Abstract: A waterjet system in accordance with at least some embodiments includes a carriage, a motion assembly configured to move the carriage horizontally relative to a workpiece, and a cutting head carried by the carriage. The waterjet system can also include a kinematic chain through which the cutting head is operably connected to the carriage. The kinematic chain can include first, second, and third joints rotatably adjustable about different first, second, and third axes, respectively. The carriage and the first and second joints can be configured to move the cutting head along a path relative to the workpiece while the cutting head directs a jet toward the workpiece to form a product. The third joint can be configured to shift a kinematic singularity away from the path to reduce or eliminate delay and corresponding reduced cutting accuracy associated with approaching the kinematic singularity.

Abstract: The methods and apparatus disclosed in this document may be used to create parts with void features such as holes, cavities, channels, slots, and the like. In some embodiments, the void features have a large depth to width aspect ratio. In some embodiments, the void features are formed in pliable, resilient and/or elastomeric materials. In some embodiments, the void features are formed in parts comprising silicone elastomer or silicone rubber. The void features may be adapted and configured for use in medical applications, aerospace applications, electrical applications, and/or industrial applications in some embodiments.

Abstract: A control apparatus for controlling a thickness of a substrate, such as a glass ribbon. The control apparatus comprises a laser assembly and a shielding assembly. The laser assembly generates an elongated laser beam traveling in a propagation direction along an optical path. The shielding assembly comprises at least one shield selectively disposed in the optical path. The shield is configured to decrease an optical intensity of a region of the elongated laser beam. The shielding assembly is configured to change an intensity profile of the elongated laser beam from an initial intensity profile to a targeted intensity profile. A desired targeted intensity profile can be dictated by an arrangement of the shield(s) relative to the optical path, and can be selected to affect a temperature change at portions of the substrate determined to benefit from a reduction in thickness.

Abstract: A laser slicing apparatus for dividing a workpiece with a laser beam, including: a light shielding area detection section that detects light shielding areas existing on a side of a first surface of the workpiece; and a control section that radiates a first laser beam from the side of the first surface so as to scan across a whole area of the first surface of the workpiece and form a first modified layer in a to-be-sliced plane inside the workpiece, and that radiates a second laser beam to the light shielding areas of the workpiece from a second surface on an opposite side of the first surface and form a second modified layer in such a manner that the second modified layer is continuous with the first modified layer in the to-be-sliced plane.

Abstract: A method using femtosecond laser for nano precision preparation. Initial damage nanoholes formed by using femtosecond laser multiphoton excitation are used as a seed structure, and the energy and polarization state of subsequent laser pulses are adjusted in real time, such that uniform and directional optical near-field enhancement is generated near the seed structure and finally the high-precision removal of machined materials is realized. Benefiting from the high localization of near-field spot energy in space, the method uses femtosecond laser pulses having the wavelength of 800 nm to achieve a machining accuracy having the minimum linewidth of only 18 nm, and the linewidth resolution reaches 1/40 of the wavelength; and the method using femtosecond laser for nano precision preparation does not need a vacuum environment, having good air/solution machining compatibility.

Abstract: A laser machining device comprises a movable stage which is controlled by a stage controller. A laser produces a beam for machining and the beam is scanned over the part using a laser scanner under control of the laser scanner. The scanner controller controls the stage controller to synchronize movements of the stage with movements of the scanner. The stage may carry the part to be machined or the scanner.

Abstract: A computerized method and computing platform provides for managing a skill-based competition including receiving event rules including competition set-up rules and authentication a competition set-up prior to competing. Upon validating set-up, the method includes capturing, via the recording device, a video feed of the first user competing in the skill-based competition. A local processing engine can therein analyze the submission to either prepare it for network transmission or determine if network transmission is warranted in relation to other competitor submissions in the competition.

Abstract: To provide a robot control system and a robot control method capable of placing a component grasped by a robot hand at an accurate location on another member. A robot control system is provided with: a robot hand configured to grasp a clip; a camera configured to capture an image of the clip grasped by the robot hand, a calculation unit configured to calculate a position of the clip or an inclination of a component based on an imaging result of the clip captured by the camera, and a robot control unit configured to control the robot hand to adjust, based on the position of the clip or the inclination of the component calculated by the calculation unit, a position or an inclination of the robot hand and move the clip to a stringer.

Abstract: A computerized method and computing platform provides for managing a skill-based competition via network-based submissions. The method includes providing event rules across a communication network to a first user, the event rules relating to competing in the skill-based competition. Via the communication network, the method includes receiving an entry submission from the first user, the entry submission including score data and video data relating to a video feed of the first user competing in the skill-based competition. The method includes analyzing the video feed of the first user competing in the skill-based competition using at least one photogrammetry processing technique, including validating if the first user was in compliance with the event rules while competing in the skill-based competition. Based thereon, a verification score is compared with the score data and the method manages a leaderboard data set as part of managing the competition.

Abstract: A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.

Abstract: An article is produced by welding a first piece to a second piece by a laser beam. The first piece includes an open cavity and a first sealing surface. The second piece has a second sealing surface. The first piece and second piece are inside chamber with a controllable internal pressure that is changed to cause a flow of a gas from the open cavity. The open cavity is closed by moving at least one of the pieces. The first sealing surface forms a partially gas tight preliminary joint with the second sealing surface. The first piece and the second piece define an interface. The chamber is opened after the preliminary joint has been formed. A welded seam is formed by focusing a laser beam to the interface after the chamber is opened. The first sealing surface and the second sealing surface are substantially planar.

Abstract: A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

Abstract: In one aspect the invention relates to a method for calculating control instructions (CI) for controlling a cutting head (H) of a laser machine (L) for cutting a set of contours in a workpiece. The method comprises reading (S71) an encoded cutting plan (P), and continuously determining a state (S73) relating to the processing of the workpiece by the laser machine (L) by means of a set of sensor signals (sens). Further, the method provides a computer-implemented decision agent (DA), which dynamically calculates an action (a) for the machining head (H) to be taken next and based thereon providing control instructions (CI) for executing the processing plan (P) by accessing a trained model with the encoded cutting plan (P) and with the determined state (s).

Abstract: A laser machining apparatus includes a scanner head having at least two galvanometer mirrors and galvano motors, a moving means for moving the scanner head, a movement control apparatus for controlling the moving means, and a scanner control apparatus having a galvano motor control unit for controlling rotational driving angles of the galvano motors. The movement control apparatus has a rotation angle detection unit for detecting a rotation angle of the scanner head with respect to the moving direction. The scanner control apparatus has a mirror angle calculation unit for calculating, from data on the rotation angle, rotational driving angles of the mirrors so that an intersecting direction of the laser beam corresponds to a predetermined direction with respect to the moving direction. The galvano motor control unit controls the galvano motors so that the rotational driving angles calculated by the mirror angle calculation unit are set.

Abstract: Systems and methods for producing a textured pattern on a surface of a part using a laser. The part or laser may be rotated while forming the textured pattern to create a continuous textured pattern on a surface of a part. The continuous textured pattern may be substantially uniform over the entire pattern. A laser texturing system may also include an optical scanner. A first region of the surface of the part may be scanned using a first laser beam. One or more laser texturing parameters or a simulated geometric model may be created based on the scan of the first region. The textured pattern may be formed on the first region using a second laser beam. The textured pattern may be formed in accordance with the one or more laser texturing parameters or simulated geometric model.

Abstract: A laser beam machine has a laser head (3) for emitting a laser beam onto a workpiece which is to be treated, and a movement unit (1, 2, 9) for physically moving the laser head (3), which movement unit has a linearly moving machine portal (1) and a transverse carriage (2) which is held such that it can be moved on said machine portal in a transverse manner, wherein a flexible fiber cable (10) with a minimum permissible bending radius enters at an inlet point on the upper laser head end for transmitting the laser beam, and wherein a cable guidance system (12, 13) is provided in order to guide the fiber cable (10) at least over a portion of its length.

Abstract: A laser-jet apparatus for creating a penetration through a stress region adjacent to a wellbore includes an outer tool housing, the outer tool housing having a housing central bore. A laser assembly includes a lens case with an outer diameter that is smaller than an inner diameter of the housing central bore, defining an annular passage between the outer tool housing and the lens case. A focusing lens and a collimating lens are located within the lens case. The focusing lens is shaped to control the divergence of a laser beam and the collimating lens is shaped to fix the diameter of the laser beam. A jet fluid path is located in the annular passage, the jet fluid path shaped to merge jet fluid with the laser beam. The outer tool housing has a frusto-conical tip for directing the combined jet fluid and laser beam to the stress region.

Abstract: A laser processing device having a function for avoiding interference during an approach motion of a processing nozzle of the laser processing device. When a distance between a processing nozzle and a workpiece is equal to a setting value where gap control can be started, it is judged as to whether or not the mechanical position of the processing nozzle is above a predetermined processing start position. When the mechanical position of the processing nozzle is higher than the processing start position, a controller judges that an abnormality occurs by which laser processing cannot be carried out, and automatically stops the approach motion of the processing nozzle.

Abstract: A travel system (20) for a canister storage, transfer, or transport system generally includes a support structure (22), at least one traveling device (24) for preparing, inspecting, and/or repairing the canister, and a base ring (26) for supporting the traveling device and providing for rotational movement of the traveling device relative to the support structure.

Abstract: A cutting head for a cutting machine, the cutting head having a holder arranged to support a cutting device, the holder being secured to an arm assembly that is adapted to be mounted to the cutting machine, a first servo motor to drive the arm assembly to effect rotational movement or swivel of the torch holder and a second servo motor to drive the arm assembly to effect tilt of the holder about a vertical axis whereby, in use, as the holder tilts and swivels to impart a bevel cut to a work piece the tip of the cutting device is held stationary.

Abstract: A laser assembly includes a laser and an articulated arm having a plurality of couplers arranged to receive a laser-beam from the laser. The assembly is mounted on a support structure, and is rotatable on the support structure in two axes perpendicular to each other. Six degrees of freedom of motion of the end of the articulated arm can be accomplished with one less coupler in the arm than would be necessary without rotation of the assembly on the support structure.

Abstract: An apparatus for measuring oil droplets and other bodies in a liquid, the apparatus comprising a body having an imaging device mounted therein, said body having a measurement window adjacent a measuring region through which an image of a fluid within the measurement region may be viewed by the imaging device, wherein a light source is provided for illuminating said measurement region, said light source being directed towards the imaging device by a light directing means, the apparatus including an ultrasonic transducer mechanically coupled to the measurement window for removing fouling from the measurement window and for creating cavitation within said measurement region, wherein said light directing means is located in or adjacent said measurement region to be exposed to said cavitation created by the ultrasonic transducer to remove fouling from said light directing means.

Abstract: The invention relates to a method and a device for joining workpieces by means of a laser beam, wherein the device comprises: a scanner optics for guiding the laser beam; a press element, which, during the joining process, is pressed along a pressing direction onto at least one of the workpieces; and a housing, which houses the scanner optics and the laser beam running from the scanner optics towards the workpieces, wherein the press element forms a part of the housing and is movable relative to the rest of the housing by at least one degree of movement freedom.

Abstract: In order to provide a laser irradiation system, a method for removing a coating, and a laser irradiation apparatus capable of efficiently removing a coating on a surface of a structure and recovering the removed substance using suction, a laser head (3) is configured from an optical system (4) for irradiating laser beam (30), a suctioning means (33) for suctioning removed matter (60) produced at the point where the laser beam (30) is directed, and an attachment (5) configured to be capable of abutting a surface (20) of a structure, the optical system (4) being operated to scan the irradiation point of the laser beam so as to draw a trajectory of a circle having a radius r1 around the optical axis of the laser beam (30) on a surface substantially perpendicular to the optical axis.

Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

Abstract: This robot system includes a robot, a laser emitting portion moved by the robot, capable of scanning a welding locus with a laser beam at least in a state where the laser emitting portion is not moving, and a control portion controlling the laser emitting portion to scan the welding locus with the laser beam in order to perform welding with weaving on the welding locus at least in the state where the laser emitting portion is not moving.

Abstract: The sealing apparatus includes a measuring unit moving above a sealing unit to measure a pattern of the sealing unit, a laser beam irradiation device moving along the measuring unit to irradiate a laser beam onto the sealing unit, and a control unit controlling a moving path and a size of a focusing area of the laser beam irradiation device according to the pattern of the sealing unit that is measured in the measuring unit.

Abstract: In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in working direction, it encloses a tilt angle (?) differing from 0 degrees with the longitudinal axis of the laser head. Starting therefrom, to produce the inclination of the collimated laser beam to the vertical with a very small number of optical components if possible, the invention suggests that the laser beam is supplied to the laser head by means of an optical fiber and the laser beam is collimated, passes through the deflection element laterally offset to the longitudinal axis of the laser head and is deflected by means of said element onto the workpiece surface and focused at the same time.

Abstract: Laser crystallization equipment includes a laser generator generating a laser beam, the laser beam being directed toward a processing target substrate, and a blade member over the processing target substrate, the blade member being configured to chop the laser beam with a predetermined width in two directions, wherein two ends of the laser beam chopped by the blade member are irradiated to the processing target substrate as diffraction light.

Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Abstract: The present invention relates to a cutting system for high precision cutting of substantially flat elements (1, 11), comprising a support plane (40) for said substantially flat elements (1, 11), a first axle (Xa) of motion and a second axle (Ya) of motion, perpendicular to the first axle (Xa) and parallel to the support plane (40), and a support (7) for a cutting device, placeable along such axles; the support plane (40) is moveable, independently from the support (7), along a third axle (Xw) of movement, parallel to the first axle (Xa), so as the relative movement of the support (7) in respect with the support plane (40) results in a first component corresponding to the sum of the movements along the first axle (Xa) and the third axle (Xw), and in a second component corresponding to the sum of the movements along the second axle (Ya).

Abstract: A machine for the surface treatment of a cylinder includes a first operative station for supporting the cylinder and for bringing it into rotation around its longitudinal axis, and at least a second operative station cooperating with the first station for generating and emitting, by means of an optical fiber apparatus, pulsed laser radiations randomly striking the surface of the cylinder and defining a desired roughness on the same surface; the second station being adjustably coupled with the first station in a first direction parallel with respect to the axis of the cylinder and carrying one or more pulsed laser radiation emitting heads, and slidingly assembled with respect to the cylinder in a second direction perpendicular to the axis of the cylinder.

Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.

Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Abstract: In a method for machining a workpiece, a laser beam (5) is guided across the workpiece surface by means of a beam guide (2, 51), wherein the laser beam guide comprises a first guide (2) effecting a laser beam guide at a first path speed. The laser beam guide comprises a second guide (51) simultaneously operating with the first guide, which effects a laser beam guide at a second path speed, which is higher than the first path speed.

Abstract: Provided are: a table on which a workpiece is placed, a laser oscillator emitting a laser beam; a light-guide optical system deflecting the beam emitted from the oscillator; a cylindrical extensible bellows surrounding an optical path of the beam after the light-guide optical system deflects the beam; a bend mirror moving in an axial direction of the bellows while extending/contracting the bellows and deflecting the beam having passed through the bellows toward the table; a machining head irradiating the workpiece with the beam deflected by the mirror; an abnormality detector including a beam-sensor light-emitting unit emitting a beam advancing parallel with an axis of the bellows and a beam-sensor light-receiving unit measuring the amount of received light of the beam; and a control device bringing down the laser oscillator when the amount of received light of the beam in the beam-sensor light-receiving unit falls below a first threshold.

Abstract: A robot system includes a robot, a controller, and a laser emitter which is configured to emit a laser beam to a target workpiece and which is configured to be moved by the robot. The controller is configured to control the laser emitter to emit the laser beam based on information regarding an arbitrarily-shaped work path and movement information of the laser emitter. The controller is configured to determine whether or not a reference position of the arbitrarily-shaped work path on the target workpiece is located in a predetermined range of the laser emitter while the laser emitter is moving. The controller is further configured to control the laser emitter to emit the laser beam to the arbitrarily-shaped work path if the reference position is located in the predetermined range.

Abstract: In some aspects, methods includes forming intersecting apertures in a workpiece with a laser beam by moving the laser beam along intersecting line paths, and cutting out a portion of a shape from the workpiece by moving the laser beam along a continuous final path extending around an intersection point of the intersecting line paths.

Abstract: A laser energy delivery system includes a relay imaging system. Input optics arranged to receive the laser energy, a transmitting mirror having adjustable angle of incidence relative to the input optics, and a robot mounted optical assembly are configured to direct laser energy toward the movable target image plane. The laser energy follows an optical path including an essentially straight segment from the transmitting mirror to the receiving mirror, having a variable length and a variable angle relative to the input optics through air. Diagnostics on the processing head facilitate operation.

Abstract: A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features.

Abstract: A manipulation system controllably moves a head relative to a surface of an inhabitable structure for irradiating the surface with energy waves from the head. The manipulation system includes a positioning mechanism coupled to the head. The positioning mechanism includes a first-axis position system adapted to move the head along a first direction substantially parallel to the surface. The positioning mechanism further includes a second-axis position system coupled to the first-axis position system and adapted to move the head along a second direction substantially parallel to the surface. The manipulation system further includes an anchoring mechanism coupled to the positioning mechanism and releasably coupled to the structure.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: An apparatus for forming a pattern using a laser is provided. The apparatus includes a pattern storing unit, a controller, a laser oscillating unit, an X-Y driver, a header unit, and a stage. The pattern storing unit stores data on light guide patterns of a discontinuous straight line shape. The controller transmits position signal of the light guide patterns to the X-Y driver and simultaneously, transmits a switching signal to the laser oscillating unit. The laser oscillating unit outputs a laser beam synchronized with a movement of the header unit. The X-Y driver moves the header unit and the stage. The header unit moves along a first guide rail. The stage moves along a fixed second guide rail in the front and rear direction of the light guide panel.

Abstract: A semiconductor device includes a plurality of active areas disposed on a semiconductor substrate. A manufacturing method of the semiconductor device includes performing a first annealing process on the semiconductor substrate by emitting a first laser alone a first scanning direction, and performing a second annealing process on the semiconductor substrate by emitting a second laser alone a second scanning direction. The first scanning direction and the second scanning direction have an included angle.

Abstract: A beam processor for processing a work surface of a workpieee W by irradiating the work surface with a beam, includes: an output source for outputting the beam, a beam moving device for moving the beam output from the output source; and a plurality of reflectors disposed on an optical path of the beam between the beam moving device and the work surface for reflecting the beam moved by the beam moving device and conducting the beam to the work surface, wherein the plurality of reflectors is inclined a predetermined angle corresponding to an incident direction of the beam so that the beam moved by the beam moving device is conducted nearly vertically to a different position of the work surface.

Abstract: An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.

Abstract: A method for processing workpieces includes performing a laser processing operation in which a laser beam is directed at a first mirror face and at a second mirror face of a redirecting mirror. The second mirror face is at least partially surrounded by the first mirror face. During the laser processing operation, the second mirror face performs a pendulum movement relative to the first mirror face.

Abstract: The present invention relates to a device for guiding a laser beam along a target path, particularly a joint. It has a laser beam input module that guides an incident laser beam onto a swiveling beam guiding device downstream from the laser beam input module. The beam guiding device projects the laser beam onto the target path. Said beam guiding device comprises a tactile sensor connected to the swiveling optic that is designed to perform a tactile scan of the target path and to deflect the swiveling optic appropriately. According to the invention, an intermediate focal point is located in the beam path of the laser beam between laser beam input module and swiveling optic. Moreover, the swivel axis of the swiveling optic runs through the intermediate focal point.

Abstract: To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.

Abstract: A laser beam welding device and a laser beam welding method are described. It is provided that a laser beam converted to have an annular cross-sectional area by using an optical system is deflected for the purpose of producing a radial weld.