Path Adjustment Patents (Class 219/121.79)
  • Patent number: 10434603
    Abstract: Systems and methods for producing a textured pattern on a surface of a part using a laser. The part or laser may be rotated while forming the textured pattern to create a continuous textured pattern on a surface of a part. The continuous textured pattern may be substantially uniform over the entire pattern. A laser texturing system may also include an optical scanner. A first region of the surface of the part may be scanned using a first laser beam. One or more laser texturing parameters or a simulated geometric model may be created based on the scan of the first region. The textured pattern may be formed on the first region using a second laser beam. The textured pattern may be formed in accordance with the one or more laser texturing parameters or simulated geometric model.
    Type: Grant
    Filed: June 21, 2014
    Date of Patent: October 8, 2019
    Assignee: Apple Inc.
    Inventors: Michael S. Nashner, Peter N. Russell-Clarke
  • Patent number: 10166633
    Abstract: A laser beam machine has a laser head (3) for emitting a laser beam onto a workpiece which is to be treated, and a movement unit (1, 2, 9) for physically moving the laser head (3), which movement unit has a linearly moving machine portal (1) and a transverse carriage (2) which is held such that it can be moved on said machine portal in a transverse manner, wherein a flexible fiber cable (10) with a minimum permissible bending radius enters at an inlet point on the upper laser head end for transmitting the laser beam, and wherein a cable guidance system (12, 13) is provided in order to guide the fiber cable (10) at least over a portion of its length.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: January 1, 2019
    Assignee: Messer Cutting Systems GmbH
    Inventors: Tobias Wolf, Robert Schröder, Thomas Dünzkofer, Ingo Göller
  • Patent number: 9932803
    Abstract: A laser-jet apparatus for creating a penetration through a stress region adjacent to a wellbore includes an outer tool housing, the outer tool housing having a housing central bore. A laser assembly includes a lens case with an outer diameter that is smaller than an inner diameter of the housing central bore, defining an annular passage between the outer tool housing and the lens case. A focusing lens and a collimating lens are located within the lens case. The focusing lens is shaped to control the divergence of a laser beam and the collimating lens is shaped to fix the diameter of the laser beam. A jet fluid path is located in the annular passage, the jet fluid path shaped to merge jet fluid with the laser beam. The outer tool housing has a frusto-conical tip for directing the combined jet fluid and laser beam to the stress region.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: April 3, 2018
    Assignee: Saudi Arabian Oil Company
    Inventors: Sameeh Issa Batarseh, Hazim H. Abass
  • Patent number: 9895769
    Abstract: A laser processing device having a function for avoiding interference during an approach motion of a processing nozzle of the laser processing device. When a distance between a processing nozzle and a workpiece is equal to a setting value where gap control can be started, it is judged as to whether or not the mechanical position of the processing nozzle is above a predetermined processing start position. When the mechanical position of the processing nozzle is higher than the processing start position, a controller judges that an abnormality occurs by which laser processing cannot be carried out, and automatically stops the approach motion of the processing nozzle.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: February 20, 2018
    Assignee: FANUC CORPORATION
    Inventor: Hiroaki Tokito
  • Patent number: 9724790
    Abstract: A travel system (20) for a canister storage, transfer, or transport system generally includes a support structure (22), at least one traveling device (24) for preparing, inspecting, and/or repairing the canister, and a base ring (26) for supporting the traveling device and providing for rotational movement of the traveling device relative to the support structure.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: August 8, 2017
    Assignee: TN Americas LLC
    Inventors: Robert Grubb, Aleksandr Kofman
  • Patent number: 9687933
    Abstract: A cutting head for a cutting machine, the cutting head having a holder arranged to support a cutting device, the holder being secured to an arm assembly that is adapted to be mounted to the cutting machine, a first servo motor to drive the arm assembly to effect rotational movement or swivel of the torch holder and a second servo motor to drive the arm assembly to effect tilt of the holder about a vertical axis whereby, in use, as the holder tilts and swivels to impart a bevel cut to a work piece the tip of the cutting device is held stationary.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: June 27, 2017
    Assignee: PROFILE CUTTING SYSTEMS PTY LTD
    Inventor: Gianpiero Antonio Buccella
  • Patent number: 9371957
    Abstract: A laser assembly includes a laser and an articulated arm having a plurality of couplers arranged to receive a laser-beam from the laser. The assembly is mounted on a support structure, and is rotatable on the support structure in two axes perpendicular to each other. Six degrees of freedom of motion of the end of the articulated arm can be accomplished with one less coupler in the arm than would be necessary without rotation of the assembly on the support structure.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: June 21, 2016
    Assignee: RELIANT TECHNOLOGIES, LLC
    Inventor: Joseph L. Dallarosa
  • Patent number: 9116102
    Abstract: An apparatus for measuring oil droplets and other bodies in a liquid, the apparatus comprising a body having an imaging device mounted therein, said body having a measurement window adjacent a measuring region through which an image of a fluid within the measurement region may be viewed by the imaging device, wherein a light source is provided for illuminating said measurement region, said light source being directed towards the imaging device by a light directing means, the apparatus including an ultrasonic transducer mechanically coupled to the measurement window for removing fouling from the measurement window and for creating cavitation within said measurement region, wherein said light directing means is located in or adjacent said measurement region to be exposed to said cavitation created by the ultrasonic transducer to remove fouling from said light directing means.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: August 25, 2015
    Assignee: Advanced Sensors Limited
    Inventors: Khalid Thabeth, Frank Lunney, Turan Mirza
  • Patent number: 9114477
    Abstract: The invention relates to a method and a device for joining workpieces by means of a laser beam, wherein the device comprises: a scanner optics for guiding the laser beam; a press element, which, during the joining process, is pressed along a pressing direction onto at least one of the workpieces; and a housing, which houses the scanner optics and the laser beam running from the scanner optics towards the workpieces, wherein the press element forms a part of the housing and is movable relative to the rest of the housing by at least one degree of movement freedom.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: August 25, 2015
    Assignee: Scansonic MI GmbH
    Inventors: Igor Haschke, Arwed Kilian
  • Publication number: 20150076125
    Abstract: In order to provide a laser irradiation system, a method for removing a coating, and a laser irradiation apparatus capable of efficiently removing a coating on a surface of a structure and recovering the removed substance using suction, a laser head (3) is configured from an optical system (4) for irradiating laser beam (30), a suctioning means (33) for suctioning removed matter (60) produced at the point where the laser beam (30) is directed, and an attachment (5) configured to be capable of abutting a surface (20) of a structure, the optical system (4) being operated to scan the irradiation point of the laser beam so as to draw a trajectory of a circle having a radius r1 around the optical axis of the laser beam (30) on a surface substantially perpendicular to the optical axis.
    Type: Application
    Filed: March 8, 2013
    Publication date: March 19, 2015
    Applicant: TOYOKOH, Co., Ltd.
    Inventors: Hiroyasu Toyosawa, Kazuaki Toyosawa, Kazuhisa Fujita, Shinichiro Okihara
  • Patent number: 8969752
    Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: March 3, 2015
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Kenshi Fukumitsu, Fumitsugu Fukuyo, Naoki Uchiyama
  • Patent number: 8965556
    Abstract: This robot system includes a robot, a laser emitting portion moved by the robot, capable of scanning a welding locus with a laser beam at least in a state where the laser emitting portion is not moving, and a control portion controlling the laser emitting portion to scan the welding locus with the laser beam in order to perform welding with weaving on the welding locus at least in the state where the laser emitting portion is not moving.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: February 24, 2015
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Yuki Oe, Keiji Makino
  • Publication number: 20150048070
    Abstract: The sealing apparatus includes a measuring unit moving above a sealing unit to measure a pattern of the sealing unit, a laser beam irradiation device moving along the measuring unit to irradiate a laser beam onto the sealing unit, and a control unit controlling a moving path and a size of a focusing area of the laser beam irradiation device according to the pattern of the sealing unit that is measured in the measuring unit.
    Type: Application
    Filed: March 18, 2014
    Publication date: February 19, 2015
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventor: Jeong-Won HAN
  • Patent number: 8952289
    Abstract: Laser crystallization equipment includes a laser generator generating a laser beam, the laser beam being directed toward a processing target substrate, and a blade member over the processing target substrate, the blade member being configured to chop the laser beam with a predetermined width in two directions, wherein two ends of the laser beam chopped by the blade member are irradiated to the processing target substrate as diffraction light.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: February 10, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Byoung-Kwon Choo, Cheol-Ho Park, Kwon-Hyung Lee, Sung-Chul Pyo
  • Patent number: 8952290
    Abstract: In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in working direction, it encloses a tilt angle (?) differing from 0 degrees with the longitudinal axis of the laser head. Starting therefrom, to produce the inclination of the collimated laser beam to the vertical with a very small number of optical components if possible, the invention suggests that the laser beam is supplied to the laser head by means of an optical fiber and the laser beam is collimated, passes through the deflection element laterally offset to the longitudinal axis of the laser head and is deflected by means of said element onto the workpiece surface and focused at the same time.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: February 10, 2015
    Assignee: Messer Cutting Systems GmbH
    Inventor: Karl Eck
  • Publication number: 20150001194
    Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.
    Type: Application
    Filed: September 18, 2014
    Publication date: January 1, 2015
    Inventors: Mark A. Unrath, Andrew Berwick, Alexander A. Myachin
  • Publication number: 20140374393
    Abstract: The present invention relates to a cutting system for high precision cutting of substantially flat elements (1, 11), comprising a support plane (40) for said substantially flat elements (1, 11), a first axle (Xa) of motion and a second axle (Ya) of motion, perpendicular to the first axle (Xa) and parallel to the support plane (40), and a support (7) for a cutting device, placeable along such axles; the support plane (40) is moveable, independently from the support (7), along a third axle (Xw) of movement, parallel to the first axle (Xa), so as the relative movement of the support (7) in respect with the support plane (40) results in a first component corresponding to the sum of the movements along the first axle (Xa) and the third axle (Xw), and in a second component corresponding to the sum of the movements along the second axle (Ya).
    Type: Application
    Filed: June 24, 2014
    Publication date: December 25, 2014
    Inventor: Johan BATTHEU
  • Publication number: 20140332509
    Abstract: A machine for the surface treatment of a cylinder includes a first operative station for supporting the cylinder and for bringing it into rotation around its longitudinal axis, and at least a second operative station cooperating with the first station for generating and emitting, by means of an optical fiber apparatus, pulsed laser radiations randomly striking the surface of the cylinder and defining a desired roughness on the same surface; the second station being adjustably coupled with the first station in a first direction parallel with respect to the axis of the cylinder and carrying one or more pulsed laser radiation emitting heads, and slidingly assembled with respect to the cylinder in a second direction perpendicular to the axis of the cylinder.
    Type: Application
    Filed: December 5, 2012
    Publication date: November 13, 2014
    Applicant: TENOVA S.p.A.
    Inventors: Claudio Trevisan, Paolo Gaboardi, Giovanni Boselli
  • Patent number: 8859934
    Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: October 14, 2014
    Assignee: Insera Therapeutics, Inc.
    Inventors: Vallabh Janardhan, Vikram Janardhan
  • Patent number: 8847113
    Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: September 30, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Mark A. Unrath, Andrew Berwick, Alexander A. Myachin
  • Patent number: 8847109
    Abstract: In a method for machining a workpiece, a laser beam (5) is guided across the workpiece surface by means of a beam guide (2, 51), wherein the laser beam guide comprises a first guide (2) effecting a laser beam guide at a first path speed. The laser beam guide comprises a second guide (51) simultaneously operating with the first guide, which effects a laser beam guide at a second path speed, which is higher than the first path speed.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: September 30, 2014
    Assignee: Sauer GmbH Lasertec
    Inventors: Michael Kuhl, Peter Hildebrand, Martin Reisacher
  • Patent number: 8803026
    Abstract: Provided are: a table on which a workpiece is placed, a laser oscillator emitting a laser beam; a light-guide optical system deflecting the beam emitted from the oscillator; a cylindrical extensible bellows surrounding an optical path of the beam after the light-guide optical system deflects the beam; a bend mirror moving in an axial direction of the bellows while extending/contracting the bellows and deflecting the beam having passed through the bellows toward the table; a machining head irradiating the workpiece with the beam deflected by the mirror; an abnormality detector including a beam-sensor light-emitting unit emitting a beam advancing parallel with an axis of the bellows and a beam-sensor light-receiving unit measuring the amount of received light of the beam; and a control device bringing down the laser oscillator when the amount of received light of the beam in the beam-sensor light-receiving unit falls below a first threshold.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: August 12, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Shigeru Yokoi
  • Publication number: 20140217076
    Abstract: A robot system includes a robot, a controller, and a laser emitter which is configured to emit a laser beam to a target workpiece and which is configured to be moved by the robot. The controller is configured to control the laser emitter to emit the laser beam based on information regarding an arbitrarily-shaped work path and movement information of the laser emitter. The controller is configured to determine whether or not a reference position of the arbitrarily-shaped work path on the target workpiece is located in a predetermined range of the laser emitter while the laser emitter is moving. The controller is further configured to control the laser emitter to emit the laser beam to the arbitrarily-shaped work path if the reference position is located in the predetermined range.
    Type: Application
    Filed: April 22, 2014
    Publication date: August 7, 2014
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Yuki OE, Keiji MAKINO
  • Patent number: 8716625
    Abstract: In some aspects, methods includes forming intersecting apertures in a workpiece with a laser beam by moving the laser beam along intersecting line paths, and cutting out a portion of a shape from the workpiece by moving the laser beam along a continuous final path extending around an intersection point of the intersecting line paths.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 6, 2014
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventor: Thomas Hert
  • Patent number: 8698040
    Abstract: A laser energy delivery system includes a relay imaging system. Input optics arranged to receive the laser energy, a transmitting mirror having adjustable angle of incidence relative to the input optics, and a robot mounted optical assembly are configured to direct laser energy toward the movable target image plane. The laser energy follows an optical path including an essentially straight segment from the transmitting mirror to the receiving mirror, having a variable length and a variable angle relative to the input optics through air. Diagnostics on the processing head facilitate operation.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: April 15, 2014
    Assignee: Metal Improvement Company LLC
    Inventors: C. Brent Dane, Fritz B. Harris, Joseph T. Taranowski, Steven L Honett, Stewart B. Brown
  • Patent number: 8680430
    Abstract: A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: March 25, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Mark A. Unrath
  • Patent number: 8624158
    Abstract: A manipulation system controllably moves a head relative to a surface of an inhabitable structure for irradiating the surface with energy waves from the head. The manipulation system includes a positioning mechanism coupled to the head. The positioning mechanism includes a first-axis position system adapted to move the head along a first direction substantially parallel to the surface. The positioning mechanism further includes a second-axis position system coupled to the first-axis position system and adapted to move the head along a second direction substantially parallel to the surface. The manipulation system further includes an anchoring mechanism coupled to the positioning mechanism and releasably coupled to the structure.
    Type: Grant
    Filed: April 10, 2006
    Date of Patent: January 7, 2014
    Assignee: Loma Linda University Medical Center
    Inventors: Paul E. Denney, Jay R. Eastman, Paul M. Fallara, Andrew P. Joseph, John S. Phillips, Michael N. Patena, Tim Burnham, Paul Coleman
  • Patent number: 8624153
    Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: January 7, 2014
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Kazuhiro Atsumi, Koji Kuno, Masayoshi Kusunoki, Tatsuya Suzuki, Kenshi Fukumitsu, Fumitsugu Fukuyo
  • Patent number: 8592718
    Abstract: An apparatus for forming a pattern using a laser is provided. The apparatus includes a pattern storing unit, a controller, a laser oscillating unit, an X-Y driver, a header unit, and a stage. The pattern storing unit stores data on light guide patterns of a discontinuous straight line shape. The controller transmits position signal of the light guide patterns to the X-Y driver and simultaneously, transmits a switching signal to the laser oscillating unit. The laser oscillating unit outputs a laser beam synchronized with a movement of the header unit. The X-Y driver moves the header unit and the stage. The header unit moves along a first guide rail. The stage moves along a fixed second guide rail in the front and rear direction of the light guide panel.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: November 26, 2013
    Assignee: LS Tech Co., Ltd.
    Inventors: Deukil Park, Choongyop Rhew, Daisoung Park, Wonmyeong Kang
  • Patent number: 8575043
    Abstract: A semiconductor device includes a plurality of active areas disposed on a semiconductor substrate. A manufacturing method of the semiconductor device includes performing a first annealing process on the semiconductor substrate by emitting a first laser alone a first scanning direction, and performing a second annealing process on the semiconductor substrate by emitting a second laser alone a second scanning direction. The first scanning direction and the second scanning direction have an included angle.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: November 5, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Chan-Lon Yang, Tzu-Feng Kuo, Hsin-Huei Wu, Ching-I Li, Shu-Yen Chan
  • Publication number: 20130270240
    Abstract: A beam processor for processing a work surface of a workpieee W by irradiating the work surface with a beam, includes: an output source for outputting the beam, a beam moving device for moving the beam output from the output source; and a plurality of reflectors disposed on an optical path of the beam between the beam moving device and the work surface for reflecting the beam moved by the beam moving device and conducting the beam to the work surface, wherein the plurality of reflectors is inclined a predetermined angle corresponding to an incident direction of the beam so that the beam moved by the beam moving device is conducted nearly vertically to a different position of the work surface.
    Type: Application
    Filed: January 5, 2011
    Publication date: October 17, 2013
    Inventor: Kiyoyuki Kondo
  • Patent number: 8497451
    Abstract: An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: July 30, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Mu-Chi Hsu, Qing Liu, Guo-Han Yue, Chi-Lu Chih, Jun-Qi Li
  • Patent number: 8498037
    Abstract: A method for processing workpieces includes performing a laser processing operation in which a laser beam is directed at a first mirror face and at a second mirror face of a redirecting mirror. The second mirror face is at least partially surrounded by the first mirror face. During the laser processing operation, the second mirror face performs a pendulum movement relative to the first mirror face.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: July 30, 2013
    Assignee: Trumpf Laser—und Systemtechnik GmbH
    Inventors: Wolfgang Andreasch, Stefan Boeckmann
  • Publication number: 20130161299
    Abstract: The present invention relates to a device for guiding a laser beam along a target path, particularly a joint. It has a laser beam input module that guides an incident laser beam onto a swiveling beam guiding device downstream from the laser beam input module. The beam guiding device projects the laser beam onto the target path. Said beam guiding device comprises a tactile sensor connected to the swiveling optic that is designed to perform a tactile scan of the target path and to deflect the swiveling optic appropriately. According to the invention, an intermediate focal point is located in the beam path of the laser beam between laser beam input module and swiveling optic. Moreover, the swivel axis of the swiveling optic runs through the intermediate focal point.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 27, 2013
    Applicant: SCANSONIC MI GMBH
    Inventor: Scansonic MI GMBH
  • Patent number: 8450638
    Abstract: To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: May 28, 2013
    Assignee: Seishin Trading Co., Ltd.
    Inventor: Toshikazu Kajikawa
  • Patent number: 8404994
    Abstract: A laser beam welding device and a laser beam welding method are described. It is provided that a laser beam converted to have an annular cross-sectional area by using an optical system is deflected for the purpose of producing a radial weld.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: March 26, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Klaus Spennemann, Sonja Kittel
  • Patent number: 8389893
    Abstract: A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpiece is shifted. To obtain a reference for the position of the focal point, an image of a luminating modulation object is projected through the objective onto the workpiece into the focal plane or so as to intersect it. Reflections of the image occurring at the boundary surface are imaged into an autofocus image plane, and are detected by a camera. The camera image plane either intersects the autofocus image plane when the image of the illuminating modulation object lies in the focal plane, or lies in the autofocus image plane when the image of the modulation object intersects the focal plane.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: March 5, 2013
    Assignee: Nanoscribe GmbH
    Inventors: Michael Kempe, Peter Westphal, Wolfgang Grau, Georg von Freymann
  • Patent number: 8367970
    Abstract: A method and device (1) for laser machining vehicle bodies or body parts (2) uses a laser beam (14) that is guided from a laser source (13) to a remote laser tool (15) on a robot hand by a guiding device (16). The robot (4) maintains the laser tool (15) in a suspended manner over the tool (2), at a focal length (F) and at a contact free distance and guides it along a machining path (30). The laser beam (14) is deviated, by movement of the hand axis (IV, V, VI), about a variable deviation angle (?), and the laser source (13), whose power is variable, is controlled according to the movement of the laser beam. The beam deviation of the hand axis (IV, V, VI) can be superimposed on an offset movement of the robot (4).
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: February 5, 2013
    Assignee: Kuka Systems GmbH
    Inventors: Peter Rippl, Johann Hesse, Anton Englhard
  • Patent number: 8362393
    Abstract: An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When an outer-circumferential surface of a welded portion of a cylindrical tubular body (2) is irradiated with a laser beam that circles around an outer circumference of the tubular body (2), a heating width W in a circumferential direction heated by the laser-beam irradiation and a laser-beam moving speed V in the circumferential direction are set so that a stress in the circumferential direction in an inner surface of the tubular body (2) produced by the heating with the laser beam is at least larger than a yielding stress of a material that the tubular body (2) is made of.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: January 29, 2013
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takahiro Ota, Shuho Tsubota, Takashi Ishide, Kazuhiko Kamo, Noriaki Sugimoto, Yoshiyuki Hemmi, Hironori Onitsuka, Takashi Akaba
  • Patent number: 8334479
    Abstract: The system comprises a buckling arm robot with a robot frame (1) and an articulated arm (2) and a fiber optic cable (5) which is connected to one end of the articulated arm (2) and through which a laser beam (11) with a beam axis (10) is coupled into the articulated arm (2) in the direction of a first axis of the articulated arm (2). The fiber optic cable (5) is indirectly connected to the stationary end of the articulated arm (2) via an alignment unit (6) which comprises a collimating lens system (13) and at least two alignment mirrors (12.1, 12.2), each of which mirrors can swivel about at least one axis of rotation and move along at least one axis of translation, with the axes of rotation and the axes of translation being disposed at right angles to each other so that the beam axis (10) of the laser beam (11) can be made to coincide with the optical axis (4).
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: December 18, 2012
    Assignee: Jenoptik Automatisierungstechnik GmbH
    Inventors: Alex Jancso, Thomas Doering, Jean Pierre Bergmann, Andreas Patschger, Michael Nittner
  • Patent number: 8304688
    Abstract: Apparatuses for fabricating micro patterns using a laser diode array and methods for fabricating micro patterns are presented. The apparatus includes a laser diode array having at least one laser diode wherein light emitted from each laser diode is focused by a convex lens onto a second material layer attached to a first material layer. At least one driving shaft drives motion of the first and the second material layers. An adjustment means is used for adjusting the gap and pitch between adjacent laser diodes.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: November 6, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Ying-Chi Chen, Rung-Ywan Tsai
  • Patent number: 8260443
    Abstract: A method for the optimized movement co-ordination of measuring machines or machine tools having redundant axles having at translatory action, wherein the longer partial axles in each case permit a relatively slowly accelerated partial movement over a relatively large measuring or processing space and the shorter partial axles in each case essentially carry out the movement components of a total movement at a substantially altogether constant measuring or processing speed, which require an acceleration beyond a maximum set or stipulated for the respective longer partial axles, wherein, when approaching positions that in an undivided movement would otherwise not be attainable, the base axles correspondingly decelerate and can even come to a complete standstill, wherein by simultaneous displacement of the neutral starting point of the additional axles, the respective movement component of the base axles missing from the total movement is compensated.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: September 4, 2012
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventor: Andreas Ehlerding
  • Patent number: 8226448
    Abstract: A laser beam irradiation apparatus irradiates a laser beam to a sealing unit disposed between a first substrate and a second substrate to seal the first substrate and the second substrate. The laser beam irradiation apparatus includes a laser head for irradiating the laser beam; and a control unit for controlling a drive-velocity and a drive-direction of the laser beam. The laser beam is controlled by the control unit which repetitively performs a backward and forward movement along a first direction, and passes a same position at least twice.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: July 24, 2012
    Assignee: Samsung Mobile Display Co., Ltd.
    Inventors: Alexander Voronov, Gyoo-Wan Han, Tae-Wook Kang, Cheol-Lae Roh
  • Patent number: 8088633
    Abstract: A method of aligning a wafer when lithographically fabricating a light-emitting diode (LED). The method includes forming on the wafer at least one roughened alignment mark having a root-mean-square (RMS) surface roughness ?S. The roughened alignment mark is formed as a consequence of forming a plasma etch to roughen a LED surface on which the wafer alignment mark resides. The method also includes imaging the at least one roughened wafer alignment mark with alignment light having a wavelength ?A that is in the range from about 2?S to about 8?S. The method also includes comparing the detected image to an alignment reference to establish wafer alignment. Once wafer alignment is established, p-contacts and n-contacts can be formed on the LED upper surface in their proper locations.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: January 3, 2012
    Assignee: Ultratech, Inc.
    Inventors: Robert L. Hsieh, Khiem Nguyen, Warren W. Flack, Andrew M. Hawryluk
  • Patent number: 8044323
    Abstract: A weld zone of T-piping and its neighborhood are efficiently laser-heated to remove residual stress. For this purpose, the weld zone of a T-piping (50) is irradiated and heated with a laser beam emitted from a laser head (10) to remove residual stress. At this time, a rotating travel cart (3) travels along a ring rail (2) to adjust the position of the laser head (10) in a ?-direction, a vertical slide (4) slides to adjust the position of the laser head (10) in a Z-direction, a radial slide (5) slides to adjust the position of the laser head (10) in an L-direction, an arcuate piece slide (7) slides along an arcuate piece to adjust the ?-direction of the laser head (10), a laser head support portion (9) turns to adjust the ?-direction of the laser head (10), and oscillation adjusts the position of the laser head (10) in a ?-direction.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: October 25, 2011
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takashi Akaba, Shuho Tsubota, Kenji Nishikawa, Noriaki Sugimoto, Shoji Kushimoto, Takashi Ishide, Takahiro Ohta
  • Publication number: 20110220624
    Abstract: The present invention provides a cutting method for a cutting device to cut the peripheral isolation lines of solar panels, having the following steps: preparing a solar panel and installing an image acquisition device at the corresponding position on the solar panel; setting the image acquisition device to move along the solar panel edge and acquire the image of the solar panel edge by means of located whole acquisition or line scan, and using an image processing device to calculate the location data of the edges of the solar panel; and setting a cutting device to cut the isolation line of the solar panel according to the edge location data. The present method can accurately judge the locations of the solar panel edges through image processing algorithm to find the parts near the margins and avoid defects, so that the solar panel can have maximum efficacy and utility.
    Type: Application
    Filed: March 10, 2010
    Publication date: September 15, 2011
    Applicant: MARKETECH INTERNATIONAL CORP.
    Inventors: Miin-Tsair SU, Sheng-Pin Wang, Jou-Chin Liao, Sheng-Chao Li, Chuan-Chang Lee
  • Patent number: 7994449
    Abstract: The present invention provides a square-wave laser seal pattern made by first directing a laser beam onto an shaft while the shaft is moving in a horizontal direction relative to a laser device so as to create a horizontal laser seal bond segment. Next, with the shaft rotating about a shaft longitudinal axis, the laser beam is directed onto the shaft so as to create a vertical laser seal bond segment. By alternately creating and coupling together a plurality of horizontal and vertical laser seal bond segments, a square-wave laser seal is formed around a circumference of the shaft. The shaft's movement in a horizontal direction relative to a laser beam may be either at a constant speed or a variable speed so as to control the amount of laser energy heat impacting the shaft material.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: August 9, 2011
    Assignee: Advanced Cardiovascular Systems, Inc.
    Inventors: Jessica Chiu, Lara K. Suh, Arthur Wen
  • Patent number: 7977601
    Abstract: An X & Y orthogonal cut apparatus for scribing a pair of parallel cuts on a planar workpiece, the workpiece plane having an X-axis and a Y-axis, where the apparatus includes a laser device generating at least two beams including a first beam and a second beam, the first beam and the second beam each having an impact point on the workpiece, the first and second impact points being positioned diagonally with respect to the X and Y axes of the workpiece, and at least one actuator to move at least one of the impact points relative to the workpiece and the workpiece relative to the impact points.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: July 12, 2011
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Leonard Kandt
  • Patent number: 7935910
    Abstract: A method of forming a via hole reaching a bonding pad in a wafer having a plurality of devices on the front surface of a substrate and bonding pads formed on each of the devices by applying a pulse laser beam from the rear surface side of the substrate, wherein when a pulse laser beam having a spot diameter which satisfies D/2?d?D?2 ?m (wherein a diameter of the via hole to be formed is represented as D and a spot diameter of the pulse laser beam is represented as d) is applied in such a manner that the periphery of the spot moves along the inner circumference of the via hole to be formed, the pulse laser beam is applied at an angle of 120 to 180° from the previous application position.
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: May 3, 2011
    Assignee: Disco Corporation
    Inventor: Hiroshi Morikazu
  • Patent number: 7906744
    Abstract: A method for machining workpieces (6) uses a moving laser beam (4), whereby the laser tool (3) is held at a separation above the workpiece (6) by means of a multi-axis mechanical manipulator (2) with a manipulator hand (8) and moved along a given track in an offset movement. During the machining process an at least partly opposing compensation movement of the laser beam (4) is superimposed on the offset movement. A device is provided for machining workpieces (6) with a moving laser beam (4). The laser tool (3) is held by means of a multi-axis mechanical manipulator (2) and a device for generation of a opposing compensation movement of the laser beam (4) is superimposed on the offset movement.
    Type: Grant
    Filed: July 20, 2004
    Date of Patent: March 15, 2011
    Assignee: Kuka Systems GmbH
    Inventor: Peter Rippl