Abstract: A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.

Abstract: In a laser irradiation device, a patterning method and a method of fabricating an Organic Light Emitting Display (OLED) using the same. The laser irradiation device includes a light source, a mask, a projection lens, and a Fresnel lens formed at a predetermined portion of the mask to change an optical path. When an organic layer pattern is formed using the laser irradiation device, laser radiation is irradiated onto a region of an organic layer, which is to be cut, and the laser radiation is appropriately irradiated onto a region of the organic layer, which is to be separated from a donor substrate. The laser radiation irradiated onto an edge of the organic layer pattern has a laser energy density greater than that of the laser radiation irradiated onto other portions of the organic layer pattern. As a result, it is possible to form a uniform organic layer pattern and reduce damage of the organic layer.

Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application device for applying a laser beam to the workpiece held on the chuck table, a processing-feed device for moving the chuck table and the laser beam application device relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed device for moving the chuck table and the laser beam application device relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application device includes a laser oscillation device for oscillating a laser beam, a first acousto-optic deflection device for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation device in the processing-feed direction (X-axis direction), and a second acousto-optic deflection device for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation device in the i

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path.

Abstract: The present invention relates to a technique that remarkably increases the processing speed of a conventional ultra-fast laser micro process having a very high processing accuracy. According to the present invention, a laser processing method based on transient changes in the status of laser-induced material couples a pulse of a ultrafast laser to a pulse of at least one auxiliary laser other than the ultrafast laser to reversibly change a material to be processed.

Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating.

Abstract: A laser annealing apparatus is provided, which can simultaneously process a plurality of moving semiconductor devices in an inline manner using one annealing laser. The apparatus may include a laser beam emitting unit, which emits laser beams to target regions of a to-be-processed object. Also included may be a plurality of first nozzles and a plurality of second nozzles, through which gas used for controlling an atmosphere of the target regions of the to-be-processed object is introduced or exhausted. The first and second nozzles may face each other so that the laser beams emitted from the laser beam emitting unit fall therebetween. The apparatus may further include a moving unit, which horizontally moves the to-be-processed object, to which the laser beams are emitted, at approximately the same transport speed.

Abstract: A system for delivering energy to a substrate including a dynamically directable source of radiant energy providing a plurality of beams of radiation, each propagating in a dynamically selectable direction. Independently positionable beam steering elements in a plurality of beam steering elements are operative to receive the beams and direct them to selectable locations on the substrate.

Abstract: An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond laser beam and condensing the first femtosecond laser beam to have a first focal depth, a second condenser lens receiving the second femtosecond laser beam, and condensing the second femtosecond laser beam to have a second focal depth different from the first focal depth, and a second beam splitter receiving and splitting the first femtosecond laser beam condensed through the first condenser lens and the second femtosecond laser beam condensed through the second condenser lens, and irradiating the split first and second femtosecond laser beams at different positions on a substrate to be cut.

Abstract: Disclosed herein is an apparatus for cutting a glass plate. The apparatus comprises a cracking means for forming a minute crack at a point on the glass plate where the cutting is started, at least one scribing means using a laser beam absorbed by the glass plate, at least one quenching means using a quenching fluid after irradiation of the laser beam, a breaking means using the laser beam. The breaking means comprises a laser oscillator, a reflection mirror and a focusing lens. The focusing lens has at least two or more focal lengths. The apparatus may further apparatus further comprise a photo mask formed with light transmission openings for transmitting a part of the laser beam to be irradiated on the glass plate instead of the focusing lens. With the apparatus of the present invention, the problems caused by the conventional lens, such as a reduced straightness of a cutting line or a rough cutting plane, can be prevented, thereby providing a clean cutting plane.

Abstract: A system for delivering energy to a substrate including a dynamically directable source of radiant energy providing a plurality of beams of radiation, each propagating in a dynamically selectable direction. Independently positionable beam steering elements in a plurality of beam steering elements are operative to receive the beams and direct them to selectable locations on the substrate.

Abstract: A system for delivering energy to a substrate including a dynamically directable source of radiant energy providing a plurality of beams of radiation, each propagating in a dynamically selectable direction. Independently positionable beam steering elements in a plurality of beam steering elements are operative to receive the beams and direct them to selectable locations on the substrate.

Abstract: Provided are equipment and a method for measuring a transmittance of a photomask. The system includes an acoustic optical deflector (AOD) substrate interposed between a light source and the photomask. The AOD is adapted to deflect a laser beam to an oblique incidence angle with respect to a surface of the photomask. A radio frequency (RF) signal source is coupled with the AOD substrate. Varying the frequency of the signal applied to the AOD substrate acts to change the refractive degree of the substrate, thereby changing an angle of deflection of the incident laser beam. A photodetector is positioned to receive the laser beam passing through the photomask and is adapted to measure an intensity of the laser beam which has penetrated the photomask. As a result, a transmittance of the photomask can be measured under off axis illumination (OAI).

Abstract: A wafer laser processing method for forming deteriorated layers along a plurality of streets in the inside of a wafer having a device area where a plurality of areas are sectioned by the plurality of streets arranged in a lattice pattern on the front surface and devices are formed in the sectioned areas and having a peripheral excess area surrounding the device area, the surface of the device area being formed to be higher than the surface of the peripheral excess area, by applying a laser beam to the front surface of the wafer along the streets with its focal point set to the inside of the wafer, comprising a first deteriorated layer forming step for forming a deteriorated layer along the streets in the insides of the peripheral excess area and the device area by applying a laser beam to the peripheral excess area and the device area along the streets with its focal point set to the insides of the peripheral excess area and the device area from the front surface side of the wafer; and a second deteriorated l

Abstract: A coordinate detecting device includes a resistive film formed on a substrate and a common electrode for applying a voltage to the resistive film, wherein a potential distribution is created in the resistive film, an electric potential of the resistive film at a contact position is detected, and a position of the contact position of the resistive film is detected. In a manufacturing apparatus, a laser light source irradiates laser light to remove a part of the resistive film to form a resistive film removed part, an optical system converges the laser light, a plurality of probes measure electric potentials of a surface of the resistive film with the common electrode providing the voltage to the resistive film, an X-Y table moves the substrate at least two-dimensionally, and a control part controls the X-Y table and the laser light source.

Abstract: A device and method for steering a laser beam to a focal point in target tissue requires generating a laser beam. Diversions of the laser beam from a central beam path are minimized by a sequential arrangement of optical steering components. In order, the beam is first directed to the center of a z-scanning apparatus which will move the focal point in the medium in a z-direction. The beam is then passed to the center of a first galvanometric mirror which introduces focal point movements in the x-direction. A second galvanometric mirror then compensates for the x-direction movement by redirecting the beam to the center of a third galvanometric mirror where focal point movements in the y-direction are introduced.

Abstract: Disclosed is a method and apparatus for processing signals in a satellite/laser positioning system capable of generating location coordinates from received satellite signals and a received laser signal. A height coordinate bias value is maintained by a filter processor during periods when the laser signal is available. The height coordinate bias value represents an estimated difference between a satellite signal derived height coordinate and a laser signal derived height coordinate. During periods when the laser signal is available, the laser signal derived height coordinate is output. During periods when the laser signal is not available, a corrected height coordinate value is generated by applying the height coordinate bias value to the satellite signal derived height coordinate.

Abstract: Apparatus for the industrial processing of a material by a fiber laser, which fiber laser emits optical radiation, the apparatus configured such that the optical radiation forms an optical power distribution on a surface of the material, including first and second optical powers which are located at respective first and second radii from a center of the optical power distribution and which are of substantially higher intensity than a third optical power which is located at a third radius from the center of the optical power distribution and which is smaller than the first and the second radii.

Abstract: An object of the present invention is to provide a phase shifter for laser annealing which is capable of effectively preventing the sticking of particles. A first layer and a third layer are made of quartz glass, and a two-dimensional pattern of fine grooves is formed in the surfaces of the layers. The first layer and the third layer are arranged so that a second layer is sandwiched between the layers in a state in which the surfaces provided with the grooves face each other. A peripheral edge portion of the first layer is laminated on that of the third layer by a spacer. The second layer is made of an inactive gas introduced between the first layer and the third layer.

Abstract: Under one aspect, a method of processing a film includes defining a plurality of spaced-apart regions to be crystallized within a film, the film being disposed on a substrate and capable of laser-induced melting; generating a sequence of laser pulses having a fluence that is sufficient to melt the film throughout its thickness in an irradiated region, each pulse forming a line beam having a length and a width; continuously scanning the film in a first scan with a sequence of laser pulses at a velocity selected such that each pulse irradiates and melts a first portion of a corresponding spaced-apart region, wherein the first portion upon cooling forms one or more laterally grown crystals; and continuously scanning the film in a second time with a sequence of laser pulses at a velocity selected such that each pulse irradiates and melts a second portion of a corresponding spaced-apart region, wherein the first and second portions in each spaced-apart region partially overlap, and wherein the second portion upon

Abstract: A laser ablation system is controlled by an autofocus subsystem particularly optimized for precision ablation of large workpieces, in an open factory environment where temperatures are not tightly controlled, where the workpieces may have high-spatial-frequency features that affect the focus condition of the working beam. The autofocus operates at a high bandwidth to support high process speed. The autofocus beam shares most of its optical path with the working beam, so its measurements account for thermal effects in the beam train as well as the workpiece. The autofocus beam measures target or adjacent areas just before, or during, ablation, so that temperature drifts do not have time to change the effective focus error. The autofocus spot is substantially the same size as the working spot, so its measurements account for workpiece features of the same spatial frequencies that affect the working beam.

Abstract: A transition joint for joining dissimilar metals with the chemical composition of the joint varied in a controlled manner from end to end. The transition joint has a first end of having a chemical composition similar to that of one of the metals to be joined and a second end having a chemical composition similar to that of the other metal with a gradual composition variation between the first and second ends.

Abstract: A laser processing method for making an inkjet head, including a step of irradiating laser light to an inkjet head material for removing a part of the inkjet head material. The laser light is emitted from a solid laser and has a wavelength of not longer than 355 nm.

Abstract: The present invention relates to a beam modulating apparatus for mold fabrication by ultra-fast laser technique. More particularly, the present invention discloses a beam modulating apparatus for fabricating micro-/nano-scaled structures, which adopts an energy shaping scheme for beam shape modulation while using the modulated beam for mold fabrication. Following the development of flexible electronic devices, such as flexible displays, all kinds of roller molds formed with micro-/nano-scaled structures are becoming the key issue for commercialization and mass production which require a breakthrough in ultra-precision machining and photo-lithography that overcomes the bottlenecks related to shape, size, thermal effect and precision for fabricating sub-micron sized structures and thus greatly enhancing product design capability and functionality.

Abstract: A laser machining apparatus in which three or more beam splits are made incident on one machining lens so that high speed machining can be achieved, and the machining quality (shapes, dimensions, accuracy and straightness of machined holes) is excellent. The optical paths of beams A and B having the same polarization direction are aligned almost in one and the same direction by a total reflection/transmission type beam combining means 31c using a difference in incident angle. After that, the optical paths of the beams A and B and the optical path of a beam C different in polarization direction therefrom are aligned almost in one and the same direction by a polarizing type beam combining means 32. Then, the beams A, B and C are made incident on a machining lens 45.

Abstract: A laser processing apparatus comprises a laser source, a substrate-holding unit, a liquid-supplying unit, a support which has a plurality of mask patterns including a specific mask pattern for imparting a cross-sectional shape to the laser beam, and a support-driving mechanism which moves the support. The liquid-supplying unit supplies the liquid to the substrate, forming a liquid film thereon. The support-driving mechanism moves the support, aligning the specific mask pattern with an axis of the laser beam. The laser beam emitted from the laser unit passes through the specific mask pattern, acquiring a specific cross-sectional shape, and is applied to the substrate through the liquid film, illuminating.

Abstract: A method for controlling the shape of the area machined by a pulse of laser light on a surface, such that the shape has a desired elliptical shape with its major axis aligned in a desired direction and the length of this major axis is less than or equal to a diameter of a beam spot. The pulse is generated and focused to the beam spot within a target area. The polarization of the pulse is adjusted to be elliptically polarized with an axis of the polarization ellipse oriented in the desired direction. The ellipticity of the polarization of the pulse is adjusted such that the pulse of laser light has contours of constant machining capacity on the workpiece surface, which have a similar shape to the desired shape. The fluence of the pulse light is controlled such that the area machined by the pulse is substantially the desired shape.

Abstract: A method of patterning a cross-linked polymer layer includes providing a substrate comprising a cross-linked polymer layer. A laser beam is generated. The laser beam is directed onto a first surface of the polymer layer. Relative movement between the laser beam and the first surface is caused, thereby forming at least one feature on the first surface.

Abstract: A laser treatment apparatus, configured for treating a workpiece, includes: a first laser generation device, a first optical assembly, a second laser generation device, a second optical assembly, a third laser generation device, and an optical detection device. The first optical assembly is configured for directing a first laser beam generated by the first laser generation device onto a first target of the workpiece. The second optical assembly is configured for directing a second laser beam generated by the second laser generation onto a second target of the workpiece. The first laser beam has a wavelength different from that of the second laser beam. The third laser generation device is configured for generating a third laser beam to strike on the first target and/or the second target. The optical detection device is configured for detecting a reflection part of the third laser beam reflected from the workpiece.

Abstract: A laser beam processing machine including a chuck table for holding a workpiece, a laser beam application device for applying a laser beam to the workpiece held on the chuck table, and a processing-feed mechanism for moving the chuck table and the laser beam application device relative to each other. The condenser of the laser beam application device includes a first prism for dividing the laser beam oscillated from the laser beam oscillation mechanism into a first laser beam and a second laser beam, and a second prism for correcting optical paths of the first laser beam and the second laser beam so they become parallel to each other. An image forming lens forms respective spots of the first laser beam and the second laser beam whose optical paths have been corrected to be parallel to each other by the second prism, into images of spots having linear portions on the outer sides and arcuate portions on the inner sides.

Abstract: A laser crystallizing device including a mask divided into two regions, having open parts of the same shape at complementary positions; and a light-shielding pattern selectively leaving one region of the mask open and masking the other region.

Abstract: A method for repairing molds for collapsible connections utilizing a femtosecond laser pulse length. Also provided is a laser source for implementing a multistep profile repair process for the removal of excess material in C4 molds by utilizing the femtosecond laser pulse lengths.

Abstract: In photo-shaping a target object executed by a photo-shaping machine (10) along with a computing device (1), a first path (P1) is generated as a light beam irradiation path on the basis of contour data of each section sliced at a specified pitch of three-dimensional CAD model data of the target object desired to be formed, and the first parameter data. A second path (P2) is generated as a removal processing path on the basis of the three-dimensional CAD model data, the second parameter data, and removing timing data showing a timing of executing the removal process. Driving programs (P3) are generated for executing the photo-shaping process including the light beam irradiation and the removal process, on the basis of the first path data, second path data and removing timing data, thereby performing the photo-shaping and removal process according to the driving programs.

Abstract: A laser processing machine includes a beam splitter for splitting an incoming laser beam into a first laser beam having a first intensity and a second laser beam having a second intensity, a first focusing mirror for focusing the first laser beam onto a first laser processing site on a workpiece at an angle from a direction directly above the workpiece, a second focusing mirror for focusing the second laser beam onto second laser processing site on the workpiece at an angle from a direction directly above the workpiece, and a supplementary laser processing element for supplementing laser processing of the workpiece, wherein the supplementary laser processing element is disposed directly above the first or second laser processing site.

Abstract: A laser processing machine that includes a chuck table adapted to hold a workpiece thereon and laser beam irradiation unit for applying a laser beam to the workpiece held on the chuck table. The laser beam irradiation unit includes: a laser beam oscillation section for emitting a pulse laser beam; a defection section for deflecting the pulse laser beam emitted from the laser beam oscillation section; and a concentrator having an ellipsoidal focusing spot forming section for focusing the pulse laser beam deflected by the deflection unit and forming a focusing spot into an ellipse.

Abstract: A laser beam hardening tool is comprised of an engagement portion for freely engaging with a tool holding portion of a machine tool, a beam guide path which is a passage of supplied laser beam, and a torch portion for radiating laser beam which passed through the beam guide path on a workpiece, thereby executing hardening with laser beam inside the machine tool by installing the laser beam hardening tool in the tool holding portion of the machine tool.

Abstract: A method of laser micro-machining, by means of a laser, a work piece (31) of the type described comprising the steps of: locating the workpiece on a carrier forming a part of a transport system whereby the carrier can be displaced along a path (P) parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by means of an output beam from the laser at a working datum position (A) defined relative to the path which path is established by means of the transport system to traverse the first datum position; a plane defined by the X- and Y-Axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser characterized by the steps of: maintaining distance between the datum position and a current first surface position of the work-piece in the vicinity of the datum position; and varyi

Abstract: In a device for manufacturing a three-dimensional object by subsequently solidifying a solidifiable material (9) layerwise at the positions corresponding to the cross-section of the object an inner container (201) is inserted in a building container (112) that is present in a building space (3), which inner container can be exchanged. Thereby costs can be saved, because the inner container (201) can have a very simple design.

Abstract: A shape with a substantially perfect circle is obtained as a processed shape such as a modified shape or a worked shape at a light focus point in a cross-section in a direction parallel to an advance direction of a femtosecond laser light beam. A section in a direction perpendicular to an advance direction of a laser light beam emitted from a femtosecond laser (10) is formed in a predetermined shaped. The laser light of which sectional shape in the direction perpendicular to the advance direction is formed in the predetermined shape is entered into a lens (14). The light is focused by the lens inside a transparent material (100) and processes the inside of the transparent material.

Abstract: An energy beam machining system includes an emitter for emitting an energy beam and beam adjusting optics, such as a zoom telescope, for adjusting the pupil size of the system to multiple values. The adjusting of the pupil size can be carried out automatically, semi-automatically, or manually. In manual modes, instructions can be presented to the operator (e.g., via a monitor or pre-programmed audio instruction) indicating how to adjust pupil size. A focus lens focuses the adjusted beam directed along each path at a different focal point within a scan field encompassed in the field of view of the focus lens. Beam directing optics are configured to enable multiple scan fields within the field of view of the focus lens.

Abstract: Disclosed herein is a laser beam processing machine having a chuck table for holding a workpiece, a laser beam applicator for applying a laser beam capable of passing through the workpiece to the workpiece held on the chuck table, and a processing-feeder for moving the chuck table and the laser beam applicator relative to each other, the laser beam applicator having a laser beam oscillator, an optical transmitter for transmitting a laser beam oscillated from the laser beam oscillator and a condenser lens for converging a laser beam transmitted by the optical, transmitter. The optical transmitter includes a birefringence lens for separating the laser beam oscillated from the laser beam oscillator into normal light and abnormal light; and the condenser lens converges respectively the normal light and the abnormal light separated by the birefringence lens to form the focal point of the normal light and the focal point of the abnormal light.

Abstract: A scanning/laser ablation apparatus includes an orbiting objective mounted on a radial arm that is rotated around a central axis such that the objective travels along a circular scan path. An input laser beam is directed along the central axis to a first mirror, which redirects the beam to the orbiting objective, e.g., by way of a second mirror. The orbiting objective focuses the beam at a focal point that coincides with the planar surface of a target object (e.g., a solar cell wafer having a blanket passivation layer). As the focused beam passes over the target object, the laser beam is repeatedly pulsed to ablate corresponding portions of the passivation layer such that contact openings are formed during each scan pass. The laser pulses are timed such that associated contact openings from multiple scan passes are aligned in parallel columns that are subsequently connected by metallization.

Abstract: A laser scanning mechanism and multiple processing stations are circumferentially disposed around a central axis. The laser scanning mechanism includes a rotating member driven by a motor to rotate around the central axis, and an optical system fixedly mounted on the rotating member and arranged to redirect input laser beam pulses from the central axis along a circular scan path. Each station including a mechanism for moving a corresponding target object radially across the circular scan path. The laser beam pulses output from the scanning mechanism can be used to process (e.g., ablate material from) multiple target objects simultaneously. The laser scanning mechanism redirects the input laser beam pulses such that the laser beams remain on-axis and in focus as they are scanned along the circular (curved) scan path. A system for producing photovoltaic devices utilizes the laser ablation apparatus and a direct-write metallization apparatus.

Abstract: The invention provides a rotation-type changer of torches and nozzles for a laser beam machine having a movable table. The automatic tool changer 100 of a laser beam machine is equipped with a plurality of torch holders 160 and a nozzle changer 170 disposed on the magazine 150. The working head 40 moves in a Y-axis direction perpendicular to the paper plane and in a Z-axis direction. The torch holder 160 storing the torch to be exchanged is rotated along the Y-axis path line and the working head 40 is lowered to exchange the torch.

Abstract: The ultraviolet short-pulse laser light emitted from the ultraviolet short-pulse laser light source 1 is focused on and caused to irradiate a macromolecular crystal 8 contained in a sample container 6 via a shutter 2, intensity adjusting element 3, irradiation position control mechanism 4, and focusing optical system 5. The sample container 6 is carried on a stage 7, and can be moved in three dimensions along the directions of the x, y and z axes in an x-y-z orthogonal coordinate system with the direction of the optical axis being taken as the z axis; furthermore, the sample container 6 can be rotated about the z axis. Working of the macromolecular crystal is performed by means of ultraviolet short-pulse laser light that is focused on and caused to irradiate the surface of the macromolecular crystal 8. In this way, various types of working can be securely performed on macromolecular crystals with little damage and by means of a simple operation.

Abstract: A laser cutting apparatus capable of properly cutting a workpiece having a large thickness with a laser beam. The laser cutting apparatus includes a gas laser oscillator; and an optical system including a collective lens and transmitting and collecting a laser beam generated in the gas laser oscillator to irradiate a workpiece with the laser beam. An index M2 for evaluating a beam quality of the laser beam emerging from the optical system, with which the workpiece is irradiated, is in a range of 2.8 to 4.

Abstract: A method of carrying out laser processing along processing lines having linear portions and curved portions formed on a workpiece by using a laser beam processing machine comprising a laser beam application means for applying a laser beam to the workpiece held on a chuck table which comprises a condenser for converging a laser beam, having a focal spot changing means for changing the shape of a focal spot between an elliptic spot and a circular spot, comprising the steps of: moving a processing line formed on the workpiece to the application position of a laser beam, activating the focal spot changing means to make an elliptic focal spot and positioning the long axis of the elliptic spot along a linear portion of the processing line when the linear portion of the processing line is located at the application position of the laser beam and activating the focal spot changing means to make a circular focal spot when a curved portion of the processing line is located at the application position of the laser be

Abstract: A laser welding head capable of producing a plurality of beams that are proficient in providing a unique keyhole. The welding head is movable through a plurality of positions relative to substrates that enables the plurality of beams to engage the substrates in a manner that welds the substrates in a variety of stack-up positions. A welding method using the welding head is also provided.

Abstract: Crystallization by irradiation of laser light forms a plurality of convex portions (ridges) on the surface of a crystalline semiconductor film that is obtained, which decreases a film quality. A method of laser irradiation comprises the steps of: overlapping an area which is irradiated with a first laser beam of a pulsed oscillation having a wavelength of equal to or shorter than that of visible light with an area which is irradiated with a second laser beam of a pulsed oscillation having a longer wavelength than that of the first laser beam; and irradiating a subject to be irradiated with the first laser beam and the second laser beam while synchronizing the pulsed oscillation of the first laser beam with that of the second laser beam, and moving the subject to be irradiated, and the first laser beam and the second laser beam relatively each other.