapes or pulse widths supplied at a desire repetition rate via modulation of a semiconductor laser signal source to the system to precisely control the applied power application of the beam relative to the thermal sensitivity of the material to be processed. The high power fiber amplifier system has particular utility in high power applications requiring process treatment of surfaces, such as polymeric, organic, ceramic and metal surfaces, e.g.

Abstract: A process for planarization of a silicon wafer is described together with apparatus for implementing it. The process planarizes by directing a high-energy, pulsed laser beam in a direction parallel to the wafer surface while the wafer is rotating. The height of the beam relative to the wafer is carefully controlled thereby enabling the removal of all material above the lower edge of the beam to be removed from the wafer through laser ablation. The method works equally well for removal of metal (as in planarization of damascene wiring) or dielectric (as in planarization of conventional wiring). Once all excess material has been removed (typically requiring about 60 seconds) additional operation of the process does no harm so neither end point detection nor precise control of process time are required.

Abstract: A laser system (1) for producing a line beam laser output (4) comprises a laser source (6), and a lens system (12) for modifying the intensity profile of the incident laser input, and comprising a plurality of lens elements (16) arranged at a predetermined lens pitch. An optical filter (9) is provided between the laser source (6) and the lens system (12), the filter comprising transmissive portions (42) and opaque portions (44). The transmissive portions (42) define a repeating pattern (46) with a pitch corresponding to the lens pitch. The optical filter (9) modifies the input to the lens system (12) such that the output of the lens system gives rise to a desired intensity profile at the output of the laser system (1). This desired profile can have a tapered profile at the top of the hat, which gives improved performance for laser crystallization. The invention can be implemented with minimum adaptation of an existing top hat profile laser system.

Abstract: A method for forming through holes, which has laser beam as the light source to project the laser beam to the work object using an optical system through a photomask for the formation of through holes on the work object by ablation processing, comprises the steps of increasing the concentration of the optical processing energy contributing to the process using the reflected beam created from the work object in the laser ablation processing; and forming each of through holes having the configuration enabling the narrower end to be changed to the wider end in the incident direction of laser beam. With the structure thus arranged, it becomes possible to increase the energy concentration that contributes to the process as compared with the usual ablation processing, because the reflected beam created in the ablation processing can be utilized again for the optical processing.

Abstract: An control system for controlling movement of a product to be imaged relative to a laser and operation of a laser. The control system comprises a mechanism for obtaining drill position data from a data storage device. The control system further includes a mechanism for simultaneously sending necessary signals to alter a path of a laser beam emitted by the laser relative to the object to be imaged. The control system further includes a mechanism for providing a feedback to indicate that the path laser beam, from the laser to the product to be imaged, is suitably altered. The control system further includes a mechanism for firing the laser beam for one of burning, drilling or forming a desired formation in a surface of the object to be imaged. The control system further includes a mechanism for returning the control system, when necessary, for reading further drill position data from the data storage device.

Abstract: A method and a device for modifying target material for esthetic or biomedical applications. A source of energy is directed to apply the energy to a region of the tissue, so as to ablate or modify a portion of the tissue in the region allowing the creation of a desired esthetic pattern or target perforation for product, drug or nutrient delivery. Preferably, cooling of tissue in the region is initiated subsequent to the ablation.

Abstract: A method of correcting laser beam intensity, a laser beam intensity correction mechanism and a multi-branched laser oscillation device having the correction mechanism to adjust the laser beam intensity easily and smoothly, are provided.

Abstract: A processing method for a ceramic green sheet and a laser beam machine used therefor, which can efficiently form a plurality of penetration holes having a desired shape and dimension at predetermined locations of the ceramic green sheet, are provided. By performing the steps of dividing a shaped laser beam into a plurality of laser beams by passing through a diffraction grating in order that an energy of the individual zero order diffracted beam becomes equivalent to, or less than, the threshold value for processing the ceramic green sheet, reflecting the divided laser beams with a galvanomirror, converging the reflected laser beams with an converging lens and radiating the laser beams to the ceramic green sheet, the ceramic green sheet is prevented from being processed by the zero order diffracted beam and the higher order diffracted beam so as to simultaneously form a plurality of penetration holes having a desired shape and dimension.

Abstract: A method for manufacturing an ink jet recording head, which is provided with a ceiling plate having grooves of locally different depth to form ink paths arranged for each of discharge ports; and a substrate having discharge energy generating elements each arranged on a part of each of the paths, and which is structured by bonding the ceiling plate and the substrate together, comprises the steps of performing a first laser processing to process grooves of first depth by irradiating laser beam through a first mask pattern corresponding to the ink path pattern of the ceiling plate; and performing a second laser processing to form a region of locally different depth in each of the grooves by irradiating laser beam through a second mask pattern having the reduced beam pattern to be locally open on the exposure region of the first mask pattern corresponding to the grooves each having the first depth. With the method thus structured, the processing is performed up to the first depth without reducing beam.

Abstract: A laser cutting system has a specially designed frame that allows the laser cutting head to be mounted to the underside of a cross beam for a more efficient movement. The frame is further designed so as to allow the accessing of the work area of the laser cutting system along three different directions. The movement of the laser cutting head for fabricating a sheet placed in the work area of the laser cutting system is effected by a process that takes into consideration a number of parameters and determined data all of which are interpolated for generating optimal movements to further enhance the operating efficiency of the laser cutting system. The laser resonator of the laser cutting system of the instant invention is configured to have a telescopic system that maintains the density and power of the laser beam by auto focusing the same so that optimum cuts can be effected irrespective of whichever area of the worksheet is to be fabricated.

Abstract: A laser machining apparatus for performing high-precision machining on a thin film deposited on a substrate, such as a liquid crystal panel. The apparatus includes a pulse laser generator for emitting a laser beam, a driver for driving the pulse laser generator, a phase grating for dividing the laser beam; a rotary stage for rotating the phase grating to control the direction of the beams illuminating an object, and a spatial filter (element 2101).

Abstract: The present invention is an improved method and apparatus for drilling blind via holes to connect between upper conductive layers and lower conductive layers of printed wiring boards with laser lights. The resin layer contacting the targeted conductive layer is dilled to remain the residual layer with laser lights, and the residual layer is removed with a UV laser beam whose energy density is lower than the decomposition energy threshold of the conductive layer and higher than that of the resin layer. The apparatus for this drilling has at least two laser paths. The spatial energy distributions are made top-hat-shaped with beam homogenizer units in the paths, and the diameters and the energy densities are adjusted independently. Moreover, the paths are aligned to a common axis near the surface of a substrate for shortening the processing time.

Abstract: A method and apparatus for machining a work piece with a laser beam to form a circular hole in the work piece applies the laser beam to a beam rotator which rotates the laser beam about an axis of rotation before it is applied to the work piece. In one embodiment, a laser generates a laser beam having a beam area and a beam axis within the beam area. A beam rotator rotates the laser beam about the beam axis and directs the rotating laser beam to the work piece. One beam rotator employs three reflective surfaces which invert the beam across only one axis defined in the beam cross-section. Another beam rotator employs a triangular prism which receives the laser beam at a first surface at an angle of incidence equal to the Brewster's angle for the prism, totally internally reflects the laser beam from a second surface to direct the light out of the prism through a third surface. This beam rotator also employs a rotating half wave plate to ensure that the light entering the prism is p-polarized.

Abstract: A laser processing method includes the steps of irradiating a projection mask having a light transmitting area, for allowing a laser beam to be transmitted therethrough, with the laser beam; and irradiating a processing target with the laser beam transmitted through the light transmitting area. A spot of the laser beam on the projection mask is shaped so as to irradiate a portion in the vicinity of first edges of the light transmitting area, the first edges extending in one direction, and so as not to irradiate a portion in the vicinity of second edges of the light transmitting area, the second edges extending in a second direction which is different from the first direction.

Abstract: A system is provided with a laser beam source, a reflector mirror that is a reflecting member for reflecting a laser beam emitted from the laser beam source, a spindle motor that is a rotating and driving unit for rotating and driving the reflector mirror, and a f-&thgr; lens that is a converging unit for converging a laser beam reflected by the reflector mirror. The reflector mirror is rotated and driven under the condition that its normal line is mounted to be slanted to a rotary axis of a spindle motor. The optical axis of the reflector beam of the laser beam introduced into the reflector mirror is deflected so as to take a precession. A circular track is depicted on the surface of a workpiece to be machined by a beam spot converged by the f-&thgr; lens to perform the machining work.

Abstract: A mask is mounted on one surface of a ceramic green sheet which is supported on an X-Y table. The mask is provided with a plurality of through hole transmissive portions. A pulsed laser beam is applied to the mask. The size of the laser beam is sufficiently large to encompass at least several of said through hole transmissive portions. The laser beam passes through the through hole transmissive portions and simultaneously forms a plurality of through holes in the ceramic green sheet. Because the mask is located on (or at least substantially adjacent) the surface of the ceramic green sheet, the size and shape of the through holes will be approximately identical to the size and shape of the through hole transmissive portions, thereby precisely controlling the size and shape of the through holes. The mask can be irradiated while the ceramic green sheet is moving.

Abstract: A method and apparatus for precision laser scanning suitable for precision machining or cleaning using an ultrashort pulsed laser beam are disclosed. The apparatus employs a laser source that emits a pulsed laser beam, a dispersion compensation scanner that scans the pulsed laser beam, and a focusing unit that focuses the pulsed laser beam from the dispersion compensation scanner on a work piece. The dispersion compensation scanner comprises a first scanning device that scans the pulsed laser beam in a first direction and that causes dispersion of the pulsed laser beam. The dispersion compensation scanner further comprises a first dispersion compensation device that compensates for the dispersion caused by the first scanning device. Effects of polarization of the ultrashort pulsed laser beam on the quality of machining are described. Uses of the invention in direct fabrication of photolithographic masks and in work piece cleaning are also described.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.

Abstract: An optical device includes a substrate 60 and three prisms 10, 20 and 30. The first prism 10 is disposed adjacent to an upper surface of the substrate 60. An incoming beam aperture 65 is positioned adjacent a first surface 12 of the first prism 10, the first surface 12 extending away from the upper surface of the substrate 60. The second prism 30 is disposed adjacent to the upper surface of the substrate 60 and is spaced from the first prism 10 by a first distance. The third prism 20 is also disposed adjacent to the upper surface of the substrate 60. The third prism 20 may be spaced from the second prism 30 by the same first distance. An outgoing beam aperture 66 is positioned adjacent a first surface 22 of the third prism 20. The substrate 60 has phase changing reflective surfaces 40 and 50 along the upper surface between the first prism 10 and the second prism 30 and between the second prism 30 and the third prism 20.

Abstract: A Q-switched, diode-pumped, solid-state (DPSS) laser (54) employs harmonic generation through nonlinear crystals (72) to generate UV light (74) for both link processing and target alignment. The type and geometry of the nonlinear crystals (72) are selected, and their temperatures are precisely controlled, to produce focused spot sizes with excellent beam quality for severing of IC fuses. A fraction of the laser output (56) can be utilized in a secondary target alignment system (50). An imaging optics module (52) may be employed to further enhance the shape quality of either or both of the secondary and primary beams. Each beam passes through a detection module (100) that measures the incident and reflected light. The two beams pass through a common combiner to facilitate calibration and alignment of the beams and subsequent link processing.

Abstract: A laser beam generating assembly for materials processing includes a resonator to generate a linearly polarized laser beam, and a beam forming assembly which includes mirrors to orient the polarization plane of the laser beam in a prescribed orientation relative to the vertical and a delay plate which has its reflective surface oriented so that the polarization plane of the beam impinges thereon is at an angle of 45° . The delay plate serves to produce a polarized laser beam with a rotating polarization vector, and in particular an elliptical or circular polarization of the laser beam.

Abstract: A composite machining apparatus which permits a plurality of machining heads to perform different machining operations on a workpiece having a gantry that is capable of moving back having multiple horizontally movable machining heads carried thereon to individually move vertically. Thus, the composite machining apparatus allows the multiple machining heads to perform different machining operations, one after another, on a workpiece placed on the table without moving the workpiece.

Abstract: A laser via drilling system, and a method of use thereof, is provided. The apparatus uses two or more laser systems to achieve processing parameter flexibility. The output beams from the independently controlled laser systems are combined using a beam splitter that combines the beams into single or multiple processing beams. The operational flexibility of the system can be further enhanced through the use of multiple EO modulators and a polarization sensitive beam splitter.

Abstract: In a laser processing apparatus including a laser oscillator for emitting laser light onto a workpiece through an f&thgr; lens for drilling a hole in the workpiece, a wavelength selector for passing only a light ray having a specific wavelength is disposed between the laser oscillator and the workpiece.

Abstract: A method for setting up a transparent confinement media nozzle for flowing the confinement media during laser shock peening of a work piece includes the following steps: Step A) flowing a confinement media and setting a flow rate of the confinement media through a confinement media flow nozzle; Step B) positioning the nozzle to flow the confinement media through the nozzle and onto the correlation surface; and Step C) measuring a confinement media layer thickness on the correlation surface using an ultrasonic transducer attached to a side of the test piece opposite that of the correlation surface. The ultrasonic transducer is attached to a side of the test piece opposite that of the correlation surface. One embodiment of the invention employs the work piece as the test piece and the correlation surface is a first laser shock peening surface on a first side of the work piece.

Abstract: The invention relates to a novel design of a diode laser, especially for laser treatment of workpieces. As the beam source there is at least one laser chip which has at least one laser light emitter which lies with its active layer perpendicular to a first axial direction (Y-axis; Z-axis) and which extends in a second axial direction (X-axis), or several emitters provided next to one another in the second axial direction, the second axial direction (X-axis) being perpendicular to the first axial direction (Y-axis, Z-axis).

Abstract: According to the method of processing in accordance with the present invention, first, a beam area formed by a laser beam on the organic insulating film is set to be larger than an area formed by projecting a target part of an organic insulating film onto a horizontal plane, subsequently, the organic insulating film is moved toward the irradiated region of the laser beam, and the irradiation with the laser beam is terminated when the end part of the target part coincides with the moving end part of the laser beam. This enables the resultant processed target surface to be smooth and free from reaction product including decomposed segments of the target body.

Abstract: The invention relates to a workpiece irradiation system which has several individually adjustable deflecting devices, and in which several spatially mutually separated individual processing beam pencils are respectively deflected separately, by means of the deflecting devices arranged in the optical beam path, to at least one workpiece to be irradiated, to variable points or surfaces on the workpiece.

Abstract: A device for machining a hole or a shape of varying profile in a mechanical workpiece using an excimer laser comprises a screen having an aperture of predetermined shape disposed between the excimer laser and a device for focussing the laser beam, the screen being movable in a plane perpendicular to the laser beam. Control means is provided for automatically controlling displacement of the screen in real time while the hole is being machined in the workpiece, the control being effected as a function of the number of pulses emitted by the excimer laser. As an alternative, the screen may be replaced by a diaphragm comprising variable-aperture shutters.

Abstract: A Method and Apparatus for ablating features from a substrate, such as drilling holes in a polymer substrate for an ink jet printhead, by illuminating the substrate that has passed through a mask that is continuously orbited or moved in a two dimensional pattern. The mask is capable of following a trajectory perpendicular to the angle of the radiation.

Abstract: A light beam heating apparatus having a condensing lens mechanism including an aspherical lens and a spherical lens disposed in a light path. The light beam heating apparatus also includes a light source and a light path which transmits the light beam irradiated from the light source, to an object to be heated. The light beam is transmitted through an optical fiber along part the light path, and the aspherical lens and spherical lens are disposed on the optical fiber side and on the object-to-be-heated side respectively. The above-described construction functions to suppress lateral aberration when the diameter of an optical fiber in use is changed, thereby preventing deterioration of the imaging capacity. Also, the occurrence of chromatic aberration can be suppressed to a minimum. Thus, energy concentration in the light condensing section can be improved.

Abstract: A machining device for illuminating a periodic pattern of a mask with coherent light emitted from a light source and projecting the image of the pattern onto a workpiece through an optical system. The optical system includes first and second optical members. The second optical member, which is positioned at an area where diffracted light rays of different orders out of the diffracted light rays generated by the mask are superimposed, employs an optical material having a smaller variation in an optical path length arising from light absorption than an optical material of the first optical member, which is positioned at an area where diffracted light rays of different orders are not superimposed.

Abstract: A process and device for the laser treatment of the internal surfaces of hollow bodies such as engine blocks with cylinder bores which consist of the matrix alloys such as a light-metal or aluminum, wherein a wear-resistant coating is applied to the working surfaces of the pistons within the cylinder. A probe enters the cylinder and includes the laser beam which produces a beam spot on the internal surface of the cylinder and applies an alloying powder at the focus of the spot using a continuously conveying protective gas. The probe is displaced along the axis of the cylinder and simultaneously rotated while the alloying powder is melted in the spot of the laser beam to a depth sufficient to form a wear-resistant coating which will not break loose during the normal operation and life of the engine block. The engine block can be fixed in a stationary position while the probe or probes move simultaneously within the cylinders to apply the hardened surface coating.

Abstract: A component (10) to be balanced is fixtured between rotatable fixtures (22, 24) that establish a simulated rotational centerline and is rotated to a preselected rotational speed where the magnitude and angular location of maximum imbalance is determined. An automatic control system (50) generates a laser light pulse locally at the location of imbalance while the component is rotated to remove material of the location with the laser light pulse having a power and/or duration dependent on the amount of material that needs to be removed from the location of imbalance. The sequence is repeated by the automatic control system for additional revolutions of the component until the balance satisfies a preselected balance tolerance range.

Abstract: A method and apparatus for positioning a surface of a workpiece for laser machining. A laser beam is focused to a focal point to form a plasma generating a plasma emission. An imaging system is oriented to receive the plasma emission and generate a plasma image. The imaging system is adjusted to focus the plasma image and is then fixed. The laser is then diverted away from the focal point and an illumination source is activated to illuminate the surface of the workpiece. The imaging system generates an image of the surface of the workpiece. The workpiece is adjusted in position toward the focal point until the image of the surface of the workpiece is in focus.

Abstract: The present invention provides a method for cutting wood or other materials by separating the material along a line of controlled failure through the application of mechanical force in combination with laser light to break molecular bonds holding the material together along the line of controlled failure. The method includes the use of a generally broad wedge-shaped blade having planar lower and upper surfaces which converge toward each other to terminate along a leading edge. The blade is generally hollow with a cavity for passing optical fibers carrying laser light to a transparent window attached to the leading edge of the blade. Laser light passes through the window and is directed to a line of controlled failure in the material being cut to break the molecular bonds and locally weaken the material while mechanical force is applied to the blade to separate the material and advance the line of controlled failure into the material thereby separating a slice of the material.

Abstract: In a laser processing method for accurately forming a convexo-concave structure on the surface of a glass substrate, a periodic optical intensity distribution of a laser beam is obtained by an interference between diffracted light beams of +1 degree and −1 degree emitted from a phase mask, onto which the laser beam is irradiated, in the vicinity of the emission side of the phase mask, and a glass substrate, on which a thin film is formed, is set in the area where the periodic optical intensity distribution is provided. As a result, the thin film is evaporated or ablated depending on the periodic optical intensity, thereby a diffraction grating, which has the same period as that of the varying optical intensity, is formed on the glass substrate.